KR20030068725A - Method for manufacturing liquid crystal display device - Google Patents

Abstract

PURPOSE: A method for manufacturing a liquid crystal display is provided to reduce time required for a process before joining two substrates, efficiently operate the production line, and prevent a sealant from being contaminated by particles. CONSTITUTION: A second glass substrate on which a sealant is applied is cleaned to remove particles(31S). The second substrate is fixed on an upper stage of a vacuum joining chamber(32S). A first substrate on which liquid crystal is dropped is fixed on a lower stage of the vacuum joining chamber(33S). A glass receiver is placed under the second glass substrate(34S). The vacuum joining chamber is vacuumed(35S). The upper and lower stages fix the first and second glass substrates by an ESC(Electric Static Charge)(36S). The glass receiver is returned to the original position(37S). The upper stage is descended to press the first and second glass substrates to join the first and second glass substrates together(38S). Clean dry air is supplied to the vacuum joining chamber to vent the vacuum joining chamber(39S). The pressed glass substrates are unloaded(40S).

Description

Method for manufacturing liquid crystal display device

The present invention relates to a method for manufacturing a liquid crystal display device, and more particularly, to a method for manufacturing a liquid crystal display device of a liquid crystal dropping method.

As the information society develops, the demand for display devices is increasing in various forms, and in recent years, the LCD (Lipuid Crystal Display Device), PDP (Plasma Display Panel), ELD (Electro Luminescent Display), and VFD (Vacuum Fluorescent) Various flat panel display devices such as displays have been studied, and some of them are already used as display devices in various devices.

Among them, LCD is the most widely used as the substitute for CRT (Cathode Ray Tube) for mobile image display because of its excellent image quality, light weight, thinness, and low power consumption. In addition to the use of the present invention, a variety of applications such as a television, a computer monitor, and the like for receiving and displaying broadcast signals have been developed.

As described above, although various technical advances have been made in order for a liquid crystal display device to serve as a screen display device in various fields, the task of improving the image quality as a screen display device is often arranged with the above characteristics and advantages. . Therefore, in order to use a liquid crystal display device in various parts as a general screen display device, the key to development is how much high definition images such as high definition, high brightness, and large area can be realized while maintaining the characteristics of light weight, thinness, and low power consumption. It can be said.

Such a liquid crystal display may be largely divided into a liquid crystal panel displaying an image and a driving unit for applying a driving signal to the liquid crystal panel, wherein the liquid crystal panel has a predetermined space and is bonded to the first and second glass substrates. And a liquid crystal layer injected between the first and second glass substrates.

Here, the first glass substrate (TFT array substrate) includes a plurality of gate lines arranged in one direction at a predetermined interval, a plurality of data lines arranged at regular intervals in a direction perpendicular to the gate lines, A plurality of thin film transistors which are switched by a plurality of pixel electrodes formed in a matrix form in each pixel region defined by crossing gate lines and data lines and signals of the gate lines to transfer the signals of the data lines to the pixel electrodes. Is formed.

The second glass substrate (color filter substrate) includes a black matrix layer for blocking light in portions other than the pixel region, an R, G and B color filter layer for expressing color colors, and a common electrode for implementing an image. Is formed.

The first and second substrates are bonded to each other by a seal material having a predetermined space by a spacer and having a liquid crystal injection hole, so that the liquid crystal is injected between the two substrates.

In this case, in the liquid crystal injection method, when the liquid crystal injection hole is immersed in the liquid crystal liquid by maintaining the vacuum state between the two substrates bonded by the real material, love is injected between the two substrates by the osmotic phenomenon. When the liquid crystal is injected as described above, the liquid crystal injection hole is sealed with a sealing material.

However, the manufacturing method of such a liquid crystal injection type liquid crystal display device has the following problems.

First, after cutting into a unit panel, the liquid crystal injection hole is immersed in the liquid crystal liquid by maintaining the vacuum state between the two substrates, so that the liquid crystal injection takes a lot of time, the productivity is reduced.

Second, in the case of manufacturing a large-area liquid crystal display device, when the liquid crystal is injected by the liquid crystal injection method, the liquid crystal is not completely injected into the panel, which causes a defect.

Third, since the process is complicated and time-consuming as described above, several liquid crystal injection equipment is required, which requires a lot of space.

Therefore, in recent years, the manufacturing method of the liquid crystal display device using the method of dropping a liquid crystal is researched. Among them, Japanese Unexamined Patent Application Publication No. 2000-147528 discloses a technique using the following liquid crystal dropping method.

The manufacturing method of the conventional liquid crystal display device using the liquid crystal dropping method is as follows.

1A to 2E are cross-sectional views of a liquid crystal display device according to a conventional liquid crystal dropping method.

As shown in FIG. 1A, an ultraviolet curable material 1 is applied to the first glass substrate 3 on which the thin film transistor array is formed to have a thickness of about 30 μm, and the liquid crystal 2 is disposed inside the material 1 (a thin film transistor array). Dropping At this time, the real material 3 is formed without a liquid crystal injection hole.

The first glass substrate 3 as described above is mounted on the table 4 in the vacuum container C that is movable in the horizontal direction, and the entire lower surface of the first glass substrate 3 is mounted on the first adsorption mechanism 5. ) By vacuum adsorption.

As shown in Fig. 1B, the entire lower surface of the second glass substrate 6 on which the color filter array is formed is vacuum-adsorbed and fixed by the second adsorption mechanism 7, and the vacuum vessel C is closed and vacuumed. Then, the second adsorption mechanism 7 is lowered in the vertical direction so that the distance between the first glass substrate 3 and the second glass substrate 6 is 1 mm, and the first glass substrate 3 is mounted. The table 4 is moved in the horizontal direction to preliminarily position the first glass substrate 3 and the second glass substrate 6.

As shown in FIG. 1C, the second adsorption mechanism 7 is lowered in the vertical direction to bring the second glass substrate 6 into contact with the liquid crystal 2 or the actual material 1.

As shown in FIG. 1D, the table 4 on which the first glass substrate 3 is mounted is moved in the horizontal direction to adjust the position of the first glass substrate 3 and the second glass substrate 6.

As shown in FIG. 1E, the second adsorption mechanism 7 is lowered in the vertical direction to bond the second glass substrate 6 to the first glass substrate 3 through the actual material 1, and to press to 5 μm. .

As shown in FIG. 1F, the bonded first and second glass substrates 3 and 6 are taken out of the vacuum container C, and the ultraviolet rays are irradiated to the actual substance 1 to cure the actual substance 1 to provide a liquid crystal display device. Complete

However, the conventional method of manufacturing the liquid crystal display device of the liquid crystal dropping method has the following problems.

First, since the actual material is formed on the same substrate and the liquid crystal is dropped, the process time until joining the two substrates takes a lot.

Second, since a real material is applied to the first substrate and liquid crystal is dropped, but no process is performed on the second substrate, an unbalance occurs between the processes of the first substrate and the second substrate, thereby efficiently operating the production line. Difficult to do

Third, since the substance is applied to the first substrate and the liquid crystal is dropped, the substrate to which the substance is applied cannot be cleaned by the cleaning equipment USC before bonding. Therefore, it is not possible to wash the material to which the upper and lower substrates are bonded, so that the particles cannot be removed, resulting in the actual contact failure during the bonding.

Fourth, the bonding of the two substrates is bonded only by the physical force of the table and the second adsorption mechanism, so if the horizontality of the table and the second adsorption mechanism is not correct, no uniform pressure is applied to the entire substrate, resulting in poor adhesion. May occur.

Fifth, when the vacuum container is brought to atmospheric pressure after bonding, air is introduced, which may cause a poor state of the vacuum container due to moisture contained in the air.

The present invention has been made to solve the above problems, and an object thereof is to provide a method for manufacturing a liquid crystal display device of a liquid crystal dropping method which can shorten the process time and pressurize the substrate at a uniform pressure to improve productivity.

1A to 1F are schematic cross-sectional views showing a conventional liquid crystal display method of a liquid crystal display device.

2a to 2e are schematic cross-sectional views showing a liquid crystal display device process of the liquid crystal dropping method according to the present invention.

3 is a bonding process flow chart according to the present invention

Explanation of symbols for the main parts of the drawings

10 vacuum vacuum chamber 11, 13 glass substrate

12: liquid crystal 14: real

15: upper stage 16: lower stage

According to an aspect of the present invention, there is provided a method of manufacturing a liquid crystal display device, including the steps of loading a first substrate and a second substrate into a polymerizer chamber, bonding the first and second substrates together; Venting the presser chamber to pressurize the two bonded substrates; and unloading the pressurized first and second substrates.

Here, the step of loading, the step of adsorbing the first substrate and the second substrate to the lower and upper stages in the adapter chamber, the substrate receiver of the adapter is located below the second substrate fixed to the upper stage And a step of fixing the first and second substrates by the electrostatic adsorption method, respectively.

In the step of bonding, the pressure is preferably changed in at least two stages to be bonded.

Preferably, the step of venting the adapter chamber includes a step of raising the upper stage of the adapter and a step of injecting gas or dry air into the adapter chamber.

The process of venting the combiner chamber preferably injects gas or dry air into the combiner chamber before starting the rise of the upper stage of the combiner and before completion of the rise.

In the method of injecting gas or dry air into the adapter chamber, it is preferable to inject through the upper surface of the adapter chamber.

Preferably, the gas or dry air is injected through the upper stage at the same time as it is injected through the upper surface in the adapter chamber.

The method of injecting gas or dry air into the adapter chamber is preferably injected through the lower surface of the adapter chamber.

Preferably, the gas or dry air is injected through the upper stage while simultaneously injecting through the lower surface of the adapter chamber.

The gas is preferably injected with N ₂ gas.

It is preferable to further add a step of fixing the substrate to the lower stage of the chamber before the gas or dry air injection.

In the venting of the adapter chamber, gas or dry air is preferably injected into the adapter chamber in two stages.

In the unloading process, it is preferable to load at least one of the first substrate or the second substrate to be subjected to the next bonding process to the upper or lower stage and to unload the bonded substrate.

Hereinafter, a method of manufacturing a liquid crystal display device according to the present invention having such a feature will be described in detail with reference to the accompanying drawings.

2A to 2F are schematic cross-sectional views showing the process of the liquid crystal display device according to the present invention.

2A, the liquid crystal 12 is dripped at the 1st glass substrate 11, and the real material 14 is formed in the 2nd glass substrate 13. As shown in FIG. Here, a plurality of panels are designed on one of the first and second glass substrates 11 and 13 to form a thin film transistor array on each panel, and on the remaining substrates, a plurality of panels are designed to correspond to each panel. As a result, a color filter array including a black matrix layer, a color filter layer, a common electrode, and the like is formed in each panel. For ease of explanation, the substrate on which the thin film transistor array is formed is called a first glass substrate 11, and the substrate on which a color filter array is formed is called a second glass substrate 13.

Here, the bonding process is described in more detail as follows.

3 is a flowchart illustrating a bonding process of the liquid crystal display according to the present invention.

In the bonding process according to the present invention, a process of loading a first substrate onto which a liquid crystal is dropped and a second substrate on which a substance is applied to a combiner chamber, a process of bonding the two substrates, and venting the combiner chamber It may be divided into a process of pressing two bonded substrates, and a process of unloading the two pressurized substrates from the vacuum bonder chamber.

First, before loading, the second glass substrate 13 coated with the actual material may be cleaned in an Ultra Sonic Cleaner (USC) to remove particles generated during the process. That is, since the liquid crystal is not dripped but the actual material is apply | coated to the 2nd glass substrate 13, cleaning is possible.

Then, the loading step is fixed to the upper stage 15 of the vacuum adapter chamber 10 by vacuum adsorption so that the portion to which the sealant 14 is applied is directed downward as shown in FIG. 2B (32S). ) And the first glass substrate 11 on which the liquid crystal 12 is dropped is fixed to the lower stage 16 of the vacuum bonding chamber 10 by a vacuum suction method (33S). At this time, the vacuum adapter chamber 10 maintains the standby state.

Specifically, the second glass substrate 11 moves the second glass substrate 11 so that the loader of the robot (not shown in the drawing) faces the material 14 coated downward. Place it inside. In this state, the upper stage 15 of the vacuum adjoining chamber 10 is lowered to fix the second glass substrate 13 by vacuum adsorption and then rises. At this time, the electrostatic adsorption method (ESC) can be fixed instead of the vacuum adsorption method.

The loader of the robot exits the vacuum combiner chamber 10, and the lower stage 16 in the vacuum combiner chamber 10 is placed on the first glass substrate 11 having the liquid crystal 12 dropped by the loader of the robot. ) To the top.

In the above description, although the liquid crystal 12 is dropped on the first glass substrate 11 having the thin film transistor array and the substance is formed on the second glass substrate 13 having the color filter array, the first glass substrate ( 11) a real substance can be applied, and a liquid crystal can be dripped onto the said 2nd board | substrate, and a liquid crystal can also be dripped and the real thing may be apply | coated to either of the two glass substrates. However, the board | substrate with which liquid crystal was dripped may be located in a lower stage, and the remaining board | substrate may be located in an upper stage.

Subsequently, a substrate receiver (not shown) is placed 34S immediately below the second glass substrate 13 fixed to the upper stage 15. At this time, the method of placing the substrate receiver on the second substrate is as follows.

First, the upper stage is lowered or the substrate receiver is raised to bring the second glass substrate and the substrate receiver into close proximity, and then the second glass substrate 13 is lowered on the substrate receiver.

Second, the upper stage is first lowered by a predetermined distance and the substrate receiver is secondly raised to bring the second glass substrate 13 and the substrate receiver into close proximity, and then the second glass substrate 13 is moved to the substrate receiver. Put on top.

Third, the upper stage is lowered, the substrate receiver is raised, or the upper stage is first lowered, and the substrate receiver is raised secondly, so that the second glass substrate 13 and the substrate receiver have a predetermined distance therebetween. The upper stage can then adsorb the second glass substrate.

At this time, the reason why the substrate receiver is positioned below the second glass substrate 13 is that the stages 15 and 16 adsorb the first and second glass substrates by a vacuum adsorption method. Since the degree of vacuum in the adapter chamber becomes higher than the vacuum of each stage while making the chamber 10 into a vacuum state, the suction force of the first and second glass substrates 11 and 13 held by the stage is lost, in particular The second glass substrate adsorbed on the upper stage is to be prevented from falling off and falling on the first glass substrate 11.

Therefore, before the vacuum chamber is brought into the vacuum state, the second glass substrate 13 adsorbed on the upper stage is placed on the substrate receiver, or the upper stage and the substrate receiver on which the second glass substrate is adsorbed are spaced at a predetermined interval. The second glass substrate 13 may be positioned from the upper stage to the substrate receiver while positioning and vacuuming the chamber. In addition, when the vacuum chamber chamber starts to be vacuumed, there may be additional means for fixing the substrate since the substrate may move due to flow in the chamber at an initial stage.

The vacuum adhering chamber 10 is brought into a vacuum state (35S). Here, the vacuum degree of the vacuum adapter chamber 10 varies depending on the liquid crystal mode to be bonded, but the IPS mode is about 1.0 x 10 ^-3 Pa to 1Pa, and the TN mode is about 1.1 x 10 ^-3 Pa to 10 ^2. Let Pa.

In the above, the chamber 10 of the vacuum adapter may be vacuumed in two stages. That is, the substrate is adsorbed to the upper and lower stages, the door of the chamber is closed, and the first vacuum is started. The substrate receiver is positioned below the upper stage and the substrate adsorbed on the upper stage is placed on the substrate receiver or the substrate is held at a predetermined interval while the substrate is held at the substrate receiver. Is vacuumed second. At this time, the vacuum is faster at the time of the second vacuum than at the first vacuum, and the primary vacuum ensures that the vacuum degree of the vacuum adhering chamber is not higher than the vacuum suction force of the upper stage.

In addition, without separating the vacuum into primary and secondary, the substrate may be adsorbed to each stage, the door of the chamber may be closed, and the vacuum may be started to place the substrate receiver under the upper stage during the vacuum. At this time, the time point at which the substrate receiver is positioned below the upper stage should be positioned before the vacuum degree of the vacuum adapter chamber becomes higher than the vacuum suction force of the upper stage.

The reason why the vacuum of the vacuum adapter chamber is secondly carried out as described above is to prevent the vacuum adapter chamber from suddenly evacuating because the substrate in the chamber may be distorted or flowed.

When the vacuum adhering chamber 10 reaches the vacuum in a predetermined state, the upper and lower stages 15 and 16 are each of the first and second glass substrates 11 and 13 by an electrostatic charge (ESC) method. ) Is fixed (36S) and the substrate receiver is returned to its original position (37S).

Here, the electrostatic adsorption method includes at least two or more plate electrodes formed on the stage to supply negative / positive DC power to the plate electrodes and to adsorb them. That is, when a positive or negative voltage is applied to each of the flat plate electrodes, a negative or positive charge is induced on the stage and a conductive layer (a transparent electrode such as a common electrode or a pixel electrode is formed) is formed on the glass substrate by those charges. Therefore, the substrate is adsorbed by the Coulomb force generated between the conductive layer and the stage. At this time, a voltage of about 0.1 to 1 KV is applied when the surface on which the conductive layer of the substrate is formed is located on the stage side, and 3 to 4 KV when a surface on which the conductive layer of the substrate is formed is located on the side opposite to the stage. do. Here, an elastic sheet may be formed on the upper stage.

As shown in FIGS. 2C and 2D, the first glass substrate 11 is lowered by lowering the upper stage 15 while the two glass substrates 11 and 13 are loaded on the stages 15 and 16 by electrostatic adsorption. And the second glass substrate 13 are pressed in order to bond (primary pressurization) 38S. At this time, in the pressing method, the upper stage 15 or the lower stage 16 is moved in the vertical direction to press the two substrates, and at this time, the moving speed and the pressure of the stage are varied and pressed. That is, when the liquid crystal 12 of the 1st glass substrate 11 and the 2nd glass substrate 13 contact, or the real material 14 of the 1st glass substrate 11 and the 2nd glass substrate 13 is contacted, The stage is moved at a constant speed or constant pressure up to a point in time, and the pressure is gradually increased gradually from the point of contact to the desired final pressure. That is, the load cell is installed on the axis of the moving stage to recognize the point of contact, and the two glasses at a pressure of 0.1 ton at the time of contact, 0.3 ton at the middle stage, 0.4 ton at the last stage and 0.5 ton at the final stage The substrates 11 and 13 are bonded together (see Fig. 2D).

At this time, the upper stage presses the substrate by one axis, but may be installed so that each axis is equipped with a separate load cell (device for measuring pressure) by installing a plurality of axes to press independently on each axis. have. Therefore, when the lower stage and the upper stage are not horizontally aligned and the materials are not uniformly bonded, the shafts of the corresponding portions may be pressed at a relatively higher pressure or at a lower pressure so that the materials may be uniformly bonded.

When the bonding of the two substrates is completed by pressing, the adsorption is stopped by the electrostatic adsorption method (ESC off), and then the upper stage 15 is raised by raising the upper stage 15 as shown in FIG. 2E. Separate from the glass substrates 11 and 13.

In addition, in order to make the vacuum reactor chamber 10 in the vacuum state and pressurize the bonded substrate uniformly, as shown in FIG. 2F, a gas such as N ₂ or dry air (such as N ₂ ) is applied to the adapter chamber 10. Clean Dry Air) is supplied to vent the vacuum adhering chamber (39S).

As such, when the vacuum adapter chamber 10 is vented, the first and second glass substrates bonded by the real material 14 are in a vacuum state, and the vacuum adapter chamber 10 is in an atmospheric state, and thus, As a result, the first and second glass substrates 11 and 13 in a vacuum state are pressed at a uniform pressure so as to maintain a uniform gap. Here, the bonded first and second glass substrates 11 and 13 are not only pressurized by atmospheric pressure but also pressurized by an injection force of N ₂ or dry air input during venting.

In addition, it is important to ensure that both substrates are uniformly pressed during the chamber venting. The pressure applied to each part of the two substrates must be uniform, so that the height of the material between the two substrates can be formed uniformly, and the liquid crystal can be spread evenly on each part. Because it can prevent. In addition, in order to uniformly apply pressure to each part of the substrate while venting the chamber, the direction of venting is important, in which direction the gas vented into the chamber is vented.

Therefore, the present invention is to provide an embodiment as follows.

First, a plurality of tubes are formed in the upper part of the chamber to inject gas into the chamber, and second, a plurality of tubes are formed in the lower part of the chamber to inject gas into the chamber. A tube may be formed to inject gas into the chamber, or fourthly, the above method may be performed in parallel. Although it is preferable to inject gas from the upper part of the chamber, the vent direction may be determined in consideration of the size of the substrate and the state of the stage.

In addition, the two substrates 11 and 13 are pressurized not only by the atmospheric pressure but also by the injection force of the gas injected during the venting.

The plurality of gas injection pipes may be formed in at least two or more, preferably determined according to the size of the substrate, and here eight may be formed.

In order to prevent the substrate from shaking during the venting of the chamber, a fixing means or a method capable of preventing the shaking of the substrate may be used.

If the chamber is rapidly vented, the substrate may be shaken and the bonded substrate may be misaligned so that the gas can be vented step by step, and a slow valve for gradually supplying the gas may be further provided. In other words, there is a method of starting the vent in the chamber and completing the vent at once, and slowly starting the vent first to prevent shaking of the substrate, and when reaching a certain point, the vent speed is differently changed to reach the atmospheric pressure faster. It may be.

The timing of gas injection is also very important because there is a problem that the bonded substrate on the stage may be shaken by gas or misalignment may occur while venting the chamber.

The vent timing starts when the alignment is completed and pressurization proceeds first to form a vacuum state between the two substrates.

In detail, the first method may start the vent after raising the upper stage, and the second may start the vent before the upper stage starts to be completed to shorten the process time. At this time, the upper stage may be raised while blowing gas or dry air through the upper stage.

Then, the pressed substrate is unloaded (40S). That is, when the vent is completed, the upper stage 15 is raised and unloads the pressed first and second glass substrates 11 and 13 using the loader of the robot, or the pressed first and second glass substrates. The loader 11 of the robot unloads from the upper stage 16 after the upper stage 15 is lifted up by the upper stage 15.

At this time, in order to shorten the process time, one of the first glass substrate 11 or the second glass substrate 13 to be subjected to the next bonding process is loaded on the stage and the unloaded first and second glass substrates are unloaded. Can be. That is, a second substrate to be bonded next is placed on the upper stage 15 using a loader of a robot so that the upper stage fixes the second substrate by vacuum adsorption, and then on the lower stage 16. Unloading the pressurized first and second substrates, or the upper stage 15 adsorbs and lifts the pressurized first and second glass substrates 11 and 13, and the robot's loader is the first joining process to proceed. After loading the glass substrate 11 into the lower stage, the pressurized first and second glass substrates may be unloaded.

In the above, the liquid crystal spreading process of spreading the liquid crystals of the bonded substrates to the real side after bonding the substrates and before unloading may be further performed. Alternatively, after the unloading process is completed, if the liquid crystal does not spread, the liquid crystal spreading process may be further performed in order to spread the liquid crystal evenly toward the actual surface. At this time, the liquid crystal spreading step is performed for 10 minutes or more, and the liquid crystal spreading step can be performed in air or in vacuum.

The manufacturing method of the liquid crystal display device according to the present invention as described above has the following effects.

First, since a liquid crystal is dropped on the first substrate and a substance is formed on the second substrate, the process time before joining the two substrates is shortened, thereby improving productivity.

Second, since liquid crystal is dropped on the first substrate and a substance is applied on the second substrate, the process of the first substrate and the second substrate is balanced so that the production line can be efficiently operated.

Third, since the liquid crystal is dropped on the first substrate and the substance is applied to the second substrate, the substrate coated with the substance can be cleaned in the cleaning equipment (USC) just before bonding, thereby preventing the substance from being contaminated from the particles. can do.

Fourth, since the substrate receiver is positioned below the substrate and the adapter chamber is made in a vacuum state, the substrate adsorbed on the upper stage can be prevented from falling and the substrate is damaged.

Fifth, since the two substrates are bonded while recognizing the time point at which the two substrates are in contact with each other, the damage that the dropped liquid crystal may affect the alignment layer may be minimized.

Sixth, since the upper stage presses the substrate by a plurality of shafts that can press independently on each axis, when the lower stage and the upper stage are not horizontal to each other and the material is not uniformly bonded, It may be pressurized to a higher pressure or to a lower pressure so that the substance can be uniformly bonded.

Seventh, since vacuuming the adjoiner chamber over a second time, it is possible to prevent the chamber from suddenly vacuuming, thereby preventing the substrate from breaking and flowing due to a sudden vacuum.

Eighth, the two substrates are bonded together in a vacuumed amalgamator chamber and then the ventilator chamber is vented to atmospheric pressure to pressurize the bonded substrates so that the entire substrate can be pressed at a uniform pressure.

Ninth, venting in two steps minimizes damage to the substrate.

Tenth, the loading and unloading process can be performed at the same time, thereby reducing the process time.

Eleventh, since the liquid crystal spreading step is performed, the process time of the liquid crystal display device can be shortened.

The twelfth, separating the upper stage from the two substrates and venting at the same time can shorten the vent process time.

Claims (13)

Loading the first substrate and the second substrate into the combiner chamber; Bonding the first and second substrates together; Venting the combiner chamber to pressurize the two bonded substrates; And, And unloading the pressurized first and second substrates. The method of claim 1, The loading step includes the steps of adsorbing a first substrate and a second substrate to lower and upper stages in the adapter chamber; Positioning the substrate receiver of the adapter together under a second substrate fixed to the upper stage; And fixing the first and second substrates by the electrostatic adsorption method, respectively. The method of claim 1, The bonding step is a method of manufacturing a liquid crystal display device, characterized in that the pressure is changed in at least two steps. The method of claim 1, The step of venting the adjoining chamber may include a step of raising the upper stage of the adjuvant, And injecting gas or dry air into the adapter chamber. The method of claim 1, The venting of the adapter chamber comprises injecting gas or dry air into the adapter chamber before starting the ascension of the upper stage of the adapter and before completion of the ascent. The method according to claim 4 or 5, Method of injecting gas or dry air into the adapter chamber, the method of manufacturing a liquid crystal display, characterized in that the injection through the upper surface in the adapter chamber. The method of claim 6, And injecting the gas or dry air through an upper stage while injecting the gas or dry air through an upper surface of the combiner chamber. The method according to claim 4 or 5, Method for injecting gas or dry air into the adapter chamber, the method of manufacturing a liquid crystal display, characterized in that the injection through the lower surface in the adapter chamber. The method of claim 8, And injecting the gas or the dry air through the upper stage while injecting the gas or dry air through the lower surface of the adapter chamber. The method according to claim 4 or 5, Wherein the gas is injected with N ₂ gas. The method according to claim 4 or 5, And fixing the substrate to the lower stage of the chamber before injecting the gas or the dry air. The method of claim 1, The venting of the adapter chamber comprises injecting gas or dry air into the adapter chamber in two stages. The method of claim 1, The unloading process may include loading at least one of a first substrate and a second substrate on which the next bonding process is to be performed on the upper or lower stage and unloading the bonded substrate.