KR200343988Y1 - a socket for testing semiconductor - Google Patents

Abstract

The present invention relates to a socket for a semiconductor inspection, a plurality of lower probe coupling holes 111 are formed at equal intervals along the length direction through the top and bottom on one side and the lower flow prevention jaw (111a) on the lower side, The lower bolt coupling hole 112 is formed on both left and right ends thereof, and the lower base plate 110 protrudes upward from the lower bolt coupling hole 112. A lower surface of the lower base plate 110 is formed in the recess along the longitudinal direction and extends to a lower portion of the lower base plate lower bolt coupling hole 112; One side is formed through the intermediate probe coupling hole 131 communicated with the lower probe coupling hole 111 of the lower base plate, the other side is the upper bolt coupling hole 132 communicated with the lower bolt coupling hole 112 An upper base plate 130 having a through hole formed therein and having a coupling hole 133 into which the coupling pin 113 is inserted; A lower base plate accommodating protrusion 140 formed to protrude from one lower end portion and left and right end portions of the upper base plate 130 so as to contact one end surface and left and right end surfaces of the lower base plate 110 on an inner side thereof; A housing 150 protruding from an upper surface of the upper base plate 130 by having an upper probe coupling hole 151 communicating with the intermediate probe coupling hole 131 of the upper base plate and having an upper flow preventing jaw 151a formed thereon. )and; In accordance with the technical gist, the base circuit board and the socket guide are assembled and installed to form a socket device. Easy to manufacture and assemble, compatible with the arrangement and number of base circuit boards or semiconductor chips, and if damage occurs on the contact terminal, it can be easily replaced and installed on the base circuit board and socket guide, causing almost no damage. The present invention relates to a socket for semiconductor inspection of a structure that can prevent unnecessary consumption of components that are not used.

Description

Socket socket for semiconductor testing {a socket for testing semiconductor}

The present invention relates to a socket hole for semiconductor inspection, and more particularly, to a socket hole that is assembled to the base circuit board and the socket guide to form a socket device, the lower base plate and the upper base plate to insert the probe It relates to a semiconductor inspection socket device having a bifurcated structure and formed with various protrusions and grooves of the base circuit board and the socket guide and a structure suitable for mutual coupling between the upper and lower base plates.

In general, a printed circuit board (PCB) is an electronic component in which a plurality of chips, which are small pieces of a semiconductor, are mounted on a plate surface and these chips are connected by a connection bus formed on the plate surface. Each of these chips can perform various functions, and electrical signals can be transmitted to each chip through a bus. A chip made of such a high density integrated circuit board is a high density integrated micro chip, and the micro chip is mounted on an electronic product to play an important role in determining the performance of the product.

Therefore, it is necessary to inspect by the inspection apparatus to confirm whether the semiconductor or the microchip of the electronic product is in a normal state. In order to perform such an inspection, an inspection probe device is employed, and a plurality of inspection probe devices are mounted and used in an inspection socket device.

As a prior art, a brief description will be made of the chip inspection socket device of Utility Model Registration No. 264548, which is the subject innovation of the present invention. 1 is a perspective view of the chip inspection socket device.

The socket device is installed on the base circuit board, the lower base plate 100 is formed in the longitudinal direction of the probe bottom rod 101 is formed in the longitudinal direction and the flow prevention jaw 150 in the lower direction; An alignment pin 110 formed on an upper surface of the lower base plate 100; The coupling hole is formed from the lower side to the upper side is inserted and coupled to the alignment pin 110 is coupled to the upper surface of the lower base plate 100, the probe coupling to communicate with the probe coupling hole 101 of the lower base plate 100 Ball base 101 is formed at equal intervals, the upper base plate 120 formed with a flow preventing jaw 150 in the upper direction in the probe coupling hole 101; A probe 130 inserted into the communication probe coupling hole 101 of the lower base plate 100 and the upper base plate 120 and having a flow pin 131 elastically moving up and down at both ends; A housing which is formed integrally with the upper base plate 120 so as to protrude from the upper surface of the upper base plate 120 and communicates with the probe coupling hole 101 is formed to support the adjacent end portion of the probe 130. It has a structure consisting of 140.

The socket device is intended to improve the reliability of the inspection and to reduce the damage of the chip inspection terminal by the fluid flow of the probe in the chip inspection, evenly contacted by a certain flow, but this is to improve the contact quality of the socket device itself As a result, it is not possible to completely prevent damage to the contact terminals caused by repeated impacts.

The chip inspection socket is a consumable which is mainly replaced by damage to a probe or the like that comes into contact with the chip. The socket device of the above structure has the upper and lower base plates that accommodate the probe when the probe is damaged. Since the socket device itself, including 120 and 100, is replaced and reinstalled on the base circuit board, unnecessary consumption occurs in the components other than the contact portion, and the socket device itself is separately prepared according to the arrangement and number of base circuit boards or chips. Since each of the socket devices must be manufactured and are incompatible with each other, there is a need for improvement to a prefabricated socket structure in which a contact terminal portion and other components that are hardly damaged are distinguished and each component can have mutual compatibility.

The present invention devised to solve the above problems, an object of the present invention is to provide a socket assembly for semiconductor inspection of the structure capable of forming one socket device by being assembled to the base circuit board and the socket guide.

Another object of the present invention is to provide a socket hole for semiconductor inspection, which is easy to manufacture and assemble and which is compatible with the arrangement and number of base circuit boards or chips.

In addition, if damage occurs in the contact terminal portion can be easily replaced on the base circuit board and the socket guide to provide a socket for the semiconductor inspection socket that can prevent unnecessary consumption of components that rarely cause damage for other purposes. do.

1-a perspective view of a semiconductor inspection probe according to the prior art.

Figure 2-perspective view showing a state in which the socket for semiconductor inspection according to the present invention is installed.

Figure 3-perspective view of the semiconductor inspection socket sphere according to the present invention from above.

Figure 4-perspective view of the semiconductor socket for testing according to the present invention from the bottom.

5 is a front sectional view of a socket for semiconductor inspection according to the present invention.

6 is a side cross-sectional view of a socket for semiconductor inspection according to the present invention.

<Description of Major Symbols Used in Drawings>

100: socket hole 110: lower base plate

111: lower probe coupling hole 111a: lower flow prevention jaw

112: lower bolt coupling hole 113: coupling pin

120: board fitting groove 130: upper base plate

131: intermediate probe coupling hole 132: upper bolt coupling hole

133: coupling hole 140: lower base plate receiving protrusion

150: housing 151: upper probe coupling hole

151a: upper flow prevention jaw 160: guide alignment projection

170: probe 200: socket guide

300: base circuit board

The present invention for achieving the above object, a plurality of lower probe coupling holes 111 having a lower flow preventing jaw (111a) is provided at one side through the top and bottom at the same interval along the longitudinal direction, the other side Lower bolt coupling holes 112 are formed at both left and right ends thereof, and a lower base plate 110 having a coupling pin 113 protruding upward from the lower bolt coupling hole 112 in the middle; A lower surface of the lower base plate 110 is formed in the recess along the longitudinal direction and extends to a lower portion of the lower base plate lower bolt coupling hole 112; One side is formed through the intermediate probe coupling hole 131 communicated with the lower probe coupling hole 111 of the lower base plate, the other side is the upper bolt coupling hole 132 communicated with the lower bolt coupling hole 112 An upper base plate 130 having a through hole formed therein and having a coupling hole 133 into which the coupling pin 113 is inserted; A lower base plate accommodating protrusion 140 formed to protrude from one lower end portion and left and right end portions of the upper base plate 130 so as to contact one end surface and left and right end surfaces of the lower base plate 110 on an inner side thereof; A housing 150 protruding from an upper surface of the upper base plate 130 by having an upper probe coupling hole 151 communicating with the intermediate probe coupling hole 131 of the upper base plate and having an upper flow preventing jaw 151a formed thereon. )and; The technical test of the semiconductor inspection socket hole 100, including; guide alignment protrusions 160 protruding from the upper surface of the upper base plate 130 to the left and right sides of the housing 150.

Here, the lower base plate 110, it is preferable that the left and right both ends of the other side formed with the lower bolt coupling hole 112 is formed recessed inward.

In addition, the upper, middle and lower probe coupling holes (151, 131, 111) formed in communication, it is preferable that the probe 170 is provided with a flow pin that is elastically up and down flows at both ends.

Therefore, there is an advantage that one socket device can be formed by being assembled to the base circuit board and the socket guide.

In addition, there is another advantage that it is easy to fabricate and assemble and is compatible with the arrangement and number of base circuit boards or chips.

In addition, when damage occurs in the contact terminal portion, it is possible to simply replace and install on the base circuit board and the socket guide, there is another advantage that it is possible to prevent unnecessary consumption of the components that rarely cause damage.

The present invention having the configuration as described above will be described in detail with reference to the following drawings. Figure 2 is a perspective view showing a semiconductor inspection socket sphere is installed according to the present invention, Figures 3 and 4 are a perspective view of the semiconductor inspection socket sphere according to the present invention from the top, bottom, respectively, Figure 5 is the present invention It is a front sectional view of a socket for semiconductor inspection according to the invention, Figure 6 is a side sectional view of a socket for semiconductor inspection according to the present invention.

The socket opening 100 for semiconductor inspection according to the present invention includes a lower base plate 110, a board fitting groove 120, an upper base plate 130, a lower base plate accommodation protrusion 140, and a housing 150. ), A guide alignment protrusion 160, and the probe 170.

The lower base plate 110 and the upper base plate 130 are divided to be coupled and separated from each other, the board alignment groove 120 is the lower base plate for installation on the base circuit board 300 It is a coupling element formed in the 110, the lower base plate receiving protrusion 140, the housing 150, the guide alignment projection 160 for the installation on the lower base plate 110 and the socket guide 200 It is a coupling element formed on the upper base plate 130.

The base circuit board 300 and the socket guide 200 are components that form one socket device by being combined with the socket for socket 100 for semiconductor inspection according to the present invention, as shown in FIG. The socket for the semiconductor inspection socket 100 according to the present invention is bolted to the upper surface of the substrate 300 and the socket guide 200 is bound to the base circuit board 300 at the socket sphere 100 by the socket. The sphere 100 is fixedly installed between the base circuit board 300 and the socket guide 200.

In the embodiment shown in FIG. 1, the base circuit board 300 has a structure for inspecting four chip terminals arranged in two rows and two rows, and the socket hole 100 is connected to the base circuit board 300. Each of the four rectangular through holes formed at the front and rear ends thereof is coupled to the base circuit board 300 by the socket guide 200 having a shape corresponding to the top surface of the base circuit board 300, thereby providing the socket holes ( 100, the socket guide 200, the base circuit board 300 is stably bound to each other to form one socket device.

When the base circuit board 300 and the socket guide 200 are manufactured to inspect the chip terminal having a different arrangement or number than the above, the socket hole 100 is arranged in the arrangement of the connection protrusions forming the chip terminal. If there is no change in size, the same structure as described above may be applied, and thus the base circuit board 300 and the socket guide 200 or the arrangement and number of chips may be compatible.

Since the base circuit board 300 and the socket guide 200 are components that hardly cause damage due to repetitive impact, and the socket holes 100 are components corresponding to the contact terminal portions where the damage is mainly generated, If damage occurs in the terminal part, the socket hole 100 is simply replaced and installed on the base circuit board 300 and the socket guide 200 to selectively eliminate unnecessary consumption of a component that hardly causes damage that has occurred. Can be prevented.

First, the lower base plate 110 will be described.

The lower base plate 110 is formed in a substantially horizontal plate shape is installed on the upper surface of the base circuit board 300, the lower probe coupling hole 111 is formed in the front side, the lower bolt coupling hole ( 112 is formed, the coupling pin 113 is formed in the middle.

The lower probe coupling hole 111 is formed at equal intervals along the longitudinal direction of the lower base plate on the front side of the lower base plate 110, the upper and lower so that the lower probe 170 can be inserted in a standing state The lower flow preventing jaw (111a) which is the limit of movement to the lower side when the probe 170 is inserted into the inner side is formed in the through shape.

The lower bolt coupling holes 112 are formed in pairs at the rear left and right ends of the lower base plate 110 and penetrate uniaxially to each of the pair of bolts to be fixed on the base circuit board 300. It is formed in communication with and corresponding to a pair of bolt coupling holes formed on the base circuit board 300.

The coupling pin 113 is formed in a pair of left and right inside the lower bolt coupling hole 112 in the middle of the lower base plate 110, predetermined from the lower side of the upper base plate 130 (described below) to the upper side. Protruding upward to be inserted into the coupling hole 133 formed by the depth.

The lower base plate 110 is formed by recessing the left and right ends of the rear portion inwardly to form a gap having a height difference with the lower surface of the upper base plate 130 when assembled with the upper base plate 130. By using the upper base plate 130 (described below) to facilitate assembly and disassembly.

The lower base plate 110 is formed at the lower end of the lower side of the lower surface of the board is fitted with a board alignment groove 120 for precise positioning when combined with the base circuit board 300, the board alignment groove 120 is the lower base plate It is formed over the entire rear end of the 110 and extended forward to include the lower bolt coupling hole 112, the outer portion of the bolt coupling hole of the base circuit board 300 protruding upwards is sandwiched and continuously The end of the through-hole forming a straight path is caught and the board alignment groove 120 and the base circuit board 300 are aligned.

The upper base plate 130 is a component that is coupled to the upper surface of the lower base plate 110 has a rectangular flat plate shape corresponding to the upper surface of the lower base plate 110, the lower probe coupling hole 111 of the lower base plate ), The lower bolt coupling hole 112, the coupling pin 113, the intermediate probe coupling hole 131, the upper bolt coupling hole 132, the coupling hole 133, respectively.

The intermediate probe coupling hole 131 is formed on the front side of the upper base plate 130 so as to communicate with the plurality of lower probe coupling holes 111 formed in the lower base plate 110, the probe in a standing state (170) It has a shape penetrated up and down so that the middle portion can be inserted.

The upper bolt coupling hole 132 communicates with the lower bolt coupling hole 112 of the lower base plate so as to pass through the bolt together with the lower bolt coupling hole 112 to be coupled on the base circuit board 300. It is formed in pairs at the rear left and right both ends of the upper base plate 130 which is a position.

The coupling hole 133 is formed to a depth corresponding to the height of the coupling pin 113 in the middle portion of the upper base plate 130 so that the coupling pin 113 of the lower base plate is inserted and coupled, the As the insertion pin 113 is inserted into and aligned with the lower base plate 110 and the upper base plate 130.

The lower base plate accommodation protrusion 140 protrudes downward from the front lower end and left and right ends of the upper base plate 130 so that the lower base plate 130 is in contact with the lower surface of the upper base plate 130. At the same time the front and left and right both sides are in contact with the inner surface of the lower base plate receiving protrusion 140.

The lower base plate receiving protrusion 140 has an open rear shape, and the upper base plate 130 is coupled to the upper base plate 130 when the lower base plate 110 is coupled with the gap formed at the rear left and right ends thereof. , Assembly and dismantle the lower base plate (130, 110).

The housing 150 is formed to protrude integrally with the upper base plate 130 on the upper surface of the upper base plate 130, the intermediate probe coupling of the lower probe coupling hole 111 and the upper base plate of the lower base plate The upper probe coupling hole 151 is formed in communication with the ball 131, the upper limit of the upper probe coupling hole 151 when the upper portion of the probe 170 is inserted into the upper limit of the movement of the probe 170 An upper flow preventing jaw 151a is formed.

When the probe 170 is inserted into the probe coupling holes 111, 131, and 151 formed in the lower base plate 110, the upper base plate 130, and the housing 150, upper and lower portions of the probe 170 are provided. The flow pin portion provided is projected upward and downward through the upper probe coupling hole 151 and the lower probe coupling hole 111, respectively, and is caught by the upper and lower flow preventing jaws 151a and 111a. The stepless separation of the upper and lower sides of 170 is prevented, and supports the probe 170 which is pressed under the upper and lower sides.

A guide alignment protrusion 160 protrudes from the upper side of the upper base plate 130 to the left and right sides of the housing 150 located at the front side, and the socket guide 200 is fitted to the guide alignment protrusion 160. As coupled to the upper surface of the circuit board 300, the socket sphere 100 according to the present invention is coupled on the base circuit board 300 through the bolt coupling holes (132, 112) of the upper and lower base plate The socket guide 200 fitted to the guide alignment protrusion 160 is in close contact with the base circuit board 300 to be stably coupled at both rear and front sides.

The probes 170 inserted into the upper, middle, and lower probe coupling holes 151, 131, and 111 formed in communication are formed at both ends of the cylindrical body portion having the upper and lower openings and both ends of the body portion, and are fixed up and down by the elastic force of the spring. It consists of a flow pin which is flowed, the one side of the flow pin is connected to the connection terminal of the base circuit board and the other side of the flow pin is connected to the chip connection terminal to be inspected.

The probe 170 is equalized between the probe 170 and the chip, the chip and the base circuit board 300 by the flow pin is elastically moved up and down by the connection pressure when the chip is in contact with the chip for inspection of the semiconductor. One connection is made.

The present invention by the configuration as described above, there is an effect that one socket device can be formed by being assembled to the base circuit board and the socket guide.

In addition, there is another effect that it is easy to fabricate and assemble and is compatible with the arrangement and number of base circuit boards or chips.

In addition, when damage occurs in the contact terminal portion, it is possible to simply replace and install on the base circuit board and the socket guide, there is another effect that it is possible to prevent unnecessary consumption of the components that rarely cause damage.

Claims (3)

One side of the plurality of lower probe coupling holes 111 are formed at equal intervals along the longitudinal direction, and the lower side of the coupling hole 111 is provided with a lower flow preventing jaw (111a) on the lower side, the lower bolt coupling holes 112 on the left and right ends It is formed in the middle, the lower base plate 110 is formed with a coupling pin 113 protruding upward in the lower bolt coupling hole 112; A lower surface of the lower base plate 110 is formed in the recess along the longitudinal direction and extends to a lower portion of the lower base plate lower bolt coupling hole 112; One side is formed through the intermediate probe coupling hole 131 communicated with the lower probe coupling hole 111 of the lower base plate, the other side is the upper bolt coupling hole 132 communicated with the lower bolt coupling hole 112 An upper base plate 130 having a through hole formed therein and having a coupling hole 133 into which the coupling pin 113 is inserted; A lower base plate accommodating protrusion 140 formed to protrude from one lower end portion and left and right end portions of the upper base plate 130 so as to contact one end surface and left and right end surfaces of the lower base plate 110 on an inner side thereof; A housing 150 protruding from an upper surface of the upper base plate 130 by having an upper probe coupling hole 151 communicating with the intermediate probe coupling hole 131 of the upper base plate and having an upper flow preventing jaw 151a formed thereon. )and; And a guide fitting protrusion (160) protruding from the upper surface of the upper base plate (130) to the left and right sides of the housing (150). The method of claim 1, wherein the lower base plate 110, The socket opening for semiconductor inspection 100, characterized in that the left side bolts formed in the lower bolt coupling hole 112 is recessed inward. The method of claim 1, wherein the upper, middle, lower probe coupling holes (151, 131, 111) formed in communication, A socket 100 for semiconductor inspection, characterized in that the probe 170 is provided with a flow pin that is elastically up and down flows at both ends.