KR20050019951A - A cooling device - Google Patents

Abstract

PURPOSE: A cooling unit is provided to restrict environmental pollution and to minimize thermal resistance by disposing a thermoelectric semiconductor using peltier effect, a heat sink, and a cooling body maximizing a surface area. CONSTITUTION: A cooling unit(100) is composed of a thermoelectric semiconductor(110) forming a heating unit(112) and a cooling unit(114) at upper and lower sides by electrodes; a hexahedral heat sink(120) comprising a base plate(122) installed at the heating unit, vertical fins(124) arranged at four spots on the upper surface of the base plate, horizontal fins(130) for connecting horizontally the vertical fins, and a radiating fin(134) for connecting one of facing horizontal fins; and a cooling body(140) installed in the cooling unit, produced by plate-shaped metal, and composed of a cooling groove(142) formed on the lower surface and an open-cell type foam metal layer(144) brazed to maximize a surface area of the cooling groove.

Description

Cooling Unit {A cooling device}

The present invention relates to a cooling unit, and more particularly, by arranging a cube-shaped heat sink on the heat generating portion side of the thermoelectric semiconductor and providing a cooling body on the cooling portion side of the thermoelectric semiconductor, it is possible to prevent environmental pollution in advance. It relates to a cooling unit that can save energy by minimizing thermal resistance.

In general, the cooling devices used in home appliances or industrial fields are mainly composed of a refrigerant compression method. This refrigerant compression method consumes a lot of power, and in case of a cooler using excessive noise and freon gas, it is the main culprit of ozone layer destruction when leaked.

Recently, in order to solve the problems described above, a thermoelectric semiconductor is used. The thermoelectric semiconductor is provided with a heat generating portion and a cooling portion on both sides when a current flows. At this time, a temperature difference of about 70 ° C. is generated in the heat generating unit and the cooling unit. Using this principle, it has been applied to cooling rice barrels, cosmetic refrigerators, small-capacity kimchi refrigerators, and communication chips sensitive to heat changes.

However, when the above-described thermoelectric semiconductors do not have a heat sink such as a heat sink, the thermoelectric material may reach the melting point of the thermoelectric material bonding material of the thermoelectric semiconductor through a thermal equilibrium state where both sides have the same temperature. There is a problem that the thermoelectric material can not be used because the bonding material is melted. In addition, since the surface area of the heat sink is used by mounting the heat sink to the heat generating portion of the thermoelectric semiconductor has a problem that can not be smooth heat dissipation.

The present invention has been made to solve the above-mentioned conventional problems, the object of the present invention is to arrange a heat sink of the cube shape on the heat generating side of the thermoelectric semiconductor which is a cooling source, and by providing a cooling body on the cooling unit side of the thermoelectric semiconductor, It is to provide a cooling unit that can save energy by not only preventing environmental pollution but also minimizing thermal resistance.

In order to achieve the object of the present invention as described above, the present invention,

A thermoelectric semiconductor having upper and lower heat generating parts and cooling parts formed by electrodes;

A base plate disposed on the heat generating unit, a vertical pin disposed on the top surface of the base plate in all directions, a horizontal pin connecting each vertical pin horizontally, and a heat radiating fin connecting one of the horizontal pins facing each other; Hexahedral heat sinks; And

It is provided with a cooling unit made of a metal having a plate shape while being disposed in the cooling unit and a cooling groove on the lower surface, and the cooling groove made of a braze-type foamed metal layer brazing welded to maximize the surface area.

As described above, according to the present invention, by placing a cube-shaped heat sink on the heat generating portion side of the thermoelectric semiconductor as a cooling source and providing a cooling body on the cooling portion side of the thermoelectric semiconductor, environmental pollution can be prevented in advance. The thermal resistance can be minimized to save energy.

Hereinafter, a cooling unit according to a preferred embodiment of the present invention with reference to the accompanying drawings.

1 is an exploded perspective view showing a separate cooling unit according to the present invention, and Figure 2 is a combined perspective view showing a coupling state of the cooling unit shown in FIG.

1 and 2, the cooling unit 100 of the present invention, the heat generating portion 112 and the heat generating portion 112 and the cooling portion 114 is formed by the electrode on the top and bottom, and the heat generating portion 112 And a heat sink 120 disposed in the cooling unit 140 and a cooling body 140 disposed in the cooling unit 114.

In this case, the heat sink 120 includes a base plate 122, a vertical fin 124, a horizontal fin 130, and a heat dissipation fin 134. The base plate 122 is in close contact with the heat generating part 112 of the thermoelectric semiconductor 110. The vertical fin 124 is disposed above the base plate 122, the horizontal fin 130 is disposed between the vertical fins 124, and the heat dissipation fin 134 is disposed between the horizontal fins 130. The vertical pins 124 are disposed in all directions on the upper surface of the base plate 122. The vertical pin 124 has a cylindrical shape and extends upward by a predetermined length. At this time, on the upper surface and the lower surface of the vertical pin 124 is formed an annular ground flange 126 to increase the heat dissipation area while preventing shifting when stacked. On the other hand, on the outer circumferential surface of the vertical fin 124, a first heat dissipation protrusion 128 having a vertical wrinkle shape to maximize the heat dissipation area is formed. Preferably, the vertical pin 124 may be manufactured in a rectangular cross section or hexagonal cross section. The plurality of horizontal pins 130 are integrally formed on the vertical pins 124 formed as described above.

The horizontal pin 130 has a rectangular bar shape and horizontally connects the central portion of each vertical pin 124. On the outer circumferential surface of the horizontal fin 130, like the vertical fin 124, a second heat dissipation protrusion 132 having a vertical corrugation shape is formed on the outer surface to maximize the heat dissipation area. Preferably, the horizontal pin 130 may be manufactured to have a rod end surface. On the other hand, the heat dissipation fin 134 is the first connecting pin 136 connecting one of the horizontal pin 130 facing each other and the first connecting pin 136 in one adjacent position and the other end of the first connecting pin 136 And a second connecting pin 138a and a third connecting pin 138b extending vertically with respect to both sides. At this time, the ends of the second connecting pin 138a and the third connecting pin 138b are extended so as not to be in close contact with another horizontal pin 130. The heat sink 120 is made of any one of aluminum, copper, and silver.

On the other hand, the cooling body 140 is made of metal and has a plate shape. A plurality of cooling grooves 142 are formed on the lower surface of the cooling body 140, and the open type foaming metal layer 144 is brazed by the cooling grooves 142 so as to maximize the surface area.

Preferably, between the upper portion of the thermoconductor 110 and the lower surface of the base plate 122, and between the lower portion of the thermoconductor 110 and the upper surface of the cooling body 140 facilitate complete grounding and heat transfer between the metals. In order to do this, the adhesive 150 is applied. Preferably the adhesive 150 is any one of silver paste, silver pad, thermal grease or thermal epoxy. The cooling unit 100 configured as described above can be applied to home appliances and industrial apparatuses that extract heat from the fluid and release it to the outside.

As described above, the cooling unit 100 according to the present invention is a thermoelectric semiconductor using a Peltier phenomenon generated by applying electricity rather than cooling by vaporizing a liquefied refrigerant by compressing heat present in a liquid or gas ( 110 and a heat sink 120 having a hexahedral shape to maximize the surface area, as well as the cooling body 140 to maximize the surface area, it is possible to prevent environmental pollution, which is a problem of the conventional cooling unit using a refrigerant, The thermal resistance can be minimized to save energy.

In addition, the cooling unit 100 according to the present invention has the advantage that it is possible to continuously produce the cooling unit 100 having a uniform quality as well as to obtain a small and high cooling efficiency, thereby maximizing the production efficiency.

Although described above with reference to a preferred embodiment of the present invention, those skilled in the art can be variously modified and changed within the scope of the invention without departing from the spirit and scope of the invention described in the claims You will understand.

1 is an exploded perspective view showing a separate cooling unit according to the present invention,

FIG. 2 is a combined perspective view illustrating a coupling state of the cooling unit illustrated in FIG. 1, and

3 is a cross-sectional view taken along the line A-A of FIG.

Explanation of symbols on the main parts of the drawing

100: cooling unit 110: thermoelectric semiconductor

112: heat generating portion 114: cooling portion

120: heat sink 122: base plate

124: vertical pin 130: horizontal pin

134: heat sink fin 140: cooling body

142: cooling groove 144: open cell foam metal layer

Claims (8)

A thermoelectric semiconductor having upper and lower heat generating parts and cooling parts formed by electrodes; Any one of a base plate disposed on the heat generating unit, a vertical pin disposed on an upper surface of the base plate in all directions, a horizontal pin connecting the vertical pins horizontally, and the horizontal pins facing each other; A six-sided heat sink having heat dissipation fins connected thereto; And Cooling unit is made of a metal having a plate shape while being disposed in the cooling unit and a cooling groove on the lower surface of the cooling groove is made of a cooling body to be brazed and welded to the cooling groove to maximize the surface area. According to claim 1, wherein the vertical fin has a cylindrical shape extending vertically upwards and is formed on the upper surface and the lower surface to prevent the deviating during stacking to increase the heat dissipation area is formed on the outer peripheral surface of the vertical pin Cooling unit, characterized in that the first heat dissipation projection having a vertical wrinkles shape is formed to maximize the heat dissipation area. The cooling unit according to claim 1, wherein the vertical pins can be made of any one of a rectangular cross section and a hexagonal cross section. The method of claim 1, wherein the horizontal fin has a rectangular bar shape and is connected horizontally to the central portion of each of the vertical pins and the second heat dissipation projection of the vertical wrinkles shape is formed on the outer peripheral surface to maximize the heat dissipation area Cooling unit characterized by. The cooling unit according to claim 1, wherein the horizontal pin can be manufactured in a rod cross section. The heat dissipation fin of claim 1, wherein the heat dissipation fins extend to both sides perpendicular to the first connection pins at positions adjacent to one end and the other end of the first connection pins; 2. A refrigeration unit comprising: a second connecting pin and a third connecting pin. The method of claim 1, wherein an adhesive is provided between the heat generating portion of the thermoelectric semiconductor and the lower surface of the base plate and between the cooling portion of the thermoelectric semiconductor and the upper surface of the cooling body to facilitate complete grounding and heat transfer between metals. Cooling unit, characterized in that applied. 8. The cooling unit of claim 7, wherein the adhesive is any one of silver paste, silver pad, thermal grease, and thermal epoxy.