CN220776346U - Heat dissipation device - Google Patents
Heat dissipation device Download PDFInfo
- Publication number
- CN220776346U CN220776346U CN202322246735.XU CN202322246735U CN220776346U CN 220776346 U CN220776346 U CN 220776346U CN 202322246735 U CN202322246735 U CN 202322246735U CN 220776346 U CN220776346 U CN 220776346U
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- heat
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- tungsten alloy
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- 230000017525 heat dissipation Effects 0.000 title claims description 20
- 239000000758 substrate Substances 0.000 claims abstract description 65
- 229910001080 W alloy Inorganic materials 0.000 claims abstract description 30
- 239000011159 matrix material Substances 0.000 claims abstract description 17
- 229910052797 bismuth Inorganic materials 0.000 claims description 16
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 16
- XSOKHXFFCGXDJZ-UHFFFAOYSA-N telluride(2-) Chemical compound [Te-2] XSOKHXFFCGXDJZ-UHFFFAOYSA-N 0.000 claims description 16
- 238000001816 cooling Methods 0.000 claims description 14
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 6
- 229910052737 gold Inorganic materials 0.000 claims description 6
- 239000010931 gold Substances 0.000 claims description 6
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 claims description 3
- OWUGOENUEKACGV-UHFFFAOYSA-N [Fe].[Ni].[W] Chemical compound [Fe].[Ni].[W] OWUGOENUEKACGV-UHFFFAOYSA-N 0.000 claims description 3
- LTOKVQLDQRXAHK-UHFFFAOYSA-N [W].[Ni].[Cu] Chemical compound [W].[Ni].[Cu] LTOKVQLDQRXAHK-UHFFFAOYSA-N 0.000 claims description 3
- SBYXRAKIOMOBFF-UHFFFAOYSA-N copper tungsten Chemical compound [Cu].[W] SBYXRAKIOMOBFF-UHFFFAOYSA-N 0.000 claims description 3
- 238000009825 accumulation Methods 0.000 abstract description 5
- 230000000694 effects Effects 0.000 description 9
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 230000005679 Peltier effect Effects 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 229910052742 iron Inorganic materials 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 230000021715 photosynthesis, light harvesting Effects 0.000 description 2
- 238000005057 refrigeration Methods 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- FAWGZAFXDJGWBB-UHFFFAOYSA-N antimony(3+) Chemical compound [Sb+3] FAWGZAFXDJGWBB-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Abstract
The utility model provides a heat dissipating device, which is used for dissipating heat and reducing temperature of a heat source, and comprises a tungsten alloy heat conducting pad, a first substrate, a second substrate and a plurality of connecting columns, wherein the tungsten alloy heat conducting pad is used for being attached to the heat source, the first substrate is overlapped on the tungsten alloy heat conducting pad in parallel, the second substrate is arranged in parallel corresponding to the first substrate, each connecting column is vertically connected between the first substrate and the second substrate, and each connecting column is arranged in a matrix; therefore, the tungsten alloy heat conduction pad can rapidly disperse and conduct the heat energy of the heat source to the first substrate, and conduct the heat energy to the second substrate through each connecting column to dissipate the heat, so that the overheat caused by accumulation of the heat energy is avoided.
Description
Technical Field
The present utility model relates to a heat dissipating device, and more particularly to a heat dissipating device capable of rapidly conducting heat for dissipating heat.
Background
At present, common heat dissipation modes for electronic components are mainly divided into active heat dissipation (active cooling) and passive heat dissipation (passive cooling). Wherein the active heat dissipation comprises, in addition to the compressor system, thermoelectric refrigeration (Thermoelectric cooling) which, by means of the Peltier effect (Peltier effect) produced by the flow of electric current through the semiconductor material, effects a refrigeration heat dissipation effect with one end face absorbing heat and one end face releasing heat; whereas passive heat dissipation relies mostly on the heat transfer characteristics of the material itself or the latent heat absorbed by the phase change of the working fluid, so as to guide the heat from a high temperature to a low temperature, common passive heat dissipation is as follows: heat radiating fins, heat pipes, a temperature equalizing plate, a liquid cooling system … and the like. Whether thermoelectric cooling or passive heat dissipation is performed, heat generated by a heat source (e.g., a heat-generating electronic component) is first conducted to a heat dissipation device via a heat-conducting pad disposed between the heat source and the heat dissipation device to dissipate heat.
However, as electronic components move toward high performance, high speed, and small volume, the electronic components not only become smaller, but also generate more heat during operation; in addition, some electronic components (such as a base station antenna) are disposed outdoors due to the use requirement, and thus exposed to a high temperature environment, so that the heat dissipation efficiency is greatly affected.
Disclosure of Invention
The main purpose of the utility model is to rapidly disperse and conduct the heat energy of the heat source to the first substrate through the tungsten alloy heat conducting pad, and conduct the heat energy to the second substrate through each connecting column for heat dissipation, thereby avoiding overheat caused by accumulation of the heat energy.
In order to achieve the above-mentioned objective, the present utility model provides a heat dissipating device for dissipating heat from a heat source, the heat dissipating device comprises a tungsten alloy heat conductive pad, a first substrate, a second substrate and a plurality of connection columns, the tungsten alloy heat conductive pad is attached to the heat source, the first substrate is stacked on the tungsten alloy heat conductive pad in parallel, the second substrate is disposed in parallel with respect to the first substrate, each connection column is vertically connected between the first substrate and the second substrate, and each connection column is arranged in a matrix.
In an embodiment of the utility model, the tungsten alloy heat conducting pad is a member made of tungsten copper alloy, tungsten nickel copper alloy or tungsten nickel iron alloy.
In an embodiment of the present utility model, each of the connection pillars includes a plurality of n-type bismuth telluride pillars and a plurality of p-type bismuth telluride pillars, the first substrate has a first electrode, and the second substrate has a second electrode.
In one embodiment of the present utility model, the connection columns are arranged in a four by five matrix.
In one embodiment of the present utility model, the connection columns are arranged in a four by four matrix.
In one embodiment of the present utility model, the connection columns are arranged in a three by six matrix.
In one embodiment of the present utility model, the connection columns are arranged in a four by six matrix.
In an embodiment of the utility model, the first substrate is directly adhered to the tungsten alloy heat conductive pad.
In an embodiment of the utility model, each of the connecting posts is directly adhered to the first substrate and the second substrate.
In an embodiment of the present utility model, the first substrate and the second substrate are both members made of gold material.
According to the heat dissipation device, the heat energy of the heat source can be rapidly dispersed and conducted to the first substrate through the tungsten alloy heat conduction pad, and the heat energy is conducted to the second substrate through the connecting columns to dissipate heat, so that the high heat energy dissipation requirement of high-efficiency electronic components during operation is met, and overheat caused by accumulation of heat energy is avoided.
Drawings
Fig. 1 is a perspective view of the present utility model.
Fig. 2 is a top view of the present utility model.
Fig. 3 is a cross-sectional view of the present utility model.
Fig. 4 is a cross-sectional view of the present utility model in use.
Fig. 5 is a top view of a four by four matrix arrangement of connecting posts according to the present utility model.
Fig. 6 is a top view of a three by six matrix arrangement of connecting posts according to the present utility model.
Fig. 7 is a top view of a four by six matrix arrangement of connecting posts according to the present utility model.
In the figure:
10, a tungsten alloy heat conduction pad; 11, heating surface; 12, a heat conducting surface; a first substrate; a heat absorbing surface 21; 22 a first connection surface;
23, a first electrode; 30, a second substrate; 31, refrigerating surface; a second connection surface 32; 33 a second electrode; 40, connecting the columns;
an n-type bismuth telluride column; a p-type bismuth telluride column; h, a heat source.
Detailed Description
In the description of the present utility model, it should be understood that the terms "front," "rear," "left," "right," "front," "rear," "end," "longitudinal," "transverse," "vertical," "top," "bottom," etc. indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and should not be construed as limiting the present utility model.
As used herein, terms such as "first," "second," "third," "fourth," and "fifth," etc., describe various elements, components, regions, layers, and/or sections that are not to be limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another. Unless the context clearly indicates otherwise, words such as "first," "second," "third," "fourth," and "fifth" as used herein do not imply a sequence or order.
The terms "substantially" and "about" are used herein and are not otherwise defined, but rather are used to describe and describe small variations. When combined with an event or circumstance, the term can include the exact whereabouts of the event or circumstance and the whereabouts of the event or circumstance to a close approximation. For example, when combined with a numerical value, the term can include a variation of less than or equal to + -10%, such as less than or equal to + -5%, less than or equal to + -4%, less than or equal to + -3%, less than or equal to + -2%, less than or equal to + -1%, less than or equal to + -0.5%, less than or equal to + -0.1%, or less than or equal to + -0.05% of the numerical value.
The present utility model will be further described with reference to the accompanying drawings and specific examples, which are not intended to limit the utility model, so that those skilled in the art may better understand the utility model and practice it.
The utility model provides a heat dissipation device which is used for dissipating heat of a heat source H and reducing temperature. In the embodiment, the heat source H is a high-performance electronic component that generates a large amount of high heat energy during operation, but the utility model is not limited thereto, and any heat generating object that needs to be cooled can be used as a cooling object of the cooling device of the utility model. Referring to fig. 1 to 4, the heat dissipating device of the present utility model includes a tungsten alloy heat conductive pad 10, a first substrate 20, a second substrate 30 and a plurality of connecting pillars 40.
In the present embodiment, the tungsten alloy heat-conducting pad 10 is a member made of tungsten-copper alloy, tungsten-nickel-copper alloy or tungsten-nickel-iron alloy, so as to achieve a faster heat-conducting effect compared with aluminum, iron, copper, gold or any of the foregoing metals, but the utility model is not limited thereto, and the tungsten alloy heat-conducting pad 10 may be made of tungsten alloy with other components. The tungsten alloy heat conducting pad 10 has a heating surface 11 and a heat conducting surface 12 opposite to each other. The tungsten alloy heat conducting pad 10 is used for being attached to the heat source H. More specifically, the heating surface 11 of the tungsten alloy heat conducting pad 10 is directly adhered to the heat source H in a pressing and packaging manner, so that auxiliary bonding by other mediums (such as heat dissipating paste) is not needed, and the heat conducting effect can be prevented from being affected due to the increase of thermal resistance.
The first substrate 20 has a heat absorbing surface 21 and a first connecting surface 22 opposite to each other. The first substrate 20 is stacked on the tungsten alloy heat conductive pad 10 in parallel. Specifically, the heat absorbing surface 21 of the first substrate 20 is directly adhered to the heat conducting surface 12 of the tungsten alloy heat conducting pad 10, so that auxiliary bonding by other mediums (such as heat dissipating paste) is not needed, and the heat conducting effect can be prevented from being affected due to the increase of heat resistance.
The second substrate 30 has a cooling surface 31 and a second connecting surface 32 opposite to each other. The second substrate 30 is disposed in parallel with the first substrate 20. Specifically, the second connection surface 32 of the second substrate 30 is disposed towards the first connection surface 22 of the first substrate 20, and the first substrate 20 is located between the tungsten alloy thermal pad 10 and the second substrate 30. In the present embodiment, the first substrate 20 and the second substrate 30 are both made of gold, so as to achieve a faster heat and electrical conduction effect than aluminum, iron or an alloy of any of the foregoing metals, but the present utility model is not limited thereto.
Each of the connection posts 40 is vertically connected between the first substrate 20 and the second substrate 30. Specifically, the two end surfaces of each connecting post 40 are directly adhered to the first connecting surface 22 of the first substrate 20 and the second connecting surface 32 of the second substrate 30, so that auxiliary bonding by other mediums (such as heat dissipating paste) is not needed, and the heat conduction effect can be prevented from being affected due to the increase of heat resistance.
The connection posts 40 are arranged in a matrix. Specifically, in the present embodiment, the connection columns 40 are arranged in a four by five matrix, but the present utility model is not limited thereto. For example, as shown in fig. 5 to 7, each connecting post 40 may be arranged in a four-by-four, three-by-six or four-by-six matrix, or may be arranged in other numbers not disclosed in the drawings, and it should be understood by those skilled in the art that the area of the first connecting surface 22 and the second connecting surface 32 may be correspondingly adjusted with respect to the outer diameter of the connecting post 40.
Therefore, the heat dissipating device of the present utility model is directly adhered to the heat source H by the tungsten alloy heat conducting pad 10, so that the heat energy of the heat source H can be rapidly dispersed and conducted to the first substrate 20, and then conducted to the second substrate 30 for heat dissipation by the connecting columns 40, thereby meeting the high heat energy dissipation requirement of the high-performance electronic components during operation, avoiding overheat caused by heat accumulation, and improving the defect that the heat resistance is increased to affect the heat conduction caused by the additional arrangement of a medium such as a heat dissipating paste in the conventional technology.
Specifically, the heat conduction efficiency of the conventional heat conduction material is as follows: copper has a thermal conductivity of about 170W/mK, gold has a thermal conductivity of about 152W/mK, aluminum has a thermal conductivity of about 130W/mK, and iron has a thermal conductivity of about 43W/mK. The heat conductivity of the tungsten alloy adopted by the utility model can be between 160 and 240W/mK according to the proportion of the mixed copper, so that compared with the traditional heat conducting materials such as aluminum, iron, copper, gold and the like, the tungsten alloy can conduct and disperse heat energy more rapidly, thereby avoiding overheat caused by accumulation of heat energy.
Further, each of the connection pillars 40 in the present embodiment includes a plurality of n-type bismuth telluride pillars 41 and a plurality of p-type bismuth telluride pillars 42 arranged in a staggered manner, and the first substrate 20 has a first electrode 23 and the second substrate 30 has a second electrode 33. Specifically, the n-type bismuth telluride column 41 is an n-type bismuth telluride having a columnar shape, wherein the n-type bismuth telluride is selenium-doped bismuth telluride; the p-type bismuth telluride column 42 is a p-type bismuth telluride having a columnar shape, and the p-type bismuth telluride is bismuth telluride doped with antimony element. Therefore, when the heat dissipating device of the present embodiment electrically connects the first electrode 23 and the second electrode 33 to the positive and negative terminals of the power supply respectively to form a loop, the active cooling effect of thermoelectric cooling (Thermoelectric cooling, TEC) can be achieved, that is, the heat absorbing surface 21 of the first substrate 20 absorbs heat by Peltier effect (Peltier effect), so as to cool the heat energy conducted by the tungsten alloy heat conducting pad 10. In other embodiments, not shown in the drawings, a plurality of heat dissipation fins (not shown) may be disposed on the cooling surface 31 of the second substrate 30, so as to further enhance the heat dissipation effect of passive cooling.
The above-described embodiments are merely preferred embodiments for fully explaining the present utility model, and the scope of the present utility model is not limited thereto. Equivalent substitutions and modifications will occur to those skilled in the art based on the present utility model, and are intended to be within the scope of the present utility model. The protection scope of the utility model is subject to the claims.
Claims (10)
1. The utility model provides a heat abstractor for heat dissipation cooling to a heat source, its characterized in that, this heat abstractor includes:
a tungsten alloy heat conduction pad for attaching to the heat source;
the first substrate is overlapped on the tungsten alloy heat conduction pad in parallel;
a second substrate arranged in parallel with the first substrate; and
The connecting columns are vertically connected between the first substrate and the second substrate, and each connecting column is arranged in a matrix.
2. The heat dissipating device of claim 1, wherein the tungsten alloy thermal pad is a member made of tungsten copper alloy, tungsten nickel copper alloy or tungsten nickel iron alloy.
3. The heat dissipating device of claim 1, wherein each of said connecting posts comprises a plurality of n-type bismuth telluride posts and a plurality of p-type bismuth telluride posts in equal numbers, said first substrate having a first electrode and said second substrate having a second electrode.
4. The heat sink of claim 1 wherein each of the connection posts is arranged in a four by five matrix.
5. The heat dissipating device of claim 1, wherein each of said connecting posts is arranged in a four by four matrix.
6. The heat sink of claim 1 wherein each of the connecting posts is arranged in a three by six matrix.
7. The heat sink of claim 1 wherein each of the connection posts is arranged in a four by six matrix.
8. The heat sink of claim 1, wherein the first substrate is directly adhered to the tungsten alloy thermal pad.
9. The heat dissipating device of claim 1, wherein each of said connecting posts is directly adhered to said first substrate and said second substrate.
10. The heat sink of claim 1, wherein the first substrate and the second substrate are both members made of gold.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322246735.XU CN220776346U (en) | 2023-08-21 | 2023-08-21 | Heat dissipation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322246735.XU CN220776346U (en) | 2023-08-21 | 2023-08-21 | Heat dissipation device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220776346U true CN220776346U (en) | 2024-04-12 |
Family
ID=90597250
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322246735.XU Active CN220776346U (en) | 2023-08-21 | 2023-08-21 | Heat dissipation device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220776346U (en) |
-
2023
- 2023-08-21 CN CN202322246735.XU patent/CN220776346U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant |