KR20040062966A - 정전기 소산 필름을 갖는 반도체 구성요소 취급 장치 - Google Patents
정전기 소산 필름을 갖는 반도체 구성요소 취급 장치 Download PDFInfo
- Publication number
- KR20040062966A KR20040062966A KR10-2004-7007903A KR20047007903A KR20040062966A KR 20040062966 A KR20040062966 A KR 20040062966A KR 20047007903 A KR20047007903 A KR 20047007903A KR 20040062966 A KR20040062966 A KR 20040062966A
- Authority
- KR
- South Korea
- Prior art keywords
- film
- thin conductive
- thermoplastic
- conductive
- thin
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 54
- 238000000465 moulding Methods 0.000 claims abstract description 55
- 238000000034 method Methods 0.000 claims abstract description 51
- 239000000463 material Substances 0.000 claims abstract description 47
- 230000008569 process Effects 0.000 claims abstract description 21
- 238000012545 processing Methods 0.000 claims abstract description 17
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 11
- 229920001169 thermoplastic Polymers 0.000 claims description 52
- 239000004416 thermosoftening plastic Substances 0.000 claims description 47
- 230000002093 peripheral effect Effects 0.000 claims description 12
- 229920001774 Perfluoroether Polymers 0.000 claims description 11
- 239000004642 Polyimide Substances 0.000 claims description 10
- 238000004891 communication Methods 0.000 claims description 10
- 229920001721 polyimide Polymers 0.000 claims description 10
- 239000000654 additive Substances 0.000 claims description 8
- -1 polythertherketone Polymers 0.000 claims description 8
- 239000002033 PVDF binder Substances 0.000 claims description 7
- 239000004734 Polyphenylene sulfide Substances 0.000 claims description 7
- 238000005299 abrasion Methods 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 7
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 7
- 229920000069 polyphenylene sulfide Polymers 0.000 claims description 7
- 229920002981 polyvinylidene fluoride Polymers 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
- 239000004812 Fluorinated ethylene propylene Substances 0.000 claims description 6
- 239000004793 Polystyrene Substances 0.000 claims description 6
- 229920009441 perflouroethylene propylene Polymers 0.000 claims description 6
- 229920000728 polyester Polymers 0.000 claims description 6
- 230000004888 barrier function Effects 0.000 claims description 5
- HQQADJVZYDDRJT-UHFFFAOYSA-N ethene;prop-1-ene Chemical group C=C.CC=C HQQADJVZYDDRJT-UHFFFAOYSA-N 0.000 claims description 5
- 239000000835 fiber Substances 0.000 claims description 5
- 239000012815 thermoplastic material Substances 0.000 claims description 5
- 230000013011 mating Effects 0.000 claims description 4
- 229920000049 Carbon (fiber) Polymers 0.000 claims description 3
- 238000010521 absorption reaction Methods 0.000 claims description 3
- 150000001412 amines Chemical class 0.000 claims description 3
- 239000004917 carbon fiber Substances 0.000 claims description 3
- 239000002482 conductive additive Substances 0.000 claims description 3
- 238000001816 cooling Methods 0.000 claims description 3
- 230000008878 coupling Effects 0.000 claims description 3
- 238000010168 coupling process Methods 0.000 claims description 3
- 238000005859 coupling reaction Methods 0.000 claims description 3
- 229910002804 graphite Inorganic materials 0.000 claims description 3
- 239000010439 graphite Substances 0.000 claims description 3
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 3
- 239000002861 polymer material Substances 0.000 claims description 3
- 230000003068 static effect Effects 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 3
- 239000012530 fluid Substances 0.000 claims description 2
- 150000002576 ketones Chemical class 0.000 claims description 2
- 229920002223 polystyrene Polymers 0.000 claims 5
- 150000003457 sulfones Chemical class 0.000 claims 4
- 239000004697 Polyetherimide Substances 0.000 claims 3
- 229920001601 polyetherimide Polymers 0.000 claims 3
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 claims 1
- 239000004695 Polyether sulfone Substances 0.000 claims 1
- 230000000996 additive effect Effects 0.000 claims 1
- 239000011230 binding agent Substances 0.000 claims 1
- 229920001577 copolymer Polymers 0.000 claims 1
- 238000007599 discharging Methods 0.000 claims 1
- 239000011737 fluorine Substances 0.000 claims 1
- 229910052731 fluorine Inorganic materials 0.000 claims 1
- 229920006393 polyether sulfone Polymers 0.000 claims 1
- 238000007493 shaping process Methods 0.000 claims 1
- 239000000969 carrier Substances 0.000 abstract description 12
- 229920001940 conductive polymer Polymers 0.000 abstract description 7
- 229910052799 carbon Inorganic materials 0.000 abstract description 3
- 239000004696 Poly ether ether ketone Substances 0.000 abstract 1
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 abstract 1
- 229920002530 polyetherether ketone Polymers 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 description 57
- 229920000642 polymer Polymers 0.000 description 16
- 238000004519 manufacturing process Methods 0.000 description 13
- 238000002347 injection Methods 0.000 description 10
- 239000007924 injection Substances 0.000 description 10
- 239000002245 particle Substances 0.000 description 10
- 239000004417 polycarbonate Substances 0.000 description 10
- 229920000515 polycarbonate Polymers 0.000 description 10
- 229920003023 plastic Polymers 0.000 description 8
- 239000004033 plastic Substances 0.000 description 7
- 230000008901 benefit Effects 0.000 description 6
- 229920006254 polymer film Polymers 0.000 description 6
- 239000000356 contaminant Substances 0.000 description 5
- 239000000945 filler Substances 0.000 description 5
- 239000004698 Polyethylene Substances 0.000 description 4
- 239000012876 carrier material Substances 0.000 description 4
- 229920000573 polyethylene Polymers 0.000 description 4
- 239000000047 product Substances 0.000 description 4
- 238000010276 construction Methods 0.000 description 3
- 238000011109 contamination Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 230000000712 assembly Effects 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- 239000002991 molded plastic Substances 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- QSJXEFYPDANLFS-UHFFFAOYSA-N Diacetyl Chemical compound CC(=O)C(C)=O QSJXEFYPDANLFS-UHFFFAOYSA-N 0.000 description 1
- 229920012266 Poly(ether sulfone) PES Polymers 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000004873 anchoring Methods 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000012050 conventional carrier Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 238000012938 design process Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 238000010137 moulding (plastic) Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000007666 vacuum forming Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6732—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
- H01L21/67323—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls characterized by a material, a roughness, a coating or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
- B29C70/74—Moulding material on a relatively small portion of the preformed part, e.g. outsert moulding
- B29C70/76—Moulding on edges or extremities of the preformed part
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/88—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts characterised primarily by possessing specific properties, e.g. electrically conductive or locally reinforced
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67326—Horizontal carrier comprising wall type elements whereby the substrates are vertically supported, e.g. comprising sidewalls
- H01L21/6733—Horizontal carrier comprising wall type elements whereby the substrates are vertically supported, e.g. comprising sidewalls characterized by a material, a roughness, a coating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67366—Closed carriers characterised by materials, roughness, coatings or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67396—Closed carriers characterised by the presence of antistatic elements
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Composite Materials (AREA)
- Packaging Frangible Articles (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Stackable Containers (AREA)
- Containers Having Bodies Formed In One Piece (AREA)
- Packaging For Recording Disks (AREA)
- Details Of Rigid Or Semi-Rigid Containers (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US33368601P | 2001-11-27 | 2001-11-27 | |
| US60/333,686 | 2001-11-27 | ||
| PCT/US2002/038076 WO2003046952A2 (en) | 2001-11-27 | 2002-11-26 | Semiconductor component handling device having an electrostatic dissipating film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20040062966A true KR20040062966A (ko) | 2004-07-09 |
Family
ID=23303841
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR10-2004-7007903A KR20040062966A (ko) | 2001-11-27 | 2002-11-26 | 정전기 소산 필름을 갖는 반도체 구성요소 취급 장치 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20050056601A1 (zh) |
| EP (1) | EP1470570A4 (zh) |
| JP (1) | JP2005510868A (zh) |
| KR (1) | KR20040062966A (zh) |
| CN (1) | CN1741885A (zh) |
| AU (1) | AU2002352956A1 (zh) |
| TW (1) | TW200301009A (zh) |
| WO (1) | WO2003046952A2 (zh) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003046950A2 (en) * | 2001-11-27 | 2003-06-05 | Entegris, Inc. | Semiconductor component handling device having a performance film |
| JP4584023B2 (ja) * | 2005-05-17 | 2010-11-17 | 信越ポリマー株式会社 | 基板収納容器及びその製造方法 |
| US20070154716A1 (en) * | 2005-12-30 | 2007-07-05 | Saint-Gobain Performance Plastics Corporation | Composite material |
| US20070152195A1 (en) * | 2005-12-30 | 2007-07-05 | Saint-Gobain Performance Plastics Corporation | Electrostatic dissipative composite material |
| US20070154717A1 (en) * | 2005-12-30 | 2007-07-05 | Saint-Gobain Performance Plastics Corporation | Thermally stable composite material |
| US7476339B2 (en) * | 2006-08-18 | 2009-01-13 | Saint-Gobain Ceramics & Plastics, Inc. | Highly filled thermoplastic composites |
| KR20170100353A (ko) * | 2016-02-25 | 2017-09-04 | (주)코스탯아이앤씨 | 반도체 수납 트레이 및 반도체 수납 트레이용 커버 |
| KR101843982B1 (ko) * | 2017-02-22 | 2018-03-30 | 윤세원 | 전자부품 용기 및 그의 제조방법 |
| JP6578033B2 (ja) * | 2018-01-29 | 2019-09-18 | ウォン ユン、セ | 電子部品の容器の製造方法 |
| DE102019125819A1 (de) | 2019-04-17 | 2020-10-22 | Taiwan Semiconductor Manufacturing Co., Ltd. | Halbleiterverarbeitungsvorrichtung und verfahren unter einsatz einer elektrostatischen entladungs-(esd)- verhinderungsschicht |
| US10950485B2 (en) * | 2019-04-17 | 2021-03-16 | Taiwan Semiconductor Manufacturing Co., Ltd. | Semiconductor processing apparatus and method utilizing electrostatic discharge (ESD) prevention layer |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH088294B2 (ja) * | 1988-05-17 | 1996-01-29 | 三井東圧化学株式会社 | Ｉｃ用ウエハーのコンテナー |
| US5186338A (en) * | 1991-07-11 | 1993-02-16 | Eastman Kodak Company | Pallet for holding a cassette |
| US6010008A (en) * | 1997-07-11 | 2000-01-04 | Fluoroware, Inc. | Transport module |
| DE19924182B4 (de) * | 1998-05-28 | 2008-04-17 | Entegris, Inc., Chaska | Träger für zu bearbeitende, aufzubewahrende und/oder zu transportierende Halbleiterwafer |
| US6428729B1 (en) * | 1998-05-28 | 2002-08-06 | Entegris, Inc. | Composite substrate carrier |
| US6079565A (en) * | 1998-12-28 | 2000-06-27 | Flouroware, Inc. | Clipless tray |
| US6248262B1 (en) * | 2000-02-03 | 2001-06-19 | General Electric Company | Carbon-reinforced thermoplastic resin composition and articles made from same |
| JP4424524B2 (ja) * | 2000-04-12 | 2010-03-03 | Ｏｋｉセミコンダクタ株式会社 | チップトレイ |
| WO2003046950A2 (en) * | 2001-11-27 | 2003-06-05 | Entegris, Inc. | Semiconductor component handling device having a performance film |
-
2002
- 2002-11-26 KR KR10-2004-7007903A patent/KR20040062966A/ko not_active Application Discontinuation
- 2002-11-26 AU AU2002352956A patent/AU2002352956A1/en not_active Abandoned
- 2002-11-26 EP EP02789916A patent/EP1470570A4/en active Pending
- 2002-11-26 CN CNA02827606XA patent/CN1741885A/zh active Pending
- 2002-11-26 US US10/496,679 patent/US20050056601A1/en not_active Abandoned
- 2002-11-26 WO PCT/US2002/038076 patent/WO2003046952A2/en active Application Filing
- 2002-11-26 JP JP2003548279A patent/JP2005510868A/ja not_active Withdrawn
- 2002-11-27 TW TW091134460A patent/TW200301009A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| EP1470570A2 (en) | 2004-10-27 |
| US20050056601A1 (en) | 2005-03-17 |
| WO2003046952A3 (en) | 2003-12-11 |
| EP1470570A4 (en) | 2007-12-12 |
| AU2002352956A1 (en) | 2003-06-10 |
| WO2003046952B1 (en) | 2004-02-26 |
| CN1741885A (zh) | 2006-03-01 |
| AU2002352956A8 (en) | 2003-06-10 |
| WO2003046952A2 (en) | 2003-06-05 |
| JP2005510868A (ja) | 2005-04-21 |
| TW200301009A (en) | 2003-06-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| WITN | Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid |