KR200495515Y1 - Apparatus for Manufacturing Electrolytic Copper Foil - Google Patents

Abstract

The present invention is an electrodeposition unit for electrodeposition of copper foil; Winding unit for winding the copper foil; a first cutting part for cutting the transport copper foil so that the transport copper foil transported from the electrodeposition unit is separated into a wound copper foil to be wound on the winding part and a separated copper foil to be separated from the wound copper foil; a guide part for guiding the wound copper foil to be transported toward the winding part; And It relates to an electrodeposited copper foil manufacturing apparatus including a first suction unit for sucking the copper chip generated in the process of cutting the transport copper foil by the first cutting unit.

Description

Electrolytic copper foil manufacturing apparatus {Apparatus for Manufacturing Electrolytic Copper Foil}

The present invention relates to an electrodeposited copper foil manufacturing apparatus for manufacturing a copper foil.

Copper foil (銅箔) is used to manufacture various products such as anodes for secondary batteries and flexible printed circuit boards (FPCBs). This copper foil is manufactured through an electroplating method in which an electrolytic solution is supplied between an anode and a cathode and then an electric current flows. In manufacturing the copper foil through the electroplating method as described above, an electrodeposited copper foil manufacturing apparatus is used.

The electrodeposited copper foil manufacturing apparatus according to the prior art includes an anode part, a cathode part, and a cutting part.

The anode part is electrically energized with the cathode part through an electrolyte. The anode part functions as an anode in performing electroplating.

The cathode part is to manufacture a copper foil by an electroplating method using an electrolyte. The cathode part functions as a cathode in performing electroplating.

The cutting part is to cut the copper foil carried from the positive electrode part and the negative electrode part. On both sides of the cathode part, the copper foil is manufactured to be relatively thick due to the high current density. The cutting portion cuts a relatively thick portion of the copper foil. Thereafter, the copper foil cut by the cutting unit is wound.

Here, in the process of cutting the copper foil by the cutting unit, copper chips having a fine size are scattered due to various causes such as friction between the cutting unit and the copper foil. These copper chips are moved to the wound copper foil and attached to the surface of the wound copper foil, thereby causing various defects in the copper foil. In addition, copper chips attached to the surface of the wound copper foil cause wrinkles on the copper foil and scratches on the surface of the copper foil. When the defective copper foil is used for a negative electrode for a secondary battery as described above, the yield and quality of the secondary battery may also be reduced.

Therefore, there is an urgent need to develop an electrodeposited copper foil manufacturing apparatus capable of reducing the quality deterioration of the copper foil due to copper chips scattered in the process of cutting the copper foil.

The present invention has been devised to solve the above needs, and to provide an electrodeposited copper foil manufacturing apparatus capable of reducing the quality deterioration of copper foil due to copper chips scattered during cutting of the copper foil.

In order to solve the above problems, the present invention may include the following configuration.

An electrodeposited copper foil manufacturing apparatus according to the present invention includes an electrodeposition unit for electrodepositing the copper foil; Winding unit for winding the copper foil; a first cutting part for cutting the transport copper foil so that the transport copper foil transported from the electrodeposition unit is separated into a wound copper foil to be wound on the winding part and a separated copper foil to be separated from the wound copper foil; a guide part for guiding the wound copper foil to be transported toward the winding part; and a first suction unit for sucking the copper chips generated in the process of cutting the transport copper foil by the first cutting unit.

According to the present invention, the following effects can be achieved.

According to the present invention, as the amount of copper chips attached to the surface of the wound copper foil is reduced, the phenomenon of wrinkles on the copper foil and scratches on the surface of the copper foil can be reduced, thereby reducing defects occurring in the copper foil. In addition, the present invention can also increase the yield and quality of the secondary battery by reducing defects occurring in the copper foil when the copper foil is used for a negative electrode for a secondary battery.

1 is a schematic side view of an electrodeposited copper foil manufacturing apparatus according to the present invention;
2 is a schematic front view showing a state in which the first suction part partially covers between the first cut part and the winding part in the electrodeposited copper foil manufacturing apparatus according to the present invention;
3 is a schematic perspective view showing a first suction part in the electrodeposited copper foil manufacturing apparatus according to the present invention;
4 is a schematic side cross-sectional view showing a state in which the first suction unit sucks the copper chips generated as the first cutting unit cuts the transport copper foil in the electrodeposited copper foil manufacturing apparatus according to the present invention;
5 is a schematic front view showing a state in which the second suction part partially covers between the second cut part and the winding part in the electrodeposited copper foil manufacturing apparatus according to the present invention;

Hereinafter, an embodiment of an electrodeposited copper foil manufacturing apparatus according to the present invention will be described in detail with reference to the accompanying drawings.

1 to 5, the electrodeposited copper foil manufacturing apparatus 1 according to the present invention is a copper foil used for manufacturing various products such as a negative electrode for a secondary battery, a flexible printed circuit board (FPCB), etc. will be manufacturing To this end, the electrodeposited copper foil manufacturing apparatus 1 according to the present invention may include an electrodeposition part 2 , a winding part 3 , a first cutting part 4 , and a first suction part 6 .

Referring to FIG. 1 , the electrodeposition part 2 uses an electrolyte to electrodeposit a copper foil by an electroplating method. The electrodeposition part 2 may include a cathode 21 and an anode 22 . When the negative electrode 21 is energized with the positive electrode 22 and an electric current flows, copper ions in which the electrolyte is dissolved may be reduced in the negative electrode 21 . Accordingly, the carrier copper foil TF may be electrodeposited on the surface of the negative electrode 21 .

The cathode 21 may be rotated about the cathode shaft 211 . The negative electrode 21 is rotated about the negative electrode shaft 211, and the electrodeposition operation of electrodepositing the transport copper foil (TF) on the surface and the unwinding operation of removing the electrodeposited copper foil (TF) from the surface are performed continuously. can be done with The negative electrode 21 may be formed in a drum shape as a whole, but is not limited thereto, and may be formed in another shape as long as it can continuously perform electrodeposition and unwinding operations while rotating. The negative electrode 21 may be disposed above the positive electrode 22 .

The positive electrode 22 is electrically energized with the negative electrode 21 through the electrolyte. The anode 22 may function as an anode in performing electroplating. The anode 22 may be disposed below the cathode 21 . The positive electrode 22 may be disposed below the negative electrode 21 to be spaced apart from the surface of the negative electrode 21 . The anode 22 may be formed in the same shape as the surface of the cathode 21 . For example, when the negative electrode 21 is formed in a circular rectangular shape, the positive electrode 22 may be formed in a semicircular rectangular shape.

Referring to FIG. 1 , the winding unit 3 winds the copper foil. The winding part 3 may wind up the copper foil cut by the first cutting part 4 while rotating. The copper foil wound around the winding unit 3 may be cut to a predetermined width by an operator. The winding part 3 may be formed in the form of a drum as a whole, but is not limited thereto, and may be formed in another form as long as it can continuously perform a winding operation of winding the copper foil while rotating.

Referring to FIG. 1 , the first cutting part 4 cuts the transport copper foil TF carried from the electrodeposition part 2 . When the transport copper foil TF unwound from the negative electrode 21 is transported toward the first cut part 4 , the first cut part 4 wraps the transport copper foil TF to the wound copper foil CF and the separated copper foil SF. ) can be cut. The wound copper foil CF may correspond to a portion to be wound on the winding part 3 after the transport copper foil TF is cut. The separation copper foil SF may correspond to a portion to be separated from the wound copper foil CF after the transport copper foil TF is cut. The separation copper foil SF may be disposed on the outside of the carrier foil TF based on a width direction (X-axis direction) perpendicular to the direction in which the carrier copper foil TF is transported.

The first cutting part 4 may continuously cut the transport copper foil TF as the transport copper foil TF is continuously transported. Accordingly, the wound copper foil CF may be continuously transported toward the winding unit 3 to be wound around the winding unit 3 . After the separated copper foil SF is separated from the wound copper foil CF, it may be transported toward a separated copper foil winding unit (not shown) and wound around the separated copper foil winding unit. The separated copper foil winding unit is to wind the separated copper foil (SF).

The first cut portion 4 may be disposed to engage one end of the guide portion 5 based on the width direction (X-axis direction). For example, the first cutting part 4 may be partially inserted into a guide groove (not shown) formed in the guide part 5 to cut the transport copper foil TF that is continuously transported. The first cutting portion 4 may be formed in the form of a disk having a blade formed on the outer periphery, but is not limited thereto, and if the transport copper foil TF is transported and the transport copper foil TF is continuously cut at the same time It may be formed in other shapes.

1 to 5 , the guide part 5 guides the wound copper foil CF to be transported toward the winding part 3 . The guide 5 may support the wound copper foil CF. When the guide part 5 rotates, the wound copper foil CF may be transported toward the winding part 3 while being supported by the guide part 5 . The guide part 5 may be formed in the form of a drum extending in the width direction (X-axis direction), but is not limited thereto, and by supporting the wound copper foil CF, the wound copper foil CF is If it is a shape that can be guided to be transported toward the winding unit 3, it may be formed in another shape.

A guide groove (not shown) may be formed in the guide part 5 . The guide groove is a groove into which the first cut portion 4 is inserted. The guide part 5 may be engaged with the first cut part 4 through the guide groove. The first cutting part 4 may cut the transport copper foil TF in a state inserted into the guide groove as the guide part 5 rotates. The first cut part 4 may be engaged with the guide part 5 at one end of the guide part 5 based on the width direction (X-axis direction). The guide part 5 may rotate together with the first cut part 4 in a state of being engaged with the first cut part 4 . Accordingly, the first cutting part 4 may cut one end of the transport copper foil TF in a state engaged with the guide part 5 . Accordingly, the guide unit 5 performs a cutting operation of cutting the transport copper foil TF together with the first cutting unit 4 and a guide operation of guiding the wound copper foil CF toward the winding unit 3 together. can be done

1 to 5 , the first suction part 6 is for sucking the copper chips generated while the first cutting part 4 cuts the transport copper foil TF. The first suction unit 6 may block the copper chip from moving toward the wound copper foil CF by sucking the copper chip. Accordingly, the copper chips generated in the process of the first cutting unit 4 cutting the transport copper foil TF are moved toward the wound copper foil CF and are then removed by the suction force provided by the first suction unit 6 . 1 It can be sucked into the suction part (6).

Accordingly, the electrodeposited copper foil manufacturing apparatus 1 according to the present invention reduces the amount of copper chips generated by the first cutting part 4 moving toward the wound copper foil CF, so that the surface of the wound copper foil CF is applied. It is implemented to reduce the amount of attached copper chips. Therefore, the electrodeposited copper foil manufacturing apparatus 1 according to the present invention can improve the quality of the manufactured copper foil by reducing the degree of wrinkles in the wound copper foil CF as copper chips are attached to the surface of the wound copper foil CF. In addition, when the copper foil with improved quality is used for manufacturing the secondary battery, the yield and quality of the secondary battery can also be increased.

Referring to FIG. 1 , the first suction unit 6 may include a first suction mechanism 61 (shown in FIG. 1 hereinafter).

The first suction mechanism 61 is for providing a suction force for sucking the copper chip. The first suction mechanism 61 provides a suction force to the copper chip moving toward the wound copper foil CF, so that the copper chip moves toward the wound copper foil CF and then moves toward the first suction unit 6. .

The first suction mechanism 61 may provide suction force through a power generating means such as a motor (not shown). The first suction mechanism 61 may receive power from a separate power source to provide suction power. The first suction mechanism 61 may be connected to a collection container (not shown) for collecting the sucked copper chips. The copper chips sucked through the suction force provided by the first suction mechanism 61 may be moved toward the collecting container and collected in the collecting container. Accordingly, the electrodeposited copper foil manufacturing apparatus 1 according to the present invention can increase the easiness of the operation of removing the collected copper chips.

1 to 5 , the first suction unit 6 may include a first blocking mechanism 62 .

The first blocking mechanism 62 is for blocking the copper chips generated in the process of the first cutting part 4 cutting the transport copper foil TF from moving toward the wound copper foil CF. The first blocking mechanism 62 may be installed to at least partially cover between the first cutting part 4 and the winding part 3 . Accordingly, the copper chip generated by the first cutting part 4 may be moved toward the wound copper foil CF and blocked by the first blocking mechanism 62 .

Accordingly, the electrodeposited copper foil manufacturing apparatus 1 according to the present invention is implemented to further reduce the degree of movement of the copper chip toward the wound copper foil CF through the first blocking mechanism 62 . Accordingly, the electrodeposited copper foil manufacturing apparatus 1 according to the present invention can reduce the degree of adhesion of copper chips to the surface of the wound copper foil CF, so that the degree of wrinkles, scratches, etc. occurring on the copper foil in the wound copper foil CF In addition to reducing the yield, it is possible to further increase the yield and quality of the secondary battery manufactured using the copper foil.

One end of the first blocking mechanism 62 may be disposed at a position spaced apart from the first cutting part 4 in the first direction (ID arrow direction). The first direction (ID arrow direction) is a direction from one end of the guide part 5 toward the other end with respect to the width direction (X-axis direction). Accordingly, the first cut-off mechanism 62 points between the first cut-off part 4 and the winding part 3 in a state that protrudes from the first cut-out part 4 in the first direction (ID arrow direction). can be installed.

Accordingly, in the electrodeposited copper foil manufacturing apparatus 1 according to the present invention, the area in which the first blocking mechanism 62 blocks the copper chip moving toward the wound copper foil CF is increased in the first direction (ID arrow direction). is implemented Accordingly, in the electrodeposited copper foil manufacturing apparatus 1 according to the present invention, the amount of copper chips attached to the surface of the wound copper foil CF can be further reduced by blocking the copper chips moving in the first direction (ID arrow direction). In addition, the electrodeposited copper foil manufacturing apparatus 1 according to the present invention is implemented to block the movement of the copper chip toward other mechanisms and devices disposed in the first direction (ID arrow direction) with respect to the first cutting part 4 . Accordingly, the electrodeposited copper foil manufacturing apparatus 1 according to the present invention reduces the probability of failure of other mechanisms and devices due to scattered copper chips, thereby further increasing the operation rate and productivity.

The other end of the first blocking mechanism 62 may be disposed at a position spaced apart from the first cutting part 4 in the second direction (the direction of the ED arrow). The second direction (the direction of the ED arrow) is opposite to the first direction (the direction of the ID arrow). Accordingly, the first cut-off mechanism 62 points between the first cut-off part 4 and the winding part 3 in a state in which it protrudes from the first cut-out part 4 in the second direction (the direction of the ED arrow). can be installed.

Accordingly, in the electrodeposited copper foil manufacturing apparatus 1 according to the present invention, the area in which the first blocking mechanism 62 blocks the copper chip moving toward the wound copper foil CF is increased in the second direction (ED arrow direction). is implemented Therefore, in the electrodeposited copper foil manufacturing apparatus 1 according to the present invention, the amount of copper chips attached to the surface of the wound copper foil CF can be further reduced by blocking the copper chips moving in the second direction (the direction of the ED arrow). In addition, the electrodeposited copper foil manufacturing apparatus 1 according to the present invention is implemented to block the movement of the copper chip toward other mechanisms and devices disposed in the second direction (ED arrow direction) with respect to the first cutting part 4 . Accordingly, the electrodeposited copper foil manufacturing apparatus 1 according to the present invention reduces the probability of failure of other mechanisms and devices due to scattered copper chips, thereby further increasing the operation rate and productivity.

At least a portion of the first blocking mechanism 62 may be formed of a transparent or translucent material. Accordingly, in the electrodeposited copper foil manufacturing apparatus 1 according to the present invention, while the first blocking mechanism 62 blocks the copper chip moving toward the wound copper foil CF, the guide part 5 and the winding part 3 It may be implemented so as not to block the operator's view of the process performed between them. Therefore, the electrodeposited copper foil manufacturing apparatus 1 according to the present invention can contribute to further increasing the easiness of the management of the apparatus, structure, etc. disposed between the guide part 5 and the winding part 3 . The first blocking mechanism 62 may be formed of a transparent or semi-transparent material only a portion of the length extending in the width direction (X-axis direction). For example, the first blocking mechanism 62 may be formed of a material such as glass or acrylic.

The first blocking mechanism 62 may be connected to the first suction mechanism 61 . Accordingly, the first blocking mechanism 62 may serve as a passage to suck the copper chip through the suction force provided by the first suction mechanism 61 . Accordingly, in the electrodeposited copper foil manufacturing apparatus 1 according to the present invention, when the first blocking mechanism 62 blocks the movement of the copper chip toward the wound copper foil CF, the blocked copper chip is transferred to the first suction mechanism 61 ) It is implemented to be immediately sucked through the suction power provided by Therefore, the electrodeposited copper foil manufacturing apparatus 1 according to the present invention prevents copper chips from accumulating in the first blocking mechanism 62 , and thus increases the operation rate by increasing the cycle of cleaning operation for the first blocking mechanism 62 . can contribute to making

The first blocking mechanism 62 may be connected to the first suction mechanism 61 through a connection member (not shown) such as a hose. The first blocking mechanism 62 may be directly connected to the first suction mechanism 61 . Accordingly, the suction force provided by the first suction mechanism 61 may be applied to the copper chip through the first blocking mechanism 62 . A first suction port 62a may be formed in the first blocking mechanism 62 . The first suction port 62a may be an inlet of the first blocking mechanism 62 through which the suctioned copper chip is moved. The copper chip may be sucked into the first suction port 62a through the suction force provided by the first suction device 61 . The copper chips sucked into the first suction port 62a may be collected in the collection container. When the first shut-off mechanism 62 is connected to the first suction mechanism 61 through the connection member, the first suction port 62a is configured such that the sucked copper chip moves through the inner space of the connection member. It may communicate with the inner space of the connecting member.

2 to 5 , the first blocking mechanism 62 may include a first blocking member 621 and a first blocking member 622 .

The first blocking member 621 blocks the copper chip from moving toward the wound copper foil CF. The first shielding member 622 blocks the copper chip from moving toward the wound copper foil CF in a direction different from that of the first blocking member 621 . The first blocking member 621 may be installed to cover an area different from the first blocking member 622 . Accordingly, the first blocking mechanism 62 may block the copper chip moving toward the wound copper foil CF in different directions.

Accordingly, in the electrodeposited copper foil manufacturing apparatus 1 according to the present invention, compared to the comparative example in which the first blocking mechanism 62 blocks the copper chip only in one direction, the angle and area for blocking the copper chip moving in different directions are increased. implemented as much as possible. Therefore, the electrodeposited copper foil manufacturing apparatus 1 according to the present invention further reduces the amount of copper chips moved toward the wound copper foil CF, thereby further reducing the amount of copper chips attached to the surface of the wound copper foil CF. There are advantages.

The first blocking member 621 may cover the front of the first cutting part 4 to block the copper chip from moving forward from the first cutting part 4 to the winding part 3 . . The first blocking member 621 may cover the front of the first cutting part 4 by being disposed in front of the first cutting part 4 . The first blocking member 621 may be formed to extend in a height direction (Y-axis direction) perpendicular to the width direction (X-axis direction) to cover the front of the first cutting part 4 . Accordingly, in the electrodeposited copper foil manufacturing apparatus 1 according to the present invention, the area in which the first blocking mechanism 62 blocks the copper chip by the first blocking member 621 is further increased in the height direction (Y-axis direction) implemented as much as possible. Accordingly, the electrodeposited copper foil manufacturing apparatus 1 according to the present invention further reduces the amount of copper chips moved toward the wound copper foil CF, thereby further reducing the amount of copper chips attached to the surface of the wound copper foil CF. .

The first blocking member 621 may be formed in the form of a wide plate, but is not limited thereto, and may be formed in another form as long as it can block the copper chip moving toward the wound copper foil CF. For example, as the first blocking member 621 extends in the height direction (Y-axis direction), it may be formed by drawing an arc away from the first cutting part 4 .

The first blocking member 622 is coupled to the first blocking member 621 . The first blocking member 622 may be installed to extend in a different direction with respect to the extending direction of the first blocking member 621 to cover an area different from the first blocking member 621 . Accordingly, the first shielding member 622 may block the copper chip from moving to the wound copper foil CF in a direction different from that of the first blocking member 621 .

The first shielding member 622 may cover the lower side of the first cutting part 4 to block the copper chip from moving downward. The first shielding member 622 may be disposed below the first cutting part 4 to cover the lower side of the first cutting part 4 . The first blocking member 621 is in the front-rear direction (Z-axis direction) perpendicular to the width direction (X-axis direction) and the height direction (Y-axis direction) so as to cover the lower side of the first cutting part 4 . It may be formed to be extended. Accordingly, the electrodeposited copper foil manufacturing apparatus 1 according to the present invention can expect the following effects.

First, in the electrodeposited copper foil manufacturing apparatus 1 according to the present invention, the area in which the first blocking mechanism 62 blocks the copper chip by the first shielding member 622 is further increased in the front-rear direction (Z-axis direction). is implemented Accordingly, the electrodeposited copper foil manufacturing apparatus 1 according to the present invention further reduces the amount of copper chips moved toward the wound copper foil CF, thereby further reducing the amount of copper chips attached to the surface of the wound copper foil CF. .

Second, in the electrodeposited copper foil manufacturing apparatus 1 according to the present invention, as the first blocking member 622 covers the lower side of the first cutting part 4, it collides with the first blocking member 621 It is implemented to block even the copper chips scattered by the Therefore, the electrodeposited copper foil manufacturing apparatus 1 according to the present invention prevents copper chips from moving to the floor and to the instruments and devices disposed below the first blocking mechanism 62, so it is suitable for maintenance work such as cleaning and repair. It is possible to further increase the operation rate by increasing the cycle time.

Here, the front and the down are for distinguishing each configuration, and it will be clear to those of ordinary skill in the art to which the present invention pertains that it does not refer to a specific direction.

The first blocking member 622 may be coupled to a lower end of the first blocking member 621 . The first shielding member 622 may be formed in the form of a wide plate, but is not limited thereto, and may be formed in another form as long as it can block the copper chip moving downward.

2 and 3 , the first blocking mechanism 62 may include a first inner member 623 .

The first inner member 623 blocks the copper chip from moving in the first direction (the direction of the ID arrow). The first inner member 623 may be formed to cover the first direction (ID arrow direction) with respect to the first blocking member 621 and the first covering member 622 . The first inner member 623 has one end facing the first direction (ID arrow direction) from the first blocking member 621 and the first direction (ID arrow direction) from the first covering member 622 . One end facing can be coupled to each.

Accordingly, the electrodeposited copper foil manufacturing apparatus 1 according to the present invention is implemented such that the area in which the first blocking mechanism 62 blocks the copper chip by the first inner member 623 is further increased. Therefore, the electrodeposited copper foil manufacturing apparatus 1 according to the present invention further reduces the amount of copper chips moved in the first direction (ID arrow direction), thereby further reducing the amount of copper chips attached to the surface of the wound copper foil CF. can do it In addition, the electrodeposited copper foil manufacturing apparatus 1 according to the present invention can prevent the copper chip from moving to the instruments and devices arranged in the first direction (ID arrow direction) with respect to the first cutting part 4 . Therefore, the electrodeposited copper foil manufacturing apparatus 1 according to the present invention can further increase the operation rate by increasing the cycle for maintenance work such as cleaning and repair.

The first inner member 623 may be disposed to be positioned in the first direction (ID arrow direction) with respect to the first blocking member 621 and the first covering member 622 . The first inner member 623 may be formed in the form of a wide plate, but is not limited thereto, and may be formed in another form as long as it can block the copper chip moving in the first direction (ID arrow direction). have. For example, the first inner member 623 may be formed to be recessed in the first direction (ID arrow direction).

2 and 3 , the first blocking mechanism 62 may include a first outer member 624 .

The first outer member 624 blocks the copper chip from moving in the second direction (direction of the ED arrow). The first outer member 624 may be formed to cover the second direction (direction of the ED arrow) with respect to the first blocking member 621 and the first covering member 622 . To this end, the first outer member 624 has the other end facing the second direction (ED arrow direction) from the first blocking member 621 and the second direction (ED arrow direction) from the first covering member 622 . direction) may be coupled to each of the other ends facing each other.

Accordingly, the electrodeposited copper foil manufacturing apparatus 1 according to the present invention is implemented such that the area in which the first blocking mechanism 62 blocks the copper chip by the first outer member 624 is further increased. Accordingly, the electrodeposited copper foil manufacturing apparatus 1 according to the present invention further reduces the amount of copper chips moved toward the wound copper foil CF, thereby further reducing the amount of copper chips attached to the surface of the wound copper foil CF. . In addition, the electrodeposited copper foil manufacturing apparatus 1 according to the present invention can prevent the copper chip from moving to the instruments and devices arranged in the first direction (ID arrow direction) with respect to the first cutting part 4 . Therefore, the electrodeposited copper foil manufacturing apparatus 1 according to the present invention can further increase the operation rate by increasing the cycle for maintenance work such as cleaning and repair.

The first outer member 624 may be disposed to be positioned in the second direction (the direction of the ED arrow) with respect to the first blocking member 621 and the first shielding member 622 . The first outer member 624 may be formed in the form of a wide plate, but is not limited thereto, and may be formed in another form as long as it can block the copper chip moving in the second direction (the direction of the ED arrow). have.

Referring to FIG. 5 , the electrodeposited copper foil manufacturing apparatus 1 according to the present invention may include a second cutting part 7 and a second suction part 8 .

The second cutting part 7 cuts the transport copper foil TF into the wound copper foil CF and the separated copper foil SF. The second cutting portion 7 may continuously cut the transport copper foil TF as the transport copper foil TF is continuously transported. The first cut portion 4 and the second cut portion 7 may be disposed to be spaced apart from each other in the width direction (X-axis direction). In this case, the first cut part 4 and the second cut part 7 are spaced apart from each other based on the width direction (X-axis direction) and may be installed to engage one end and the other end of the guide part 5, respectively. have. For example, when the first cut part 4 is installed to engage one end of the guide part 5 , the second cut part 7 may be installed to engage the other end of the guide part 5 . Accordingly, the first cut portion 4 and the second cut portion 7 may cut both ends of the transport copper foil (TF).

The second cutting part 7 may be formed in the form of a disk having a blade formed on the outer periphery, but is not limited thereto, and if the transport copper foil TF is transported and the transport copper foil TF is continuously cut at the same time It may be formed in other shapes.

The second suction part 8 is for sucking the copper chips generated while the second cutting part 7 cuts the transport copper foil TF. The second suction unit 8 may block the copper chip from moving toward the wound copper foil CF by sucking the copper chip. Accordingly, the copper chips generated in the process of the second cutting unit 7 cutting the transport copper foil TF are moved toward the wound copper foil CF and are then removed by the suction force provided by the second suction unit 8 . 2 It can be sucked into the suction part (8).

Accordingly, the electrodeposited copper foil manufacturing apparatus 1 according to the present invention reduces the amount of copper chips generated by the second cutting part 7 moving toward the wound copper foil CF, so that on the surface of the wound copper foil CF. It is implemented to further reduce the amount of copper chips to be attached. Therefore, the electrodeposited copper foil manufacturing apparatus 1 according to the present invention can improve the quality of the manufactured copper foil by reducing the degree of wrinkles in the wound copper foil CF as copper chips are attached to the surface of the wound copper foil CF. In addition, when the copper foil with improved quality is used for manufacturing the secondary battery, the yield and quality of the secondary battery can also be increased.

When the second cut part 7 and the first cut part 4 are disposed to be spaced apart from each other in the width direction (X-axis direction), the second suction part 8 and the first suction part 6 ) may be arranged to be spaced apart from each other in the width direction (X-axis direction). Accordingly, in the electrodeposited copper foil manufacturing apparatus 1 according to the present invention, the transport copper foil ( TF), it is implemented so that the copper chip can be sucked through the second suction unit 8 and the first suction unit 6 . Therefore, in the electrodeposited copper foil manufacturing apparatus 1 according to the present invention, the first suction part 6 extends along the width direction (X-axis direction) to cut the second cut part 7 and the first cut part 4 . In preparation for the comparative example in which all of them are covered, since the size in which the first suction part 6 is formed can be reduced, space efficiency can be increased.

Referring to FIG. 5 , the second suction unit 8 may include a second suction mechanism (not shown).

The second suction mechanism is for providing a suction force for sucking the copper chip. The second suction mechanism may provide a suction force to the copper chip moving toward the wound copper foil CF so that the copper chip moves toward the wound copper foil CF and then toward the second suction unit 8 .

The second suction mechanism may provide suction power through a power generating means such as a motor (not shown). The second suction mechanism may receive power from a separate power source to provide suction power. The second suction mechanism may receive power from the same power source as the first suction mechanism 61 to provide suction power. The second suction mechanism may be connected to the collection container (not shown) for collecting the sucked copper chips. The copper chips sucked through the suction force provided by the first suction mechanism 61 may be moved toward the collecting container and collected in the collecting container. Accordingly, the electrodeposited copper foil manufacturing apparatus 1 according to the present invention can increase the easiness of the operation of removing the collected copper chips.

Referring to FIG. 5 , the second suction unit 8 may include a second blocking mechanism 82 .

The second blocking mechanism 82 is to block the copper chips generated while the second cutting part 7 cuts the transport copper foil TF from moving toward the wound copper foil CF. The second blocking mechanism 82 may be installed to at least partially cover between the second cutting part 7 and the winding part 3 . Accordingly, the copper chip generated by the second cutting part 7 may be moved toward the wound copper foil CF and blocked by the second blocking mechanism 82 .

Accordingly, the electrodeposited copper foil manufacturing apparatus 1 according to the present invention is implemented to further reduce the degree of movement of the copper chip toward the wound copper foil CF through the second blocking mechanism 82 . Accordingly, the electrodeposited copper foil manufacturing apparatus 1 according to the present invention can reduce the degree of adhesion of copper chips to the surface of the wound copper foil CF, so that the degree of wrinkles, scratches, etc. occurring on the copper foil in the wound copper foil CF In addition to reducing the yield, it is possible to further increase the yield and quality of the secondary battery manufactured using the copper foil.

One end of the second blocking mechanism 82 may be disposed at a position spaced apart from the second cutting part 7 in the first direction (ID arrow direction). Accordingly, the second cut-off mechanism 82 points between the second cut-off part 7 and the winding part 3 in a state in which it protrudes from the second cut-off part 7 in the first direction (ID arrow direction). can be installed.

Accordingly, in the electrodeposited copper foil manufacturing apparatus 1 according to the present invention, the area in which the second blocking mechanism 82 blocks the copper chip moving toward the wound copper foil CF increases in the first direction (ID arrow direction). is implemented Accordingly, in the electrodeposited copper foil manufacturing apparatus 1 according to the present invention, the amount of copper chips attached to the surface of the wound copper foil CF can be further reduced by blocking the copper chips moving in the first direction (ID arrow direction). In addition, the electrodeposited copper foil manufacturing apparatus 1 according to the present invention is implemented to block the movement of the copper chip toward other mechanisms and devices arranged in the first direction (ID arrow direction) with respect to the second cutting part 7 . Accordingly, the electrodeposited copper foil manufacturing apparatus 1 according to the present invention reduces the probability of failure of other mechanisms and devices due to scattered copper chips, thereby further increasing the operation rate and productivity.

The other end of the second blocking mechanism 82 may be disposed at a position spaced apart from the second cutting part 7 in the second direction (the direction of the ED arrow). Accordingly, the second cut-off mechanism 82 points between the second cut-off part 7 and the winding part 3 in a state in which it protrudes from the second cut-out part 7 in the second direction (the direction of the ED arrow). can be installed.

Accordingly, in the electrodeposited copper foil manufacturing apparatus 1 according to the present invention, the area in which the second blocking mechanism 82 blocks the copper chip moving toward the wound copper foil CF is increased in the second direction (ED arrow direction). is implemented Therefore, in the electrodeposited copper foil manufacturing apparatus 1 according to the present invention, the amount of copper chips attached to the surface of the wound copper foil CF can be further reduced by blocking the copper chips moving in the second direction (the direction of the ED arrow). In addition, the electrodeposited copper foil manufacturing apparatus 1 according to the present invention is implemented to block the movement of the copper chip toward other mechanisms and devices arranged in the second direction (the direction of the ED arrow) with respect to the second cutting part 7 . Accordingly, the electrodeposited copper foil manufacturing apparatus 1 according to the present invention reduces the probability of failure of other mechanisms and devices due to scattered copper chips, thereby further increasing the operation rate and productivity.

At least a portion of the second blocking mechanism 82 may be formed of a transparent or translucent material. Accordingly, in the electrodeposited copper foil manufacturing apparatus 1 according to the present invention, while the second blocking mechanism 82 blocks the copper chip moving toward the wound copper foil CF, the guide part 5 and the winding part 3 It may be implemented so as not to block the operator's view of the process performed between them. Therefore, the electrodeposited copper foil manufacturing apparatus 1 according to the present invention can contribute to further increasing the easiness of the management of the apparatus, structure, etc. disposed between the guide part 5 and the winding part 3 . The second blocking mechanism 82 may be formed of a transparent or semi-transparent material for only a portion of the length extending in the width direction (X-axis direction). For example, the second blocking mechanism 82 may be formed of a material such as glass or acrylic.

The second blocking mechanism 82 may be connected to the first suction mechanism 81 . Accordingly, the second blocking mechanism 82 may serve as a passage to suck the copper chip through the suction force provided by the second suction mechanism. Accordingly, in the electrodeposited copper foil manufacturing apparatus 1 according to the present invention, when the second blocking mechanism 82 blocks the copper chip from moving toward the wound copper foil CF, the blocked copper chip is provided by the second suction mechanism. It is implemented to be immediately sucked through the suction force. Therefore, the electrodeposited copper foil manufacturing apparatus 1 according to the present invention prevents copper chips from accumulating in the second blocking mechanism 82 , and thus increases the operation rate by increasing the cycle of the cleaning operation for the second blocking mechanism 82 . can contribute to making

The second blocking mechanism 82 may be connected to the first suction mechanism 81 . In this case, each of the second blocking mechanism 82 and the first blocking mechanism 62 is connected to the first suction mechanism 61 to suck the copper chip through the suction force provided by the first suction mechanism 61 . It can serve as a pathway to do so. Accordingly, in the electrodeposited copper foil manufacturing apparatus 1 according to the present invention, when preparing for the embodiment in which the second blocking mechanism 82 is connected to the second suction mechanism, the second suction mechanism is not required, so manufacturing and operating costs can be reduced, and space efficiency can be further increased.

The second blocking mechanism 82 may be connected to the second suction mechanism through a connection member (not shown) such as a hose. The second blocking mechanism 82 may be directly connected to the second suction mechanism. Accordingly, the suction force provided by the second suction mechanism may be applied to the copper chip through the second blocking mechanism 82 . A second suction port (not shown) may be formed in the second blocking mechanism 82 . The second suction port may be an inlet of the second blocking mechanism 82 through which the suctioned copper chip is moved. Through the suction force provided by the second suction mechanism, the copper chip may be sucked into the second suction hole. The copper chips sucked into the second suction port may be collected in the collection container. When the second blocking mechanism 82 is connected to the second suction mechanism through the connecting member, the second suction port is located in the inner space of the connecting member so that the sucked copper chip moves through the inner space of the connecting member. can be communicated.

Referring to FIG. 5 , the second blocking mechanism 82 may include a second blocking member 821 and a second shielding member 822 .

The second blocking member 821 blocks the copper chip from moving toward the wound copper foil CF. The second shielding member 822 blocks the copper chip from moving toward the wound copper foil CF in a direction different from that of the second blocking member 821 . The second blocking member 821 may be installed to cover an area different from the second blocking member 822 . Accordingly, the second blocking mechanism 82 may block the copper chips moving toward the wound copper foil CF in different directions.

Accordingly, in the electrodeposited copper foil manufacturing apparatus 1 according to the present invention, when the second blocking mechanism 82 blocks the copper chip only in one direction, the angle and area for blocking the copper chip moving in different directions are increased. implemented as much as possible. Therefore, the electrodeposited copper foil manufacturing apparatus 1 according to the present invention further reduces the amount of copper chips moved toward the wound copper foil CF, thereby further reducing the amount of copper chips attached to the surface of the wound copper foil CF. There are advantages.

The second blocking member 821 may cover the front of the second cutting part 7 to block the copper chip from moving forward. The second blocking member 821 may cover the front of the second cutting part 7 by being disposed in front of the second cutting part 7 . The second blocking member 821 may be formed to extend in the height direction (Y-axis direction) to cover the front of the second cut-off part 7 . Accordingly, in the electrodeposited copper foil manufacturing apparatus 1 according to the present invention, the area in which the second blocking mechanism 82 blocks the copper chip by the second blocking member 821 is further increased in the height direction (Y-axis direction) implemented as much as possible. Accordingly, the electrodeposited copper foil manufacturing apparatus 1 according to the present invention further reduces the amount of copper chips moved toward the wound copper foil CF, thereby further reducing the amount of copper chips attached to the surface of the wound copper foil CF. .

The second blocking member 821 may be formed in a wide plate shape, but is not limited thereto, and may be formed in another shape as long as it can block the copper chip moving toward the wound copper foil CF. For example, as the second blocking member 821 extends in the height direction (Y-axis direction), it may be formed by drawing an arc away from the second cutting part 7 .

The second blocking member 822 is coupled to the second blocking member 821 . The second blocking member 822 may be installed to extend in a different direction from the extending direction of the second blocking member 821 to cover an area different from the second blocking member 821 . Accordingly, the second shielding member 822 may block movement of the copper chip to the wound copper foil CF in a direction different from that of the second blocking member 821 .

The second shielding member 822 may cover the lower portion of the second cutting part 7 to block the copper chip from moving downward. The second shielding member 822 may be disposed below the second cut-out part 7 to cover the lower side of the second cut-out part 7 . The second blocking member 821 is formed along the front-rear direction (Z-axis direction) perpendicular to the width direction (X-axis direction) and the height direction (Y-axis direction) so as to cover the lower side of the second cutting part 7 . It may be formed to be extended. Accordingly, the electrodeposited copper foil manufacturing apparatus 1 according to the present invention can expect the following effects.

First, in the electrodeposited copper foil manufacturing apparatus 1 according to the present invention, the area in which the second blocking mechanism 82 blocks the copper chip by the second shielding member 822 is further increased in the front-rear direction (Z-axis direction). is implemented Accordingly, the electrodeposited copper foil manufacturing apparatus 1 according to the present invention further reduces the amount of copper chips moved toward the wound copper foil CF, thereby further reducing the amount of copper chips attached to the surface of the wound copper foil CF. .

Second, in the electrodeposited copper foil manufacturing apparatus 1 according to the present invention, as the second shielding member 822 covers the lower side of the second cutting part 7, the second blocking member 821 collides with the second blocking member 821. It is implemented to block even the copper chips scattered by the Therefore, the electrodeposited copper foil manufacturing apparatus 1 according to the present invention prevents the copper chips from moving to the floor, mechanisms and devices disposed below the second blocking mechanism 82, and thus is suitable for maintenance work such as cleaning and repair. It is possible to further increase the operation rate by increasing the cycle time.

The second blocking member 822 may be coupled to a lower end of the second blocking member 821 . The second shielding member 822 may be formed in the form of a wide plate, but is not limited thereto, and may be formed in another form as long as it can block the copper chip moving downward.

Referring to FIG. 5 , the second blocking mechanism 82 may include a second inner member 823 .

The second inner member 823 blocks the copper chip from moving in the second direction (direction of the ED arrow). The second inner member 823 may be formed to cover the second direction (direction of the ED arrow) with respect to the second blocking member 821 and the second shielding member 822 . The second inner member 823 has one end facing the second direction (ED arrow direction) from the second blocking member 821 and the second direction (ED arrow direction) from the second covering member 822 . One end facing can be coupled to each.

Accordingly, the electrodeposited copper foil manufacturing apparatus 1 according to the present invention is implemented such that the area in which the second blocking mechanism 82 blocks the copper chip by the second inner member 823 is further increased. Accordingly, the electrodeposited copper foil manufacturing apparatus 1 according to the present invention further reduces the amount of copper chips moved in the second direction (the direction of the ED arrow), thereby further reducing the amount of copper chips attached to the surface of the wound copper foil CF. can do it In addition, the electrodeposited copper foil manufacturing apparatus 1 according to the present invention can prevent the copper chip from moving to the instruments and devices arranged in the second direction (the direction of the ED arrow) with respect to the second cutting part 7 . Accordingly, the electrodeposited copper foil manufacturing apparatus 1 according to the present invention can further increase the operation rate by increasing the cycle for maintenance work such as cleaning and repair.

The second inner member 823 may be disposed to be positioned in the second direction (direction of the ED arrow) with respect to the second blocking member 821 and the second shielding member 822 . The second inner member 823 may be formed in the form of a wide plate, but is not limited thereto, and may be formed in another form as long as it can block the copper chip moving in the second direction (the direction of the ED arrow). have. For example, the second inner member 823 may be formed to be recessed in the second direction (direction of the ED arrow).

Referring to FIG. 5 , the second blocking mechanism 82 may include a second outer member 824 .

The second outer member 824 blocks the copper chip from moving in the first direction (ID arrow direction). The second outer member 824 may be formed to cover the first direction (ID arrow direction) with respect to the second blocking member 821 and the second shielding member 822 . To this end, the second outer member 824 has the other end of the second blocking member 821 facing the first direction (ID arrow direction) and the second end of the second blocking member 822 in the first direction (ID arrow direction). direction) may be coupled to each of the other ends facing each other.

Accordingly, the electrodeposited copper foil manufacturing apparatus 1 according to the present invention is implemented such that the area in which the second blocking mechanism 82 blocks the copper chip by the second outer member 824 is further increased. Accordingly, the electrodeposited copper foil manufacturing apparatus 1 according to the present invention further reduces the amount of copper chips moved toward the wound copper foil CF, thereby further reducing the amount of copper chips attached to the surface of the wound copper foil CF. . In addition, the electrodeposited copper foil manufacturing apparatus 1 according to the present invention can prevent the copper chip from moving to the instruments and devices arranged in the first direction (ID arrow direction) with respect to the second cutting part 7 . Accordingly, the electrodeposited copper foil manufacturing apparatus 1 according to the present invention can further increase the operation rate by increasing the cycle for maintenance work such as cleaning and repair.

The second outer member 824 may be disposed to be positioned in the first direction (ID arrow direction) with respect to the second blocking member 821 and the second shielding member 822 . The second outer member 824 may be formed in the form of a wide plate, but is not limited thereto, and may be formed in another form as long as it can block the copper chip moving in the first direction (ID arrow direction). have.

The present invention described above is not limited to the above-described embodiments and the accompanying drawings, and it is common in the technical field to which the present invention pertains that various substitutions, modifications and changes are possible without departing from the technical spirit of the present invention. It will be clear to those who have the knowledge of

1: Electrolytic copper foil manufacturing apparatus 2: Electrodeposition part
3: winding part 4: first cut part
5: guide part 6: first suction part
7: second cut part 8: second suction part
21: negative electrode 22: positive electrode
61: first suction mechanism 62: first blocking mechanism
82: second blocking mechanism 621: first blocking member
622: first covering member 623: first inner member
624: first outer member 821: second blocking member
822: second covering member 823: second inner member
824: second outer member

Claims (10)

Electrodeposition part (2) for electrodeposition of the copper foil;
Winding unit for winding the copper foil (3);
The transport copper foil so that the transport copper foil TF transported from the electrodeposition unit 2 is separated into a wound copper foil CF to be wound on the winding part 3 and a separation copper foil SF to be separated from the wound copper foil CF A first cutting portion (4) for cutting (TF);
a guide part 5 for guiding the wound copper foil CF to be transported toward the winding part 3; and
The first cutting part 4 includes a first suction part 6 for sucking the copper chips generated in the process of cutting the transport copper foil TF,
The first suction part 6 is connected to a first suction device 61 providing suction force for sucking the copper chip, and the first suction device 61 to provide the first cutting part 4 and the winding part 3 ) including a first blocking mechanism 62 installed to at least partially cover between,
The first blocking mechanism 62 is disposed between the wound copper foil (CF) and the separated copper foil (SF) to block the copper chip moving toward the wound copper foil (CF) when the transport copper foil (TF) is cut. delete According to claim 1,
The first blocking mechanism 62 includes a first blocking member 621 for blocking the copper chip from moving toward the wound copper foil CF, and a direction different from the direction in which the first blocking member 621 extends. and a first shielding member 622 coupled to the first blocking member 621 to extend,
The electrodeposited copper foil manufacturing apparatus, characterized in that the first blocking member (621) and the first shielding member (622) are installed to cover different regions. 4. The method of claim 3,
The first blocking member 621 covers the front of the first cutting part 4 to block the copper chip from moving forward toward the winding part 3 from the first cutting part 4 Electrolytic copper foil manufacturing apparatus with 4. The method of claim 3,
The first shielding member (622) is an electrodeposited copper foil manufacturing apparatus, characterized in that to cover the lower portion of the first cutting portion (4) to block the copper chip from moving downward. 4. The method of claim 3,
The first blocking mechanism 62 is coupled to each of the first blocking member 621 and the first blocking member 622 in a first direction from one end of the guide part 5 to the other end in the width direction. Including the first inner member 623,
The first inner member (623) is an electrodeposited copper foil manufacturing apparatus, characterized in that it blocks the copper chip from moving in the first direction. 4. The method of claim 3,
The first blocking mechanism 62 includes a first outer member 624 coupled to each of the first blocking member 621 and the first blocking member 622 in a second direction opposite to the first direction, ,
The first outer member (624) is an electrodeposited copper foil manufacturing apparatus, characterized in that it blocks the copper chip from moving in the second direction. According to claim 1,
One end of the first blocking mechanism 62 is disposed at a position spaced apart from the first cutting part 4 in the first direction from one end of the guide part 5 to the other end in the width direction,
The other end of the first blocking mechanism (62) is an electrodeposited copper foil manufacturing apparatus, characterized in that it is disposed at a position spaced apart from the first cutting portion (4) in a second direction opposite to the first direction. According to claim 1,
The first blocking mechanism 62 is an electrodeposited copper foil manufacturing apparatus, characterized in that at least a portion is formed of a transparent or translucent material. According to claim 1,
a second cutting part 7 for cutting the transport copper foil TF so that the transport copper foil TF is separated into the wound copper foil CF and the separated copper foil SF; and a second suction part 8 for sucking the copper chips generated in the process where the second cutting part 7 cuts the transport copper foil TF,
The electrodeposited copper foil manufacturing apparatus, characterized in that the first cut portion (4) and the second cut portion (7) are arranged to be spaced apart from each other based on the width direction.

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