KR200454664Y1

KR200454664Y1 - Reflow Soldering Machine

Info

Publication number: KR200454664Y1
Application number: KR20090004113U
Authority: KR
Inventors: 이종호
Original assignee: 주식회사 티에스엠
Priority date: 2009-04-09
Filing date: 2009-04-09
Publication date: 2011-07-19
Also published as: KR20100010179U

Abstract

The present invention relates to a reflow soldering machine, and by heating the outer wall of the air blocking unit using high temperature air on the preheating side, it is possible to raise the temperature of the inner space of the air blocking unit, thereby fundamentally solving the soldering problem of the PCB. In addition, it has the effect of contributing to the improvement of quality, reducing the frequency of stopping the production line, and improving the productivity. In addition to the cost savings, the existing reflow soldering machine can be easily retrofitted for immediate field application.

Description

Reflow Soldering Machine {REFLOW SOLDERING MACHINE}

The present invention relates to a reflow soldering machine for soldering to a PCB, and relates to a reflow soldering machine for heating the outer wall of the air blocking part using high temperature air on the preheating side to prevent liquefaction of the flux gas.

In general, reflow soldering machines have a process of heating or cooling solder paste for solder in a production line for attaching leadframe and PCB to each other or for mounting small electronic components such as semiconductor chips or resistor chips on the PCB. It is a device for attaching to a phase.

FIG. 1 is a perspective view of a conventional reflow soldering machine, and FIG. 2 is a front view of a conventional reflow soldering machine, and the reflow soldering machine as shown in the drawing includes a conveyor conveying part (10) in a chamber 10 formed integrally. 11), oven 12, exhaust 14 and the like.

An input unit 15 is formed in front of the chamber 10 to inject the PCB 30. The PCB 30 introduced through the input unit 15 is supplied to the conveyor transfer unit 11 to be in the oven 12. Transferred to negative.

At this time, the PCB 30 is supplied in a state where solder paste is applied. As shown in FIG. 2, the oven 12 includes a preheating unit 12a, a main heating unit 12b, and a cooling unit 12c, and the PCB 30 includes a preheating unit 12a and a preheating unit ( 12b), the solder paste is melted by hot air and soldered.

Thereafter, the solder paste is cooled and solidified by cold air while passing through the cooling unit 12c to complete the soldering process of the PCB 30.

In this case, a lead frame or a semiconductor chip is soldered onto the PCB 30, and the solder paste generates carbonized gas, that is, flux gas in the process of melting at a high temperature (220 to 240 ° C.).

Such flux gas is discharged and recovered by the exhaust part 14 formed behind the cooling part 12c of the oven 12.

The conventional reflow soldering machine as described above forms an air cutoff portion 12d at an inlet side and an outlet side of the oven 12 into which the PCB 30 is introduced, thereby preventing the internal heat from being lost. On the other hand, the flux gas generated inside the oven 12 is prevented from being directly discharged into the atmosphere.

3 is an enlarged view illustrating main parts of an oven inlet side of a conventional reflow soldering machine.

In the prior art as shown in the figure, an air shutoff portion 12d is provided at the inlet side of the oven 12 to block the heat and flux gas from being released into the atmosphere.

Here, a tunnel-shaped air curtain is formed at the center of the air blocking part 12d to surround the PCB 30 which is mounted on the conveyor conveying part 11 and transported from the outside.

The air cutout part 12d has a structure in which fluid can move freely along the movement path of the preheating part 12a, the main heat part 12b, and the conveyor transfer part 11, which are the next steps.

That is, the moving passage of the conveyor conveying unit 11 serves to move the flux gas as well as the heat of the preheating unit 12a and the main heating unit 12b.

Therefore, the flux gas always exists in the air cutout 12d together with the heated air.

However, the temperature inside the air cutout 12d is maintained at a significantly lower temperature than the preheating unit 12a and the main heating unit 12b, which are the next processes, which are introduced through the moving passage of the conveyor conveying unit 11. This is because the heated air is directly heat-exchanged by the outside air introduced through the inlet 15 of the chamber 10 or by heat-exchanging with the inner walls of the air cutout 12d in contact with the outside air so that the average temperature falls. .

At this time, the average temperature inside the air cutout (12d) reaches 80 ~ 90 ℃. This can be seen that considerably lower temperature, considering that the average temperature of the preheating unit 12a is 180 ~ 210 ℃.

Moreover, the range of 80-90 degreeC which is the average temperature in the air cutout part 12d is the temperature which flux gas liquefies, and the flux gas which was not exhausted through the exhaust part 14 is an outer wall or an image of the air cutout part 12d. A problem occurs that drops onto the upper surface of the PCB 30 introduced into the oven 12 by forming a liquid droplet on the side wall.

As such, the liquid flux 31 dropped on the PCB 30 has a problem of causing soldering defects. If such a defect occurs, the production of the product must be stopped, and the air cutout 12d needs to be cleaned and restarted, which not only lowers the productivity, but also lacks reliability in terms of quality control of the product.

An object of the present invention for solving the above problems is to increase the temperature of the inner space of the air blocking portion by heating the outer wall of the air blocking portion using high temperature air on the preheating side.

Another object of the present invention is to simplify the construction by simply changing the internal structure without installing a separate equipment or device, and to simply modify the existing reflow soldering machine to be immediately applied to the field.

In order to achieve the above object, the present invention provides a reflow soldering machine including a conveyor conveying part, an oven, and an exhaust part in an integrally formed chamber, wherein a first air blocking part is formed at an inlet side of the oven, and the first air blocking is performed. Characterized in that the liquefaction prevention means for preventing the liquefaction of the flux gas in the portion.

Here, the liquefaction prevention means is characterized in that the heating means for heating the outer wall of the upper space of the first air blocking portion.

In addition, the liquefaction prevention means is characterized in that the heating by installing an electric heater using a heating coil on the rear surface of the outer wall of the first air blocking portion.

In addition, the liquefaction prevention means is characterized in that the air duct connecting the preheated portion side and the upper outer wall of the first air cut-off portion, and supplies the hot air to the air duct to be heated.

At this time, the air duct is formed to form a flow path of the shape surrounding the upper outer wall of the first air blocking portion, the flow path is characterized in that the "c" shape.

In addition, the flow path of the air duct is characterized in that the inlet to which the hot air is supplied is connected to the lower side of the heater, the outlet is connected to the upper side of the heater.

In addition, the flow path of the air duct is characterized in that it consists of a lower passage connected to the inlet side, and an upper passage connected to the outlet side.

The present invention heats the outer wall of the air blocking unit by using the high temperature air on the preheating side, thereby increasing the temperature of the inner space of the air blocking unit, thereby solving the problem of soldering defect of the PCB and contributing to quality improvement. It has the effect of improving the productivity by reducing the frequency of stopping the production line.

This design can be installed by simply changing the internal structure without installing any additional equipment or device. Therefore, it is possible to reduce the installation cost and to easily modify the existing reflow soldering machine and immediately apply it in the field. Have

Hereinafter, with reference to the accompanying drawings for a preferred embodiment according to the present invention will be described in detail.

4 is a front view of the reflow soldering machine according to the present invention.

In the reflow soldering machine of the present invention as shown in the same figure, the conveyor conveyance part 110, the oven 120, the exhaust part 140, etc. are comprised in the chamber 100 integrally formed.

A PCB 300 input unit 150 is formed in front of the chamber 100, and the PCB 300 supplied to the input unit 150 is mounted on the conveyor transfer unit 110 and transferred into the oven 120. .

At this time, the PCB 300 is a state in which the solder paste is applied, the solder paste is melted by the high temperature hot air while passing through the oven 120 to be soldered.

Looking at the internal structure of the oven 120 in more detail, a first air car end 121 is installed at the inlet side, the preheating unit 123 and the main heating unit 125 behind the first air blocking unit 121. ) And cooling units 127 are sequentially arranged, and a second air blocking unit 129 is provided at the outlet side behind the cooling unit 127.

Referring to the preheater 123, a heater 123b which is a heating element and a blower 123a for blowing hot air by blowing the heater 123b are provided in a pair. Such a combination of the heater 123b and the blower 123a may be provided with a plurality of pairs so as to face each other on the upper and lower sides with the PCB 300 interposed therebetween on the moving passage 111 of the conveyor transfer unit 110.

4 illustrates an example in which a combination of four pairs of heaters 123b and a blower 123a are installed in the preheater 123 in a vertical direction.

The hot air generated by the preheater 123 is supplied to the PCB 300 to preheat the solder paste. At this time, the preheating temperature is suitable for the average 180 ~ 210 ℃ range, it is possible to adjust the preheating temperature range by adjusting the heating temperature of each heater (123b).

Thereafter, the preheated PCB 300 is transferred to the main heating unit 125 to perform a soldering process.

Referring to the main heating unit 125, a heater 125b which is a heating element and a blower 125a for blowing hot air by blowing the heater 125b are provided in a pair. Such a combination of the heater 123b and the blower 123a may be provided with a plurality of pairs so as to face each other on the upper and lower sides with the PCB 300 interposed therebetween on the moving passage 111 of the conveyor conveyer 110.

4 illustrates an example in which a combination of two pairs of heaters 125b and a blower 125a is installed vertically in the main heating unit 125.

The hot air generated in the main heating part 125 is supplied to the PCB 300 to melt and solder the solder paste. At this time, the soldering temperature is an appropriate range of 220 ~ 240 ℃ average, it is possible to control the soldering temperature range by adjusting the heating temperature of each heater (125b).

Thereafter, the soldered PCB 300 is transferred to the cooling unit 127 to perform a cooling process.

The cooling unit 127 will be described. A cooler 127b and a blower 127a for blowing cold air by blowing the cooler 127b are provided in a pair. Such a combination of the cooler 127b and the blower 127a may be provided with a plurality of pairs so as to face each other on the upper and lower sides with the PCB 300 interposed therebetween on the moving passage 111 of the conveyor transporter 110.

4 illustrates an example in which a combination of two coolers 127b and a blower 127a is installed only on the upper side of the PCB 300 in the cooling unit 127.

The cold air generated in the cooling unit 127 is supplied to the PCB 300 to solidify the solder paste in the molten state, wherein the temperature of the cooling unit 127 is preferably in the range of 100 ~ 150 ℃, This may be controlled by adjusting the temperature of the cooler 127b.

Here, the PCB 300 is generated in the process of soldering the flux gas, such a flux gas is present in the state contained in the hot air in the oven (120).

The flux gas is discharged directly into the atmosphere by forming the first air blocking portion 121 and the second air blocking portion 129 at the inlet side and the opposite outlet side of the oven 120 into which the PCB 300 is introduced. Will be blocked.

At this time, the first air blocking unit 121 and the second air blocking unit 129 is rapidly lost to the heat of the inside of the oven 120 to the outside is lost or a large amount of outside air is introduced into the oven 120 It plays a role of blocking the occurrence of extreme temperature change.

Here, the exhaust part 140 may be connected to the second air blocking part 129 to discharge the flux gas inside the oven 120.

On the other hand, an exhaust part is not separately installed in the first air blocking part 121 at the outlet side, because of the inconvenience of securing a space for installing the exhaust part and the cost of installing the exhaust part.

Therefore, in the present invention, the liquefaction prevention means for preventing the flux gas inside from liquefying and falling on the PCB 300 without installing an exhaust part in the first air blocking part 121 is installed.

5 is an enlarged view illustrating main parts of an oven inlet side of a reflow soldering machine according to the present invention.

The present invention as shown in the figure has a liquefaction prevention means 122 'on the outer wall of the upper space of the first air blocking portion 121.

The liquefaction preventing means 122 ′ heats the outer wall 121b of the upper space of the first air blocking part 121 to fundamentally prevent the liquefied flux gas from forming. The first air blocking part ( As a method of heating the outer wall 121b of the 121, a method of heating by installing an electric heater (not shown) using a heating coil on the rear surface of the outer wall may be used.

In addition, as another embodiment for heating the outer wall 121b, a method of heating by using hot air on the preheater 123 side may be proposed, which may have a structure as shown in FIG. 5.

An embodiment of the present invention for this purpose proposes a structure of the air duct 122 connecting the preheating portion 123 side and the upper outer wall (121b) of the first air blocking portion 121.

The air duct 122 is preferably manufactured so as to form a flow path that surrounds the upper outer wall 121b of the first air blocking part 121, and to form a "-" shaped flow path as shown in FIG. 5. Can be.

At this time, the flow path of the air duct 122 may be connected to the inlet 122a through which hot air is supplied to the lower side of the heater 123b, and the outlet 122b to the upper side of the heater 123b.

That is, the hot air is supplied to the inlet 122a connected to the lower side of the heater 123b to move through the lower passage 122c formed along the upper outer wall 121b of the first air blocking unit 121 to open the outer wall 121b. After heating, it moves toward the outlet 122b through the upper flow passage 122d.

The hot air moved toward the outlet 122b is supplied toward the upper portion of the heater 123b and circulatedly heated.

In this case, the lower passage 122c and the upper passage 122d may have a multilayer structure.

The present invention having the configuration as described above, by heating the outer wall (121b) of the first air blocking portion 121 by using the high temperature air on the preheating portion 123 side, the internal space of the first air blocking portion 121 It is possible to increase the temperature of, thereby solving the problem of poor soldering of the PCB 300 and contributes to the quality improvement.

In addition, the present invention described above has the advantage that construction is possible by simply changing the internal structure without installing a separate equipment or device.

1 is a perspective view of a conventional reflow soldering machine.

2 is a front view of a conventional reflow soldering machine.

3 is an enlarged view illustrating main parts of an oven inlet side of a conventional reflow soldering machine;

Figure 4 is a front view of the reflow soldering machine according to the present invention.

Figure 5 is an enlarged view showing the main portion of the oven inlet side of the reflow soldering machine according to the present invention.

100: chamber 110: conveyor transfer unit

111: passage 120: oven

121: first air blocking portion 121a: air curtain

121b: outer wall 122: liquefaction prevention means, air duct

122a: inlet 122b: outlet

122c: lower flow path 122d: upper flow path

123: preheater 123a: blower

123b: heater 125: main part

125a: blower 125b: heater

127: cooling unit 127a: blower

127b: cooler 129: second air shutoff

129a: air curtain 140: exhaust

150: input unit 300: PCB

Claims

In the reflow soldering machine equipped with the conveyor conveying unit 110, the oven 120, the exhaust unit 140 in the chamber 100 formed integrally,

The first air blocking part 121 is formed at the inlet side of the oven 120, and the liquefaction preventing means 122 ′ is installed on the first air blocking part 121 to prevent the liquefaction of the flux gas. The liquefaction prevention means (122 ') is a reflow soldering machine, characterized in that consisting of a heating means for heating the outer wall (121b) of the upper space of the first air blocking portion (121).

delete

The method of claim 1,

The liquefaction prevention means (122 ') is a reflow soldering machine, characterized in that the heating by installing an electric heater using a heating coil on the back surface of the outer wall (121b) of the first air blocking portion (121).

The method of claim 1,

The liquefaction preventing means 122 ′ is provided with an air duct 122 connecting the preheating part 123 side and the upper outer wall 121 b of the first air blocking part 121, and hot air to the air duct 122. Reflow soldering machine, characterized in that for supplying heat.

5. The method of claim 4,

The air duct 122 forms a flow path in a shape surrounding the upper outer wall (121b) of the first air blocking portion 121, the flow path is characterized in that the "C" shape reflow soldering machine.

The method of claim 5,

The flow path of the air duct 122 allows the inlet 122a through which hot air is supplied to be connected to the lower side of the heater 123b, and the outlet 122b to be connected to the upper side of the heater 123b. machine.

5. The method of claim 4,

The flow path of the air duct 122 is a reflow soldering machine, characterized in that the lower passage (122c) connected to the inlet (122a) side, and the upper passage (122d) connected to the outlet (122b) side.