KR200417462Y1 - LED module device - Google Patents

LED module device Download PDF

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Publication number
KR200417462Y1
KR200417462Y1 KR2020060007221U KR20060007221U KR200417462Y1 KR 200417462 Y1 KR200417462 Y1 KR 200417462Y1 KR 2020060007221 U KR2020060007221 U KR 2020060007221U KR 20060007221 U KR20060007221 U KR 20060007221U KR 200417462 Y1 KR200417462 Y1 KR 200417462Y1
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South Korea
Prior art keywords
heat sink
led module
case
substrate
module device
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KR2020060007221U
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Korean (ko)
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손경진
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손경진
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    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F13/00—Illuminated signs; Luminous advertising
    • G09F13/20—Illuminated signs; Luminous advertising with luminescent surfaces or parts
    • G09F13/22—Illuminated signs; Luminous advertising with luminescent surfaces or parts electroluminescent
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89—Metals
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F13/00—Illuminated signs; Luminous advertising
    • G09F13/04—Signs, boards or panels, illuminated from behind the insignia
    • G09F13/0404—Signs, boards or panels, illuminated from behind the insignia the light source being enclosed in a box forming the character of the sign
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F13/00—Illuminated signs; Luminous advertising
    • G09F13/20—Illuminated signs; Luminous advertising with luminescent surfaces or parts
    • G09F13/22—Illuminated signs; Luminous advertising with luminescent surfaces or parts electroluminescent
    • G09F2013/222—Illuminated signs; Luminous advertising with luminescent surfaces or parts electroluminescent with LEDs

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Led Device Packages (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

본 고안은 케이스에 알루미늄 방열판이 장착되어, LED모듈의 기판이 케이스에 장착되면, 상기 기판의 히트싱크가 알루미늄 방열판과 접촉되어, 상기 히트싱크의 열이 알루미늄 방열판으로 전달되므로서, LED모듈의 열이 열전도 방식으로 외부로 잘 방열되는 LED 모듈 장치에 관한 것이다.The present invention is equipped with an aluminum heat sink in the case, when the substrate of the LED module is mounted on the case, the heat sink of the substrate is in contact with the aluminum heat sink, the heat of the heat sink is transferred to the aluminum heat sink, the heat of the LED module The present invention relates to an LED module device that radiates heat well to the outside by the heat conduction method.

본 고안에 따른 LED 모듈 장치는 케이스(51)에 알루미늄 방열판(71)이 장착되고, LED모듈(81)의 기판(83)이 케이스(51)에 장착되면, 상기 기판(83)의 히트싱크(87)가 알루미늄 방열판(71)과 접촉되는 것을 특징으로 한다.In the LED module device according to the present invention, when the aluminum heat sink 71 is mounted on the case 51, and the substrate 83 of the LED module 81 is mounted on the case 51, the heat sink of the substrate 83 is formed. 87 is in contact with the aluminum heat sink (71).

Description

엘이디 모듈 장치{LED module device}LED module device

도 1은 전광판에 LED 모듈 장치가 장착된 예를 도시한 분해 사시도1 is an exploded perspective view showing an example in which the LED module device is mounted on the display board

도 2는 종래의 LED 모듈 장치를 도시한 분해 사시도Figure 2 is an exploded perspective view showing a conventional LED module device

도 3은 본 고안에 따른 LED 모듈 장치를 도시한 분해 사시도3 is an exploded perspective view showing an LED module device according to the present invention

도 4는 본 고안에 따른 LED 모듈 장치를 도시한 사시도4 is a perspective view showing an LED module device according to the present invention

도 5는 도 4의 A-A선에 따른 단면도5 is a cross-sectional view taken along the line A-A of FIG.

도 6은 도 4의 B-B선에 따른 단면도6 is a cross-sectional view taken along the line B-B of FIG.

도 7은 알루미늄 방열판을 도시한 사시도7 is a perspective view of an aluminum heat sink

*도면의 주요부분에 대한 부호설명** Description of Signs of Main Parts of Drawings *

51 : 케이스 71 : 알루미늄 방열판51 case 71 aluminum heat sink

81 : LED모듈 83 : 기판81: LED module 83: substrate

87 : 히트싱크87: heatsink

본 고안은 전광판에 장착되는 LED 모듈 장치에 관한 것으로서, 보다 상세하 게는 케이스에 알루미늄 방열판이 장착되어, LED모듈의 기판이 케이스에 장착되면, 상기 기판의 히트싱크가 알루미늄 방열판과 접촉되어, 상기 히트싱크의 열이 알루미늄 방열판으로 전달되므로서, LED모듈의 열이 열전도 방식으로 외부로 잘 방열되는 LED 모듈 장치에 관한 것이다.The present invention relates to an LED module device mounted on an electronic board, and more particularly, an aluminum heat sink is mounted on a case, and when the substrate of the LED module is mounted on the case, the heat sink of the substrate is in contact with the aluminum heat sink, Since the heat of the heat sink is transferred to the aluminum heat sink, the heat of the LED module is related to the LED module device that the heat dissipation well to the outside in a heat conductive manner.

일반적으로, 불특정 다수에게 광고하는 방법으로 전광판이 널리 이용되고 있다.In general, an electric signboard is widely used as a method of advertising to an unspecified number.

도 1을 참조하면, 도 1은 LED 모듈 장치를 이용한 전광판의 일례로서, 전광판(1)은 문자 케이스(10)에 LED 모듈 장치(20)가 내장되고, 상기 LED 모듈 장치(20)를 커버하는 투명 또는 반투명 재질의 커버(12)가 문자 케이스(10)에 장착된다.Referring to FIG. 1, FIG. 1 is an example of an LED board using an LED module device. The LED board 1 includes an LED module device 20 embedded in a letter case 10 and covers the LED module device 20. A cover 12 of transparent or translucent material is mounted to the character case 10.

도 2를 참조하면, 종래의 LED 모듈 장치(20)는 기판(21)에 LED(23)가 장착된 LED모듈(21)이 케이스(30)에 장착된다.Referring to FIG. 2, in the conventional LED module device 20, an LED module 21 having an LED 23 mounted on a substrate 21 is mounted on a case 30.

그러나, 상기와 같이 구성된 종래의 LED 모듈 장치(20)는 LED(25)의 열이 기판(23)의 히트싱크(도시하지 않음)를 통해 방출될 때, 상기 히트싱크에서 방출되는 열이 케이스(30)의 내부에서 외부로 잘 방출되지 못하게 되므로서, 히트싱크의 기능이 저하되고, LED의 열이 잘 발산되지 못하여 상기 LED가 변색되는 단점이 있었다.However, in the conventional LED module device 20 configured as described above, when the heat of the LED 25 is discharged through a heat sink (not shown) of the substrate 23, the heat emitted from the heat sink is stored in the case ( Since the inside is not easily discharged from the inside of the 30), the function of the heat sink is reduced, the heat of the LED is not well dissipated, there is a disadvantage that the LED is discolored.

따라서, 본 고안의 목적은 케이스에 알루미늄 방열판이 장착되어, LED모듈의 기판이 케이스에 장착되면, 상기 기판의 히트싱크가 알루미늄 방열판과 접촉되어, 상기 히트싱크의 열이 알루미늄 방열판으로 전달되어 LED모듈의 열이 케이스의 외부로 잘 방출되는 LED 모듈 장치를 제공하는 것이다.Therefore, an object of the present invention is that the aluminum heat sink is mounted on the case, when the substrate of the LED module is mounted on the case, the heat sink of the substrate is in contact with the aluminum heat sink, the heat of the heat sink is transferred to the aluminum heat sink LED module It is to provide a LED module device that the heat of the well is emitted to the outside of the case.

상기와 같은 목적을 달성하기 위한 본 고안의 바람직한 실시예를 도면을 참조하여 상세하게 설명하기로 한다.Preferred embodiments of the present invention for achieving the above object will be described in detail with reference to the drawings.

도 3 내지 도 6을 참조하면, 본 고안에 따른 LED 모듈 장치(50)는 케이스(51)에 알루미늄 방열판(71)이 장착되고, LED모듈(81)의 기판(83)이 케이스(51)에 장착되면, 상기 기판(83)의 히트싱크(87)가 알루미늄 방열판(71)과 접촉된다.3 to 6, in the LED module device 50 according to the present invention, the aluminum heat sink 71 is mounted on the case 51, and the substrate 83 of the LED module 81 is mounted on the case 51. When mounted, the heat sink 87 of the substrate 83 is in contact with the aluminum heat sink 71.

상기 케이스(51)는 상부가 개방된 사각박스 형태를 가지며, 베이스부(53)에 탭구멍(55)이 형성된 복수개의 결합돌기(57)가 형성되고, 상기 결합돌기(57)가 형성된 베이스부(53)의 반대편 저면에 양면 테이프(59)가 부착되고, 상기 베이스부(53)에 형성되는 장공(61, 63)이 결합돌기(57)의 양측부에 각각 형성되고, 양측부에 LED모듈(81)의 전원선(89)을 위한 개구부(65, 67)가 각각 형성된다.The case 51 has a rectangular box shape with an open top, and a plurality of coupling protrusions 57 having tab holes 55 are formed in the base portion 53, and a base portion having the coupling protrusions 57 formed therein. The double-sided tape 59 is attached to the bottom of the opposite side of the 53, and the long holes 61 and 63 formed in the base portion 53 are formed on both sides of the engaging projection 57, respectively, and the LED module on both sides. Openings 65 and 67 for the power supply line 89 of 81 are formed, respectively.

도 5 및 도 7을 참조하면, 상기 알루미늄 방열판(71)은 체결구멍(72)이 형성된 수평부(73)가 케이스(51)의 결합돌기(57)에 안착되고, 수평부(73)의 양단에서 수직부(74, 75)가 하부로 굴절되어 연장되고, 상기 수직부(74, 75)의 하단 절곡부(76, 77)가 케이스(83)의 베이스부(53)에 형성된 장공(61, 63)을 통과한 후 굴절되 어 케이스(51)의 베이스부(53)의 저면에 밀착된다.5 and 7, in the aluminum heat sink 71, a horizontal portion 73 having a fastening hole 72 is seated on the coupling protrusion 57 of the case 51, and both ends of the horizontal portion 73 are disposed. In the vertical portion (74, 75) is bent down to extend, the lower bent portion (76, 77) of the vertical portion (74, 75) formed in the base portion 53 of the case (83) long hole (61, After passing through the 63, it is refracted and in close contact with the bottom surface of the base portion 53 of the case 51.

상기 LED모듈(81)은 기판(83)에 다수개의 LED(85)가 배열되고, 기판(83)에 체결구멍(93)이 케이스(51)의 결합돌기(57)의 탭구멍(55)에 대응되게 형성되고, 상기 기판(81)의 하부면에 히트싱크(87)가 배치되고, 상기 기판(83)의 측단에 전원선(89)이 연결된다.The LED module 81 has a plurality of LEDs 85 arranged on the substrate 83, the fastening hole 93 in the substrate 83 in the tab hole 55 of the coupling protrusion 57 of the case 51. The heat sink 87 is formed on the lower surface of the substrate 81, and a power line 89 is connected to a side end of the substrate 83.

상기와 같이 구성된 본 고안에 따른 LED 모듈 장치(50)는 케이스(51)의 양면 테이프(59)가 스틸 또는 알루미늄으로 이루어진 전광판 케이스(100)에 부착되면, 케이스(51)에 장착된 알루미늄 방열판(71)의 하단 절곡부(76, 77)가 전광판 케이스(100)와 접촉하게 되고, LED모듈(81)의 기판(83)이 케이스(51)에 끼워진 후, 볼트(91)가 기판(83)의 체결구멍(93 ; 도 3 참조)과 알루미늄 방열판(71)의 체결구멍(72)을 통해 케이스(51)의 결합돌기(57)에 형성된 탭구멍(55)에 체결되면, 히트싱크(87)와 알루미늄 방열판(71)의 수평부(73)가 접촉하게 되므로서, LED(85)에서 히트싱크(87)의 전달된 열이 알루미늄 방열판(71)으로 전도된 후, 다시 알루미늄 방열판(71)에서 전광판 케이스(100)로 전도되어, 열전도 방식으로 LED(85)의 열방출이 잘 이루어진다.LED module device 50 according to the present invention configured as described above, if the double-sided tape 59 of the case 51 is attached to the electronic display case 100 made of steel or aluminum, the aluminum heat sink (mounted to the case 51) The lower bends 76 and 77 of 71 are brought into contact with the display case 100, and after the substrate 83 of the LED module 81 is fitted into the case 51, the bolt 91 is attached to the substrate 83. When the heat sink 87 is fastened to the tab hole 55 formed in the engaging projection 57 of the case 51 through the fastening hole 93 of FIG. 3 and the fastening hole 72 of the aluminum heat sink 71, the heat sink 87 is formed. And the horizontal portion 73 of the aluminum heat sink 71 is in contact, so that the heat transferred from the heat sink 87 in the LED 85 is conducted to the aluminum heat sink 71, and then again in the aluminum heat sink 71 It is conducted to the display case 100, the heat emission of the LED 85 is made well in a thermal conductivity method.

위에서 설명한 바와같이, 본 고안에 따른 LED 모듈 장치는 히트싱크의 열이 알루미늄 방열판으로 전달되어 LED에서 히트싱크의 전달된 열이 외부로 잘 방열되므로서, LED의 변색을 방지할 수 있는 효과가 있다.As described above, the LED module device according to the present invention is the heat of the heat sink is transferred to the aluminum heat sink, the heat transmitted from the heat sink in the LED is well radiated to the outside, there is an effect that can prevent the discoloration of the LED. .

Claims (3)

케이스(51)에 알루미늄 방열판(71)이 장착되고, LED모듈(81)의 기판(83)이 케이스(51)에 장착되면, 상기 기판(83)의 히트싱크(87)가 알루미늄 방열판(71)과 접촉되는 것을 특징으로 하는 LED 모듈 장치.When the aluminum heat sink 71 is mounted on the case 51 and the substrate 83 of the LED module 81 is mounted on the case 51, the heat sink 87 of the substrate 83 is the aluminum heat sink 71. LED module device, characterized in that in contact with. 제 1 항에 있어서,The method of claim 1, 상기 케이스(51)는 상부가 개방된 사각박스 형태를 가지며, 베이스부(53)에 탭구멍(55)이 형성된 복수개의 결합돌기(57)가 형성되고, 상기 결합돌기(57)가 형성된 베이스부(53)의 반대편 저면에 양면 테이프(59)가 부착되고, 상기 베이스부(53)에 형성되는 장공(61, 63)이 결합돌기(57)의 양측부에 각각 형성되는 것을 특징으로 하는 LED 모듈 장치.The case 51 has a rectangular box shape with an open top, and a plurality of coupling protrusions 57 having tab holes 55 are formed in the base portion 53, and a base portion having the coupling protrusions 57 formed therein. The double-sided tape 59 is attached to the bottom surface opposite to the 53, and the long holes 61 and 63 formed in the base portion 53 are formed on both sides of the engaging projection 57, respectively. Device. 제 1 항에 있어서,The method of claim 1, 상기 알루미늄 방열판(71)은 체결구멍(72)이 형성된 수평부(73)가 케이스(51)의 결합돌기(57)에 안착되고, 수평부(73)의 양단에서 수직부(74, 75)가 하부로 굴절되어 연장되고, 상기 수직부(74, 75)의 하단 절곡부(76, 77)가 케이스(83)의 베이스부(53)에 형성된 장공(61, 63)을 통과한 후 굴절되어 케이스(51)의 베이스부 (53)의 저면에 밀착되는 것을 특징으로 하는 LED 모듈 장치.The aluminum heat sink 71 has a horizontal portion 73 having a fastening hole 72 seated on the engaging projection 57 of the case 51, and vertical portions 74 and 75 are disposed at both ends of the horizontal portion 73. It is refracted and extended downward, and the lower bent portions 76 and 77 of the vertical portions 74 and 75 pass through the long holes 61 and 63 formed in the base portion 53 of the case 83 and are refracted. LED module device, characterized in that the close contact with the bottom surface of the base portion (53) of (51).
KR2020060007221U 2006-03-17 2006-03-17 LED module device KR200417462Y1 (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100758718B1 (en) 2006-12-18 2007-09-14 손경진 A led module
KR20150063756A (en) * 2013-12-02 2015-06-10 엘지이노텍 주식회사 Radiating device and illuminating device for vehicle
KR101827255B1 (en) * 2017-11-30 2018-02-08 주식회사 아보네 Shadow advertising system

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100758718B1 (en) 2006-12-18 2007-09-14 손경진 A led module
KR20150063756A (en) * 2013-12-02 2015-06-10 엘지이노텍 주식회사 Radiating device and illuminating device for vehicle
WO2015084015A1 (en) * 2013-12-02 2015-06-11 엘지이노텍 주식회사 Heat sink and lighting apparatus
US10247403B2 (en) 2013-12-02 2019-04-02 Lg Innotek Co., Ltd. Heat sink and lighting apparatus
KR102199248B1 (en) 2013-12-02 2021-01-06 엘지이노텍 주식회사 Radiating device and illuminating device for vehicle
KR101827255B1 (en) * 2017-11-30 2018-02-08 주식회사 아보네 Shadow advertising system

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