KR20050003298A - Movable pincette arm incorporating therein separation plate for controlling foreign material - Google Patents

Movable pincette arm incorporating therein separation plate for controlling foreign material Download PDF

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Publication number
KR20050003298A
KR20050003298A KR1020030044018A KR20030044018A KR20050003298A KR 20050003298 A KR20050003298 A KR 20050003298A KR 1020030044018 A KR1020030044018 A KR 1020030044018A KR 20030044018 A KR20030044018 A KR 20030044018A KR 20050003298 A KR20050003298 A KR 20050003298A
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South Korea
Prior art keywords
moving
arm
separation plate
foreign matter
movable
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KR1020030044018A
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Korean (ko)
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하태중
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주식회사 하이닉스반도체
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Priority to KR1020030044018A priority Critical patent/KR20050003298A/en
Publication of KR20050003298A publication Critical patent/KR20050003298A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68771—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Manipulator (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

PURPOSE: A movable tweezer arm is provided to transfer simultaneously two or more objects without contamination by blocking foreign material using a plate for controlling foreign material. CONSTITUTION: A movable tweezer arm includes a plurality of object transferring arms and a plurality of plates for controlling foreign material. The plurality of object transferring arms(112,122) are used for loading stably a plurality of objects(110,120). The plates(114,124) are installed between the object transferring arms to protect each object from foreign material.

Description

이물 제어용 분리판을 적용한 이동용 핀셋암{MOVABLE PINCETTE ARM INCORPORATING THEREIN SEPARATION PLATE FOR CONTROLLING FOREIGN MATERIAL}MOVABLE PINCETTE ARM INCORPORATING THEREIN SEPARATION PLATE FOR CONTROLLING FOREIGN MATERIAL}

본 발명은 반도체 소자의 제조 장비에 관한 것으로서, 보다 상세하게는, 이동용 핀셋암 사이에 이물 제어용 분리판을 형성함으로써 대상물을 동시에 진행하는 것이 가능하도록 하는 이물 제어용 분리판을 적용한 이동용 핀셋암에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a manufacturing device for a semiconductor device, and more particularly, to a moving tweezers arm to which a separating plate for controlling foreign matters is made possible to simultaneously advance an object by forming a separating plate for controlling foreign matter between moving tweezers arms. .

도 1 내지 도 3은 종래의 이동용 핀셋암을 설명하기 위한 평면도 및 단면도들을 도시한다.1 to 3 show a plan view and cross-sectional views for explaining a conventional tweezers arm for movement.

도면에 도시한 바와 같이, 대상물 이동용 로봇에는 여러 개의 이동 대상물(10, 20)을 이동시키기 위해 2개 이상의 대상물 이동용 암(12, 22)이 장착되어 있다. 즉, 진행 시간을 단축시키기 위하여 대상물 이동용 암(12, 22)에는 동시에 2개 이상의 이동 대상물(10, 20)이 위치할 수 있다.As shown in the figure, the object moving robot is equipped with two or more object moving arms 12 and 22 to move several moving objects 10 and 20. That is, two or more moving objects 10 and 20 may be simultaneously positioned on the object moving arms 12 and 22 to shorten the progress time.

하지만, 이러한 경우에는 상부 대상물 이동용 암(12)에 이동용 대상물(10)이 놓인 상태에서 상부 대상물 이동용 암(12)이 이동을 진행할 경우에, 이동용 대상물(10)의 하부면에 붙어 있던 이물(foreign material)이 이동시의 작은 외부의충격이나 진동에 의하여 떨어질 수 있으며, 이때 하부 대상물 이동용 암(22) 상에 이동용 대상물(20)이 위치하고 있는 경우에는 상부 대상물 이동용 암(12)으로부터 떨어진 이물이 하부 이동 대상물(20) 상에 달라붙어 불량을 유발시킬 수 있는 문제점이 존재하였다.However, in this case, when the upper object moving arm 12 moves in the state in which the moving object 10 is placed on the upper object moving arm 12, a foreign object (foreign) adhered to the lower surface of the moving object 10. The material may fall by a small external shock or vibration during the movement, and in this case, when the moving object 20 is located on the lower object moving arm 22, the foreign material separated from the upper object moving arm 12 moves downward. There was a problem that can cause a defect by sticking on the object 20.

또한, 이러한 이유로 종래의 암 구조에서는 2개 이상의 대상물 이동용 암을 장착하여 2개 이상의 이동 대상물을 동시에 이동시킨다는 것은 현실적으로 불가능하였다.For this reason, in the conventional arm structure, it is practically impossible to mount two or more moving objects for moving two or more moving objects at the same time.

도 4는 전술한 종래의 이동용 핀셋암의 설명을 돕기 위하여 촬영한 실제의 다수개의 이동용 암을 장착하는 대상물 이동용 로봇을 나타낸다.FIG. 4 shows a robot for moving an object equipped with a plurality of actual moving arms photographed to help explain the aforementioned conventional moving tweezers arm.

본 발명은 상기와 같은 문제점을 해결하기 위해 창작된 것으로서, 본 발명의 주목적은 상부 대상물 이동용 암에서 발생한 이물이 하부 이동 대상물에 달라 붙지 않도록 암간에 이물 방지용 분리판을 형성함으로써, 상부 대상물 이동용 암에서 발생한 이물이 하부 이동 대상물에 달라붙지 않고 분리판에 떨어짐으로써, 2개 이상의 이동 대상물을 동시에 이동시킬 수 있는 이물 제어용 분리판을 적용한 이동용 핀셋암을 제공하는 것이다.The present invention has been created to solve the above problems, the main object of the present invention by forming a foreign matter separation plate between the arms to prevent foreign matter generated in the upper object moving arm to adhere to the lower moving object, in the upper object moving arm It is to provide a moving tweezers arm to which the foreign matter control separation plate that can move two or more moving objects at the same time by falling to the separating plate without sticking to the lower moving object.

도 1은 종래의 이동용 핀셋암을 설명하기 위한 평면도를 도시한다.1 is a plan view illustrating a conventional tweezers arm for movement.

도 2 및 도 3은 종래의 이동용 핀셋암을 설명하기 위한 단면도들을 도시한다.2 and 3 show cross-sectional views for explaining a conventional tweezers arm for movement.

도 4는 종래의 이동용 핀셋암을 설명하기 위한 사진을 도시한다.Figure 4 shows a photograph for explaining a conventional tweezers arm for movement.

도 5는 본 발명의 바람직한 실시예에 따른 이물 제어용 분리판을 적용한 이동용 핀셋암을 설명하기 위한 평면도를 도시한다.FIG. 5 is a plan view for explaining a moving tweezers arm to which a foreign matter control separation plate according to a preferred embodiment of the present invention is applied.

도 6 및 도 7은 본 발명의 바람직한 실시예에 따른 이물 제어용 분리판을 적용한 이동용 핀셋암을 설명하기 위한 단면도들을 도시한다.6 and 7 are cross-sectional views for explaining a movable tweezers arm to which the separating plate for controlling foreign matter according to an embodiment of the present invention.

도 8는 본 발명의 바람직한 실시예에 따른 이물 제어용 분리판을 적용한 이동용 핀셋암을 설명하기 위한 사진을 도시한다.8 is a photograph for explaining a moving tweezers arm to which the separation plate for controlling the foreign matter according to a preferred embodiment of the present invention.

도 9는 본 발명의 다른 바람직한 실시예에 따른 이물 제어용 분리판을 적용한 이동용 핀셋암을 설명하기 위한 단면도를 도시한다.9 is a cross-sectional view for explaining a moving tweezers arm to which the foreign matter control separating plate according to another preferred embodiment of the present invention.

- 도면의 주요부분에 대한 부호의 설명 --Explanation of symbols for the main parts of the drawings-

110, 122 : 이동 대상물 112, 12 : 대상물 이동용 암110, 122: moving object 112, 12: arm for moving the object

114, 124 : 이물 제어용 판114, 124: foreign material control plate

116 : 상부 대상물에서 발생한 이물116: foreign matter arising from the upper object

상기와 같은 목적을 실현하기 위한 본 발명은 다수의 이동 대상물을 안착시킬 수 있는 다수의 대상물 이동용 암과, 다수의 대상물 이동용 암사이에 설치되는 다수의 이물 제어용 분리판을 포함하는 것을 특징으로 하는 이물 제어용 분리판을 적용한 이동용 핀셋암을 제공한다.The present invention for realizing the above object is a foreign material control for comprising a plurality of object moving arm that can seat a plurality of moving objects, and a plurality of foreign material control separation plate installed between the plurality of object moving arm. Provides a movable tweezers arm with a separator.

이하, 본 발명의 바람직한 실시예를 첨부된 도면을 참조하여 설명한다. 또한 본 실시예는 본 발명의 권리범위를 한정하는 것은 아니고, 단지 예시로 제시된 것이다.Hereinafter, exemplary embodiments of the present invention will be described with reference to the accompanying drawings. In addition, this embodiment is not intended to limit the scope of the present invention, but is presented by way of example only.

도 5 내지 도 7은 본 발명의 바람직한 실시예에 따른 이물 제어용 분리판을 적용한 이동용 핀셋암을 설명하기 위한 평면도 및 단면도들을 도시한다.5 to 7 are plan views and cross-sectional views for explaining the movable tweezers arm to which the foreign matter control separating plate according to the preferred embodiment of the present invention is applied.

도 5내지 도 7에 도시한 바와 같이, 대상물 이동용 로봇에는 여러 개의 이동 대상물(110, 120)을 이동시키기 위해 2개 이상의 대상물 이동용 암(112, 122)이 장착되어 있다. 즉, 진행 시간을 단축시키기 위하여 대상물 이동용 암(112, 122)에는 동시에 2개 이상의 이동 대상물(110, 120)이 위치할 수 있다.5 to 7, the object moving robot is equipped with two or more object moving arms 112 and 122 to move several moving objects 110 and 120. That is, two or more moving objects 110 and 120 may be simultaneously located on the object moving arms 112 and 122 to shorten the progress time.

본 발명의 바람직한 실시예에 의하면, 이동용 로봇에 장착된 대상물 이동용 암(112, 122)에 위치하는 이동 대상물(110, 120)을 동시에 이동시키기 위해서 적어도 2개 이상의 대상물 이동용 암(112, 122)이 장착되어 있다. 이러한 이동용 로봇에 장착된 대상물 이동용 암(112, 122)은 이동 대상물(110, 120)을 이동시키기 위해서 움직이게 되는데, 이때 상부 대상물 이동용 암(112)에 이동용 대상물(110)이 놓인 상태에서 상부 대상물 이동용 암(112)이 이동을 진행할 경우에, 이동용 대상물(110)의 하부면에 붙어 있던 이물(foreign material)이 이동시의 작은 외부의 충격이나 진동에 의하여 떨어질 수 있다.According to a preferred embodiment of the present invention, at least two object moving arms (112, 122) to move the moving object (110, 120) located in the object moving arms (112, 122) mounted on the mobile robot at the same time It is installed. The object moving arms 112 and 122 mounted on the mobile robot are moved to move the moving objects 110 and 120, wherein the moving object 110 is placed on the upper object moving arm 112 to move the upper object. When the arm 112 moves, the foreign material adhering to the lower surface of the moving object 110 may fall off due to a small external shock or vibration during the movement.

하지만, 본 발명의 바람직한 실시예에 따르면, 전술한 과정에서 이물이 하부 대상물 이동용 암(112)에 위치하는 하부 이동 대상물(120)에 직접 떨어지는 것을 방지하기 위하여 암간에 이물 제어용 분리판(114, 124)을 설치하였다.However, according to a preferred embodiment of the present invention, in order to prevent the foreign matter falls directly on the lower moving object 120 located on the lower object moving arm 112 in the above-described process, the foreign matter control separating plates 114 and 124 between the arms. ) Was installed.

따라서, 상부 대상물 이동용 암(112)으로부터 떨어진 이물이 이물 제어용 분리판(114, 124) 상에 떨어짐으로써, 하부 이동 대상물(120) 상에 달라붙어 불량을 유발시키는 것을 방지시킬 수 있게되어 하부에 놓인 이동 대상물(120)은 이물로부터 안전한 상태가 된다.Therefore, foreign matters falling from the upper object moving arm 112 may fall on the foreign material control separating plates 114 and 124, thereby preventing them from sticking to the lower object moving object 120 and causing a defect to be placed on the lower part. The moving object 120 is in a safe state from foreign objects.

도 8는 본 발명의 바람직한 실시예에 따른 이물 제어용 분리판을 적용한 이동용 핀셋암을 보다 실제적으로 설명하기 위하여 촬영한 사진을 도시한다.8 is a photograph taken to explain in more detail the movable tweezers arm to which the foreign matter control separation plate according to the preferred embodiment of the present invention is applied.

도 9는 본 발명의 다른 바람직한 실시예에 따른 이물 제어용 분리판을 적용한 이동용 핀셋암을 설명하기 위한 단면도를 도시한다.9 is a cross-sectional view for explaining a moving tweezers arm to which the foreign matter control separating plate according to another preferred embodiment of the present invention.

본 발명의 다른 바람직한 실시예는 상부 대상용 암(212)의 위에도 이물제어용 분리판(214)가 설치되어 외부로부터 발생된 이물이 상부 대상물 이동용 암(212) 상에 위치하는 이동 대상물(210) 상에 떨어지는 것을 방지할 수 있다는 점 이외에는 전술한 본 발명의 바람직한 제 1 실시예와 동일하다.According to another exemplary embodiment of the present invention, the foreign matter control separation plate 214 is installed on the upper object arm 212 so that foreign substances generated from the outside are positioned on the upper object moving arm 212 on the moving object 210. The same as the first preferred embodiment of the present invention described above except that it can be prevented from falling.

본 발명의 제 1 및 제 2의 바람직한 실시예에 따르면, 상기 이동용 핀셋암은 반도체 공정 중에 웨이퍼 공정에서 웨이퍼 로딩 장치 및 언로딩(unloading) 장치, 마스크 제작공정, 액정판넬 제조공정, 어셈블리 공정에서의 다이 로딩 및 언로딩 장치등에 적용할 수 있는 것을 특징으로 한다.According to the first and second preferred embodiments of the present invention, the movable tweezers arm is used in a wafer loading device and an unloading device, a mask fabrication process, a liquid crystal panel manufacturing process, an assembly process in a wafer process during a semiconductor process. It can be applied to die loading and unloading devices.

또한, 본 발명은 공정을 진행하는 장비, 분석 장비, 측정 장비 등의 대상물이동용 로봇에 적용할 수 있는 것을 특징으로 한다.In addition, the present invention is characterized in that it can be applied to the robot for moving objects, such as equipment, analytical equipment, measuring equipment to proceed the process.

본 발명을 본 명세서 내에서 몇몇 바람직한 실시예에 따라 기술하였으나, 당업자라면 첨부한 특허 청구 범위에서 개시된 본 발명의 진정한 범주 및 사상으로부터 벗어나지 않고 많은 변형 및 향상이 이루어질 수 있다는 것을 알 수 있을 것이다.While the invention has been described in accordance with some preferred embodiments herein, those skilled in the art will recognize that many modifications and improvements can be made without departing from the true scope and spirit of the invention as set forth in the appended claims.

상기한 바와 같이, 본 발명은 이물 제어용 분리판을 이용하여 이물을 제어함으로써, 2개 이상의 이동 대상물을 동시에 진행하는 것이 가능하게 되는 효과가 있다.As described above, the present invention has the effect that it is possible to advance two or more moving objects at the same time by controlling the foreign matter using the foreign matter control separation plate.

또한, 본 발명은 이물 제어용 분리판을 적용함으로써, 상부 이동 대상물에서 발생한 이물뿐만 아니라 상부에서 떨어질 수 있는 모든 이물에 대해 안전해 질 수 있는 효과가 있다.In addition, the present invention has an effect that can be safe for all the foreign matter that can fall from the upper portion as well as the foreign substance generated in the upper moving object by applying the separation plate for controlling the foreign matter.

그리고, 본 발명은 이물 제어용 분리판을 적용함으로써, 해당 장비의 진행 능력을 2배 이상으로 향상시킬 수 있는 효과가 있다.In addition, the present invention has the effect of improving the advancing capacity of the equipment by more than twice, by applying the separation plate for controlling foreign matter.

Claims (4)

다수의 이동 대상물을 안착시킬 수 있는 다수의 대상물 이동용 암과,A plurality of object moving arms capable of seating a plurality of moving objects, 상기 다수의 대상물 이동용 암사이에 설치되는 다수의 이물 제어용 분리판을A plurality of foreign matter control separation plate installed between the plurality of object movement arm 포함하는 것을 특징으로 하는 이물 제어용 분리판을 적용한 이동용 핀셋암.A movable tweezers arm to which a separation plate for controlling foreign matters is included. 제 1 항에 있어서,The method of claim 1, 상기 다수의 대상물 이동용 암 중에서 가장 상부에 있는 대상물 이동용 암의 위에도 이물 제어용 분리판을 설치하는 것을 특징으로 하는 이물 제어용 분리판을 적용한 이동용 핀셋암.The tweezers arm to which the foreign matter control separator is applied is installed on the object movement arm at the top of the plurality of object movement arms. 제 1 항에 있어서,The method of claim 1, 상기 이동용 핀셋암은 반도체 공정 중에 웨이퍼 공정에서 웨이퍼 로딩 장치 및 언로딩(unloading) 장치, 마스크 제작공정, 액정판넬 제조공정, 어셈블리 공정에서의 다이 로딩 및 언로딩 장치등에 적용할 수 있는 것을 특징으로 하는 이물 제어용 분리판을 적용한 이동용 핀셋암.The movable tweezers arm can be applied to a wafer loading device and an unloading device, a mask fabrication process, a liquid crystal panel manufacturing process, a die loading and unloading device in an assembly process, etc. in a wafer process during a semiconductor process. Mobile tweezers arm with foreign material control plate. 제 1 항에 있어서,The method of claim 1, 공정을 진행하는 장비, 분석 장비, 측정 장비 등의 대상물 이동용 로봇에 적용할 수 있는 것을 특징으로 하는 이물 제어용 분리판을 적용한 이동용 핀셋암.A tweezers arm for moving a foreign matter control separation plate, which is applicable to robots for moving objects, such as equipment, analytical equipment, and measuring equipment, which are in progress.
KR1020030044018A 2003-06-30 2003-06-30 Movable pincette arm incorporating therein separation plate for controlling foreign material KR20050003298A (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11251400A (en) * 1998-03-04 1999-09-17 Hitachi Ltd Semiconductor manufacture device, transportation method for semiconductor wafer using the same and manufacture of semiconductor integrated circuit device
JP2000040730A (en) * 1998-07-24 2000-02-08 Dainippon Screen Mfg Co Ltd Substrate transfer device and substrate treatment device
JP2001319957A (en) * 2000-05-02 2001-11-16 Tokyo Electron Ltd Substrate transfer and device therefor
JP2003092335A (en) * 2001-09-18 2003-03-28 Toshiba Corp Substrate carrying apparatus, substrate processing apparatus using the same and substrate processing method

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11251400A (en) * 1998-03-04 1999-09-17 Hitachi Ltd Semiconductor manufacture device, transportation method for semiconductor wafer using the same and manufacture of semiconductor integrated circuit device
JP2000040730A (en) * 1998-07-24 2000-02-08 Dainippon Screen Mfg Co Ltd Substrate transfer device and substrate treatment device
JP2001319957A (en) * 2000-05-02 2001-11-16 Tokyo Electron Ltd Substrate transfer and device therefor
JP2003092335A (en) * 2001-09-18 2003-03-28 Toshiba Corp Substrate carrying apparatus, substrate processing apparatus using the same and substrate processing method

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