KR20050049729A - 반도체 발광장치 - Google Patents
반도체 발광장치 Download PDFInfo
- Publication number
- KR20050049729A KR20050049729A KR1020030083443A KR20030083443A KR20050049729A KR 20050049729 A KR20050049729 A KR 20050049729A KR 1020030083443 A KR1020030083443 A KR 1020030083443A KR 20030083443 A KR20030083443 A KR 20030083443A KR 20050049729 A KR20050049729 A KR 20050049729A
- Authority
- KR
- South Korea
- Prior art keywords
- light emitting
- emitting device
- light
- phosphor
- device chip
- Prior art date
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
Abstract
Description
Claims (11)
- 애노드전극 및 캐소드전극으로 이루어지는 단자부;상기 전극들 중 하나의 전극의 상단에 형성된 반사컵 내에 실장되며, 연결수단을 이용하여 상기 애노드전극 및 상기 캐소드전극에 각각 전기적으로 연결되는 제1 및 제2 발광소자칩;상기 제1 발광소자칩 또는 상기 제2 발광소자칩에 의해 여기되어 적색광을 발광시키는 형광체; 및상기 제1 및 제2 발광소자칩을 밀봉하여 형성되는 광투과성 수지층을 포함하여, 백색광 또는 다른 색광을 갖는 것을 특징으로 하는 반도체 발광장치.
- 제1항에 있어서, 상기 제1 발광소자칩은 청색광을 발광시키고, 상기 제2 발광소자칩은 녹색광을 발광시키는 것을 특징으로 하는 반도체 발광장치.
- 제1항에 있어서, 상기 형광체는 상기 광투과성 수지층에 분말 형태로 혼합되어 있는 것을 특징으로 하는 반도체 발광장치.
- 제1항에 있어서, 상기 형광체는 판 형태로 이루어져 상기 제1 및 제2 발광소자칩으로부터 일정 거리 이격된 위치에 구비되는 것을 특징으로 하는 반도체 발광장치.
- 제1항에 있어서, 상기 제1 및 제2 발광소자칩은 서로 상이한 In 양을 갖는 InGaN을 함유하고 있는 발광소자인 것을 특징으로 하는 반도체 발광장치.
- 제1항에 있어서, 상기 제1 발광소자칩에서 발광된 청색광, 상기 제2 발광소자칩에서 발광된 녹색광 및 상기 제1 발광소자칩 또는 상기 제2 발광소자칩에 의해 상기 형광체가 여기되어 발광되는 적색광의 조합으로 백색광이 얻어지는 것을 특징으로 하는 하는 반도체 발광장치.
- 애노드전극 및 캐소드전극으로 이루어지는 단자부;상기 전극들 중 하나의 전극의 상단에 형성된 반사컵 내에 실장되며, 연결수단을 이용하여 상기 애노드전극 및 상기 캐소드전극에 각각 전기적으로 연결되는 제1 및 제2 발광소자칩;상기 제1 발광소자칩 또는 제2 발광소자칩에 의해 여기되어 황색광을 발광시키는 형광체; 및상기 제1 및 제2 발광소자칩을 밀봉하여 형성되는 광투과성 수지층을 포함하여, 백색광 또는 다른 색광을 갖는 것을 특징으로 하는 반도체 발광장치.
- 제7항에 있어서, 상기 제1 발광소자칩은 자외선을 발광시키고, 상기 제2 발광소자칩은 청색광을 발광시키는 것을 특징으로 하는 반도체 발광장치.
- 제7항에 있어서, 상기 형광체는 상기 광투과성 수지층에 분말 형태로 혼합되어 있는 것을 특징으로 하는 반도체 발광장치.
- 제7항에 있어서, 상기 형광체는 판 형태로 이루어져 상기 제1 및 제2 발광소자칩으로부터 일정 거리 이격된 위치에 구비되는 것을 특징으로 하는 반도체 발광장치.
- 제7항에 있어서, 상기 제1 발광소자칩에서 발광된 자외선에 의해 상기 형광체가 여기되어 발광되는 황색광과 상기 제2 발광소자칩에서 발광된 청색광의 조합으로 백색광이 얻어지는 것을 특징으로 하는 반도체 발광장치.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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KR1020030083443A KR100999814B1 (ko) | 2003-11-24 | 2003-11-24 | 반도체 발광장치 |
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KR1020030083443A KR100999814B1 (ko) | 2003-11-24 | 2003-11-24 | 반도체 발광장치 |
Publications (2)
Publication Number | Publication Date |
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KR20050049729A true KR20050049729A (ko) | 2005-05-27 |
KR100999814B1 KR100999814B1 (ko) | 2010-12-08 |
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KR1020030083443A KR100999814B1 (ko) | 2003-11-24 | 2003-11-24 | 반도체 발광장치 |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100721514B1 (ko) * | 2005-11-01 | 2007-05-23 | 서울옵토디바이스주식회사 | 교류용 백색 발광소자 |
WO2008026851A1 (en) * | 2006-08-29 | 2008-03-06 | Seoul Semiconductor Co., Ltd. | Light emitting device |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003110151A (ja) | 2001-10-01 | 2003-04-11 | Okaya Electric Ind Co Ltd | 発光ダイオード |
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- 2003-11-24 KR KR1020030083443A patent/KR100999814B1/ko active IP Right Grant
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100721514B1 (ko) * | 2005-11-01 | 2007-05-23 | 서울옵토디바이스주식회사 | 교류용 백색 발광소자 |
WO2008026851A1 (en) * | 2006-08-29 | 2008-03-06 | Seoul Semiconductor Co., Ltd. | Light emitting device |
Also Published As
Publication number | Publication date |
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KR100999814B1 (ko) | 2010-12-08 |
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