KR20040049894A - Refillable source for thermal evaporation process - Google Patents

Abstract

PURPOSE: A refillable source for thermal evaporation process is provided which is capable of easily recharging the chemical materials even without release of vacuum when chemical materials in the evaporation source are exhausted. CONSTITUTION: The refillable source comprises an ejection part(10) comprising an opening part(11) for deposition process, and a heating part(20) for constantly maintaining temperature of the opening part; an evaporation part(70) comprising a container part(40) which is connected to an inner part of the ejection part through connection pipe(41), and in which chemical materials are contained, and a filament(60) for maintaining the connection pipe and the container part in the same temperature state as the ejection part; and a valve(50) which controls opening and closing vapor flow by connecting the ejection part to the evaporation part, and which is equipped with filament(60), wherein a pump port(80) is additionally installed at the evaporation part so that the container part is connected to pump, wherein the connection pipe connected to the ejection part is branched off so that two or more of the evaporation parts are installed on the connection pipe, wherein at least one or more rows of pipes are connected to the container part, and at least one or more of the ejection parts are installed along the pipes, and wherein the container part comprises a plate shaped base connected to the connection pipe connected to the container part, and a plurality of opening parts positioned on the base so that the opening part and the connection pipe are easily heated and insulated.

Description

Refillable source for thermal evaporation process

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an evaporation source for a deposition process capable of recharging a material, and in particular, in an evaporation source used in an evaporation process for manufacturing an organic light emitting device or a semiconductor device, the vacuum state is reduced when This is to make it easy to recharge the chemical without breaking.

Thus, it is possible to continuously recharge the material when the chemical is exhausted in the deposition process, no need to release the vacuum to recharge the material, no need to waste unnecessary work and time for the vacuum exhaust, An evaporation source for a rechargeable deposition process of a material that enables a continuous deposition process.

The thermal evaporation process is a widely used method for manufacturing semiconductor devices or flat panel display devices. In order to coat chemicals used in the manufacture of semiconductor devices and flat panel display devices on a substrate, chemicals are contained. It is a method of manufacturing a thin layer of chemicals on a substrate by heating the magnetic field to make vapor-shaped molecules pass through the connection part and exit through the opening of the ejection part to be deposited on the substrate located above the opening. The deposition process is usually carried out in a vessel which is vacuum.

The most important part of the deposition process is an evaporation source for evaporating the material by applying heat to the chemical, which is composed of a crucible, a heating part and an opening.

As the evaporation source as described above, there are a point evaporation source, a linear evaporation source, etc., the most widely used point evaporation source.

In the general structure of the point evaporation source, as shown in Fig. 1, an opening 2 is formed in the upper portion of the cylindrical crucible 1, which is filled with a chemical substance, narrowed in a bottle shape and widened again. A heating part 3 for heating the crucible 1 is installed outside the crucible 1, and the opening part 2 may further include a nozzle part 4 so that chemicals can spread widely. .

Thus, the heating unit 3 is heated in a state where the point evaporation source is kept from the substrate 5 to deposit a substance.

However, as described above, since the deposition process proceeds with the evaporation source separated from the substrate by a certain distance, the utilization rate of the material is somewhat decreased, even if one day, the chemical in the evaporation source is exhausted.

Then, at this time, the heated heat is cooled, the vacuum is released, the chemicals are charged to the crucible of the evaporation source, and vacuum evacuation is performed again. Such vacuum evacuation and heating take a long time. Therefore, there was a problem in that unnecessary work and time are required when recharging the material.

The present invention is to solve the above-mentioned drawback, it is possible to continuously recharge the material when the chemical is exhausted in the deposition process, there is no need to release the vacuum to recharge the material, unnecessary for vacuum exhaust There is a need to provide an evaporation source for a rechargeable deposition process of materials that does not waste work and time, and allows for a continuous deposition process. In addition, it is easy to configure the openings in various forms that can improve the uniformity of the thin film on a large area substrate by placing the openings through which steam is discharged and a container for storing chemicals separately in the areas of the ejecting part and the steam producing part.

The present invention comprises an ejecting portion comprising an opening for a deposition process and a heating portion for maintaining a constant temperature of the opening; An evaporation part connected to the inside of the ejection part through a connection pipe and having a container part for containing chemicals, and a filament for making the connection pipe and the container part at the same temperature as the evaporation part; It is achieved by connecting the blower and the evaporator to control the opening and closing of the steam flow, comprising a valve equipped with a filament.

1 is a cross-sectional view showing the structure of a general point evaporation source,

2 is an evaporation source for a rechargeable deposition process of a material of the present invention.

Perspective view showing a first embodiment,

3 is an evaporation source for a rechargeable deposition process of a material of the present invention.

Perspective view showing a second embodiment,

4 is an evaporation source for a rechargeable deposition process of a material of the present invention.

Schematic diagram showing the third embodiment,

5 is an evaporation source for a rechargeable deposition process of a material of the present invention.

Perspective view showing a fourth embodiment,

6 is an evaporation source for a rechargeable deposition process of a material of the present invention.

Perspective view showing a fifth embodiment,

7 is an evaporation source for a rechargeable deposition process of a material of the present invention.

A schematic diagram showing a sixth embodiment.

<Explanation of symbols for the main parts of the drawings>

10: ejection part 11: opening part

20: heating part 40: container part

41: connector 50: valve

60: filament 70: evaporation unit

80: pump port

An embodiment of the present invention will be described in detail with reference to the accompanying drawings.

2 is a perspective view showing a first embodiment of a vapor deposition source for a rechargeable deposition process of a material of the present invention, Figure 3 is a perspective view showing a second embodiment of a vapor deposition source for a rechargeable deposition process of a material of the present invention, The present invention includes an ejecting portion (10) comprising an opening (11) for the deposition process, and a heating portion (see Fig. 4) for maintaining a constant temperature of the opening (11); It is connected to the inside of the jetting portion 10 through a connecting pipe 41 and the container portion 40 for containing a chemical, and the connecting pipe 41 and the container portion 40 and the jetting portion 10 An evaporator 70 made of a filament 60 for making the same temperature state; By connecting the blower 10 and the evaporator 70 to control the opening and closing of the steam flow, it comprises a valve 50 is provided with a filament 60 is characterized in the technical features.

As shown, the first embodiment shows an embodiment using a point evaporation source, and the second embodiment shows an embodiment using a linear evaporation source.

The container portion 40 is configured with a material filling and vacuum exhaust pipe 42 with the connection pipe 41, the valve 50 is configured to open and close the steam and to maintain the temperature of the steam as it is.

In addition, the evaporator 70, it is preferable to further configure the pump port 80 so that the container portion 40 can be connected to the pump.

4 is a schematic view showing a third embodiment of a linear evaporation source capable of recharging a material of the present invention, and is provided such that a connecting pipe 41 connecting the evaporator 70 and the container 40 is branched in two directions. By forming two evaporation unit 70 in each branched portion, when all of the chemicals contained in one container portion 40 is exhausted, so as to fill the material using the other one container portion 40 More preferably, it is also possible to configure more evaporator 70 in some cases.

FIG. 5 is a perspective view showing a fourth embodiment of a vaporization source for a vapor deposition process for recharging a material of the present invention, wherein at least one column of tubes 31 is connected to the vessel portion 40, and the ejection portion 10 is At least one configuration is shown along the pipe 31.

As described above, by constructing a plurality of ejection portions 10 along the tube 31, it is possible to improve the overall uniformity of the thin film to be produced, and also to maintain the heat and heating of the ejection portion 10 and the tube 31 This can be done easily.

FIG. 6 is a perspective view showing a fifth embodiment of a vaporization source for a deposition process capable of recharging a material of the present invention, wherein the ejection portion 10 is formed in a plate 41 connected to the container portion 40. The base 32 is connected, and a plurality of openings 11 are located in the base 32, so that the ejection portion 10 and the connection pipe 41 can be easily heated and warmed. .

In addition, as shown in FIG. 7, at least one through part 33 is formed in the base 32, and a connecting pipe additionally connected to the container part 40 below the base 32. 41 is connected to the lower base 32 'in the form of a plate, and a plurality of openings 11 are positioned in the lower base 32' and discharged from the opening 11 'of the lower base 32'. By allowing the evaporation material to be ejected through the through part 33, it is possible to simultaneously deposit two or more chemicals (sixth embodiment).

Hereinafter, the operation and effects of the present invention will be described with reference to FIGS. 2 to 7.

A chemical substance can be added to the container portion 40 of the evaporation unit 70 of the evaporation source for the vapor deposition process capable of recharging the material of the present invention, and the temperature is distributed by using the heating unit 20. May remain the same as

Thus, when the deposition process is performed to fabricate the device, the peel heating unit 20 and the filament 60 are operated to include the ejection unit 10, the inside of the valve 50, and the container unit 40. Since the entire structure of the evaporator 70 has a uniform temperature distribution, at any time, the vapor of the chemical generated in the evaporator 70 including the container part 40 is discharged from the opening 11 of the ejector 10. It is possible to export to.

When the chemicals in one container part 40 are exhausted, as shown in FIG. 4, when the two evaporation parts 70 are installed, when the chemicals in one container part 40 are exhausted, By operating the valve 50, the process is performed by using the evaporator 70 in which steam is prepared in a state of heating and keeping the other side. At this time, the temperature of the container part 40 of the exhausted side is lowered and the evaporator 70 is By releasing the vacuum using the pump port 80 of the, and refilling the chemical to the container 40 to make the process alternately, it is possible to continue the process without interruption of work .

It is also possible to deposit two or more materials at the same time by mounting two or more evaporation sources of the technique of the invention in a vacuum system.

The above embodiment is an example for explaining the technical idea of the present invention in detail, and the scope of the present invention is not limited to the above drawings and embodiments.

As described above, the present invention makes it possible to continuously recharge the material when the chemical is exhausted in the deposition process, and does not need to release the vacuum to recharge the material, which wastes unnecessary work and time for evacuation. There is no need, and there is an effect that the continuous deposition process is possible, and the evaporation part including the container part containing chemicals and the ejection part for discharging steam can be separated to improve the uniformity of the thin film on a large area substrate. It is an invention that the opening can be easily configured in various forms.

Claims (6)

An ejecting portion comprising an opening for a deposition process and a heating portion for maintaining a constant temperature of the opening; An evaporation part connected to the inside of the ejection part through a connecting pipe and having a container part for containing chemicals, and a filament for bringing the connecting pipe and the container part into the same temperature state as the ejecting part; The evaporation source capable of continuously charging the material, characterized in that it comprises a valve having a filament, and controls the opening and closing of the steam flow by connecting the blower and the evaporator. The method of claim 1, wherein the evaporator, And a pump port is further configured to allow the container portion to be connected to the pump. The method of claim 1, wherein the evaporation unit, Evaporation source for the continuous recharge of the material, characterized in that the two or more connecting pipes connected to the ejecting portion is installed to be installed. The evaporation source of claim 1, wherein at least one tube of heat is connected to the container, and at least one ejection unit is installed along the tube. The method of claim 1, wherein the blowing unit, A plate-shaped base is connected to the connection pipe connected to the container portion, a plurality of openings are located in the base, Evaporation source for the rechargeable deposition process of the material, characterized in that to facilitate the heating and insulation of the opening and the connection pipe. The base of claim 5, wherein at least one through portion is formed in the base, and a lower base in the form of a plate is connected to a connection tube additionally connected to the container portion at a lower side of the base, and a plurality of openings are formed in the lower base. Location, The evaporation source for the rechargeable deposition process of the material, characterized in that by depositing the evaporation material discharged from the opening of the lower base through the penetrating portion, it is possible to deposit two or more chemicals at the same time.