JP2000040730A - Substrate transfer device and substrate treatment device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable a substrate to ascend or descend at high speed, while preventing the substrate lifting and particles from being attached to it. SOLUTION: Cover members 71, 72, and 73 are provided above and below substrates Wa and Wb, which are stacked up in layers respectively. The cover members 72 and 73, each located below the substrates Wa and Wb, serve to prevent the boards Wa and Wb from levitating and particles from adhering to the undersides of the substrates Wa and Wb when the substrates are made to descend, and also serve to prevent particles contained in air flows that flow under the substrates from adhering to the undersides of the substrates when the substrates are made to ascend, whereby the substrates can be transferred at a high speed. The cover members 71 and 72, each located above the substrates Wa and Wb, serve to prevent the particles from being attached to the upsides of the substrates Wa and Wb, and the substrates Wa and Wb can be transferred at a high speed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a semiconductor wafer, a glass substrate for a liquid crystal display, a glass substrate for a photomask,
The present invention relates to a substrate transfer device for transferring a substrate such as an optical disk substrate (hereinafter, referred to as a “substrate”) and a substrate processing apparatus using the same.

[0002]

2. Description of the Related Art In such a substrate processing apparatus, a plurality of substrate processing units for performing a predetermined processing on a substrate are provided. The transfer of the substrate is performed. further,
In order to suppress an increase in the area occupied by the substrate processing apparatus in a plane (hereinafter, referred to as a “footprint”), there is also a type in which the plurality of substrate processing units are vertically stacked in multiple stages. . In this case, the transfer of the substrate between the respective substrate processing units has a large moving distance in the vertical direction, and the time required for the vertical movement has a great influence on the time required for the substrate transfer, and thus the required time of the entire substrate processing apparatus. Processing time will be affected. As described above, since the elevating speed of the substrate transfer means is closely related to the required time of the substrate transfer, if the lowering speed of the substrate transfer means is restricted, it becomes a factor that limits the improvement of the throughput in the substrate processing apparatus.

[0003]

However, if the moving speed at the time of lowering the substrate is increased in order to shorten the time required for moving up and down in the substrate processing, there is a problem that the substrate held by the substrate holding arm rises. there were.
This is because when the substrate transport means descends with a large descending speed, a pressure difference occurs around the substrate held on the substrate holding arm, and the airflow around the substrate holding arm flows into the lower part of the substrate. Are floating on the substrate holding arm. If the substrate is lifted, the substrate may fall, or the substrate may be damaged when re-contacting the holding arm.

[0004] In addition, when the substrate is moved up and down, there is another problem that particles carried by the air current generated toward the substrate adhere to the substrate surface on the negative pressure side. For example,
When the substrate transfer means rises with a large ascending speed, a pressure difference is generated around the substrate held on the substrate holding arm, and the airflow around the substrate holding arm flows into the lower part of the substrate, so that the lower surface of the substrate is Particles sometimes adhered.

There is also a problem that particles carried by an air current generated toward the substrate when the substrate is lifted adhere to the upper surface of the substrate.

SUMMARY OF THE INVENTION In view of the above problems, it is a first object of the present invention to provide a substrate transfer device capable of preventing a substrate from rising and descending at a high speed.

A second object of the present invention is to provide a substrate transfer apparatus capable of preventing particles from adhering and moving up and down at a high speed.

[0008]

According to a first aspect of the present invention, there is provided a substrate transfer apparatus having a degree of freedom of elevation, wherein (a) each holds a substrate substantially horizontally. A plurality of arms that are capable of being stacked at a distance from each other, and (b) disposed below each of the plurality of arms, and a substrate holding space of each arm when the plurality of arms move up and down. And a plurality of lower cover members that cover the lower side.

According to a second aspect of the present invention, there is provided a substrate transfer apparatus having a degree of freedom in elevating and lowering, wherein (a) each of them can hold a substrate substantially horizontally, and is stacked at a distance from each other. A plurality of arms, and (b) a plurality of upper cover members disposed above each of the plurality of arms and covering an upper side of the substrate holding space of each arm when the plurality of arms are moved up and down. It is characterized by.

According to a third aspect of the present invention, there is provided a substrate transfer apparatus having a degree of freedom in elevating and lowering, wherein (a) each of them can hold a substrate substantially horizontally, and is stacked at a distance from each other. A plurality of upper cover members disposed above each of the plurality of arms, and covering an upper side of the substrate holding space of each arm when the plurality of arms are raised and lowered, (c) A plurality of lower cover members disposed below each of the plurality of arms and covering a lower side of the substrate holding space of each arm when the plurality of arms are moved up and down.

According to a fourth aspect of the present invention, in the substrate transfer apparatus according to the third aspect, a lower cover member of an upper arm present above the plurality of arms is provided with a lower cover member of the upper arm. It is characterized by being also used as an upper cover member for a lower arm present immediately below.

According to a fifth aspect of the present invention, there is provided a substrate transfer apparatus having a degree of freedom in elevating and lowering, wherein (a) an elevating table driven up and down by a predetermined driving means, and (b) each of which substantially moves the substrate. A plurality of arms that can be held horizontally and are stacked and arranged above the elevating platform, and are moved up and down together with the elevating platform, and (c) disposed in a gap between the plurality of arms, And a cover member that covers the substrate holding space of each arm when the arms are moved up and down.

According to a sixth aspect of the present invention, there is provided a substrate processing apparatus comprising: (a) the substrate transfer apparatus according to any one of the first to fifth aspects; and (b) a plurality of unit processing units stacked and arranged on each other. A substrate processing unit for performing a predetermined process on the substrate transported by the substrate transport apparatus.

[0014]

DESCRIPTION OF THE PREFERRED EMBODIMENTS <1. Overall Configuration of Substrate Processing Apparatus>
FIG. 1A is a plan view of a substrate processing apparatus in which a substrate transfer apparatus according to an embodiment of the present invention is incorporated as a transfer robot TR1, and FIG. 1B is a front view of the apparatus of FIG. It is. In FIG. 1, an XYZ orthogonal coordinate system is added to clarify the directional relationship. Here, the horizontal plane parallel to the floor is defined as the XY plane, and the vertical direction is defined as the Z direction.

As shown in FIG. 1, in the present embodiment, the substrate processing apparatus comprises an indexer I which carries in and out a substrate.
D, a plurality of processing units for performing processing on the substrate, and a unit arrangement section MP in which substrate transport means for transporting the substrate to each processing unit are arranged, and a substrate is loaded between an exposure apparatus (not shown) and the unit arrangement section MP. / Interface IF provided for carrying out.

The unit disposition portion MP has a chemical cabinet 11 at the lowermost portion for storing a tank for storing a medicine, a pipe, and the like. As processing units, there are disposed coating processing units SC1 and SC2 (spin coater) for performing a resist coating process while rotating the substrate, and development processing units SD1 and SD2 (spin developer) for performing a developing process on the exposed substrate. . Further, above these liquid processing units, a multi-stage heat treatment unit 20 for performing heat treatment on the substrate is disposed at the front and rear of the apparatus. In addition, a cleaning liquid such as pure water is supplied to the substrate as a substrate processing unit between the two coating processing units SC1 and SC2 on the front side (negative direction side in the Y direction) of the apparatus to rotate and clean the substrate. A cleaning unit SS (spin scrubber) is provided.

At the center of the apparatus sandwiched between the coating units SC1 and SC2 and the developing units SD1 and SD2,
A transfer robot TR1 is disposed as a substrate transfer device for accessing all the surrounding processing units and transferring the substrate between them. This transfer robot TR
Numeral 1 is movable in the vertical direction (that is, has a degree of freedom of elevation) and is rotatable about a central vertical axis. The transfer robot TR1 will be further described later.

At the top of the unit arrangement section MP,
A filter fan unit FFU for forming a clean air downflow is provided. Immediately below the multi-stage heat treatment unit 20, a filter fan unit FFU that forms a downflow of clean air is provided on the liquid treatment unit side.

FIG. 2 is a diagram for explaining the arrangement of the processing units shown in FIG. Above the coating unit SC <b> 1, a six-stage heat treatment unit is disposed as the multi-stage heat treatment unit 20. Of these, a cool plate portion CP1 for cooling the substrate is provided at the position of the first stage counted from the lowest stage, and the cool plate portions CP2 and CP3 are similarly provided for the second and third stages. Is provided. The fourth stage is provided with an adhesion strengthening part AH for strengthening the adhesion between the substrate surface and the treatment liquid applied to the substrate surface. The hot plate units HP1 and HP2 for performing the processing are provided.

A heat treatment unit having a six-stage structure is disposed above the coating treatment unit SC2 as the multi-stage heat treatment unit 20. Of these, cool plate portions CP4 to CP6 are provided at the first to third positions from the bottom, and hot plate portions HP3 to HP5 are provided at the fourth to sixth positions. ing.

Above the development processing unit SD1, a four-stage heat treatment unit is arranged as the multi-stage heat treatment unit 20. Of these, cool plate portions CP7 and CP8 are provided at the first and second positions from the bottom, and hot plate portions HP6 and HP7 are provided at the third and fourth positions. I have. It should be noted that the uppermost 2
Although the stage is empty in the case of the apparatus of the present embodiment, a hot plate unit, a cool plate unit, or another heat treatment unit can be incorporated depending on the use and purpose.

Above the development processing unit SD2, a two-stage heat treatment unit is disposed as the multi-stage heat treatment unit 20. Of these, a cool plate portion CP9 is provided at the first stage position from the lowermost stage, and a post-exposure bake plate portion PEB for performing post-exposure baking processing on the substrate is provided at the second stage position. Is provided.
Also in this case, the upper side of the post-exposure bake plate portion PEB is empty, but a hot plate portion, a cool plate portion, or another heat treatment unit can be incorporated according to the application and purpose.

A predetermined processing can be performed on the substrate by sequentially transferring the liquid processing unit and the heat treatment unit by the transfer robot TR1 provided at the center of the unit arrangement part MP.

The interface IF has a function of temporarily stocking the substrate on which the resist application has been completed in the unit arrangement section MP so that the substrate can be transferred to the exposure apparatus or the exposed substrate can be received from the exposure apparatus. Although not shown, the robot includes a robot that transfers a substrate to and from the transfer robot TR1, and a buffer cassette that places the substrate.

<2. Configuration of Transfer Robot> Next, the transfer robot TR1 will be described. FIG. 3 is an external perspective view of the transport robot TR1. This transfer robot TR1
Are a pair of arms 31a, each holding a substrate W,
A horizontal moving mechanism that expands and contracts 31b and moves it in the horizontal direction;
A rotation drive mechanism for rotating about a vertical axis.
These mechanisms allow the arms 31a and 31b to move three-dimensionally.

The telescopic elevating mechanism of the transport robot TR1 is a telescopic type telescopic mechanism, in which the cylindrical link 41d can be stored in the cylindrical link 41c, and the cylindrical link 41c can be stored in the cylindrical link 41b. The cylindrical link 41b can be stored in the cylindrical link 41a. When the arms 31a and 31b are lowered, the cylindrical links can be sequentially stored. When the arms 31a and 31b are raised, the stored cylindrical links are sequentially stored. It is realized to be drawn out. This elevating operation is realized by interlockingly raising and lowering each of the cylindrical links 41a to 41c by the drive motor and the wire connection.

The transfer robot TR1 is mounted on a base 44.
The rotation drive mechanism is installed on the base and can rotate around the center of the base 44 as an axis.
In addition, in the state fixed to the base 44, the fixed cylindrical member 4
3 is attached.

Next, the arm 31 of the transport robot TR1
a and 31b will be described. Two arms 31a, 3
1b is mounted on the lifting platform 35. In addition,
The elevating table 35 is fixed to the upper surface of the cylindrical link 41a located at the top of the telescopic mechanism.

FIG. 4 is a diagram showing the structure of the arms 31a and 31b. Each of the arms 31a and 31b bends and stretches, and the first arm 31a and 31b connected to the distal end side of each of the arms 31a and 31b.
The arm segments 34a and 34b are respectively
5. Go straight in the horizontal direction while maintaining the posture with respect to 5. The first arm segments 34a and 34b are connected to the second arm segments 33a and 33b, and the second arm segments 33a and 33b are connected to the third arm segment 3.
2a and 32b. Each arm segment is configured not to interfere with each other in the operation of the arms 31a and 31b. When the arms 31a and 31b are alternately bent and stretched, the first arm segments 34a and 34b take out the processed substrate in the processing unit at the front and carry the unprocessed substrate W into the processing unit. can do.

Thus, the transfer robot TR1 is
A horizontal movement mechanism for moving the pair of arms 31a and 31b holding the substrate W in the horizontal direction by expanding and contracting, a telescopic elevating mechanism for moving in the vertical direction while expanding and contracting, and a rotation driving mechanism for rotating around the vertical axis are provided. With these mechanisms, the arms 31a and 31b can move three-dimensionally, and can transfer the substrate W to an arbitrary processing unit.

FIG. 5 is a view showing a state of the arms 31a and 31b when the arms 31a and 31b are moved up and down (vertically) by the above-mentioned telescopic elevating mechanism.

In the case of the device of this embodiment, the arm 31
Since a and 31b alternately hold the substrate when the substrate is taken in and out of each processing unit, they do not simultaneously hold the substrate. Therefore, each arm 31a, 31
b, each substrate W
The description will be continued while defining the space occupied by a and Wb as the substrate holding spaces Sa and Sb. FIG. 4 shows a state in which the substrate Wb is actually held by the lower arm 31b, and a state in which the substrate Wa is held by the upper arm 31a is drawn by a virtual line. At another point of the substrate transfer, the substrate Wa is actually held by the arm 31a, and the arm 31b does not hold the substrate Wb. In the following description, it is mainly assumed that the substrate Wa is actually held on the upper arm 31a.
The basic principle is the same in the case where 1b is holding the substrate Wb.

As shown in FIG. 5, the arm 3
1a and 31b are both in a contracted state, and the substrate holding spaces Sa and Sb are in a state of being stacked facing each other at a predetermined interval. And each arm 31
A cover part 70 as shown in FIG. 6 is provided so as to cover the substrate holding spaces Sa and Sb of a and 31b. In addition,
3 to 5, the cover 70 is not shown for simplicity, but actually, as shown in FIG. 7, the cover 70 is provided.

FIG. 7 shows the arm 3 on the lift 35.
The substrate holding spaces Sa and Sb of 1a and 31b are
FIG. The cover 70
It has a structure in which three plate-like cover members 71, 72, 73 capable of covering a portion where the substrate W is held are laminated, and the cover members 71, 72, 73 are arranged substantially parallel to each other. Is done. Then, each of the cover members 71, 72, 73
Are connected to and fixed to the support 70b, and the support 70b is fixed to the lift 35.
As described above, the cover 70 is fixed to the lift 35.

FIG. 8 is a front view of the arms 31a and 31b and the cover 70 as viewed from the direction of arrow AR1 (see FIG. 7). FIG. 9 is an arm as viewed from the direction of arrow AR2 (see FIG. 7). It is a side view of 31a, 31b and the cover part 70.

As shown in FIGS. 8 and 9, the cover member 71 is connected to the first arm segment 34a of the arm 31a.
The substrate Wa is positioned above the substrate Wa held by the substrate Wa, and is disposed so as to face and cover the upper surface of the substrate Wa (therefore, the substrate holding space Sa). Also, the cover member 7
2 is located above the substrate holding space Sb in the first arm segment 34b of the arm 31b, and the substrate Wb
Is held so as to face and cover the upper surface thereof (therefore, the substrate holding space Sb). The first arm segments 34a and 34b have a substrate holding part HD (see FIG. 5) for holding the substrate, and the substrate holding part HD is a portion corresponding to the outer peripheral part of the substrate W (Wa, Wb). Has a tapered portion TP. By placing the edge of the substrate W on the tapered portion TP,
The substrate W is held (see FIG. 10). In addition, FIG.
FIG. 9 is an enlarged view of first arm segments 34a and 34b shown in FIG.

Further, as shown in FIGS. 7 and 8, the cover member 73 is attached to the first arm segment 3 of the arm 31b.
4b is located below the substrate holding space Sb and is arranged to cover the lower surface of the substrate holding space Sb. The cover member 72 is located below the substrate Wa held by the first arm segment 34a of the arm 31a (and thus below the substrate holding space Sa).
It can be said that it is arranged so as to cover the lower surface of a. Therefore, as described later, in this embodiment, the cover member 72 is also used as a lower cover member for the substrate Wa.

The first arm segment 34a is connected via a connecting portion J having a U-shape (see FIG. 8).
It is connected to the second arm segment 33a to prevent interference with the cover members 72, 73 and the like due to the horizontal movement of the arm 31a. Similarly, the first arm segment 3
4b is connected to the second arm segment 33b via a connection portion J having a U-shape, and the arm 3
Interference with the cover member 73 and the like due to the horizontal movement of 1a and 31b is prevented. Thus, the arms 31a, 31
b can move horizontally without interfering with other members.

<3. Operation of Transfer Robot> FIGS. 11 and 12 are diagrams for explaining the elevating operation of the transfer robot TR1. FIG. 11 shows the transfer robot TR1 accessing the liquid processing unit, and FIG. It shows how to do.

First, as shown in FIG. 11, when the transport robot TR1 accesses the liquid processing unit, the telescopic type telescopic elevating mechanism 40 is in a contracted state, and the arms 31a and 31b are at a predetermined height from the liquid processing unit. The height is adjusted so that the substrate can be transferred at the position P1. Then, the arms 31a and 31b are rotated around the vertical axis by the rotation drive mechanism of the transport robot TR1 so as to face the target liquid processing unit, and the arms 31a and 31b are alternately expanded and contracted by the horizontal movement mechanism and the liquid processing unit is rotated. (For example, SC1) to transfer the substrate. Specifically, when the arm 31a holds an unprocessed substrate, the substrate that has been processed by the other arm 31b is removed from the liquid processing unit, and then the arm 31a is inserted into the liquid processing unit to process the unprocessed substrate. Carry in the unit.

On the other hand, as shown in FIG. 12, when the transport robot TR1 accesses the multi-stage heat treatment unit 20, the telescopic telescopic elevating mechanism 40 is in an extended state. When accessing the heat treatment unit (for example, HP2) provided at the uppermost stage of the multi-stage heat treatment unit 20, the arms 31a and 31b can transfer the substrate with the heat treatment unit at a predetermined height position P2. Height adjusted. In addition, the delivery of the board,
This is performed in the same manner as the access to the liquid processing unit.

As described above, the first arm segment 34
The substrate held by using a and b alternately is transported to a plurality of substrate processing units stacked in multiple stages. The vertical movement at the time of transporting the substrate is performed by a telescopic lifting mechanism 40.
Here, the moving distance in the transfer, particularly the moving distance in the vertical direction, is large, and it is desirable to move at high speed in order to shorten the transfer time of the substrate. Hereinafter, a state near the substrate W at the time of the vertical movement will be described. In any case, when performing the elevating operation while holding the substrate, the arms 31a and 31b are in a contracted state, and the upper and lower portions of the substrate holding spaces Sa and Sb (FIG. 8) are covered with cover members. 71
To 73.

<When the substrate is lowered> First, when the substrate is lowered, for example,
The case where the substrate W descends from the state shown in FIG. 12 to the state shown in FIG. 11 will be described below.

FIG. 13 is a conceptual diagram showing a relative air flow generated when the substrate W descends in the direction of arrow AD. FIG.
3 (c), the first arm segments 34a, 3a
4b, a substrate W held on one side, a cover member CU disposed above the substrate W, and a cover member C disposed below the substrate W
L, for example, the first arm segment 3
4B shows a substrate Wb (see FIG. 8) held by 4b and cover members 72 and 73 located above and below the substrate Wb. Alternatively, the substrate Wa held by the first arm segment 34a
(See FIG. 8) and cover members 71, 7 located above and below
2 is also represented.

FIG. 13A shows a case where no cover member exists as in the prior art. In this case, as described above, when the descending speed is high, the substrate W is moved in the direction of the arrow A1 under the influence of the relative airflow from below the substrate W to the lower surface LS of the substrate W. It may come up. In the drawing, the relative airflow is indicated by a broken line.

FIG. 13B shows a case where a cover member CL is provided below the substrate W. In this case, the airflow from below is blocked by the cover member CL and the influence on the substrate W is reduced, so that the substrate W can be prevented from floating. Further, even if the particles float in the atmosphere, the relative airflow toward the substrate W is reduced by the lower surface L of the substrate W.
Since it does not hit S, particles can be prevented from adhering to the lower surface LS of the substrate W.

As described above, at the time of descending, the cover members CL (72, 73) present below the respective first arm segments 34a, 34b play an important role. Further, the cover members CU (71, 72) existing above the respective substrates W (Wa, Wb) have the following effects.

FIG. 13C shows a case where a cover member CU is further provided above the substrate W. When the cover member CU is not provided, as shown in FIG. 13B, when the substrate is lowered, the upper side of the substrate W has a negative pressure. And flows toward the upper surface US of the substrate W. Then, there is a possibility that particles included in the airflow adhere to the upper surface US of the substrate W. On the other hand, in the case where the cover member CU is provided as shown in FIG. 13C, since the cover member CU prevents this “entangled” airflow from hitting the upper surface US of the substrate W, particles are generated on the upper surface US of the substrate W. Adherence can be prevented.

<When the Substrate is Raised> Next, the operation when the substrate is raised, for example, the operation when the substrate is raised from the state shown in FIG. 11 to the state shown in FIG. 12, will be described below.

FIG. 14 is a conceptual diagram showing an airflow around the substrate W generated when the substrate W rises in the direction of the arrow AU.

FIG. 14A shows a case where no cover member exists as in the prior art. At this time, when the particles float in the atmosphere, the relative airflow toward the substrate W hits the upper surface US of the substrate W, so that the particles may adhere to the upper surface US of the substrate W.
On the other hand, FIG. 14B shows that the cover member CU is
Is shown. In this case, since the cover member CU prevents the influence of the airflow from above, the relative airflow toward the substrate W can be prevented from hitting the upper surface US of the substrate W, so that particles adhere to the upper surface US of the substrate W. Can be prevented.

FIG. 14C shows a case where a cover member CL is further provided below the substrate W. Cover member C
When L is not provided, as shown in FIG. 14B, when the substrate is lifted, a negative pressure is applied to the lower side of the substrate W, so that an air flow that “engages” toward the lower surface LS of the substrate W is generated. Then, it flows toward the lower surface LS of the substrate W. There is a possibility that particles included in this airflow will adhere to the lower surface LS of the substrate W. On the other hand, in the case where the cover member CL is provided as shown in FIG. 14C, the presence of the cover member CL below the substrate W prevents the air flow such as “entangling” from hitting the lower surface LS of the substrate W. Substrate W
Particles can be prevented from adhering to the lower surface LS of the substrate.

Note that each of the cover members 71, 72, 73
It is preferable to be arranged as close as possible to the substrates Wa and Wb, and it is preferable that the substrate is formed in a shape slightly larger than the substrate W according to the shape and size of the substrate W. Thus, the above-described effect obtained by shielding the relative airflow toward the substrate W by the respective cover members 71, 72, 73 can be more effectively obtained.

Further, in the present embodiment, when the substrate is moved up and down in a state where the substrate is actually held in one of the two substrate holding spaces Sa and Sb stacked vertically, Since only one cover member is provided between two substrate holding spaces Sa and Sb adjacent to each other, and the cover member can also serve as both the upper and lower cover members, the configuration is simplified. Can be. For example, the cover member 72 (see FIG. 8)
It functions as the “lower” cover member CL for “a”, but functions as the “upper” cover member CU for the substrate Wb. Therefore, instead of providing a total of four cover members, one on each of the upper and lower sides of the substrate Wa and the substrate Wb, the number of cover members is reduced by one and the three cover members 71, 72, and 73 are replaced. A similar result can be obtained by providing.

As described above, the lifting operation can be performed at a high speed while preventing the floating of the substrate and the adhesion of particles to the substrate.

<4. Modification> In the above embodiment,
Although the case where the cover member is provided for the two substrates W held by each of the two arms has been described, the present invention is not limited to this, and the substrate may be held by each of the three or more arms. The present invention can be applied.
FIG. 15 is a conceptual diagram showing an example of such a case.
The drawing illustrates a case where cover members 71 to 74 are provided on the upper and lower sides of the substrate W (Wa, Wb, Wc) held by the three arms.

Here, in FIG.
However, in this case, since the upper cover member CU for the uppermost substrate Wa does not exist, the effect of the above-described upper cover member CU for the uppermost substrate Wa is reduced. You can't get it. However, even in this case, since the cover member 72 that is the lower cover member CL is present, the effect of the lower cover member CL can be obtained even for the uppermost substrate Wa. It is.

Further, in the above-described embodiment, the cover member CL (7) is also provided below the lowermost substrate W (Wb).
3) was provided. However, when the distance between the lowermost substrate W and the elevator 35 is small and both are close to each other and the elevator 35 plays a role similar to that of the lower cover member CL, the cover member CL is not provided. You may. FIG.
An example is shown in FIG.

FIG. 16 assumes a case where a cover member is provided for a substrate held by three arms, as in the case of FIG. In FIG. 16, cover members 72 and 73 are provided for a substrate W (Wa, Wb, Wc) held by three arms. As compared with the case of FIG. 15, the uppermost substrate Wa
Although the cover member 71 serving as U is not provided, this is the same as described above. Also,
The lowermost substrate Wc is not provided with the cover member 74 serving as the lower cover member CL. However, also in this case, at the time of elevating, since the elevating table 35 existing at a position close to the lowermost substrate Wc plays a role of a cover member CL for the lowermost substrate Wc, the cover member CL The same effect as in the case where it is provided can be obtained. In addition, in FIG.
The arms 31a and 31b can be provided directly on the upper and lower arms 35a.
Function as

Further, in the above embodiment, the cover members 71 to 71 are moved in a retracted state in which the arms are contracted so that the substrate holding spaces Sa and Sb of the arms overlap vertically. Although 73 is stacked and arranged above the elevating table 35, other arrangements may be adopted. For example, when the retreat positions of the plurality of arms during the elevating operation do not coincide with each other in the vertical direction, the upper cover member and / or the lower cover member are disposed for each of the substrate holding spaces at the retreat positions of the respective arms. It is good. However, as in the above embodiment, each arm is contracted so that each substrate holding space is
In the case where the lifting operation is performed in a state in which the arms are vertically overlapped on the cover 5, the cover member can be arranged in the gap between the arms. The number can be reduced.

Further, in the above embodiment, the substrate W
The substrate holding spaces for holding a and Wb are stacked close to each other, and a cover member serving also as the upper cover member CU and the lower cover member CL is provided in the gap between the vertically adjacent substrate holding spaces. I was supposed to place it,
It is not limited to this. The substrates Wa and Wb do not always need to be arranged close to each other, and may be arranged slightly apart in the vertical direction. In this case, as shown in FIG. 17, a cover member CU (CUa, CUb) and a cover member CL (CL) are provided for each of the plurality of substrates W (Wa, Wb).
a, CLb) can provide the same effect as described above.

In the above-described embodiment, as shown in FIG. 6, the cover 70 is formed of three plate-like cover members 7.
Although it has been described that 1, 72, and 73 have a structure that can be attached to the column 70b, the present invention is not limited to this.
For example, as shown in FIG.
0 ′) may be a box shape, and in this case, the rigidity of the cover 70 can be improved. FIG.
Is a front view of the cover part 70 '. In this case, the cover member and the arm can be arranged so as not to interfere with each other by devising the mounting position of the arm and the like. For example, it can be realized by providing an arm having a linear motion joint inside a box-shaped cover.

In the above embodiment, the case where the substrate is carried by the arm having the rotary joint has been described. However, the present invention is not limited to this, and the substrate may be carried by the arm having the direct-acting joint. In this case, interference between the cover member and the arm can be more easily avoided.

In the above embodiment, the transfer robot TR1 of a cylindrical coordinate type is exemplified as the substrate transfer device. However, the present invention is not limited to this, and any substrate transfer device that can move up and down may be used. For example, an orthogonal coordinate type transporting and moving device that can move up and down may be used.

[0065]

As described above, according to the substrate transfer apparatus of the first aspect, the plurality of arms, each of which can hold the substrate substantially horizontally and are stacked at intervals from each other, A plurality of lower cover members disposed below each of the plurality of arms and covering a lower side of the substrate holding space of each arm when the plurality of arms are moved up and down. Therefore, with respect to the substrate held in the substrate holding space, when the substrate is lowered, the substrate is prevented from rising, and when the substrate is raised, particles contained in the airflow flowing toward the lower surface of the substrate are prevented from adhering to the lower surface of the substrate. Thus, the substrate can be transferred at a high speed.

According to the substrate transfer apparatus of the second aspect,
A plurality of arms each capable of holding the substrate substantially horizontally and stacked at intervals from each other, and a plurality of arms arranged above each of the plurality of arms, and a substrate of each arm when the plurality of arms move up and down. A plurality of upper cover members that cover the upper side of the holding space. Therefore, when the substrate is held in the substrate holding space, the particles are prevented from adhering to the upper surface of the substrate when ascending, and
At the time of descending, particles contained in the airflow flowing to the upper surface side of the substrate are prevented from adhering to the upper surface of the substrate, so that the particles do not adhere to the substrate even when the substrate is transported at a high speed.

According to the substrate transfer device of the third aspect,
A plurality of arms, each of which can hold the substrate substantially horizontally, and are stacked at intervals from each other; and A plurality of lower cover members that cover the lower side of the holding space. Therefore, with respect to the substrate held in the substrate holding space, when the substrate is lowered, the substrate is prevented from rising, and when the substrate is raised, particles contained in the airflow flowing toward the lower surface of the substrate are prevented from adhering to the lower surface of the substrate. Thus, the substrate can be transferred at a high speed. Furthermore, the substrate transfer device according to claim 3 is
A plurality of upper cover members are disposed above each of the plurality of arms and cover the upper side of the substrate holding space of each arm when the plurality of arms are moved up and down. Therefore, when the substrate is held in the substrate holding space, the particles are prevented from adhering to the upper surface of the substrate when ascending,
Further, at the time of descending, particles contained in the airflow flowing toward the upper surface side of the substrate are prevented from adhering to the upper surface of the substrate, and the substrate can be transported at high speed.

According to the substrate transfer device of the fourth aspect,
Of the plurality of arms, the lower cover member for the upper arm present above also serves as the upper cover member for the lower arm immediately below the upper arm.
Therefore, the number of cover members can be reduced and the structure can be simplified.

[0069] According to the substrate transfer apparatus of the fifth aspect,
A lifting platform driven up and down by predetermined driving means, a plurality of arms each capable of holding a substrate substantially horizontally, and stacked and arranged above the lifting platform, and moving up and down together with the lifting platform; and a plurality of arms Located in the gap between the
A cover member that covers the substrate holding space of each arm when the plurality of arms move up and down. Therefore, since the cover member or the elevating platform exists below the substrate holding space, the substrate held in the substrate holding space is prevented from rising when descending, and is moved to the lower surface side of the substrate when ascending. Particles contained in the flowing air flow can be prevented from adhering to the lower surface of the substrate, and the substrate can be transferred at a high speed.

According to the substrate processing apparatus of the sixth aspect,
Since the substrate can be transported at high speed by the substrate transport device according to any one of claims 1 to 5, with respect to the substrate processing unit having a plurality of unit processing units stacked and arranged on each other, The throughput can be improved by shortening the moving time.

[Brief description of the drawings]

FIG. 1 is a plan view and a front view illustrating a substrate processing apparatus according to an embodiment of the present invention.

FIG. 2 is a diagram illustrating an arrangement of processing units constituting the apparatus of FIG. 1;

FIG. 3 is an external perspective view showing a transfer robot in a unit arrangement portion of the apparatus in FIG. 1;

4 is a perspective view showing an arm of a transfer robot in a unit arrangement portion of the apparatus in FIG. 1;

FIG. 5 is a diagram showing a state of an arm when ascending and descending.

FIG. 6 is a diagram illustrating a configuration of a cover unit.

FIG. 7 is a diagram illustrating a state in which the arm is covered by a cover unit.

FIG. 8 is a front view of an arm and a cover part.

FIG. 9 is a side view of an arm and a cover part.

FIG. 10 is a diagram illustrating a state where a substrate is held by a substrate holding portion of a first arm segment.

FIG. 11 is a diagram showing a state in which the transfer robot of FIG. 3 accesses a liquid processing unit.

FIG. 12 is a view showing a state in which the transfer robot of FIG. 3 accesses a multi-stage heat treatment unit.

FIG. 13 is a conceptual diagram showing a relative airflow generated when the substrate descends.

FIG. 14 is a conceptual diagram illustrating a relative airflow generated when the substrate is lifted.

FIG. 15 is a diagram showing an example in which the present invention is applied to a substrate held by each of three or more arms.

FIG. 16 is a diagram showing a modification of the embodiment of the present invention.

FIG. 17 is a diagram showing another modification of the embodiment of the present invention.

FIG. 18 is a diagram showing still another modification of the embodiment of the present invention.

[Explanation of symbols]

 Reference Signs List 11 chemical cabinet 20 multi-stage heat treatment unit TR1 transfer robot 31a, 31b arm 34a, 34b first arm segment 33a, 33b second arm segment 32a, 32b third arm segment 35 elevating table 40 telescopic elevating mechanism 70, 70 'cover part 71, 72, 73 Cover member CU Upper cover member CL Lower cover member W, Wa, Wb, Wc Substrate Upper surface of US substrate Lower surface of LS substrate

Continuation of the front page (72) Inventor Masami Otani 322 Hashizushi Furukawa-cho, Fushimi-ku, Kyoto Dainichi Screen Manufacturing Co., Ltd. F term (reference) 3F060 AA08 DA09 DA10 EA01 GB12 GB31 HA30 5F031 AA02 CC12 LL07

Claims (6)

[Claims] 1. A substrate transfer device having a degree of freedom of lifting and lowering, comprising: (a) a plurality of arms each capable of holding a substrate substantially horizontally and stacked at intervals from each other; A plurality of lower cover members disposed below each of the plurality of arms and covering a lower side of the substrate holding space of each arm when the plurality of arms move up and down. . 2. A substrate transfer device having a degree of freedom of lifting and lowering, wherein: (a) a plurality of arms each capable of holding a substrate substantially horizontally and stacked at intervals from each other; A plurality of upper cover members disposed above each of the plurality of arms and covering an upper side of a substrate holding space of each of the plurality of arms when the plurality of arms are moved up and down. 3. A substrate transfer device having a degree of freedom of lifting and lowering, wherein: (a) a plurality of arms each capable of holding a substrate substantially horizontally and being stacked at intervals from each other; A plurality of upper cover members disposed above each of the plurality of arms and covering an upper side of the substrate holding space of each of the plurality of arms when the plurality of arms are moved up and down; and (c) below each of the plurality of arms. A plurality of lower cover members arranged to cover the lower side of the substrate holding space of each arm when the plurality of arms are moved up and down. 4. The substrate transfer device according to claim 3, wherein a lower cover member of an upper arm existing above the plurality of arms is connected to a lower arm existing immediately below the upper arm. A substrate transfer device, which is also used as an upper cover member. 5. A substrate transfer device having a degree of freedom of lifting and lowering, comprising: (a) a lifting table driven up and down by predetermined driving means; and (b) each capable of holding a substrate substantially horizontally, and A plurality of arms that are stacked and arranged above the elevating table and that move up and down together with the elevating table; (c) disposed in a gap between the plurality of arms, A substrate transport device, comprising: a cover member that covers a substrate holding space. 6. A substrate processing apparatus, comprising: (a) the substrate transfer apparatus according to any one of claims 1 to 5, and (b) a plurality of unit processing units stacked and arranged on each other. A substrate processing unit configured to perform a predetermined process on the substrate transported by the substrate transport device.