KR200396613Y1 - Probe card and probe pin socket assembly probe card - Google Patents

Abstract

The present invention relates to an assembly of a probe pin and a probe pin socket of a vertical probe card. More specifically, the probe pin and the probe of the vertical probe card having improved durability of the probe and excellent electrical contact with the pad. Relates to an assembly of a pin socket.

According to the present invention, the probe pin insertion groove is processed according to the material of the probe pin socket buddy member. Probe pin socket buddy material is made of engineering plastic-based Ultem (PEI), Vespel (PI) and Epoxy Molding Compound (EMC) are made of slit grooves for inserting probe pins by forming socket buddy members, alumina ceramics, Silicon (Si) and quartz glass (Quartz) materials are produced by processing a probe pin insertion groove on the surface of epoxy coated by applying a certain thickness of epoxy with little heat change at high temperature on one or both sides of the probe pin socket buddy member. The pin socket buddy member selects any one material to form slit grooves at intervals of chip pad pitch, inserts the probe pins into the slit grooves, and fixes the probe pins with an adhesive. The bottom surface protrudes downward to form a printed circuit board (PCB). A probe pin socket mounted on the surface and having a probe pin for testing 4 to 6 semiconductor chips; A probe pin in which one side is circularly formed with a contact portion in which a needle is added at the center of an opening and an upper surface, a junction portion having a constant elasticity in a spring shape, and a birdie having a long hole formed in a transverse direction at the top; It consists of a vertical probe card that can test the entire semiconductor chip formed on the wafer at once by arranging the probe pin sockets in series and in parallel.

Description

Probe card and probe pin socket assembly probe card

The present invention relates to an assembly of a probe pin and a probe pin socket of a probe card, and more particularly, an assembly of a probe pin and a probe pin socket of a probe card which improves the durability of the probe and at the same time provides excellent electrical contact with the pad. It is about.

Probe cards, which are widely used for multi-chip testing, are limited in their fabrication, and a certain amount of tungsten needle combinations require needle pads due to the high force of the pads on the wafer due to the high load during wafer testing. Digging deep into the chip may damage the surface of the chip.

Cantilever probe cards using tungsten needles have probe pin flatness problems when 32 or more chips are used, or when the pitch between chips and pads is narrow. If more than six layers, the area occupied by the test head in the center of the printed circuit board becomes large, and there are many problems in manufacturing a multi-chip probe card.

In addition, the length of the tungsten needle is longer and longer depending on each layer, so that electrical characteristics such as high frequency signal transmission characteristics are inferior.

For this reason, semiconductor test companies must periodically adjust the flatness and clean the tungsten needles that make up the probe card for high yield.

In addition, probe card repair is a frequent problem, and equipment uptime is interrupted, reducing production efficiency.

Due to these problems, companies that test more than 32 chips of semiconductor devices using tungsten needles purchase more than 30% of the required quantity of probe cards and use them as spares in order to increase expensive equipment utilization.

In addition, a ceramic bar type vertical probe card requires two ceramic bars to hold one probe and three ceramic bars depending on the pad arrangement to test one (DLOC) chip.

It needs to have a thickness of three ceramic bars and two probes that fit the same width as one chip size to make a probe test head to test the chip.

In recent years, wafer testing has been launched with multi-chip wafer test equipment, and the development of design and production technology allows the entire wafer to be tested by one touch down, and the chip size is 90%, 80%, 70% step by step. In one wafer, the net die number increased from 1.5 to 2 times due to chip reduction.

A probe card made of a combination of three bars cannot cope with chip reduction when the width of the combination of three bars is larger than the chip size at the time of chip reduction.

And the vertical probe card with one test head is testing the entire wafer with 4 ~ 5 touchdowns, but the problem caused by thermal expansion is increasing as the test head size increases.

In the wafer test, the environmental test is first performed at + 25C and the second and high temperature tests are performed at the high and low temperatures (-10C to + 85C and -45C to + 125C). In the case of testing the wafer at the pad, the position of the pad changes due to the thermal expansion of the silicon wafer. However, probe cards are typically manufactured at chippad pitch intervals at + 25C.

The thermal expansion coefficient of the silicon wafer and the material of the probe card are different from each other. In the manufacture of the probe card, the probe pins are planted at pad position intervals at + 25C. The dissimilar materials with different thermal expansion coefficients cause the probe pins to contact the pads formed on the chip incorrectly, causing problems during chip testing.

In order to solve this thermal expansion problem, instead of using a single ceramic head, a test socket can be used to block the connection of several sockets, thereby distributing thermal expansion to reduce positional change.

The present invention has been proposed to solve the above problems, the present invention is to install a large number of probe pins in a small area to probe a plurality of semiconductor devices in one process probe pin and probe pin socket To provide an assembly of.

Another object of the present invention is to provide an assembly of a probe pin and a probe pin socket of a probe card that prolongs the life of the probe pin and facilitates replacement of the contact portion.

Another object of the present invention is to provide an assembly of the probe pin and the probe pin socket of the probe card to remove the test obstacles due to high heat by naturally dissipating heat generated during the high temperature test operation.

Another object of the present invention is to vertically probe the probe pin and one probe pin socket, one probe pin socket has a probe pin for testing 4 to 6 semiconductor chips, the semiconductor chip formed on the wafer area It is to provide the assembly of the probe pin and probe socket of the probe card that can test the entire wafer at once and respond to chip size reduction by mounting the entire probe pin socket to the PCB board by block connection.

The present invention for achieving the above object is formed by selecting any one of the Ultem (PEI), Vespel (PI), epoxy molding compound (EMC), alumina ceramic, silicon (Si), quartz glass (Quartz) A probe pin socket consisting of a socket bud member having a plurality of slot grooves disposed at equal intervals on the socket bud member, and a fixing protrusion mounted downwardly on a bottom surface of the socket bud member and mounted on a recess formed in a PCB substrate; It consists of a probe pin including an opening on one side and a contact point having a circular needle in the center of the upper surface, a junction portion having a constant elasticity in a spring shape, and a birdie formed with a long hole in the transverse direction at the top and a heat discharge hole in the center thereof. .

The contact portion and the junction portion of the probe pin can be changed in any direction according to the chip pad position.

In addition, one side of the buddy of the slit groove and the probe pin is configured to form a heat discharge hole.

      And the socket bud member is formed of alumina ceramic, silicon (Si), quartz glass (Quartz) of any one material to form a plurality of slit grooves at equal intervals in the coating layer coated with a certain thickness of epoxy on both sides, the The center of the slit groove is made of a configuration that the heat exhaust hole is added.

Hereinafter, the overall configuration of the present invention and specific effects obtained therefrom will be described in detail with reference to the accompanying drawings.

1 is an exploded perspective view illustrating the overall configuration of the present invention, Figure 2 is a perspective view illustrating another embodiment of the probe pin socket, Figure 3 is a longitudinal cross-sectional view of the state mounted on the PCB substrate, Figure 4 Front view illustrating a configuration state of a probe pin that is one component of the present invention.

As illustrated in FIG. 1, the overall configuration of the present invention is composed of a probe pin socket 10 and a probe pin 20.

The probe pin socket 10 is manufactured in two ways, one of which is illustrated in FIG. 1, wherein the material of the socket bud member 1 is Ultem (PEI), Vespel (PI), and epoxy molding compound. Molded to any one selected from the (EMC) and the slit groove (3a) is arranged in a vertical line on both sides.

Another method is to manufacture the slit groove (3a) as shown in Figure 2, which is the socket bud member 1 of the material of any one of alumina ceramic, silicon (Si), quartz glass (Quartz) After selecting and molding, epoxy is applied to both sides to a certain thickness to form a coating layer 3, and the slit grooves 3a are processed on the surface of the coating layer 3.

In addition, the bottom of the socket bud member (1) is a fixed projection (5) extending to the outside is added, the bottom of the fixing projection (5) is formed with fastening holes (5a) at equal intervals.

The fixing protrusion 5 is inserted into the recess 30a formed in the PCB board 30 and then fixedly mounted by screwing the bolt 9 at the bottom of the PCB board 30.

In addition, a plurality of slit grooves 3a for inserting the probe pins 20 in a vertical line are formed in the coating layer 3 at equal intervals.

The cross section selected as the probe pin socket is made by inserting the probe pin by inserting the probe pin according to the thickness of the probe pin and the pitch of the chip pad pitch, or by using epoxy with no heat deformation at low and high temperatures (-45C to + 125C). It can be produced by applying to the end face or both sides of the socket bud member 1, and to arrange the surface of the coating layer 3 in accordance with the chip pad spacing to the slot groove (3a).

In addition, a heat discharge hole 7 having a predetermined size is formed in the center of the slot groove 3a formed on both sides of the probe pin socket 10 to form a passage such as a heat discharge hole 12b formed in the probe pin 20. It is to be discharged to the outside.

The probe pin 20 coupled to the slot grooves 3a formed at equal intervals on the coating layer 3 is a metal plate having excellent electrical conductivity, which is a large number of probes by etching berylnium copper, inva, rhenium tungsten. The pin 20 is formed at a time and mass produced.

The probe pin 20 is a buddy 12, the contact portion 14 and the bonding portion 16 is formed integrally on the top of the buddy 12, which is manufactured by the etching process.

The outer surface of the birdie 12 is gold plated on the outer surface to prevent corrosion (oxidation), the upper part 12a is formed in the transverse direction in order to easily and quickly replace the contact portion 14 The inner side is formed with a heat discharge hole (12b) cut larger than the depth of the slot groove (3a) to facilitate the heat to be discharged to the outside.

The contact portion 14 is a circular structure in which one side of the opening portion 14a and a needle 14b is added, and the circular shape has a constant elasticity, so that the prober chuck operates up and down when testing the wafer. When the probe pin 20 presses the wafer chip pad and distributes the force received in a circular shape, the probe pin 20 is not bent or broken, and the scrubbing depth is stably touched when the contact is made, and a scrubbing mark is provided. Will be taken smaller.

In addition, the joint 16 located below the buddy 12 has a spring structure, and the reason for adopting the spring structure is that the test socket is placed in the lower socket frame when the pad is located at the center of the PCB board 30. Since the upper part of the probe pin 20 in which the PCB board 30 is aligned with the pad of the center part is thermally deformed, the pads are arranged long and vertically when the position is changed. The contact area can be matched and the PCB and fastening bolts are adjusted by the flat adjustment torque bolts, and the lower part of the probe card has a spring structure to prevent lifting from the pad next to the probe pin socket in the center of the PCB. At the time of locking, since the contact portion 14 positioned on the upper portion of the probe card is elastically provided, fine adjustment is possible so as not to be detached from the pad.

As shown in FIG. 4, the upper and lower structures of the probe pin 20 may be changed in eight different forms depending on the positions of the semiconductor chip pads disposed on the wafer. Even if the position of the junction and the junction part 16 is changed, the effect obtained from this is the same.

The present invention configured as described above is to insert the probe pin 20 into the slot groove (3a) formed in the coating layer (3) applied to both sides of the probe pin socket 10 to be fixed with an adhesive.

As described above, the probe pin socket 10 in which the probe pin 20 is disposed is seated in the groove 30a formed in the PCB board 30, and then the bolt 9 is fastened to the probe pin at the bottom of the PCB board 30. The socket 10 and the PCB board 30 will be integrally coupled.

In this way, by arranging a plurality of probe pin sockets 10 on the PCB substrate 30, it is possible to simultaneously inspect a plurality of semiconductor devices in one operation.

Heat generated during the inspection is discharged through the heat discharge hole (12b) formed in the buddy 12 can block the obstacles of the test due to high heat, and also by changing the structure of the contact portion 14 and the junction 16 the probe pin When the durability of the 20 and the damage of the contact portion 14 are generated at the same time, it is possible to easily cut by the long hole 12a added to the upper portion of the buddy 12 so that the replacement operation is very simple. .

As described above, according to the present invention, by changing the structure of the socket, it can be stably installed on the PCB board, and by changing the structure of the probe pins, the durability can be extended and the life can be extended, and the interworking work of the contact is quick. It is a useful design that can be done easily.

1 is an exploded perspective view illustrating the overall configuration of the present invention

2 is a perspective view illustrating another embodiment of the probe pin socket

Figure 3 is a longitudinal cross-sectional view of the present state mounted on the PCB substrate

4 is a front view illustrating a configuration state of a probe pin that is one component of the present invention;

<Description of the symbols for the main parts of the drawings>

One… Socket bud member 3.. Coating layer 3a... Slit groove 5... Fixing protrusion

10... Probe pin socket 12.. Body 12a... Long 14. Contact

16... Junction 18... Heat exhaust hole 20.. Probe pin 30... PCB board

30a... Groove

Claims (4)

Select one of Ultem (PEI), Vespel (PI), Epoxy Molding Compound (EMC), Alumina Ceramic, Silicon (Si), and Quartz Glass (Quartz) to form multiple slot grooves on both sides at equal intervals. A probe pin socket composed of a socket bud member and a fixing protrusion which protrudes downward on a bottom surface of the socket bud member and is mounted in a recess formed in a PCB substrate; It consists of a probe pin comprising a circular contact portion having a circular needle in the center of the opening and one side of the upper side, a junction portion having a constant elasticity in a spring shape, and a birdie formed with a long hole in the transverse direction at the top and a heat discharge hole in the center thereof. Assembly of the probe pin and the probe pin socket of the probe card. The assembly of the probe pin and the probe pin socket of the probe card according to claim 1, wherein the contact part and the junction part of the probe pin can be changed in an arbitrary direction according to the chip pad position. The assembly of the probe pin and the probe pin socket of the probe card, characterized in that the heat discharge hole is formed on one side of the buddy of the slit groove and the probe pin. The method of claim 1, wherein the socket bud member is formed of alumina ceramic, silicon (Si), quartz glass (Quartz) made of any one material and a plurality of slit grooves at equal intervals on the coating layer coated with a certain thickness of epoxy on both sides The assembly of the probe pin socket of the probe card, characterized in that formed in the center of the slit groove, the heat discharge hole is added to the configuration.