KR20040021922A - Heat-dissipating device - Google Patents

Abstract

PURPOSE: A heat-dissipation device is provided to enable a fan unit to absorb high-temperature air around other heat-generation component through an entrance port of a guide pipe to extract outside a computer housing, thereby accomplishing an excellent heat-dissipation effect. CONSTITUTION: A thermal superconducting body(4) has a hollow thermal transmission body disposed on a thermal-generation component(5) of an electronic device. The thermal transmission body is configured to define at least one air channel(44). A fan unit(7) is disposed to pull high-temperature air from the thermal transmission body. An entrance port(61) is connected to the thermal transmission body to collect the high-temperature air. An exit port(63) is connected to the fan unit(7). An intermediate pipe portion(62) connects the entrance port(61) with the exit port(63) to guide the high-temperature air to the exit port(63) from the entrance port(61).

Description

Heat dissipation device {HEAT-DISSIPATING DEVICE}

The present invention relates to a heat-dissipating device, and more particularly, to a heat dissipation device capable of dissipating heat in a high efficiency manner.

1 illustrates a conventional heat dissipation device suitable for mounting on top of a heat generating component 12 disposed on a circuit board 11 of an electronic device. The heat generating component 12 may be a central processing unit, an integrated circuit, or the like. The heat dissipation device comprises an aluminum heat dissipation fin unit 13 and a fan 14 oriented towards the fin unit 13 arranged in thermal contact with the heat generating component 12. The fin unit 13 is formed of copper and has a bottom portion having a heat conduction plate 15 which facilitates the transfer of heat generated by the heat generating component 12 to the fin unit. However, this conventional heat dissipation device has the following drawbacks.

1. Although aluminum and copper have a very high temperature coefficient of conductivity, their combined heat dissipation effect is not very satisfactory such that the surface temperature of the heat generating component 12 is higher than that of the fin unit 13. Remains in the state. That is, the airflow blown from the fan 14 can only dissipate heat around the fin unit 13 and reach the surface of the heat generating component 12 to dissipate heat around the heat generating component 12. none.

2. In view of the above fact, when heat is gradually accumulated on the surface of the heat generating component 12, since the conventional heat dissipation device cannot effectively dissipate high heat, the operation of the heat generating component 12 works. This effect may cause the electronic device to stop working or be damaged.

3. Referring to FIG. 2, where the heat generating component 12 is a central processing unit disposed in the computer housing 2 and mounted in the processor socket 16 of the main board 17, heat around the central processing unit is removed. The airflow generated by the fan to dissipate becomes high temperature and is dispersed in the computer housing 2 to raise the temperature in the computer housing 2. A power supply 3 with an exhaust fan unit 31 is arranged to draw hot air out of the computer housing 2 and dissipate the generated heat, but the heat dissipation effect is not ideal.

Accordingly, it is a primary object of the present invention to provide a heat dissipation device that achieves an improved heat dissipation effect using a single fan unit.

Therefore, the heat dissipation device of the present invention,

A thermal superconducting body having a hollow heat carrier suitable for being disposed on a heat generating component of an electronic device, the heat carrier being made of a heat conductive material and configured to define at least one air channel. Wow,

A fan unit arranged to draw hot air away from the heat carrier,

An inlet port in fluid communication with the heat carrier for collecting hot air from the heat carrier, an outlet port in fluid communication with the fan unit, and a high temperature from the inlet port to the outlet port for extraction by the fan unit And a guide pipe having an intermediate pipe portion that interconnects the inlet and outlet ports to direct air.

Other features and advantages of the present invention will become apparent from the following detailed description of the preferred embodiments with reference to the attached drawings.

1 is a schematic exploded side view of a conventional heat dissipation device;

2 is a partially cutaway perspective view illustrating a conventional heat dissipation device in a computer housing;

3 is a perspective view of a preferred embodiment of the heat dissipation device according to the invention in use;

4 is a cross-sectional view showing a superheat conductor of a preferred embodiment of the present invention;

5 is a plan view of a superheat conductor of a preferred embodiment of the present invention.

Explanation of symbols for the main parts of the drawings

4: super heat conductor 5: heat generating component

6: guide pipe 7: fan unit

40: heat carrier 43: fin

45: base 61: inlet port

62: intermediate pipe portion 63: outlet port

3 to 5, there is shown a preferred embodiment of a heat dissipation device according to the invention, which comprises a superheat conductor 4, a fan unit 7 and a guide pipe 6.

The superheat conductor 4 comprises a hollow heat carrier 40 suitable for being disposed on a heat generating component 5, such as a central processing unit of an electronic device, and has aluminum, copper metal, alloy metal or other having good thermal conductivity. Are made of materials. The heat carrier 40 has a thermal contact relationship with the inner surface defining the sealed vacuum chamber 41 and the heat generating component 5 such that heat generated by the heat generating component 5 is transferred to the heat carrier 40. It has a base portion 45 suitable for being disposed with. The superheat conductor 4 also includes a heat transfer layer 42 formed of a superconducting material and forming a superconductor lining on the inner surface of the heat carrier 40. In this embodiment, the superconducting material is injected into the heat transfer layer 40 and then sealed to form a vacuum chamber that is evacuated to form a closed vacuum chamber. A plurality of equally spaced limiting blocks are disposed on the inner surface of the heat carrier 40 such that when air is exhausted from the heat carrier 40 to form a closed vacuum chamber 41, Prevents planarization or angular deformation.

The superconducting material is at least one selected from the group consisting of sodium peroxide, sodium oxide, beryllium oxide, manganese sesquioxide, aluminum dichromate, calcium dichromate, boron oxide, dichromate radicals, and combinations thereof. compound; Cobalt oxide, manganese 3,2 oxide, beryllium oxide, strontium chromium, strontium carbide, rhodium oxide, cupric oxide, β-titanium, potassium dichromate, boron oxide, calcium dichromate, manganese dichromate, aluminum dichromate, bichromate radicals and At least one compound selected from the group consisting of combinations thereof; Or at least one selected from the group consisting of modified rhodium oxide, potassium dichromate, modified radium oxide, sodium dichromate, silver dichromate, single crystal silicon, beryllium oxide, strontium chromium oxide, boron oxide, sodium peroxide, β-titanium, metal dichromate, and combinations thereof Note that it contains one compound.

Indeed, before injecting the superconducting material into the heat carrier 40, the closed vacuum chamber 41 is passivated, cleaned and dried.

In the present embodiment, the heat transfer body 40 is formed to have a plurality of fins 43 extending vertically from the base portion 45 on the opposite side of the heat generating component 5. The pair of adjacent fins 43 defines an air channel 44.

The fan unit 7 is arranged to draw hot air away from the heat transfer body 40.

The guide pipe 6 is made of a heat resistant metal or rubber material and connected to the fan unit 7 and an inlet port 61 in fluid communication with the heat carrier 40 to collect hot air from the heat carrier 40. Outlet port 63 in fluid communication with it, and the inlet port 61 and the outlet port (to guide the hot air from the inlet port 61 to the outlet port 63 for extraction by the fan unit 7). A flexible intermediate pipe portion 62 interconnecting 63. The inlet port 61 of the guide pipe 6 is connected to the base portion 45 of the heat transfer body 40 and has a pin disposed therein in fluid communication with the air channel 44 defined by the fin 43. 43). In the present embodiment, the intermediate pipe portion 62 is composed of a bellows pipe portion.

In use, due to the exceptionally high conductivity temperature coefficient of the superheat conductor 4, the heat generated by the heat generating component 5 during its operation is quickly transferred to the superheat conductor 4. In addition, since the inlet port 61 of the guide pipe 6 spans over the superheat conductor 4, the hot air around the heat generating component allows air through the guide pipe 6 for extraction by the fan unit 7. It can be directed to flow along the channel 44, whereby the temperature around the heat generating component 5 drops rapidly.

The fan unit 7 may be a fan member of a power supply (not shown) disposed in a computer housing (not shown) for supplying power to the computer. As such, when power is supplied to the computer, the fan unit 7, via the inlet port 61 of the guide pipe 6 for extraction out of the computer housing, generates heat components 5 and a hard disk drive. And hot air around other heat generating components such as optical disk drives.

In order to enhance the heat dissipation effect, the heat dissipation device of the present invention also includes a heat collecting plate 8 suitable for being disposed between the superheat conductor 4 and the heat generating component 5. The heat collecting plate 8 has two opposing surfaces, each of which is coated with a thermally conductive paste 9. In the present embodiment, the heat collecting plate 8 is formed of a metal material of good thermal conductivity such as copper and aluminum.

It is shown that the heat dissipation device of the present invention can achieve excellent heat dissipation effect by using only a single fan unit.

Although the present invention has been described in terms of what is considered to be the most practical and preferred embodiment, it is to be understood that the invention is not limited to the disclosed embodiments but covers all such modifications and equivalents as would cover the widest scope of interpretation and spirit It is to be understood that it is intended to include the configuration.

According to the heat dissipation device of the present invention, excellent heat dissipation effect can be achieved by using only a single fan unit.

Claims (9)

In the heat dissipation device, A thermal superconducting body 4 having a hollow heat carrier 40 suitable for being disposed on a heat generating component 5 of an electronic device, wherein the heat carrier 40 is made of a thermally conductive material and at least A super thermal conductor 4, configured to define one air channel 44, A fan unit 7 arranged to draw hot air away from the heat transfer body 40, An inlet port 61 in fluid communication with the heat carrier 40 for collecting hot air from the heat carrier 40, an outlet port 63 in fluid communication with the fan unit, and the fan unit 7. Having an intermediate pipe 62 interconnecting the inlet port 61 and the outlet port 63 to direct hot air from the inlet port 61 to the outlet port 63 for extraction by With guide pipe (6) Heat dissipation device. The method of claim 1, It further comprises a heat collecting plate 8 suitable for being disposed between the superheat conductor 4 and the heat generating component 5. Heat dissipation device. The method of claim 2, The heat collecting plate 8 has two opposing surfaces each coated with a thermally conductive paste 9. Heat dissipation device. The method of claim 1, The heat carrier 40 has an inner surface defining a closed vacuum chamber 41 and the heat generating component 5 such that heat generated by the heat generating component 5 is transferred to the heat carrier 40. Having a base portion 45 suitable for being placed in over thermal contact Heat dissipation device. The method of claim 4, wherein The heat carrier 40 is formed to have a plurality of fins 43 extending vertically from the base portion 45 to the opposite side to the heat generating component 5, wherein the at least one air channel is adjacent to the fins. Defined by a pair and in fluid communication with the inlet port 61. Heat dissipation device. The method of claim 5, wherein The inlet port 61 of the guide pipe 6 is connected to the base 45 of the heat transfer body 40 and the fin 43 is disposed therein. Heat dissipation device. The method of claim 4, wherein The superheat conductor 4 further comprises a heat transfer layer 42 formed of a superconducting material and forming a superconducting lining on the inner surface of the heat carrier 40. Heat dissipation device. The method of claim 1, The fan unit 7 is connected to the outlet port 63 of the guide pipe 6. Heat dissipation device. The method of claim 1, The intermediate pipe portion 62 is composed of a bellows pipe portion Heat dissipation device.