KR20040065402A - Method for Manufacturing IC Card by Laminating a Plurality of Foils - Google Patents

Abstract

PURPOSE: A method for manufacturing an IC card by layering foils is provided to exclude a step digging out a groove after layering the foils, make no gab between a COB(Chip On Board) and a card plate, and strongly combine the COB and the card plate, and the electrodes of the COB and an antenna. CONSTITUTION: An antenna foil(400) forms the first hole(401) exposing a molding part(220) of the COB(200) and an antenna electrode(212), and is wound by the antenna at one side in order to expose both ends of the antenna to the inside of the first hole. The first hole is inserted into the molding part of the COB in order to expose the molding part of the COB and the antenna electrode. A connection part(411) of the antenna is electrically connected to the antenna electrode of the COB. The foil(600) having no hole is layered on the antenna foil. The layered foils are compressed/adhered with each other.

Description

Method for Manufacturing IC Card by Laminating a Plurality of Foils}

Field of invention

The present invention relates to a method of manufacturing an IC card. More specifically, the present invention is to separate the first step semi-finished product manufacturing process and the second step finished product manufacturing process of the IC card by stacking at least two or more foils with holes corresponding to COB and pressing them together to complete the IC card. A method for manufacturing an IC card.

Background of the Invention

Cards equipped with data and programs required for a chip on board (COB), that is, IC cards, are used in more and more fields because of their convenience in use and excellent information holding ability. Such an IC card generally includes a contact type IC card in which information is input and output by contacting a terminal for a card reader with an electrode, a contactless IC card having an antenna therein and capable of entering and exiting information without contacting the card reader terminal; It is divided into a combination type IC card having both the functions of the contact and contactless card.

In the conventional method of manufacturing such an IC card, as shown in FIG. 1, a plurality of foils (also called sheets) are stacked to form a card, and then a COB (Chip On Board) 200 is formed. An appropriately sized groove 800 is excavated through a milling process so that it can be mounted, the COB 200 is inserted into the groove 800, and finally covered with at least one cover foil. In such a process, a process of digging a groove 800 for the COB 200 is required in a card base in which a plurality of foils are stacked to form a single end, thereby substantially working in duplicate. In particular, in the manufacture of a combination type IC card, after inserting the COB into the groove with the electrode surface for contact terminals exposed to the outside, the electrode for the antenna of the COB and the conductive antenna should be electrically connected. It was not uncomfortable to connect the both ends of the antenna and the antenna electrode of the COB with the operator not visible from above. That is, while the end of the antenna formed on the foil is exposed inside the groove, the COB is inserted into the groove with the molding portion facing downward, the antenna electrode formed on the main board of the COB is electrically connected to both ends of the antenna In this case, the main board of the COB is positioned between the operator's eyes and the groove, that is, the antenna connection part, so that the operator's field of view is obscured (in other words, the back surface of the may board which is invisible to the operator's eyes). At the electrode to connect to the antenna). Accordingly, conventionally, a conductive paste (adhesive) is applied to both ends of the antenna exposed inside the groove and the COB is inserted and then compressed, or a hot melt sheet is attached and the COB is inserted. It was bonded by heat pressing.

However, through this type of adhesion, the electrical connection between the antenna connection portion and the COB electrode is not satisfactory, which may cause a problem that, as the IC card is used for a long time, the electrical connection may be broken or the COB itself may be detached from the card. . In addition, in order to insert the COB into the grooves formed in the laminated foil, the area of the grooves must be structurally slightly larger than the area of the COB, which causes a gap between the COB and the grooves in the completed IC card. It exists. The gap may not only allow moisture to penetrate, but there are many dissatisfaction with quality, such as COB may be released from the card plate when the card is bent.

As a solution to this problem, the present applicant has proposed a patent application No. 2002-77164, "Method of manufacturing IC card by lamination of foil", and the present application has been made on the extension line. It is characterized by separating the process of manufacturing a semi-finished product as a step and the process of forming a finished product as a second step. It is a general manufacturing form in the art that the semi-finished product manufacturer and the final finished product manufacturer are separated, and accordingly, the IC card manufacturing method according to Patent Application No. 2002-77164 is used, but the final finished product manufacturer has a conventional production line (that is, There is a need to provide a manufacturing method that can be used as is (printing equipment, printing, lamination, pressing equipment) of the foil.

It is an object of the present invention to provide a method of manufacturing an IC card which does not have to be dug again after laminating foils.

An object of the present invention is to provide an IC card manufacturing method in which a COB and a card plate can be strongly bound.

An object of the present invention is to provide an IC card manufacturing method in which a gap does not occur between a COB and a card plate.

Still another object of the present invention is to provide a method of manufacturing an IC card in which an electrode of an COB and an antenna electrode can be strongly bound.

Still another object of the present invention is to provide a method of manufacturing an IC card in which a semi-finished product manufacturing step and a finished product manufacturing step are separated.

An object of the present invention is to provide an IC card manufacturing method that can provide a more convenient IC card by filling a filler in the IC card.

The above and other objects of the present invention can be achieved by the present invention described below.

1 is a configuration diagram showing a manufacturing process of a conventional IC card.

2 is a cross-sectional view schematically illustrating a state in which a plurality of foils are stacked according to a first step semifinished product manufacturing process according to the present invention.

FIG. 3 (A) is a cross-sectional view taken along line AA ′ of FIG. 2 (A) of an IC card in which a plurality of foils are stacked according to the first step semifinished product manufacturing process according to FIG. 3B is a cross-sectional view taken along the line BB '.

4 (A) and 4 (B) are plan views showing one specific example of the second hole formed in the antenna sheet, respectively.

Brief description of the main symbols in the drawings

100: IC card 200: COB (Chip On Board)

210: motherboard 211: electrode surface for contact terminals

212: antenna electrode 220: molding part

300: second overlay foil 301: second hole

400: antenna foil 401: first hole

402: center portion 403: outer protrusion

404: inner projection 405: side hole

410: winding antenna 411: antenna connection

500: core foil 501: third hole

600: first overlay foil 700: hot melt sheet

710: sheet hole 720: center hole

800: filler

Summary of the Invention

A first feature of the IC card manufacturing method according to the present invention manufactures the IC card without going through the step of digging the groove into which the COB is to be inserted through the milling process. To this end, the present invention, the electrode surface of the contact terminal of the COB having a molding unit, an antenna electrode for a non-contact terminal, the electrode surface for a contact terminal is exposed to the outside of the IC card, the antenna for the non-contact terminal is the IC card A method for manufacturing a semi-finished product of an IC card mounted therein, wherein a surface is formed such that a first hole for exposing a molding portion of the COB and an antenna electrode is formed at a predetermined position and both ends of the antenna are exposed inside the first hole. Inserting the first foil into the molding portion of the COB so that the antenna foil having the antenna wound thereon is exposed to the molding portion of the COB and the antenna electrode; Electrically connecting a connecting portion of the antenna to an antenna electrode of the COB; A foil having no holes formed is laminated on a surface opposite to a surface of the COB terminal electrode surface exposed to the outside; And compressing the laminated foils; It provides a process for manufacturing a semi-finished IC card consisting of steps.

The method of manufacturing an IC card according to the present invention is to separate the process of manufacturing the first step semi-finished product and the process of manufacturing the second step finished product. To this end, the first step of manufacturing the semi-finished product is in accordance with the IC card semi-finished product manufacturing method described above, and the method of manufacturing the second step of IC card is substantially in addition to the semi-finished product formed by the first step. Stacking at least one foil having a second hole of the same area substantially equal to the thickness of the motherboard of the COB; And compressing the laminated whole foils; It presents a process comprising the steps further.

Detailed Description of the Invention

Hereinafter, with reference to the accompanying drawings will be described a preferred embodiment according to the present invention.

2 is a perspective view schematically illustrating a state in which a plurality of foils are stacked according to a first step semifinished product manufacturing process according to the present invention. The IC card manufacturing method according to the present invention is made on the extension of the applicant's patent application No. 2002-77164, "IC card manufacturing method by lamination of foil", as described above, the general IC card manufacturing process in the art is the antenna foil Process for manufacturing IC card semi-finished product having essential foils including the like (hereinafter referred to as "semi-finished product manufacturing process") and process for manufacturing IC card finished product further laminated with the printed foil and coating foil (hereinafter referred to as "IC It is to provide a manufacturing method for manufacturing a semi-finished product of the IC card through the lamination of the foil, which is separated, that is in the form of division of labor. Therefore, the overall process of manufacturing the IC card is similar to the patent application No. 2002-77164, "Method of manufacturing an IC card by laminating foil", and the contents disclosed in the patent application may be considered to be included in the present specification. . In brief reference to the patent application No. 2002-77164, the entire IC card manufacturing process includes a contact part terminal electrode face of a COB having a molding part, an antenna electrode for a non-contact terminal, and an electrode surface for a contact terminal. And a non-contact terminal antenna mounted inside the IC card, and stacking two or more foils to manufacture the IC card, wherein the electrode surface for the contact terminal of the COB faces downward. Positioning the COB; Stacking at least one or more foils having a first hole of substantially the same area as the main board of the COB such that the first hole is fitted in an electrode portion of the COB; An antenna foil having a second hole and an antenna formed at a point corresponding to the position of the first hole is laminated on the laminated foil so that the second hole is fitted into a molding portion of the COB; Electrically connecting a connecting portion of the antenna to an antenna electrode of the COB; A foil having no holes formed is laminated on a surface opposite to a surface on which the electrode surface of the COB of the laminated foils is exposed to the outside; And compressing the laminated foils; And wherein the molding portion and antenna electrode of the COB are exposed upwardly through the second hole, and additionally comprises a method of laminating and compressing the coating foil and the printing foils.

On the other hand, the IC card manufacturing method according to the present invention is a step of stacking the antenna foil and the core foil by inserting the COB as a first step of manufacturing a semi-finished IC card, and then the printing foil and coating foil, etc. The laminating step is separated into a second step process of manufacturing a finished IC card. For reference, the first hole and the second hole of Patent Application No. 2002-77164 correspond to the fourth hole (not shown) and the first hole in the present invention, respectively. In addition, the COB 200 is generally used, and a chip in a wafer state is disposed on the main board 210, and a molding part 220 is formed thereon. The molding part 220 does not necessarily mean molding, but is used to include anything for protecting the chip, including potting. Of these COB 200, the COB 200 used in the contact card is the lower side of the main board 210, that is, the opposite side on which the molding unit 220 is formed is the electrode surface 211 for the external terminal, the combination The COB 200 used in the card for the combi has two antenna electrodes 212 formed on the main board 210 to be connected to the antenna wire 410, and the lower surface of the main board 210 is similarly formed. It becomes an electrode surface 211 for an external terminal.

In the IC card manufacturing method according to the present invention, the first step process, which is a semi-finished product manufacturing process, is performed by stacking a plurality of foils. Firstly and substantially flattened, a hole having substantially the same shape and area (preferably having a thickness substantially equal to the thickness of the motherboard) of the main board 210 of the COB 200 is located at a predetermined position. The formed first working plate (not shown) is laid on the floor, and the COB 200 is inserted into the hole so that the electrode surface 211 faces downward. The working plate is preferably a metal plate having a constant thickness, which has the advantage of being easy to be pressed by applying heat as described below. However, without the process of inserting the COB 200 into the work plate formed with the hole, after stacking a plurality of foils for the semi-finished product described below may be pressed by inserting the COB 200 to the work plate.

Hot melt double-sided sheet 700, that is, the melted and adhered adhesive material when the heat is applied to the portions except for the molding part 220 and the antenna electrode 212 of the COB 200 to be bonded to the lower surface of the sheet formed on both sides Then, the upper surface is bonded to the antenna foil 400 which will be described later. Preferably, oil paper is formed on the upper surface of the hot melt double-sided sheet 700, and then the lower surface is adhered to the upper surface of the COB 200 (adhesion by applying heat), and then the oil paper is removed, thereby The upper surface of the antenna foil 500 can be bonded (adhered by applying heat). The hot melt sheet 700 should not protrude outside the outermost edge portion of the COB 200, that is, the main board 210 portion, preferably the outermost edge of the hot melt sheet 700 is the main By substantially matching the outermost rim of the board 210, the portion bonded to the core foil 500 is as wide as possible. Preferably, the portion of the hot melt sheet 700 in contact with the antenna electrode 212 is formed by forming a sheet hole 710 or a c-shaped groove to form the antenna connection portion 411 and the antenna electrode (described below). 212) can be electrically connected by ultrasonic welding, adhesion through a conductive adhesive, soldering, or the like, and the center portion of the hot melt sheet 700 is substantially the same size as the area of the molding part 220. The center hole 720 is formed so that the molding part 220 of the COB 200 is fitted into the center hole 720.

A first hole for exposing the molding part 220 and the antenna electrode 212 of the COB 200 to the COB 200 with the hot melt sheet 700 adhered to the upper surface thereof when viewed from above. An antenna foil 400 having a 401 formed at a predetermined position and having an antenna winding 410 formed on one surface thereof is sandwiched by inserting the molding unit 220 into the first hole 401. It is preferable that the bottom surface of the antenna foil 400 is kept horizontal with the bottom surface of the main board, as described below, at least one other foil (for example, before laying the antenna foil 400) For example, after the second overlay foil is laid, the antenna foil 400 may be stacked thereon. In addition, the step of applying the hot melt sheet 700 may be changed. In this case, unlike the second case, the bottom surface of the hot melt sheet 700 is not directly bonded to the COB 200, but the second The overlay foil 300 and the antenna foil 400 are stacked on the COB 200, and then adhered to the top surface of the COB 200 through the first hole 401 of the antenna foil 400. In this case, the hot melt sheet 700 still needs a center hole 720 for exposing the molding part 220, but a sheet hole 710 for exposing the antenna electrode 212 needs to be formed. There is no. That is, while stacking the antenna foil 400, the operator can electrically connect the antenna connecting portion 411 and the antenna electrode 212 of the COB 200 while securing a sufficient field of view. The hot melt sheet 700 is bonded thereon. Accordingly, the hot melt sheet 700 may be larger than the second hole 401, and the core sheet 500 may be formed by using the hot melt sheet 700 having a larger area than the second hole 401. It can increase the adhesion with the. In the case where the hot melt sheet 700 is bonded after laminating the antenna coil 400 in this manner, it is preferable that the second hole has the form shown in FIG. 4 (B) as described below. .

The first hole 401 may be formed in various shapes, but the molding part 220 and the antenna electrode 212 may be exposed upward. In addition, both ends (antenna connection portion 411) of the antenna winding 410 need to be formed so as to project properly into the first hole, provided that the antenna connection portion 411 to the antenna electrode 212 It should be formed to be located at the corresponding point. However, since the technology for forming the antenna connector 411 is well known to those skilled in the art, detailed description thereof will be omitted. In addition, the antenna foil 400 may be laminated after forming the antenna 410 in advance, or may form the antenna 410 after laminating a foil in which the antenna 401 is not formed. Unless stated, the antenna foil 400 is interpreted to include both of the above two cases. After stacking the antenna foil 400, it is necessary to remove the oil paper attached to the upper surface of the hot melt sheet 700. That is, the oil paper must be removed before the antenna foil 400 is stacked, and the antenna foil 400 is subsequently thermally bonded to the top surface of the hot melt sheet 700. Thereafter, the antenna connection part 411 and the antenna electrode 212 of the COB 200 are electrically connected. In this case, it is preferable to perform strong bonding using ultrasonic welding, soldering, conductive adhesive, and the like, and if necessary, a part of the end of the antenna 411 which does not contact the antenna electrode 212 is hot melted. It may be sufficient by adhering to the top surface of the sheet 700. The electrical connection between the antenna connection unit 411 and the antenna electrode 212 is well known to those skilled in the art, and a detailed description thereof will be omitted.

Preferably, before stacking the antenna foil 400, the second overlay foil 300 having the second hole 301 having the same area and shape as the main board 210 of the COB 200 is formed. After inserting into the molding part 220 of the COB 200, the antenna foil 400 is laminated. In this case, the second overlay foil 300 and the antenna foil 400 spot-bond a predetermined portion, that is, a few places by using ultrasonic waves. By stacking the second overlay foil 300, the faintly wound antenna winding 410 is not visible from the outside of the completed IC card, and as shown in FIG. 3 (A), the hot melt sheet The thickness difference caused by 700 is eliminated. Since the thickness of the antenna foil 400 is substantially the same as that of the molding part 220 of the COB 200, the molding part (only the second overlay foil 300 and the antenna foil 400) The thickness of the antenna foil 400 may be smaller than the thickness of the molding part 220, and the method may further include stacking the core foil 500. desirable.

After electrically connecting the antenna connection portion 411 of the antenna foil 400 and the antenna electrode 2120 of the COB 200, the third hole 501 having the same shape and area as the molding portion 220. At least one core foil 500 having a stack is laminated with the third hole 501 to be fitted into the molding part 220 of the COB 200. More preferably, the core foil 500 is stacked. Previously (or between laminating the plurality of core foils, i.e. after laminating one core foil in the case of laminating two core foils), the molding part 220 of the COB 200 may be completely covered. Another hot melt sheet (not shown) may be bonded so that the gap between the molding part 220 and the antenna foil 400 or the core foil 500 may be prevented in the case of subsequent thermal compression. In particular, the antenna foil 400 and the core foil 500 When the hot melt sheet is adhered to the hot melt sheet, the hot melt sheet may be covered to the first hole 401. In this case, the hot melt sheet melts in the case of subsequent thermal compression and the first hole 401. In order to fill the space around the antenna connection portion 411.

After stacking the core foil 500, the first overlay foil 600 having no holes is stacked. The first and second overlay foils 600 and 300 may have a relatively thin thickness with respect to the antenna foil 400 and the core foil 500. More preferably, as a result of the at least one core foil 500 being stacked, the height of the top surface of the core foil 500 is slightly higher than the height of the molding part 220 of the COB 200. In addition, the filler 800 is filled in an upper portion of the molding part 220 corresponding to the height difference between the core foil 500 and the molding part 220. Through this, when subsequently thermally compressed, the thickness of the foils is not thinner than the molding part 220. In other words, the foils are reduced in thickness when thermally compressed, whereas the molding part 220 is the same as before the compression is pressed, thereby preventing the thickness of the foil layer from becoming thinner than the molding part 220 of the COB 200. do. When the filler 800 is subsequently thermocompressed by using an epoxy-based adhesive, the molding part 220, the core foil 500, and the first overlay foil 600 are adhered to each other.

After stacking the first overlay foil 600, a second flat working plate is placed on the first overlay foil 600 (or the first working plate when the first working plate is not initially laid). Is inserted into the main board 210 of the COB (200) and laid down, compressing while applying heat to the at least one working plate.

In the method of manufacturing an IC card according to the present invention, a second step process for manufacturing the finished IC card is as follows. For the IC card semi-finished product formed through the above-described first step process, at least one or more foils having a fourth hole (not shown) having substantially the same area as the main board of the COB is placed under the second overlay foil 300. Stacked on, but not less than the thickness of the main board of the COB (because the thickness of the foil portion can be reduced through thermal bonding). In this case, the at least one foil may be a printing foil as necessary, and a coating foil for preventing abrasion. Preferably, the method may further include laminating at least one other foil for coating on the first overlay foil 600. Finally, the laminated whole foils are pressed while applying heat.

The IC card manufacturing method according to the present invention provides a method of manufacturing an IC card having a higher degree of smoothness through thermal compression in a semi-finished product manufacturing process and thermal compression in a finished product manufacturing process, that is, two thermal compressions.

FIG. 3 (A) is a cross-sectional view taken along line AA ′ of FIG. 2 (A) of an IC card in which a plurality of foils are stacked according to the first step semifinished product manufacturing process according to FIG. 3B is a cross-sectional view taken along the line BB '. FIG. 3 (A) is a sectional view of a state in which foils are stacked according to a preferred embodiment of the IC card semifinished product manufacturing method according to FIG. 2, and is cut along the line A-A 'of FIG. However, in this drawing, the first hole 401 of the antenna foil 400 is one hole substantially the same shape and area as the molding portion 220 and the antenna electrode at both sides (position of the antenna electrode). Two other holes exposing 212. And, the antenna connection portion 411 is exposed to each of the two holes. As shown in the figure, the antenna connection part 411 is electrically connected to the antenna electrode 212, and a space (a number of dotted portions) is formed in each of the other two holes of the first hole. Therefore, as described above, by adhering another hot melt sheet onto the antenna foil 400 and the molding part 220 so as to cover the first hole 401, the hot melt sheet melts in the case of subsequent thermal compression. Fill the space (parts with multiple dots). This increases the ease of use of the final IC card.

4 (A) and 4 (B) are plan views showing one specific example of the first hole formed in the antenna foil, respectively. The first hole 401 is formed in the antenna foil 400 of the combination IC card according to the present invention, and the first hole 401 is formed by the connection part 411 of the antenna winding 410 and the COB 200. The antenna electrode 212 is preferably formed to be visible from the operator's field of view, ie from above. Accordingly, in the first hole 401, as shown in FIG. 4 (A) (in the figure, the inside of the closed curve portion is a hole and the outside thereof is an antenna foil), and the COB 200 A central portion 402 having a size greater than or equal to the area of the molding portion is formed so that the molding portion 220 may be exposed from above, and both sides of the central portion 402 so that the antenna electrode 212 may be exposed from above. Outwardly projecting outward projections (403) are formed in each. The connecting portion 411 of the antenna winding 410 is formed to cross the outer protrusion 403, so that the operator has an antenna electrode positioned below the antenna connecting portion 411 through the hole of the outer protrusion 403. 212 is electrically connected. For reference, the surface on which the antenna winding 410 is formed is directed downward from both surfaces of the antenna foil 400, in other words, the surface on which the antenna winding 410 is formed is a surface stacked on the second overlay foil 300. Preferably, the center points of the outer protrusion 403, the hot melt sheet hole 710, and the antenna electrode 212 are positioned in the same plane.

When the hot melt sheet 700 is applied after the antenna foil 400 is stacked, the second hole 401 formed in the antenna foil 400 is the fourth (B) diagram (reference to this figure). In the closed curve portion is a hole and the outside thereof is an antenna foil. At this time, in the second hole 401, a central hole 402 having a size larger than the area of the molding part is formed so that the molding part 220 of the COB 200 can be exposed from above, that is, the operator's field of view. And a pair of inner protrusions 404 protrude from both sides of the central hole 402 and at a predetermined interval up and down the sides. That is, the four inner protrusions 404 are a part of the antenna foil 400, and the connection portion 411 of the antenna winding 410 is formed between the pair of inner protrusions of the center hole 402. It serves as a side hole 405 formed at the edge. The connecting portion 411 of the antenna winding 410 is formed to cross the side hole 405. That is, first, after stacking the antenna foil 400 having only a pair of side holes 405, the operator connects the antenna connection part 411 and the antenna electrode 212 of the COB 200 through the side holes 405. Are electrically connected to each other, and then a second hole 401 having a shape like the fourth (B) is formed in the antenna foil 400 using a puncher or the like. Then, the hot melt sheet 700 is adhered to the second hole 401, but the molding part 220 is exposed to the outside and uses a sheet 700 having a size greater than or equal to the second hole 401.

Simple modifications or changes of the present invention can be easily carried out by those skilled in the art, and all such modifications or changes can be seen to be included in the scope of the present invention.

According to the present invention, there is no step of digging again after laminating the foil, and the COB and the card plate can be strongly bound, there is no gap between the COB and the card plate, and the electrode and antenna electrode of the COB can be strongly bound. It provides a method of manufacturing an IC card and separates the process of manufacturing a semi-finished IC card from the finished product manufacturing process for the rest of the product, thereby enabling division of labor in accordance with the card manufacturing process of the art, and having improved ease of use. It has the effect of providing the manufacturing method of an IC card.

Simple modifications and variations of the present invention can be readily used by those skilled in the art, and all such variations or modifications can be considered to be included within the scope of the present invention.

Claims (16)

The electrode terminal for the contact terminal of the COB having a molding unit, the antenna electrode for the contactless terminal, the electrode surface for the contact terminal is exposed to the outside of the IC card, the antenna for the contactless terminal is mounted in the IC card In the method of manufacturing the semi-finished product of An antenna foil having an antenna wound on one surface thereof so that a first hole for exposing the molding part and the antenna electrode of the COB is formed at a predetermined position and both ends of the antenna are exposed to the inside of the first hole. Inserting the first hole into a molding portion of the COB so that an electrode is exposed; Electrically connecting a connecting portion of the antenna to an antenna electrode of the COB; Stacking the foil with no aperture on the antenna foil; And Compressing the laminated foils; IC card semi-finished product manufacturing method comprising the steps. The method of claim 1, wherein the pressing of the laminated foils comprises: a first working plate that is substantially flat, and a second working plate that is substantially flat and has holes of the same area and shape as the main board of the COB. And manufacturing the laminated foils from above and below the laminated foils. The method of claim 1, further comprising inserting a second overlay foil having a second hole for exposing the molding part and the antenna electrode of the COB to the molding part before laminating the antenna foil. IC card semi-finished product manufacturing method. The method of manufacturing an IC card semi-finished product according to claim 1, further comprising laminating a core foil having a third hole for exposing the molding portion of the COB on the antenna foil. The method of manufacturing an IC card semi-finished product according to claim 1, wherein the foil having no holes formed on the laminated foil is a first overlay foil. The method of manufacturing an IC card semi-finished product according to claim 1, further comprising applying a filler to an upper surface of the molding part. The first hot melt sheet of claim 1, wherein the center hole is inserted into the molding part of the COB, and the first hot melt sheet having a center hole and a sheet hole is formed to expose the molding part and the antenna electrode of the COB, respectively. The method of manufacturing a semi-finished IC card, further comprising the step of adhering the lower surface of the main board of the COB. The method of manufacturing an IC card semi-finished product according to claim 2, wherein the at least one working plate of the working plates is pressed while applying heat. The electrode terminal for the contact terminal of the COB having a molding part, the antenna electrode for the contactless terminal, and the electrode surface for the contact terminal is exposed outside the IC card, the antenna for the contactless terminal is mounted inside the IC card, and In the method of manufacturing the IC card by laminating two or more foils, the IC card manufacturing method comprises a method of manufacturing a first stage semi-finished IC card and a method of manufacturing a second stage finished IC card, The method of manufacturing the first step IC card is An antenna foil having an antenna wound on one surface thereof so that a first hole for exposing the molding part and the antenna electrode of the COB is formed at a predetermined position and both ends of the antenna are exposed inside the first hole. Inserting the first hole into a molding portion of the COB so that an electrode is exposed; Electrically connecting a connecting portion of the antenna to an antenna electrode of the COB; Stacking the foil with no aperture on the antenna foil; And Compressing the laminated foils; Consists of steps, The method of manufacturing the second step IC card is Stacking at least one or more foils having a fourth hole of substantially the same area as the motherboard of the COB to a thickness not less than the thickness of the motherboard of the COB; And Compressing the laminated whole foils; An IC card manufacturing method comprising the steps. 10. The method of claim 9, wherein the pressing the laminated foils of the method of manufacturing the first step IC card comprises a substantially flat first working plate, and an area and shape substantially flat and substantially the same as the mainboard of the COB. And a second working plate having a hole of the presses on the laminated foils at the upper and lower portions of the laminated foils, respectively. 10. The method of claim 9, further comprising inserting a second overlay foil having a second hole for exposing the molding part and the antenna electrode of the COB to the molding part before laminating the antenna foil. IC card semi-finished product manufacturing method. 10. The method of manufacturing a semi-finished IC card according to claim 9, further comprising the step of stacking a core foil having a third hole exposing the molding part of the COB on the antenna foil. 10. The method of claim 9, wherein the foil having no holes formed on the laminated foil is a first overlay foil. 10. The method of claim 9, further comprising applying a filler to the upper surface of the molding part. 10. The method of claim 9, wherein the first hot melt sheet having a center hole and a sheet hole for exposing the molding portion and the antenna electrode of the COB, respectively, is inserted so that the center hole is inserted into the molding portion of the COB, the first hot melt sheet The method of manufacturing a semi-finished IC card, further comprising the step of adhering the lower surface of the main board of the COB. The method of manufacturing an IC card semi-finished product according to claim 10, wherein the IC card is pressed while applying heat to at least one of the working plates.