KR20040099800A - 유기 전계 발광 소자 및 그 제조방법 - Google Patents
유기 전계 발광 소자 및 그 제조방법 Download PDFInfo
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- KR20040099800A KR20040099800A KR1020030031906A KR20030031906A KR20040099800A KR 20040099800 A KR20040099800 A KR 20040099800A KR 1020030031906 A KR1020030031906 A KR 1020030031906A KR 20030031906 A KR20030031906 A KR 20030031906A KR 20040099800 A KR20040099800 A KR 20040099800A
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- 238000005401 electroluminescence Methods 0.000 title claims description 5
- 238000004519 manufacturing process Methods 0.000 title abstract description 18
- 239000002131 composite material Substances 0.000 claims abstract description 38
- 239000000758 substrate Substances 0.000 claims abstract description 24
- 230000007062 hydrolysis Effects 0.000 claims abstract description 16
- 238000006460 hydrolysis reaction Methods 0.000 claims abstract description 16
- 230000018044 dehydration Effects 0.000 claims abstract description 10
- 238000006297 dehydration reaction Methods 0.000 claims abstract description 10
- 239000012044 organic layer Substances 0.000 claims abstract description 7
- 238000000034 method Methods 0.000 claims description 22
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 20
- 239000000203 mixture Substances 0.000 claims description 17
- 239000010410 layer Substances 0.000 claims description 14
- 238000007789 sealing Methods 0.000 claims description 11
- 125000000217 alkyl group Chemical group 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 claims description 8
- 239000003054 catalyst Substances 0.000 claims description 8
- 150000004703 alkoxides Chemical class 0.000 claims description 7
- 125000003837 (C1-C20) alkyl group Chemical group 0.000 claims description 6
- 125000006736 (C6-C20) aryl group Chemical group 0.000 claims description 6
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 claims description 6
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 6
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 6
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims description 6
- 238000002161 passivation Methods 0.000 claims description 6
- 239000002798 polar solvent Substances 0.000 claims description 6
- 229910052710 silicon Inorganic materials 0.000 claims description 6
- 239000010703 silicon Substances 0.000 claims description 6
- 229910052718 tin Inorganic materials 0.000 claims description 6
- 239000011135 tin Substances 0.000 claims description 6
- 229910052719 titanium Inorganic materials 0.000 claims description 6
- 239000010936 titanium Substances 0.000 claims description 6
- 229910052726 zirconium Inorganic materials 0.000 claims description 6
- 239000000126 substance Substances 0.000 claims description 5
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims description 4
- 238000001723 curing Methods 0.000 claims description 4
- -1 R 5 Chemical compound 0.000 claims description 3
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 3
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 3
- 238000003848 UV Light-Curing Methods 0.000 claims description 3
- 125000003545 alkoxy group Chemical group 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 2
- 229920003023 plastic Polymers 0.000 claims description 2
- 238000001029 thermal curing Methods 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 4
- 230000005669 field effect Effects 0.000 abstract 6
- 238000009833 condensation Methods 0.000 abstract 1
- 230000005494 condensation Effects 0.000 abstract 1
- 238000000354 decomposition reaction Methods 0.000 abstract 1
- 239000010408 film Substances 0.000 description 24
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 11
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 10
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 10
- 229910017604 nitric acid Inorganic materials 0.000 description 10
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 9
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 5
- 239000012528 membrane Substances 0.000 description 5
- 229910052760 oxygen Inorganic materials 0.000 description 5
- 239000001301 oxygen Substances 0.000 description 5
- 230000035515 penetration Effects 0.000 description 5
- 239000010409 thin film Substances 0.000 description 5
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 3
- 239000002274 desiccant Substances 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 230000035699 permeability Effects 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 150000002894 organic compounds Chemical class 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- PMQIWLWDLURJOE-UHFFFAOYSA-N triethoxy(1,1,2,2,3,3,4,4,5,5,6,6,7,7,10,10,10-heptadecafluorodecyl)silane Chemical compound CCO[Si](OCC)(OCC)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)CCC(F)(F)F PMQIWLWDLURJOE-UHFFFAOYSA-N 0.000 description 2
- KKYDYRWEUFJLER-UHFFFAOYSA-N 1,1,2,2,3,3,4,4,5,5,6,6,7,7,10,10,10-heptadecafluorodecyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)CCC(F)(F)F KKYDYRWEUFJLER-UHFFFAOYSA-N 0.000 description 1
- TYROLSMHVJMZOC-UHFFFAOYSA-N 1,1,2,2,3,3,4,4,5,5,6,6,7,7,10,10,10-heptadecafluorodecyl-tri(propan-2-yloxy)silane Chemical compound CC(C)O[Si](OC(C)C)(OC(C)C)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)CCC(F)(F)F TYROLSMHVJMZOC-UHFFFAOYSA-N 0.000 description 1
- YIWGJFPJRAEKMK-UHFFFAOYSA-N 1-(2H-benzotriazol-5-yl)-3-methyl-8-[2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carbonyl]-1,3,8-triazaspiro[4.5]decane-2,4-dione Chemical compound CN1C(=O)N(c2ccc3n[nH]nc3c2)C2(CCN(CC2)C(=O)c2cnc(NCc3cccc(OC(F)(F)F)c3)nc2)C1=O YIWGJFPJRAEKMK-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000012512 characterization method Methods 0.000 description 1
- NKZJCYHMTHPGKJ-UHFFFAOYSA-N diethoxy-bis(1,1,2,2,3,3,4,4,5,5,6,6,7,7,10,10,10-heptadecafluorodecyl)silane Chemical compound FC(F)(F)CCC(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)[Si](OCC)(OCC)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)CCC(F)(F)F NKZJCYHMTHPGKJ-UHFFFAOYSA-N 0.000 description 1
- XKPUOPGDSOLWRJ-UHFFFAOYSA-N ethoxy-tris(1,1,2,2,3,3,4,4,5,5,6,6,7,7,10,10,10-heptadecafluorodecyl)silane Chemical compound FC(F)(F)CCC(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)[Si](OCC)(C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)CCC(F)(F)F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)CCC(F)(F)F XKPUOPGDSOLWRJ-UHFFFAOYSA-N 0.000 description 1
- XPBBUZJBQWWFFJ-UHFFFAOYSA-N fluorosilane Chemical compound [SiH3]F XPBBUZJBQWWFFJ-UHFFFAOYSA-N 0.000 description 1
- 230000005525 hole transport Effects 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- ARYZCSRUUPFYMY-UHFFFAOYSA-N methoxysilane Chemical compound CO[SiH3] ARYZCSRUUPFYMY-UHFFFAOYSA-N 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- COMDJLYMFVPPRP-UHFFFAOYSA-N tributoxy(1,1,2,2,3,3,4,4,5,5,6,6,7,7,10,10,10-heptadecafluorodecyl)silane Chemical compound CCCCO[Si](OCCCC)(OCCCC)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)CCC(F)(F)F COMDJLYMFVPPRP-UHFFFAOYSA-N 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/04—Luminescent, e.g. electroluminescent, chemiluminescent materials containing natural or artificial radioactive elements or unspecified radioactive elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/841—Self-supporting sealing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/302—Details of OLEDs of OLED structures
- H10K2102/3023—Direction of light emission
- H10K2102/3026—Top emission
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/917—Electroluminescent
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31652—Of asbestos
- Y10T428/31663—As siloxane, silicone or silane
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- Optics & Photonics (AREA)
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
Description
구분 | TEOS28(g) | GPTS(g) | 순수(g) | 질산(g) | 에탄올(g) | 총량(g) |
실시예 1 | 26.00 | 9.38 | 11.23 | 0.61 | 52.32 | 100 |
실시예 2 | 22.53 | 13.77 | 10.93 | 0.59 | 52.17 | 100 |
실시예 3 | 19.06 | 17.70 | 10.63 | 0.58 | 52.02 | 100 |
실시예 4 | 15.60 | 21.63 | 10.33 | 0.56 | 51.87 | 100 |
구분 | TEOS28(g) | MPTMS(g) | 메타크릴산(g) | 순수(g) | 질산(g) | 에탄올(g) | 총량(g) |
실시예 5 | 24.93 | 9.91 | 0.87 | 10.77 | 0.58 | 49.66 | 100 |
실시예 6 | 10.25 | 24.82 | 2.17 | 8.94 | 0.48 | 45.08 | 100 |
실시예 7 | 0 | 35.23 | 3.08 | 7.66 | 0.42 | 41.89 | 100 |
구분 | TEOS28(g) | GPTS(g) | FAS(g) | 순수(g) | 질산(g) | 에탄올(g) | 총량(g) |
실시예 8 | 26.00 | 9.38 | 1.2 | 11.23 | 0.61 | 52.32 | 100 |
실시예 9 | 22.53 | 13.77 | 0.6 | 10.93 | 0.59 | 52.17 | 100 |
Claims (15)
- 기판;상기 기판의 일면에 형성되며, 제1전극, 유기막 및 제2전극이 순차적으로 적층된 유기 전계 발광부; 및상기 유기 전계 발광부의 제2전극 상부에 형성되며, 트리알콕시실란의 가수분해 탈수축합물로 이루어진 유기-무기 복합막을 포함하는 것을 특징으로 하는 유기 전계 발광 소자.
- 제1항에 있어서, 상기 트리알콕시실란이 화학식 1로 표시되는 것을 특징으로 하는 유기 전계 발광 소자.<화학식 1>상기식중, M은 실리콘, 티타늄, 주석 및 지르코늄으로 이루어진 군으로부터 선택되고,R1, R2, R3및 R4는 서로에 관계없이 C1-C20의 알킬기 또는 C6-C20의 아릴기이다.
- 제1항에 있어서, 상기 유기-무기 복합막이,화학식 2로 표시되는 금속 알콕사이드의 가수분해 탈수축합물과 화학식 3으로 표시되는 플루오로알킬실란의 가수분해 탈수축합물중에서 선택된 하나 이상이 더 포함하는 것을 특징으로 하는 유기 전계 발광 소자.<화학식 2>상기식중, M은 실리콘, 티타늄, 주석 및 지르코늄으로 이루어진 군으로부터 선택되고,R5, R6, R7및 R8은 서로에 관계없이 C1-C20의 알킬기 또는 C6-C20의 아릴기이다.<화학식 3>상기식중, R9는 불소화된 C1-C20의 알킬기이고, R10및 R11은 서로에 관계없이 C1-C20의 알콕시기 또는 불소화된 C1-C20의 알킬기이고, R12은 C1-C20의 알킬기이다.
- 제1항에 있어서, 상기 제2전극과 유기-무기 복합막 사이에 패시베이션층을 더 포함하는 것을 특징으로 하는 유기 전계 발광 소자.
- 제4항에 있어서, 상기 패시베이션층이 SiO2, Al2O3, Si3N4로 이루어진 군으로부터 선택된 하나 이상을 포함하는 것을 특징으로 하는 유기 전계 발광 소자.
- 제1항에 있어서, 상기 유기-무기 복합막 상부에 밀봉용 기판이 더 포함되는 것을 특징으로 하는 유기 전계 발광 소자.
- 제6항에 있어서, 상기 밀봉용 기판이 유리 기판 또는 투명성 플라스틱 기판인 것을 특징으로 하는 유기 전계 발광 소자.
- 제1전극, 유기막 및 제2전극을 순차적으로 적층하여 유기 전계 발광부가 형성된 기판을 준비하는 제1단계; 및상기 제2전극 상부에 트리알콕시실란 및 극성 용매를 포함하는 조성물을 코팅한 다음, 경화하여 유기-무기 복합막을 형성하는 제2단계;를 포함하는 것을 특징으로 하는 유기 전계 발광 소자의 제조방법.
- 제8항에 있어서, 상기 트리알콕시실란이 화학식 1로 표시되는 것을 특징으로 하는 유기 전계 발광 소자의 제조방법.<화학식 1>상기식중, M은 실리콘, 티타늄, 주석 및 지르코늄으로 이루어진 군으로부터 선택되고,R1, R2, R3및 R4는 서로에 관계없이 C1-C20의 알킬기 또는 C6-C20의 아릴기이다.
- 제8항에 있어서, 상기 조성물에 화학식 2로 표시되는 금속 알콕사이드과 화학식 3으로 표시되는 플루오로알킬실란의 가수분해 탈수축합물중에서 선택된 하나 이상이 더 포함되는 것을 특징으로 하는 유기 전계 발광 소자의 제조방법.<화학식 2>상기식중, M은 실리콘, 티타늄, 주석 및 지르코늄으로 이루어진 군으로부터 선택되고,R5, R6, R7및 R8은 서로에 관계없이 C1-C20의 알킬기 또는 C6-C20의 아릴기이다.<화학식 3>상기식중, R9는 불소화된 C1-C20의 알킬기이고, R10및 R11은 서로에 관계없이 C1-C20의 알콕시기 또는 불소화된 C1-C20의 알킬기이고, R12은 C1-C20의 알킬기이다.
- 제8항에 있어서, 상기 경화시 열경화 또는 UV 경화하는 것을 특징으로 하는 유기 전계 발광 소자의 제조방법.
- 제11항에 있어서, 상기 조성물에 화학식 1의 트리알콕시실란 1몰을 기준으로 하여 0.1 내지 0.9몰의 가수분해 촉매가 더 부가되는 것을 특징으로 하는 유기 전계 발광 소자의 제조방법.
- 제11항에 있어서, 상기 극성 용매가 메탄올, 에탄올, 부탄올, 이소프로판올, 부탄올, 메틸에틸케톤으로 이루어진 군으로부터 선택된 하나 이상이고,상기 극성 용매의 함량이 화학식 1의 트리알콕시실란 100 중량부를 기준으로 하여 100 내지 1000 중량부인 것을 특징으로 하는 유기 전계 발광 소자의 제조방법.
- 제8항에 있어서, 상기 제2전극과 유기-무기 복합막 사이에 패시베이션층을 더 형성하는 것을 특징으로 하는 유기 전계 발광 소자의 제조방법.
- 제8항에 있어서, 상기 유기-무기 복합막 상부에 밀봉용 기판을 더 적층하는 것을 특징으로 하는 유기 전계 발광 소자의 제조방법.
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CNB2004100387909A CN100492713C (zh) | 2003-05-20 | 2004-04-23 | 有机电致发光器件及其制造方法 |
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US9859526B2 (en) | 2015-02-11 | 2018-01-02 | Samsung Display Co., Ltd. | Flexible display device |
US9893315B2 (en) | 2015-11-03 | 2018-02-13 | Samsung Display Co., Ltd. | Display device and method of manufacturing the same |
US10847750B2 (en) | 2015-02-16 | 2020-11-24 | Samsung Display Co., Ltd. | Bendable display apparatus utilizing an organic layer |
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US20050275106A1 (en) * | 2004-06-14 | 2005-12-15 | Fricke Peter J | Electronic isolation device |
US7745818B2 (en) * | 2005-04-08 | 2010-06-29 | Nichia Corporation | Light emitting device with silicone resin layer formed by screen printing |
KR100685845B1 (ko) * | 2005-10-21 | 2007-02-22 | 삼성에스디아이 주식회사 | 유기전계 발광표시장치 및 그 제조방법 |
KR20070054806A (ko) * | 2005-11-24 | 2007-05-30 | 삼성전자주식회사 | 유기 발광 표시 장치 |
US7999372B2 (en) * | 2006-01-25 | 2011-08-16 | Samsung Mobile Display Co., Ltd. | Organic light emitting display device and method of fabricating the same |
KR100873080B1 (ko) * | 2007-05-10 | 2008-12-09 | 삼성모바일디스플레이주식회사 | 유기 전계 발광표시장치 |
JP6666836B2 (ja) * | 2014-03-31 | 2020-03-18 | リンテック株式会社 | 長尺のガスバリア性積層体およびその製造方法 |
US9359386B1 (en) * | 2015-02-19 | 2016-06-07 | Gelest Technologies, Inc. | Silanes and silicones with distinct hydrophilic and oleophobic substitution |
GB2555828A (en) * | 2016-11-11 | 2018-05-16 | Saralon Gmbh | Printed electroluminescent device |
CN112205076A (zh) * | 2018-05-31 | 2021-01-08 | 柯尼卡美能达株式会社 | 电子器件及其制造方法 |
JP6709007B2 (ja) * | 2018-12-28 | 2020-06-10 | 国立大学法人山形大学 | 有機エレクトロルミネッセンス素子の封止方法 |
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JP3909912B2 (ja) * | 1997-05-09 | 2007-04-25 | 東京応化工業株式会社 | シリカ系厚膜被膜形成方法 |
CA2306384A1 (en) * | 1997-10-14 | 1999-04-22 | Patterning Technologies Limited | Method of forming an electronic device |
US7037599B2 (en) * | 2003-02-28 | 2006-05-02 | Eastman Kodak Company | Organic light emitting diodes for production of polarized light |
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Cited By (6)
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US9859526B2 (en) | 2015-02-11 | 2018-01-02 | Samsung Display Co., Ltd. | Flexible display device |
US10847750B2 (en) | 2015-02-16 | 2020-11-24 | Samsung Display Co., Ltd. | Bendable display apparatus utilizing an organic layer |
US9893315B2 (en) | 2015-11-03 | 2018-02-13 | Samsung Display Co., Ltd. | Display device and method of manufacturing the same |
US10505148B2 (en) | 2015-11-03 | 2019-12-10 | Samsung Display Co., Ltd. | Display device and method of manufacturing the same |
US11569475B2 (en) | 2015-11-03 | 2023-01-31 | Samsung Display Co., Ltd. | Display device and method of manufacturing the same |
US12035563B2 (en) | 2015-11-03 | 2024-07-09 | Samsung Display Co., Ltd. | Display device and method of manufacturing the same |
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US7285340B2 (en) | 2007-10-23 |
CN1610457A (zh) | 2005-04-27 |
CN100492713C (zh) | 2009-05-27 |
KR100637131B1 (ko) | 2006-10-20 |
US20040234813A1 (en) | 2004-11-25 |
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