KR20040001289A - Photographing apparatus for lead of a semiconductor package - Google Patents

Abstract

PURPOSE: A photographing apparatus for the lead of a semiconductor package is provided to improve sharpness of the image taken by a photographing apparatus and to reduce operating speed thereof. CONSTITUTION: A support block(100) is seated on a base(51) of a frame(50). Onto a mount(120) of the support block(100), a reflection block(200) is mounted. A plurality of side illumination devices(410,420) are mounted around the side portion of the reflection block(200) so that the illuminating light directs to the center part thereof. A photographing device(500) is fixed to a support plate(52) and disposed at the lower part of the support block(100) in order to pick up the image through a light hole(100a) of the support block(100) and a mirror(20). The apparatus further includes a photographing start point sensing unit(300) and a control unit(600).

Description

Photographing apparatus for lead of a semiconductor package

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for photographing a lead of a semiconductor package. In particular, the lead of the semiconductor package can be photographed more precisely and clearly, and the structure is prevented from interfering with a peripheral device for transferring the semiconductor package. The present invention relates to a lead photographing apparatus for a semiconductor package which is greatly shortened and which is advantageous in maintenance and maintenance.

As is well known, the lead of a semiconductor package is used as a medium for electrically connecting a substrate and a chip. If the lead is deformed during lead forming, the semiconductor package is mounted in a poor contact state.

Therefore, by inspecting the lead deformation of the manufactured semiconductor package, the semiconductor package having the deformed lead exceeding the error range is judged to be defective and separately processed, and the semiconductor package having the deformed lead within the error range is determined as the pass. It is then transferred to a treatment process.

In the past, the inspector manually inspected the lead deformation of the semiconductor package after taking an arbitrary semiconductor package from among the semiconductor packages. However, in this method, the accuracy of the lead deformation test is greatly degraded, which greatly reduces the reliability of the test result. The problem is that it takes a lot of time.

In order to solve this problem, inspection equipment for determining whether a defect is determined by inspecting a lead state of a semiconductor package through a photographed image after photographing a lead of a semiconductor package has been developed in various fields, some of which are already widely used. .

On the other hand, a device for photographing a lead of a conventional semiconductor package, as in the domestic utility model publication No. 1997-50520 and the Korean Patent Application Publication No. 1998-78009, based on the semiconductor package positioned in the shooting position, the lighting fixture Is located in the downward direction, and the imaging device is generally configured to have a structure arranged in the upward direction, in this case, since the transfer device for transferring the semiconductor package in the process direction and the mutual interference of the imaging device is generated, this is prevented In order to do so, the structure and the treatment process have to be considerably complicated, which causes a problem that the treatment speed is greatly reduced. In addition, although the imaging apparatus should be close to the semiconductor package for more accurate photographing, in order to prevent interference with the semiconductor package transfer device, the installation position of the imaging apparatus must be restricted, so that the proximity of the semiconductor package lead is virtually close. Since shooting is impossible, the accuracy of shooting is deteriorated. Moreover, since the lighting fixtures or reflectors are disposed upward, foreign substances such as dust accumulate on the lighting fixtures or reflectors, and the clarity of the photographed image is deteriorated with time. Hassle that requires frequent cleaning or replacement.

In order to solve such a problem of the lead photographing apparatus of the conventional semiconductor package, the luminaire is located in the lower side of the semiconductor package with reference to the semiconductor package positioned at the photographing position, such as Korean Patent Publication No. 2000-25763 In addition, a reflector is disposed on an upper portion of a lighting apparatus while surrounding the semiconductor package, and a lead photographing apparatus of a semiconductor package, in which an image photographing apparatus is disposed below a semiconductor package, has been proposed.

In the case of such a lead photographing apparatus, the semiconductor package conveying apparatus does not interfere with the luminaire or the image photographing apparatus, but can take a close-up photograph of the lead of the semiconductor package with each component in the set position. Since it is disposed obliquely downward and the luminaire is disposed laterally, foreign matters such as dust do not easily accumulate on the reflecting surface of the reflector or the luminaire, and the sharpness of the captured image is not reduced. There is an advantage that fats and oils are advantageous.

However, the lead photographing apparatus of the present semiconductor package has a structure in which the reflector surrounds the semiconductor package. Therefore, the lead reflector must be reciprocated to transfer the reflector every time the lead photographing of each semiconductor package is carried out. There is a need for a conveying device, which results in a complicated structure and a delay in processing speed.

Moreover, since the lighting fixture is disposed in the lower side direction of the semiconductor package, the illumination is indirectly reflected on the semiconductor package, which causes a problem that the accuracy of the captured image is greatly reduced.

Accordingly, the present invention has been invented to solve the above problems, and it is possible to capture more precisely and clearly, and has a structure in which interference with the outside is prevented, thereby greatly reducing the processing speed and advantageously maintaining and maintaining the semiconductor. It is an object of the present invention to provide a lead photographing apparatus for a package.

1 is a partial cross-sectional view showing a first embodiment of a lead photographing apparatus according to the present invention;

Figure 2 is an enlarged perspective view of the main part of Figure 1,

3 is a partial perspective view of FIG. 2;

4A is a cross-sectional view of the reflective block shown in FIGS. 1 to 3;

4B is a cross-sectional view illustrating another example of the reflective block illustrated in FIG. 4A;

4C is a cross-sectional view illustrating another example of the reflective block illustrated in FIG. 4A;

5 is a partial cross-sectional view showing a second embodiment of a lead photographing apparatus according to the present invention;

6 is a partial cross-sectional view showing a third embodiment of a lead photographing apparatus according to the present invention;

7 is a partial sectional view showing a fourth embodiment of the lead photographing apparatus according to the present invention.

-Explanation of terms for the main parts of the accompanying drawings-

10; Semiconductor package 11; main body,

12; Lead, 20; Reflector,

50; Structure 51; Base,

52; Support, 60; Semiconductor package feeder,

61; Moving block 61a; Light Passing Hole,

62a, 62b; Pickup mechanism 100; Support Block,

100a; Light passing holes, 110; Outer Space,

120; Mounting section 121; Fixing Hole,

130; Connection part 200; Reflective Block,

210; Main body 211; incline,

212; Fixed protrusion 221; Mirror,

222; Total reflection prism, 300; Point of view detection unit,

410,420,430,440; Side lighting fixtures 411,421,431,441; main body,

411a, 421a, 431a, 441a; Outlets 411b, 421b, 431b, 441b; Fastener,

412,422,432,442; Light emitting unit 500; Photography,

600; Control unit 700; Input unit,

800; Output unit 900; Upper lighting fixtures.

The present invention for achieving the above object, the outer frame seated on the base, the mounting block is mounted fixed to the reflection block, and the support block having a light passing hole consisting of a connecting portion connecting the outer frame and the mounting portion; A reflection block having a reflection surface for reflecting light from the lateral direction downward in a circumferential surface thereof, the reflection block being mounted on and fixed to the mounting portion of the support block; A shooting point detection unit for detecting a shooting point and outputting it to the control unit; A side lighting device disposed in the lateral direction of the reflection block to emit light toward the center of the reflection block; An image photographing mechanism, disposed under the support block, for photographing an image projected through the light passing hole of the support block; And a control unit for automatically controlling the operation of the side lighting device and the image photographing device by receiving the output signal from the photographing point detecting unit.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

According to FIG. 1, in the lead photographing apparatus according to the present invention, the support block 100 is seated on the base 51 constituting the structure 50, and the reflective block 200 is fixed to the support block 100. Side lighting fixtures 410, 420, 430, 440 are fixed to the base 510 while surrounding the support block 100, and the image capturing apparatus 500 is fixed to the support 52 constituting the structure 50, thereby lowering the support block 100. The photographing point detecting unit 300 and the control unit 600 are arranged in an appropriate position to form a structure.

As shown in FIGS. 1 and 3, the support block 100 includes an outer frame 110 seated on the base 51, a mounting unit 120 on which the reflective block 200 is mounted and fixed, and an outer frame. Consists of a connection portion 130 connecting the 110 and the mounting portion 120 forms a structure in which a light passing hole 100a is formed. The connection portion 130 determines the position in consideration of the shape of the semiconductor package 10, as shown in Figure 3, the edge of the outer frame 110 and the mounting portion 120 by the connection portion 130 It is preferable to be connected to each other (the semiconductor package body 11 is standardized in the form of a square block, and the lead 12 is formed to protrude from the side surface of the semiconductor package body 11, so that the semiconductor package body 11 Free space is provided at the corners of the edge. The light passing holes 100a may be two or four depending on the shape of the semiconductor package 10. However, four light passing holes 100a may be used regardless of the shape of the semiconductor package 10.

The reflection block 200 is provided with a reflective surface on the circumferential surface that reflects the light from the side direction downward, and reflects the light from the side lighting fixtures (410, 420, 430, 440) in the downward direction. In the present embodiment, the reflective block 200 is made of a metallic reflective block body 210, the peripheral surface of the reflective block body 210 is formed to be inclined downward toward its center inclined surface 211 ), And the inclined surface 211 is smoothly surface treated to form a reflective surface, as shown in FIG. 4A.

The photographing time detecting unit 300 detects a photographing point, that is, a time point at which the semiconductor package 10 to be photographed is placed on the reflective block 200 and is output to the control unit 600. Although the sensor may be used as the photographing point detecting unit 300, a driving device (not shown) for driving the semiconductor package transfer device 60 (see FIGS. 6 and 7) may be used as the photographing point detecting unit 300.

The side lighting device (410, 420, 430, 440), the light emitting unit (412, 422, 432, 442) for emitting light by receiving power; Light exits 411a, 421a, 431a, 441a and fastening portions 411b, 421b, 431b, 441b to emit light from the light emitting units 412, 422, 432, 442 to the exits 411a, 421a, 431a, 441a. The guiding side luminaire main body 411, 421, 431, 441 was used. The outlets 411a, 421a, 431a and 441a are opened in the horizontal direction so that light from the outlets 411a, 421a, 431a and 441a is emitted to the reflection block 200. The light emitting units 412, 422, 432, 442 can be used as long as they are known as long as they convert electrical energy into light energy. In this embodiment, light emitting diodes (LEDs) are used.

The image capturing apparatus 500 is disposed under the support block 100 to photograph an image projected through the light passing hole 100a of the support block 100.

The control unit 600 receives an output signal from the photographing time detecting unit 300 and automatically controls the operation of the side lighting apparatuses 410, 420, 430, and 440 and the image photographing apparatus 500.

In the meantime, reference numeral 121 denotes a fixing hole, and 212 denotes a fixing protrusion that is press-fitted into the fixing hole 121.

In addition, "412" and "442" which are not drawn out in the drawing are the same as the light emitting units 422 and 432 shown in FIG. 3, and "421a" and "431a" are the outlets 411a and 441a shown in FIG. Since it is the same, it will be referred to.

The operation state of the lead photographing apparatus of the semiconductor package according to the present invention is as follows.

First, when the semiconductor package 100 to be photographed by the semiconductor package transfer device 60 (refer to FIGS. 6 and 7) is supplied to the reflective block 200, the semiconductor package 10 is placed on the reflective block 200 and positioned in position. In addition, the control unit 600 detects this through the photographing time detecting unit 300 and outputs a control signal to the side lighting apparatuses 410, 420, 430, and 440 and the image photographing apparatus 500. When a control signal from the control unit 600 is input to the side lighting fixtures 410, 420, 430, 440 and the image photographing apparatus 500, the side lighting apparatuses 410, 420, 430, 440 and the image photographing apparatus 500 are operated by the control signal. In the state where the light from the light fixtures (410, 420, 430, 440) is reflected to the reflection block 200, the image taking device 500 is to take an image through the light passing hole (100a) of the support block 100. Here, since the lead 12 of the semiconductor package 10 protrudes from the downward direction of the semiconductor package main body 11, the lead protruding from the semiconductor package main body 11 in the Z-axis direction (downward of the vertical axis in FIG. 1). The image of 12 is taken. That is, an image of a state where the leads 12 are horizontally viewed from the side is photographed. Thereafter, the image signal from the image capturing apparatus 500 is input to a separate processor (not shown). The processor receives the image signal from the image capturing apparatus 500 and processes the image to determine whether there is a lead defect. The control signal is output to an output unit (not shown) such as a display or a printer, and the output unit visually outputs an output value corresponding to the control signal from the processor. Meanwhile, the semiconductor package 10 photographed by the semiconductor package transfer device 60 is transferred to the next process, and at the same time, a new semiconductor package 10 to be photographed is supplied to the reflective block 200. Thereafter, the above operation is repeatedly performed to continuously perform lead photographing and inspection of the semiconductor package 10.

In the lead photographing apparatus for a semiconductor package according to the present invention, the light emitted from the side lighting fixtures 410, 420, 430, and 440 in a horizontal direction in the state where the semiconductor package 10 is placed on the reflective block 200, the lead of the semiconductor package 10. After the 12 is laterally reflected, it is reflected downward by the reflective surface of the reflective block 200 so as to pass through the light passing hole 100a of the support block 100 supporting the reflective block 200. In addition, since the image photographing mechanism 500 disposed below the support block 100 is photographed, the semiconductor package 10 may be freely transferred, thereby simplifying the structure of the peripheral device.

In addition, since the reflective surface of the reflective block 200 is inclined downward toward the center of the reflective block 200, foreign substances such as dust do not accumulate on the reflective surface, and thus the sharpness of the captured image by the foreign substances Deterioration is prevented.

In addition, since the reflective block 200 can be easily separated and washed or replaced, maintenance and maintenance are advantageous.

In addition, each component can be placed in close proximity for optimal imaging, and the imaging area is minimized (because the lead image on the Z axis is located inside the semiconductor package body 11), so that higher resolution imaging can be achieved. (Note that the larger the shooting area, the lower the resolution. Conventionally, the lead image on the Z axis is disposed outside the lead image viewed from the plane by the XY axis, so that the shooting area is larger than the present invention. There is nothing but).

On the other hand, the imaging device 500 may be disposed in the vertical direction to the lower portion of the support block 100, as in this embodiment, by installing a reflector 20 in the lower portion of the support block 100, It is preferable to arrange the image photographing mechanism 500 in the horizontal direction.

4B and 4C illustrate different embodiments of the reflective block 200, whereby the circumferential surface of the reflective block body 210 is formed to be inclined downward toward the center thereof so that the inclined surface 211 is provided. And a separate reflecting mirror (221, 222) is attached to this inclined surface (211).

In the case of FIG. 4B, the planar mirror 221 is used as the reflector, and in FIG. 4C, the total reflection prism 222 is used as the reflector. However, the present invention is not limited thereto, and the light in the horizontal direction is vertical. Of course, any known one that can reflect in the direction is available.

When the total reflection prism 222 is used as a reflector, as shown in FIG. 4C, the upper edge portion of the total reflection prism 222 is projected to the upper portion of the reflection block body 210, so that the semiconductor package body 11 is formed. By the upper edge portion of the total reflection prism 222 protruding to the upper portion of the reflective block body 210, while being guided to the correct position on the reflective block body 210 for photographing, to prevent movement in the horizontal direction It is preferable.

6 and 7, the upper luminaire 900, which is operated and controlled by the control unit 600, is disposed on the reflection block 200, so that light from the upper luminaire 900 is prevented. When the upper surface of the semiconductor package 10 mounted on the reflective block 200 is vertically illuminated to pass through the light passing hole 100a of the support block 100, the lead 12 of the semiconductor package 10 is passed through X · Y. You can also shoot in the axial direction.

The upper luminaire 900 is installed at a proper position in consideration of the semiconductor package transfer device 60. As shown in FIG. 6, the upper luminaire 900 of the semiconductor package transfer device 60 is disposed on the reflective block 200. The upper lighting device 900 is installed on the moving block 61 to pick up the mechanism 62a for absorbing the semiconductor package 10 supplied to the reflective block 200, and the semiconductor package discharged from the reflective block 200. The upper luminaire 900 is disposed between the pick-up mechanism 62b that absorbs 10, or as shown in FIG. 7, or an upper portion of the semiconductor package transfer device 60 disposed on the reflective block 200. The upper lighting device 900 is disposed on the upper surface of the upper lighting device 900, and the pickup mechanism 62a absorbs the semiconductor package 10 supplied to the reflective block 200 and the semiconductor package 10 discharged from the reflective block 200. Light passing hole 61a in the moving block 61 between the pick-up mechanism 62b. It may be formed.

Here, the semiconductor package transfer device 60 is a device for transferring the semiconductor package 10 seated on the reflective block 200 to the next process while supplying the semiconductor package 10 to the reflective block 200 individually. A pickup mechanism 62a for sucking the semiconductor package 10 supplied to the reflective block 200, a pickup mechanism 62b for sucking the semiconductor package 10 discharged from the reflective block 200, and these pickup mechanisms. All of the known ones having a movable block 61 supporting the 62a, 62b can be applied.

5 and 7, an input unit for inputting an image signal from the image capturing apparatus 500 to the control unit 600 to perform image processing, and also for controlling the operation of the control unit 600 ( 700 and an output unit 800 which receives the output signal from the control unit 600 and outputs it to the outside visually, is electrically connected to the control unit 600, the image processing from the image photographing mechanism 500. There is no need for a separate processor.

The input unit 700 is for setting various conditions for image processing, and all the known ones (eg, a switch, a mouse, a keyboard, etc.) that can be manually operated by an operator are available.

The output unit 800 may also use all known ones (eg, a printer, a lamp, a monitor, etc.) capable of visually displaying whether or not the lead packaged semiconductor package 10 is defective.

According to the present invention as described above, the support block is seated on the base, the reflection block is mounted on the support block and fixed, the side lighting fixture is disposed on the circumferential surface of the support block, the image recording mechanism is disposed below the support block In this state, the semiconductor package is mounted on the reflective block to be photographed, and thus, mutual interference with peripheral devices can be prevented, thereby simplifying the processing process, thereby greatly reducing the processing speed and capturing leads more precisely and clearly. And, there is an effect that the maintenance and maintenance is advantageous.

On the other hand, when the upper luminaire is disposed above the reflective block, there is an advantage that the lead shape in the XYZ axis direction can be captured as one image.

The present invention is not limited to the above embodiments, and of course, various modifications can be made without departing from the scope of the following claims.

Claims (10)

Light consisting of an outer frame 110 seated on the base 51, a mounting portion 120 on which the reflection block 200 is mounted and fixed, and a connecting portion 130 connecting the outer frame 110 and the mounting portion 120, A support block 100 having a through hole 100a; A reflection block 200 having a reflection surface for reflecting light from the lateral direction in the circumferential direction and mounted on the mounting portion 120 of the support block 100 to be fixed; A shooting time detection unit 300 which detects a shooting time point and outputs it to the control unit 600; Side lighting devices 410, 420, 430 and 440 disposed in the lateral direction of the reflection block 200 to emit light toward the center of the reflection block 200; An image photographing mechanism 500 disposed below the support block 100 to photograph an image projected through the light passing hole 100a of the support block 100; Lead photographing of a semiconductor package, comprising a control unit 600 for automatically controlling the operation of the side lighting apparatuses 410, 420, 430, 440 and the image photographing apparatus 500 by receiving an output signal from the photographing time sensing unit 300. Device. The method of claim 1, wherein the reflective block 200 is made of a metal body 210, the peripheral surface of the body 210 is formed to be inclined downward toward its center to form an inclined surface 211, Lead photographing apparatus of the semiconductor package, characterized in that the inclined surface 211 is smoothly surface-treated to form a reflective surface. The method of claim 1, wherein the peripheral surface of the main body 210 of the reflective block 200 is formed to be inclined downward toward the center thereof to form an inclined surface 211, a separate reflecting mirror is attached to the inclined surface 211 A lead photographing apparatus for a semiconductor package. 4. The apparatus of claim 3, wherein the reflector is a planar mirror (221). 4. The apparatus of claim 3, wherein the reflector is a total reflection prism (222). 6. The lead photographing apparatus of claim 5, wherein an upper edge portion of the total reflection prism (222) protrudes above the main body (210). The apparatus according to claim 1, wherein an upward luminaire (900) which is operatively controlled by the control unit (600) is disposed above the reflective block (200). According to claim 7, The upper luminaire 900 is installed on the moving block 61 of the semiconductor package transfer device 60 disposed on the reflective block 200, the supply to the reflective block 200 And a pickup mechanism 62a for absorbing the semiconductor package 10 and a pickup mechanism 62b for absorbing the semiconductor package 10 discharged from the reflective block 200. . The semiconductor package of claim 7, wherein the pick-up mechanism 62a adsorbs the semiconductor package 10 supplied to the reflective block 200, and the semiconductor package discharged from the reflective block 200. 10, a moving block 61 of the semiconductor package transfer device 60 having a pick-up mechanism 62b for absorbing 10 is installed, and an upper luminaire 900 is installed on the moving block 61. A light photographing hole 61a is formed in the movable block 61 between 62a and 62b. The input unit according to any one of claims 1 to 9, wherein an image signal from the image photographing apparatus 500 is input to the control unit 600 to be image processed, and to control the operation of the control unit 600. And the output unit 800 which receives the output signal from the control unit 600 and visually outputs the output signal from the control unit 600 is electrically connected to the control unit 600. Device.