KR200494609Y1 - Apparatus for Manufacturing Electrolytic Copper Foil - Google Patents

Abstract

The present invention is a winding unit for winding the copper foil; a first cutting unit for cutting the transport copper foil carried from the negative electrode and the positive electrode into a wound copper foil to be wound on the winding unit and a separated copper foil to be separated from the wound copper foil; a guide part for guiding the wound copper foil to be transported toward the winding part; and a first blocking portion for blocking the copper chips generated in the process of the first cutting portion cutting the transport copper foil from moving toward the wound copper foil, wherein the first blocking portion is at least between the first cutting portion and the winding portion It relates to an electrodeposited copper foil manufacturing apparatus, characterized in that it is installed to partially cover it.

Description

Electrolytic copper foil manufacturing apparatus {Apparatus for Manufacturing Electrolytic Copper Foil}

The present invention relates to an electrodeposited copper foil manufacturing apparatus for manufacturing a copper foil.

Copper foil (銅箔) is used to manufacture various products such as anodes for secondary batteries and flexible printed circuit boards (FPCBs). This copper foil is manufactured through an electroplating method in which an electrolytic solution is supplied between an anode and a cathode and then an electric current flows. In manufacturing the copper foil through the electroplating method as described above, an electrodeposited copper foil manufacturing apparatus is used.

The electrodeposited copper foil manufacturing apparatus according to the prior art includes an anode part, a cathode part, and a cutting part.

The anode part is electrically energized with the cathode part through an electrolyte. The anode part functions as an anode in performing electroplating.

The cathode part is to manufacture a copper foil by an electroplating method using an electrolyte. The cathode part functions as a cathode in performing electroplating.

The cutting part is to cut the copper foil carried from the positive electrode part and the negative electrode part. On both sides of the cathode part, the copper foil is manufactured to be relatively thick due to the high current density. The cutting portion cuts a relatively thick portion of the copper foil. Thereafter, the copper foil cut by the cutting unit is wound.

Here, in the process of cutting the copper foil by the cutting unit, copper chips having a fine size are scattered due to various causes such as friction between the cutting unit and the copper foil. These copper chips move to the wound copper foil and attach to the surface of the wound copper foil, thereby causing various defects in the copper foil. In addition, copper chips attached to the surface of the wound copper foil cause wrinkles on the copper foil and scratches on the surface of the copper foil. When the defective copper foil is used for a negative electrode for a secondary battery as described above, the yield and quality of the secondary battery may also be reduced.

Therefore, there is an urgent need for development of an electrodeposited copper foil manufacturing apparatus capable of reducing the quality deterioration of the copper foil due to copper chips scattered in the process of cutting the copper foil.

The present invention has been devised to solve the above-mentioned needs, and to provide an electrodeposited copper foil manufacturing apparatus capable of reducing the quality deterioration of copper foil due to copper chips scattered in the process of cutting the copper foil.

In order to solve the above problems, the present invention may include the following configuration.

Electrolytic copper foil manufacturing apparatus according to the present invention includes a winding unit for winding the copper foil; a first cutting unit for cutting the transport copper foil carried from the negative electrode and the positive electrode into a wound copper foil to be wound on the winding unit and a separated copper foil to be separated from the wound copper foil; a guide part for guiding the wound copper foil to be transported toward the winding part; and a first blocking portion for blocking the copper chips generated in the process of the first cutting portion cutting the transport copper foil from moving toward the wound copper foil, wherein the first blocking portion is at least between the first cutting portion and the winding portion It may be installed to partially cover it.

According to the present invention, the following effects can be achieved.

According to the present invention, by reducing the amount of copper chips adhered to the surface of the wound copper foil, wrinkles occurring in the copper foil and scratches on the surface of the copper foil are reduced, thereby reducing defects occurring in the copper foil. In addition, the present invention can also increase the yield and quality of the secondary battery by reducing defects occurring in the copper foil when the copper foil is used for a negative electrode for a secondary battery.

1 is a schematic front view showing a state in which a carrier copper foil is cut into a wound copper foil and a separated copper foil in an electrodeposited copper foil manufacturing apparatus according to the present invention;
2 is a schematic side view of an electrodeposited copper foil manufacturing apparatus according to the present invention;
3 is a schematic front view showing a state in which the first cut-off part is installed to cover a partial area between the first cut part and the winding part in the electrodeposited copper foil manufacturing apparatus according to the present invention;
4 is a schematic front view showing a state in which the first blocking part is formed to extend from one end of the guide part to the other end in the first direction in the electrodeposited copper foil manufacturing apparatus according to the present invention;
5 is a schematic perspective view of a first cut part in the electrodeposited copper foil manufacturing apparatus according to the present invention;
6 is a schematic perspective view showing a state in which the separated copper foil passes through the first through hole in the electrodeposited copper foil manufacturing apparatus according to the present invention;
7 is a schematic side cross-sectional view showing the state of the first blocking portion formed with the first attachment member in the electrodeposited copper foil manufacturing apparatus according to the present invention;
8 is a schematic front view showing a state in which the first blocking part and the second blocking part are installed to be spaced apart in the width direction in the electrodeposited copper foil manufacturing apparatus according to the present invention;
9 is a schematic perspective view of a second blocking part in the electrodeposited copper foil manufacturing apparatus according to the present invention;
10 is a schematic perspective view showing a state in which the separated copper foil passes through a second through hole in the electrodeposited copper foil manufacturing apparatus according to the present invention;
11 is a schematic side cross-sectional view showing the state of the second blocking portion formed with the second attachment member in the electrodeposited copper foil manufacturing apparatus according to the present invention;

Hereinafter, an embodiment of an electrodeposited copper foil manufacturing apparatus according to the present invention will be described in detail with reference to the accompanying drawings.

1 and 2, the electrodeposited copper foil manufacturing apparatus 1 according to the present invention is a copper foil used for manufacturing various products such as a negative electrode for a secondary battery, a flexible printed circuit board (FPCB), etc. will be manufacturing

To this end, the electrodeposited copper foil manufacturing apparatus 1 according to the present invention rotates the winding part 2 for winding, the cathode part (not shown) and the anode part (not shown) to the transport copper foil 10 carried from the winding part. A first cut part 3 for cutting the wound copper foil 11 to be wound around (2) and the separated copper foil 12 to be separated from the wound copper foil 11, and the wound copper foil 11 toward the winding part 2 A guide part 4 for guiding the transport, and a first blocking part for blocking the copper chips generated in the process of cutting the transport copper foil 10 by the first cutting part 3 from moving toward the wound copper foil 11 (5) is included. The first cut-off part 5 is installed to cover between the first cut-off part 3 and the winding part 2 .

Accordingly, the electrodeposited copper foil manufacturing apparatus 1 according to the present invention blocks the copper chips scattered by the first cutting part 3 from moving toward the wound copper foil, thereby reducing the degree of adhesion of the copper chips to the surface of the wound copper foil. implemented as much as possible. Therefore, the electrodeposited copper foil manufacturing apparatus 1 according to the present invention not only reduces wrinkles on the copper foil and scratches on the surface of the copper foil, but also increases the yield and quality of a secondary battery manufactured using the copper foil.

Hereinafter, the winding part 2, the first cutting part 3, the guide part 4, and the first blocking part 5 will be described in detail with reference to the accompanying drawings.

Referring to FIG. 2 , the winding unit 2 winds the copper foil. The winding part 2 may wind up the copper foil cut by the first cutting part 3 while rotating. The copper foil wound on the winding part 2 may be cut to a predetermined width. The winding part 2 may be formed in a drum shape as a whole, but is not limited thereto, and may be formed in another shape as long as it can continuously perform a winding operation of winding the copper foil while rotating.

1 to 4 , the first cutting part 3 cuts the transport copper foil 10 carried from the negative electrode part (not shown) and the positive electrode part (not shown). The cathode part and the anode part are to continuously manufacture the transport copper foil 10 through an electroplating method while rotating. When the transport copper foil 10 is transported from the cathode part and the anode part, the first cutting part 3 may cut the transport copper foil 10 into the wound copper foil 11 and the separated copper foil 12 . The wound copper foil 11 may correspond to a portion to be wound on the winding part 2 after the transport copper foil 10 is cut. The separated copper foil 12 may correspond to a portion to be separated from the wound copper foil 11 after the transport copper foil 10 is cut. In this case, the separated copper foil 12 may be disposed on the outside of the copper foil 10 based on the width direction (X-axis direction) perpendicular to the direction in which the copper foil 10 is transported.

The first cutting part 3 may continuously cut the transport copper foil 10 as the transport copper foil 10 is continuously transported. Accordingly, the wound copper foil 11 may be continuously transported toward the winding part 2 and wound around the winding part 2 . After the separated copper foil 12 is separated from the wound copper foil 11, it may be transported toward a separate copper foil winding unit (not shown) and wound around the separated copper foil winding unit. The separated copper foil winding unit winds the separated copper foil 12 .

The first cut part 3 may be arranged to engage with one end of the guide part 4 based on the width direction (X-axis direction). The first cutting part 3 may be formed in the form of a disk having a blade formed on the outer periphery, but is not limited thereto, and if the copper foil 10 is transported and the copper foil 10 is continuously cut at the same time It may be formed in other shapes.

1 to 4 , the guide part 4 guides the wound copper foil 11 to be transported toward the winding part 2 . The guide part 4 may support the wound copper foil 11 . When the guide part 4 rotates, the wound copper foil 11 may be transported toward the winding part 2 while being supported by the guide part 4 . The guide part 4 may be formed in the form of a drum extending in the width direction (X-axis direction), but is not limited thereto, and by supporting the wound copper foil 11 , the wound copper foil 11 is If it is a shape that can be guided to be transported toward the winding unit 2, it may be formed in another shape.

The guide part 4 may be engaged with the first cut part 3 . In this case, the first cutting part 3 may be engaged with the guide part 4 at one end of the guide part 4 based on the width direction (X-axis direction). The guide part 4 may rotate together with the first cut part 3 in a state of being engaged with the first cut part 3 . Accordingly, the first cutting part 3 may cut the transport copper foil 10 in a state engaged with the guide part 4 . Accordingly, the guide part 4 performs a cutting operation of cutting the transport copper foil 10 together with the first cutting part 3 and a guide operation of guiding the wound copper foil 11 toward the winding part 2 together. can be done

2 to 8 , the first cut-off part 5 prevents the copper chips generated in the process of the first cutting part 3 cutting the transport copper foil 10 from moving toward the wound copper foil 11 . it will block The first cut-off part 5 may be installed to at least partially cover between the first cut-off part 3 and the winding part 2 . Accordingly, the copper chips generated in the process of the first cutting part 3 cutting the transport copper foil 10 may be blocked by the first blocking part 5 while moving toward the wound copper foil 11 .

Accordingly, the electrodeposited copper foil manufacturing apparatus 1 according to the present invention blocks the copper chips scattered by the first cutting part 3 from moving toward the wound copper foil 11, so that the copper chips are placed on the surface of the wound copper foil 11. It is implemented so that the degree of attachment is reduced. Therefore, the electrodeposited copper foil manufacturing apparatus 1 according to the present invention not only reduces wrinkles on the copper foil and scratches on the surface of the copper foil, but also increases the yield and quality of a secondary battery manufactured using the copper foil.

One end of the first cut-off part 5 may be disposed at a position spaced apart from the first cut-off part 3 in the first direction (ID arrow direction). The first direction (ID arrow direction) is a direction from one end of the guide part 4 toward the other end with respect to the width direction (X-axis direction). Accordingly, the first cut-off part 5 points between the first cut-off part 3 and the winding part 2 in a state in which it protrudes from the first cut-out part 3 in the first direction (ID arrow direction). can be installed.

Accordingly, in the electrodeposited copper foil manufacturing apparatus 1 according to the present invention, the area in which the first blocking part 5 blocks the copper chip moving toward the wound copper foil 11 is increased in the first direction (ID arrow direction). is implemented Therefore, in the electrodeposited copper foil manufacturing apparatus 1 according to the present invention, the amount of copper chips adhering to the surface of the wound copper foil 11 can be further reduced by blocking the copper chips moving in the first direction (ID arrow direction). In addition, the electrodeposited copper foil manufacturing apparatus 1 according to the present invention is implemented to block the movement of the copper chip toward other mechanisms and devices arranged in the first direction (ID arrow direction) with respect to the first cutting part 3 . Accordingly, the electrodeposited copper foil manufacturing apparatus 1 according to the present invention reduces the probability of failure of other mechanisms and devices due to scattered copper chips, thereby further increasing the operation rate and productivity.

The other end of the first cut-off part 5 may be disposed at a position spaced apart from the first cut-off part 3 in the second direction (the direction of the ED arrow). The second direction (the direction of the ED arrow) is opposite to the first direction (the direction of the ID arrow). Accordingly, the first cut-off part 5 points between the first cut-off part 3 and the winding part 2 in a state in which it protrudes from the first cut-out part 3 in the second direction (the direction of the ED arrow). can be installed.

Accordingly, in the electrodeposited copper foil manufacturing apparatus 1 according to the present invention, the area in which the first blocking part 5 blocks the copper chip moving toward the wound copper foil 11 is increased in the second direction (ED arrow direction). is implemented Therefore, in the electrodeposited copper foil manufacturing apparatus 1 according to the present invention, the amount of copper chips adhering to the surface of the wound copper foil 11 can be further reduced by blocking the copper chips moving in the second direction (the direction of the ED arrow). In addition, the electrodeposited copper foil manufacturing apparatus 1 according to the present invention is implemented to block the movement of the copper chip toward other mechanisms and devices arranged in the second direction (the direction of the ED arrow) with respect to the first cut part 3 . Accordingly, the electrodeposited copper foil manufacturing apparatus 1 according to the present invention reduces the probability of failure of other mechanisms and devices due to scattered copper chips, thereby further increasing the operation rate and productivity.

The first blocking part 5 has one end and the other end spaced apart from each other based on the width direction (X-axis direction) is 1/5 or more with respect to the length in which one end and the other end of the guide part 4 are spaced apart from each other It may be formed in 1/3 or less. That is, the length of the first blocking part 5 extended in the width direction (X-axis direction) is 1/5 or more of the length of the guide part 4 extended in the width direction (X-axis direction) 1/ 3 or less may be formed. Therefore, as shown in FIG. 3 , the first blocking part 5 covers only a partial area between the guide part 4 and the winding part 2 based on the width direction (X-axis direction). can be formed. In particular, when the length extending in the width direction (X-axis direction) of the first blocking part 5 is formed to be 1/5 or more of the length of the guide part 4, it is possible to block the copper chip more effectively. In particular, when the length extending in the width direction (X-axis direction) of the first blocking portion 5 is formed to be less than 1/3 of the length of the guide portion 4, the guide portion 4 and the winding It may not block the view of the operator between the mounting (2).

Accordingly, in the electrodeposited copper foil manufacturing apparatus 1 according to the present invention, while the first blocking part 5 blocks the copper chip moving toward the wound copper foil 11, the guide part 4 and the winding part 2 It may be implemented so as not to block the operator's view of the process performed between them. Accordingly, the electrodeposited copper foil manufacturing apparatus 1 according to the present invention can further increase the easiness of the management of the instruments and devices disposed between the guide part 4 and the winding part 2 .

The first blocking portion 5 may be formed to at least partially cover between one end and the other end of the guide portion 4 in the width direction (X-axis direction). To this end, the first blocking part 5 may be formed to extend in the first direction (ID arrow direction) from one end of the guide part 4 to the other end. Accordingly, in the electrodeposited copper foil manufacturing apparatus 1 according to the present invention, the area in which the first blocking part 5 blocks the copper chip moving toward the wound copper foil 11 is further increased in the first direction (ID arrow direction) implemented as much as possible. Therefore, the electrodeposited copper foil manufacturing apparatus 1 according to the present invention can further block the copper chip moving toward the wound copper foil 11 in the first direction (ID arrow direction).

The first blocking part 5 may be formed of a transparent or translucent material. Accordingly, in the electrodeposited copper foil manufacturing apparatus 1 according to the present invention, while the first blocking part 5 blocks the copper chip moving toward the wound copper foil 11, the guide part 4 and the winding part 2 It may be implemented so as not to block the operator's field of view. The first blocking portion 5 may be formed of a transparent or translucent material as a whole. The first blocking part 5 may be formed of a transparent or semi-transparent material only for a part of the length extending in the width direction (X-axis direction).

3 to 8 , the first blocking part 5 may include a first blocking member 51 and a first blocking member 52 .

The first blocking member 51 blocks the copper chip from moving toward the wound copper foil 11 . In this case, the first blocking member 51 may be installed to cover an area different from the first blocking member 52 . Accordingly, the first blocking part 5 may block the copper chip in different directions through the first blocking member 51 and the first blocking member 52 .

Accordingly, the electrodeposited copper foil manufacturing apparatus 1 according to the present invention is implemented such that the angle and area for blocking the copper chip are increased compared to the case where the first blocking part 5 blocks the copper chip only in one direction. Therefore, in the electrodeposited copper foil manufacturing apparatus 1 according to the present invention, the amount of copper chips adhering to the surface of the wound copper foil 11 can be further reduced by further reducing the amount of copper chips moving toward the wound copper foil 11 . .

The first blocking member 51 may cover the front of the first cutting part 3 so as to block the copper chip from moving forward from the first cutting part 3 toward the winding part 2 . . The first blocking member 51 may cover the front of the first cutting part 3 by being disposed in front of the first cutting part 3 . The first blocking member 51 may be formed to extend in a height direction (Y-axis direction) perpendicular to the width direction (X-axis direction) to cover the front of the first cutting part 3 . Accordingly, in the electrodeposited copper foil manufacturing apparatus 1 according to the present invention, the area in which the first blocking part 5 blocks the copper chip by the first blocking member 51 is further increased in the height direction (Y-axis direction) implemented as much as possible. Therefore, in the electrodeposited copper foil manufacturing apparatus 1 according to the present invention, the amount of copper chips adhering to the surface of the wound copper foil 11 can be further reduced by further reducing the amount of copper chips moving toward the wound copper foil 11 . .

The first blocking member 51 may be formed in the form of a wide plate, but is not limited thereto, and may be formed in another form as long as it can block the copper chip moving toward the wound copper foil 11 . For example, as the first blocking member 51 extends in the height direction (Y-axis direction), it may be formed in an arc so as to be farther away from the first cutting part 3 .

The first shielding member 52 is coupled to the first blocking member 51 . The first blocking member 52 may be installed to extend in a different direction with respect to the extending direction of the first blocking member 51 to cover an area different from the first blocking member 51 . Accordingly, the first shielding member 52 may block movement of the copper chip toward the wound copper foil 11 in a direction different from that of the first blocking member 51 .

The first shielding member 52 may cover the lower side of the first cutting part 3 to block the copper chip from moving downward. The first shielding member 52 may be disposed below the first cut-off part 3 to cover the lower side of the first cut-out part 3 . The first blocking member 51 extends in the front-rear direction (Z-axis direction) perpendicular to the width direction (X-axis direction) and the height direction (Y-axis direction) so as to cover the lower side of the first cutting part 3 . can be formed. Accordingly, the electrodeposited copper foil manufacturing apparatus 1 according to the present invention can be expected to have the following effects.

First, in the electrodeposited copper foil manufacturing apparatus 1 according to the present invention, the area in which the first blocking part 5 blocks the copper chip by the first shielding member 52 is further increased in the front-rear direction (Z-axis direction). is implemented Therefore, in the electrodeposited copper foil manufacturing apparatus 1 according to the present invention, the amount of copper chips adhering to the surface of the wound copper foil 11 can be further reduced by further reducing the amount of copper chips moving toward the wound copper foil 11 . .

Second, in the electrodeposited copper foil manufacturing apparatus 1 according to the present invention, as the first shielding member 52 covers the lower side of the first cutting part 3, it collides with the first blocking member 51 and then It is implemented to block the copper chip scattered by the Therefore, the electrodeposited copper foil manufacturing apparatus 1 according to the present invention prevents copper chips from moving to the floor and to the instruments and devices disposed below the first blocking part 5, so that it is suitable for maintenance work such as cleaning and repair. It is possible to further increase the operation rate by increasing the cycle time.

Here, the front and the bottom are for distinguishing each configuration, and it will be clear to those of ordinary skill in the art to which the present invention pertains that it does not refer to a specific direction.

The first blocking member 52 may be coupled to a lower end of the first blocking member 51 . The first shielding member 52 may be formed in the form of a wide plate, but is not limited thereto, and may be formed in another form as long as it can block the copper chip moving downward.

Referring to FIG. 5 , the first blocking part 5 may include a first collecting groove 53 .

The first collecting groove 53 collects copper chips. The first collecting groove 53 may be formed in the first covering member 52 . The first collecting groove 53 may be formed by concavely recessing the first covering member 52 downward. In the first collecting groove 53 , the copper chips scattered directly from the first cutting part 3 and the copper chips falling after colliding with the first blocking member 51 or the first covering member 52 may be collected. .

Accordingly, in the electrodeposited copper foil manufacturing apparatus 1 (shown in FIG. 2 ) according to the present invention, copper chips are collected in the first collecting groove 53 , so that the first shielding member 52 blocks the copper chips from moving downward. It is implemented so that the amount to be increased is increased. Therefore, the electrodeposited copper foil manufacturing apparatus 1 according to the present invention not only increases the operation rate by increasing the cycle for cleaning the first shielding member 52 in order to remove the collected copper chips, but also increases the operation rate of the first shielding member 52 . Ease of cleaning the member 52 may also be increased.

3 to 5 , the first blocking part 5 may include a first inner member 54 .

The first inner member 54 blocks the copper chip from moving in the first direction (ID arrow direction). The first inner member 54 may be formed to cover the first direction (the direction of the ID arrow) with respect to the first blocking member 51 and the first covering member 52 . The first inner member 54 has one end facing the first direction (ID arrow direction) from the first blocking member 51 and the first direction (ID arrow direction) from the first covering member 52 . One end facing may be coupled to each.

Accordingly, the electrodeposited copper foil manufacturing apparatus 1 according to the present invention is implemented such that the area in which the first blocking part 5 blocks the copper chip by the first inner member 54 is further increased. Therefore, the electrodeposited copper foil manufacturing apparatus 1 according to the present invention further reduces the amount of copper chips moving in the first direction (ID arrow direction), thereby further reducing the amount of copper chips attached to the surface of the wound copper foil 11 . can do it In addition, the electrodeposited copper foil manufacturing apparatus 1 according to the present invention can also prevent the copper chip from moving to the instruments and devices arranged in the first direction (ID arrow direction) with respect to the first cutting part 3 . Therefore, the electrodeposited copper foil manufacturing apparatus 1 according to the present invention can further increase the operation rate by increasing the cycle for maintenance work such as cleaning and repair.

The first inner member 54 may be disposed to be positioned in the first direction (ID arrow direction) with respect to the first blocking member 51 and the first shielding member 52 . The first inner member 54 may be formed in a wide plate shape, but is not limited thereto, and may be formed in another shape as long as it can block the copper chip moving in the first direction (ID arrow direction). have. For example, the first inner member 54 may be formed to be recessed in the first direction (ID arrow direction).

3 to 6 , the first blocking part 5 may include a first outer member 55 .

The first outer member 55 blocks the copper chip from moving in the second direction (the direction of the ED arrow). The first outer member 55 may be formed to cover the second direction (the direction of the ED arrow) with respect to the first blocking member 51 and the first shielding member 52 . To this end, the first outer member 55 has the other end facing the second direction (ED arrow direction) from the first blocking member 51 and the second direction (ED arrow direction) from the first covering member 52 . direction) may be coupled to each of the other ends facing each other.

Accordingly, the electrodeposited copper foil manufacturing apparatus 1 according to the present invention is implemented such that the area in which the first blocking part 5 blocks the copper chip by the first outer member 55 is further increased. Therefore, in the electrodeposited copper foil manufacturing apparatus 1 according to the present invention, the amount of copper chips adhering to the surface of the wound copper foil 11 can be further reduced by further reducing the amount of copper chips moving toward the wound copper foil 11 . . In addition, the electrodeposited copper foil manufacturing apparatus 1 according to the present invention can also prevent the copper chip from moving to the instruments and devices arranged in the first direction (ID arrow direction) with respect to the first cutting part 3 . Therefore, the electrodeposited copper foil manufacturing apparatus 1 according to the present invention can further increase the operation rate by increasing the cycle for maintenance work such as cleaning and repair.

The first outer member 55 may be disposed to be positioned in the second direction (the direction of the ED arrow) with respect to the first blocking member 51 and the first shielding member 52 . The first outer member 55 may be formed in the form of a wide plate, but is not limited thereto, and may be formed in another form as long as it can block the copper chip moving in the second direction (the direction of the ED arrow). have.

Referring to FIG. 6 , the first blocking part 5 may include a first passing hole 56 .

The first passing hole 56 is to pass the separation copper foil 12 through. The first through hole 56 may be formed to pass through the first covering member 52 . When the first cutting part 3 cuts the transport copper foil 10, the separated copper foil 12 is separated from the wound copper foil 11 and passes through the first through hole 56, so that the separated copper foil winding part (not shown) may be wound.

Accordingly, the electrodeposited copper foil manufacturing apparatus 1 according to the present invention passes through the first through hole 56 when the separated copper foil 12 moves, so that the separated copper foil 12 is moved to the first shielding member 52 . It is implemented to be spaced apart from Therefore, the electrodeposited copper foil manufacturing apparatus 1 according to the present invention is implemented so that the first shielding member 52 blocks the movement of the copper chip and does not interfere with the movement of the separated copper foil 12 .

The first through hole 56 may be disposed to be positioned between the first cutting part 3 and the separating copper foil winding part. The first through hole 56 may be formed to have a size larger than that of the separation copper foil 12 in the width direction (X-axis direction).

Referring to FIG. 7 , the first blocking part 5 may include a first attachment member 57 .

The first attachment member 57 provides adhesive force so that the copper chip is attached. The first attachment member 57 is attached to at least one of the first blocking member 51 , the first shielding member 52 , the first inner member 54 , and the first outer member 55 . can be installed. The first attachment member 57 blocks the movement of the copper chip and allows the copper chip to be attached, thereby limiting arbitrary movement of the copper chip.

Accordingly, the electrodeposited copper foil manufacturing apparatus 1 according to the present invention is implemented to prevent the copper chip from being arbitrarily separated from the first blocking unit 5 due to the wind blowing from the outside, vibration transmitted from other instruments and devices, etc. . Therefore, the electrodeposited copper foil manufacturing apparatus 1 according to the present invention is implemented such that the degree of movement of the copper chips collected in the first blocking part 5 to other mechanisms and devices is reduced, thereby further increasing the cycle for maintenance work. This can further increase the operating rate.

The first attachment member 57 is attached to at least one of the first blocking member 51 , the first shielding member 52 , the first inner member 54 , and the first outer member 55 . It may be formed to be detachable. Accordingly, the electrodeposited copper foil manufacturing apparatus 1 according to the present invention is implemented such that the operator detaches the first attachment member 57 to which the copper chip is attached and attaches a new first attachment member 57, thereby cleaning the collected copper chips. Ease of operation can be increased.

Referring to FIG. 8 , the electrodeposited copper foil manufacturing apparatus 1 according to the present invention may include a second cutting part 6 and a second blocking part 7 .

The second cutting part 6 cuts the transport copper foil 10 into the wound copper foil 11 and the separated copper foil 12 . The second cutting part 6 may continuously cut the transport copper foil 10 as the transport copper foil 10 is continuously transported. The first cut part 3 and the second cut part 6 may be disposed to be spaced apart from each other based on the width direction (X-axis direction). In this case, the first cut part 3 and the second cut part 6 are spaced apart from each other based on the width direction (X-axis direction) and may be installed to engage one end and the other end of the guide part 4, respectively. have. For example, when the first cut part 3 is installed to engage one end of the guide part 4 , the second cut part 6 may be installed to engage the other end of the guide part 4 . Accordingly, the first cut portion 3 and the second cut portion 6 may cut both ends of the transport copper foil 10 .

The second cutting part 6 may be formed in the form of a disk having a blade formed on the outer periphery, but is not limited thereto, and if the copper foil 10 is transported and the copper foil 10 is continuously cut at the same time. It may be formed in other shapes.

8 to 11 , the second cut-off part 7 prevents the copper chips generated in the process of the second cutting part 6 cutting the transport copper foil 10 from moving toward the wound copper foil 11 . it will block To this end, the second cut-off part 7 may be installed to at least partially cover between the second cut-off part 6 and the winding part 2 . Accordingly, the copper chips generated in the process of the second cutting part 6 cutting the transport copper foil 10 may be blocked by the second blocking part 7 while moving toward the wound copper foil 11 .

Accordingly, the electrodeposited copper foil manufacturing apparatus 1 according to the present invention blocks the copper chips scattered by the second cutting part 6 from moving toward the wound copper foil 11, so that the copper chips are placed on the surface of the wound copper foil 11. It is implemented so that the degree of attachment is reduced. Therefore, the electrodeposited copper foil manufacturing apparatus 1 according to the present invention not only reduces wrinkles on the copper foil and scratches on the surface of the copper foil, but also increases the yield and quality of a secondary battery manufactured using the copper foil.

One end of the second cut-off part 7 may be disposed at a position spaced apart from the second cut-off part 6 in the second direction (the direction of the ED arrow). Accordingly, the second cut-off part 7 points between the second cut-off part 6 and the winding part 2 in a state in which it protrudes from the second cut-out part 6 in the second direction (the direction of the ED arrow). can be installed.

Accordingly, in the electrodeposited copper foil manufacturing apparatus 1 according to the present invention, the area in which the second blocking part 7 blocks the copper chip moving toward the wound copper foil 11 is increased in the second direction (ED arrow direction). is implemented Accordingly, the electrodeposited copper foil manufacturing apparatus 1 according to the present invention blocks the copper chip moving toward the wound copper foil 11 in the second direction (the direction of the ID arrow), so that the copper chip attached to the surface of the wound copper foil 11 is removed. quantity can be further reduced. In addition, in the electrodeposited copper foil manufacturing apparatus 1 according to the present invention, the copper chip is disposed in the second direction (ED arrow direction) with respect to the wound copper foil 11 as well as the second cut portion 6 toward other mechanisms and devices. It is implemented to block movement. Accordingly, the electrodeposited copper foil manufacturing apparatus 1 according to the present invention reduces the probability of failure of other mechanisms and devices due to scattered copper chips, thereby further increasing the operation rate and productivity.

The other end of the second cut-off part 7 may be disposed at a position spaced apart from the second cut-off part 6 in the first direction (ID arrow direction). Accordingly, the second cut-off part 7 points between the second cut-out part 6 and the winding part 2 in a state in which it protrudes from the second cut-out part 6 in the first direction (ID arrow direction). can be installed.

Accordingly, in the electrodeposited copper foil manufacturing apparatus 1 according to the present invention, the area in which the second blocking part 7 blocks the copper chip moving toward the wound copper foil 11 is increased in the first direction (ID arrow direction). is implemented Therefore, the electrodeposited copper foil manufacturing apparatus 1 according to the present invention blocks the copper chip moving toward the wound copper foil 11 in the first direction (the direction of the ID arrow), so that the copper chip attached to the surface of the wound copper foil 11 is removed. quantity can be further reduced. In addition, in the electrodeposited copper foil manufacturing apparatus 1 according to the present invention, the copper chip is disposed in the first direction (ID arrow direction) with respect to the wound copper foil 11 as well as the second cut portion 6 toward other mechanisms and devices. It is implemented to block movement. Accordingly, the electrodeposited copper foil manufacturing apparatus 1 according to the present invention reduces the probability of failure of other mechanisms and devices due to scattered copper chips, thereby further increasing the operation rate and productivity.

The second blocking part 7 has one end and the other end spaced apart from each other in the width direction (X-axis direction) by 1/5 or more with respect to the length in which one end and the other end of the guide part 4 are spaced apart from each other. It may be formed in 1/3 or less. That is, the length of the second blocking part 7 extended in the width direction (X-axis direction) is 1/5 or more of the length of the guide part 4 extended in the width direction (X-axis direction) 1/ 3 or less may be formed. Accordingly, as shown in FIG. 8 , the second blocking part 7 covers only a partial area between the guide part 4 and the winding part 2 based on the width direction (X-axis direction). can be formed. In particular, the second blocking part 7 can effectively block the copper chip when the guide part 4 is formed to have a length of 1/5 or more of the length extended in the width direction (X-axis direction). In particular, the second blocking portion 7 is the center of the guide portion 4 when the guide portion 4 is formed to have a length of 1/3 or less of the length extending in the width direction (X-axis direction). It may not block the operator's view of the vicinity.

Accordingly, in the electrodeposited copper foil manufacturing apparatus 1 according to the present invention, while the second blocking part 7 blocks the copper chip moving toward the wound copper foil 11, the operator's It may be implemented so as not to block the field of view. Therefore, the electrodeposited copper foil manufacturing apparatus 1 according to the present invention can further increase the easiness of the management operation of the instruments and devices disposed near the center of the guide part 4 .

The second blocking part 7 may be formed of a transparent or translucent material. Accordingly, in the electrodeposited copper foil manufacturing apparatus 1 according to the present invention, while the second blocking part 7 blocks the copper chip moving toward the wound copper foil 11, the operator's It may be implemented so as not to block the field of view. A portion formed of a transparent or translucent material may be selected by an operator for the second blocking portion 7 . For example, the second blocking part 7 may be entirely made of a transparent or translucent material. The second blocking part 7 may be formed of a transparent or semi-transparent material only for a part of the length extending based on the width direction (X-axis direction).

8 to 11 , the second blocking part 7 may include a second blocking member 71 and a second shielding member 72 .

The second blocking member 71 blocks the copper chip from moving toward the wound copper foil 11 . In this case, the second blocking member 71 may be installed to cover an area different from the second blocking member 72 . Accordingly, the second blocking part 7 may block the copper chip in different directions through the second blocking member 71 and the second shielding member 72 .

Accordingly, the electrodeposited copper foil manufacturing apparatus 1 according to the present invention is implemented such that the area for blocking the copper chip is increased compared to the case where the second blocking part 7 blocks the copper chip only in a single direction. Therefore, in the electrodeposited copper foil manufacturing apparatus 1 according to the present invention, the amount of copper chips adhering to the surface of the wound copper foil 11 can be further reduced by further reducing the amount of copper chips moving toward the wound copper foil 11 . .

The second blocking member 71 may cover the front of the second cutting part 6 to block the copper chip from moving forward toward the winding part 2 from the second cutting part 6 . The second blocking member 71 may cover the front of the second cutting part 6 by being disposed in front of the second cutting part 6 . The second blocking member 71 may be formed to extend in a height direction (Y-axis direction) perpendicular to the width direction (X-axis direction) to cover the front of the second cutting part 6 . Accordingly, in the electrodeposited copper foil manufacturing apparatus 1 according to the present invention, the area in which the second blocking part 7 blocks the copper chip by the second blocking member 71 further increases in the height direction (Y-axis direction). implemented as much as possible. Therefore, in the electrodeposited copper foil manufacturing apparatus 1 according to the present invention, the amount of copper chips adhering to the surface of the wound copper foil 11 can be further reduced by further reducing the amount of copper chips moving toward the wound copper foil 11 . .

The second blocking member 71 may be formed in the form of a wide plate, but is not limited thereto, and may be formed in another form as long as it can block the copper chip moving toward the wound copper foil 11 . For example, as the second blocking member 71 extends in the height direction (Y-axis direction), it may be formed in an arc so as to be farther away from the second cutting part 6 .

The second shielding member 72 is coupled to the second blocking member 71 . The second blocking member 72 may be installed to extend in a different direction with respect to the extending direction of the second blocking member 71 to cover an area different from the second blocking member 71 . Accordingly, the second shielding member 72 may block movement of the copper chip to the wound copper foil 11 in a direction different from that of the second blocking member 71 .

The second shielding member 72 may cover the lower portion of the second cutting part 6 to block the copper chip from moving downward. The second shielding member 72 may be disposed below the second cut-out part 6 to cover the lower side of the second cut-out part 6 . The second blocking member 71 is formed to extend in the front-rear direction (Z-axis direction) perpendicular to the width direction (X-axis direction) and the height direction (Y-axis direction), so that the lower side of the second cutting part 6 . can cover Accordingly, the electrodeposited copper foil manufacturing apparatus 1 according to the present invention can be expected to have the following effects.

First, in the electrodeposited copper foil manufacturing apparatus 1 according to the present invention, the area in which the second blocking part 7 blocks the copper chip by the second shielding member 72 is further increased in the front-rear direction (Z-axis direction). is implemented Therefore, in the electrodeposited copper foil manufacturing apparatus 1 according to the present invention, the amount of copper chips adhering to the surface of the wound copper foil 11 can be further reduced by further reducing the amount of copper chips moving toward the wound copper foil 11 . .

Second, the electrodeposited copper foil manufacturing apparatus 1 according to the present invention is implemented such that the second shielding member 72 is blocked by the second blocking part 7 to block the copper chips falling downward. Therefore, the electrodeposited copper foil manufacturing apparatus 1 according to the present invention prevents the copper chip from moving to the floor and the mechanisms and devices disposed below the second blocking part 7, so that it is suitable for maintenance work such as cleaning and repair. It is possible to further increase the operation rate by increasing the cycle time.

The second shielding member 72 may be coupled to a lower end of the second blocking member 71 . The second shielding member 72 may be formed in the form of a wide plate, but is not limited thereto, and may be formed in another form as long as it can block the copper chip moving downward.

Referring to FIG. 9 , the second blocking part 7 may include a second collecting groove 73 .

The second collection groove 73 collects copper chips. The second collecting groove 73 may be formed in the second shielding member 72 . The second collection groove 73 may be formed when the second shielding member 72 is concavely depressed downwardly. In the second collection groove 73 , copper chips scattered directly from the second cutting part 6 and copper chips falling after colliding with the second blocking member 71 or the second shielding member 72 may be collected. .

Accordingly, in the electrodeposited copper foil manufacturing apparatus 1 (shown in FIG. 8 ) according to the present invention, copper chips are collected in the second collecting groove 73 , so that the second shielding member 72 blocks the copper chips from moving downward. It is implemented so that the amount to be increased is increased. Therefore, the electrodeposited copper foil manufacturing apparatus 1 according to the present invention not only increases the operation rate by increasing the cycle for cleaning the second shielding member 72, but also cleans the second shielding member 72. Ease of operation can also be increased.

8 and 9 , the second blocking part 7 may include a second inner member 74 .

The second inner member 74 blocks the copper chip from moving in the second direction (the direction of the ED arrow). The second inner member 74 may be formed to cover the second direction (direction of the ED arrow) with respect to the second blocking member 71 and the second shielding member 72 . To this end, the second inner member 74 has one end facing the second direction (ED arrow direction) from the second blocking member 71 and the second direction (ED arrow direction) from the second shielding member 72 . direction) facing each other.

Accordingly, the electrodeposited copper foil manufacturing apparatus 1 according to the present invention is implemented such that the area in which the second blocking part 7 blocks the copper chip by the second inner member 74 is further increased. Therefore, in the electrodeposited copper foil manufacturing apparatus 1 according to the present invention, the amount of copper chips adhering to the surface of the wound copper foil 11 can be further reduced by further reducing the amount of copper chips moving toward the wound copper foil 11 . . In addition, the electrodeposited copper foil manufacturing apparatus 1 according to the present invention can prevent the copper chip from moving to the instruments and devices arranged in the second direction (the direction of the ED arrow) with respect to the second cutting part 6 . Therefore, the electrodeposited copper foil manufacturing apparatus 1 according to the present invention can further increase the operation rate by increasing the cycle for maintenance work such as cleaning and repair.

The second inner member 74 may be disposed to be positioned in the second direction (the direction of the ED arrow) with respect to the second blocking member 71 and the second shielding member 72 . The second inner member 74 may be formed in the form of a wide plate, but is not limited thereto, and may be formed in another form as long as it can block the copper chip moving in the first direction (ID arrow direction). have. For example, the second inner member 74 may be formed to be recessed in the second direction (direction of the ED arrow).

8 to 10 , the second blocking part 7 may include a second outer member 75 .

The second outer member 75 blocks the copper chip from moving in the first direction (ID arrow direction). The second outer member 75 may be formed to cover the first direction (ID arrow direction) with respect to the second blocking member 71 and the second shielding member 72 . To this end, the second outer member 75 has the other end of the second blocking member 71 facing the first direction (ID arrow direction) and the second end of the second blocking member 72 in the first direction (ID arrow direction). direction) may be coupled to each of the other ends facing each other.

Accordingly, the electrodeposited copper foil manufacturing apparatus 1 according to the present invention is implemented such that the area in which the second blocking part 7 blocks the copper chip by the second outer member 75 is further increased. Therefore, the electrodeposited copper foil manufacturing apparatus 1 according to the present invention further reduces the amount of copper chips moving toward the wound copper foil 11, thereby further reducing the amount of copper chips attached to the surface of the wound copper foil 11. . In addition, the electrodeposited copper foil manufacturing apparatus 1 according to the present invention can prevent the copper chip from moving to the instruments and devices arranged in the first direction (ID arrow direction) with respect to the second cutting part 6 . Therefore, the electrodeposited copper foil manufacturing apparatus 1 according to the present invention can further increase the operation rate by increasing the cycle for maintenance work such as cleaning and repair.

The second outer member 75 may be disposed to be positioned in the first direction (ID arrow direction) with respect to the second blocking member 71 and the second shielding member 72 . The second outer member 75 may be formed in the form of a wide plate, but is not limited thereto, and may be formed in another form as long as it can block the copper chip moving in the first direction (ID arrow direction). have.

Referring to FIG. 10 , the second blocking part 7 may include a second passing hole 76 .

The second passing hole 76 is to pass the separation copper foil 12 through. The second through hole 76 may be formed through the second shielding member 72 . When the second cutting part 6 cuts the transport copper foil 10, the separated copper foil 12 is separated from the wound copper foil 11 and passes through the second through hole 76, so that the separated copper foil winding part (not shown) may be wound.

Accordingly, the electrodeposited copper foil manufacturing apparatus 1 according to the present invention passes through the second through hole 76 when the separated copper foil 12 moves, so that the separated copper foil 12 is moved to the second shielding member 72 . It is implemented to be spaced apart from Therefore, the electrodeposited copper foil manufacturing apparatus 1 according to the present invention is implemented so that the second shielding member 72 blocks the movement of the copper chip and does not interfere with the movement of the separated copper foil 12 .

The second through hole 76 may be disposed between the second cutting part 6 and the separating copper foil winding part. The second through hole 76 may be formed to have a size larger than that of the separation copper foil 12 in the width direction (X-axis direction).

Referring to FIG. 11 , the second blocking part 7 may include a second attachment member 77 .

The second attachment member 77 provides adhesive force so that the copper chip is attached. The second attachment member 77 is attached to at least one of the second blocking member 71 , the second shielding member 72 , the second inner member 74 , and the second outer member 75 . can be installed. The second attachment member 77 blocks the movement of the copper chip and allows the copper chip to be attached, thereby limiting arbitrary movement of the copper chip.

Accordingly, the electrodeposited copper foil manufacturing apparatus 1 according to the present invention prevents the collected copper chips from being arbitrarily separated from the second blocking part 7 due to the wind blowing from the outside, vibration transmitted from other instruments and devices, etc. is implemented Therefore, the electrodeposited copper foil manufacturing apparatus 1 according to the present invention is implemented so that the degree of movement of the copper chips collected in the second blocking part 7 to other mechanisms and devices is reduced, thereby further increasing the cycle for maintenance work. This can further increase the operating rate.

The second attachment member 77 is attached to at least one of the second blocking member 71 , the second shielding member 72 , the second inner member 74 , and the second outer member 75 . It may be formed to be detachable. Accordingly, the electrodeposited copper foil manufacturing apparatus 1 according to the present invention is implemented such that the operator detaches the second attachment member 77 to which the copper chip is attached and attaches a new second attachment member 77, thereby cleaning the collected copper chips. Ease of operation can be increased.

The present invention described above is not limited to the above-described embodiments and the accompanying drawings, and it is common in the technical field to which the present invention pertains that various substitutions, modifications, and changes are possible without departing from the technical spirit of the present invention. It will be clear to those who have the knowledge of

1: Electrolytic copper foil manufacturing apparatus 2: Winding part
3: first cut part 4: guide part
5: first cut-off part 6: second cut-out part
7: second blocking part 10: transport copper foil
11: wound copper foil 12: separated copper foil
51: first blocking member 52: first shielding member
53: first collecting groove 54: first inner member
55: first outer member 56: first through hole
57: first attachment member 71: second blocking member
72: second shielding member 73: second collecting groove
74: second inner member 75: second outer member
76: second through hole 77: second attachment member

Claims (13)

Winding unit for winding the copper foil (2);
A first cutting part ( 3);
a guide part (4) for guiding the wound copper foil (11) to be transported toward the winding part (2); and
and a first blocking part 5 for blocking the copper chips generated in the process of the first cutting part 3 cutting the transport copper foil 10 from moving toward the wound copper foil 11,
The first cut-off part (5) is installed to at least partially cover between the first cut-off part (3) and the winding part (2),
The first blocking part 5 includes a first blocking member 51 for blocking the copper chip from moving toward the wound copper foil 11, and a direction different from the direction in which the first blocking member 51 extends. and a first shielding member 52 coupled to the first blocking member 51 to extend,
The first blocking member 51 and the first covering member 52 are installed to cover different areas,
The first blocking member 51 covers the front of the first cutting part 3 to block the copper chip from moving forward from the first cutting part 3 to the winding part 2,
The first shielding member 52 covers the lower side of the first cutting part 3 to block the copper chip from moving downward,
The first blocking member (51) is an electrodeposited copper foil manufacturing apparatus, characterized in that disposed between the wound copper foil (11) and the separated copper foil (12). delete delete delete According to claim 1,
The first blocking part 5 includes a first shielding member 52 for blocking the copper chips from moving toward the wound copper foil 11 , and a first collecting groove 53 formed in the first shielding member 52 . Electrolytic copper foil manufacturing apparatus comprising a. According to claim 1,
The first blocking part 5 is a first direction from one end of the guide part 4 to the other end based on the width direction (X-axis direction) perpendicular to the direction in which the copper chip is transported by the transport copper foil 10 . and a first inner member 54 for blocking movement to
The first inner member (54) is characterized in that coupled to one end of the first blocking member (51) facing the first direction and one end of the first covering member (52) facing the first direction, respectively. Electrolytic copper foil manufacturing equipment. According to claim 1,
One end of the first blocking part 5 is a first direction from one end of the guide part 4 to the other end based on the width direction (X-axis direction) perpendicular to the direction in which the transport copper foil 10 is transported. is disposed at a position spaced apart from the first cut part (3) as
The other end of the first cut-off part (5) is an electrodeposited copper foil manufacturing apparatus, characterized in that it is disposed at a position spaced apart from the first cut-off part (3) in a second direction opposite to the first direction. 7. The method of claim 6,
The first blocking portion 5 includes a first outer member 55 for blocking the movement of the copper chip in a second direction opposite to the first direction,
The first outer member (55) is coupled to the other end of the first blocking member (51) facing the second direction and the other end of the first blocking member (52) facing the second direction, respectively. Electrolytic copper foil manufacturing equipment. According to claim 1,
The first blocking part (5) comprises a first through hole (56) formed through the first shielding member (52) to pass the separation copper foil (12) through. According to claim 1,
The first blocking portion 5 has one end and the other end spaced apart from each other in the width direction (X-axis direction) perpendicular to the direction in which the transport copper foil 10 is transported. Electrolytic copper foil manufacturing apparatus, characterized in that the length and the other end are formed to be 1/5 or more and 1/3 or less with respect to the length spaced apart from each other. According to claim 1,
Electrolytic copper foil manufacturing apparatus, characterized in that the first blocking portion (5) includes a first attachment member (57) that provides an adhesive force so that the copper chip is attached. According to claim 1,
The first blocking part 5 covers at least a portion between one end and the other end of the guide part 4 based on the width direction (X-axis direction) perpendicular to the direction in which the transport copper foil 10 is transported, Electrolytic copper foil manufacturing apparatus, characterized in that formed of a transparent or translucent material. According to claim 1,
a second cutting part 6 for cutting the transport copper foil 10 into the wound copper foil 11 and the separated copper foil 12; and between the second cutting part 6 and the winding part 2 so that the second cutting part 6 blocks the copper chips generated in the process of cutting the transport copper foil 10 from moving toward the wound copper foil 11. and a second blocking portion 7 that at least partially covers the direction), the electrodeposited copper foil manufacturing apparatus, characterized in that arranged to be spaced apart from each other.

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