KR100769186B1 - Method for manufacturing liquid crystal display device - Google Patents

Abstract

The present invention relates to a method for manufacturing a liquid crystal display device of a liquid crystal dropping method, comprising: preparing a first substrate on which a liquid crystal is dropped and a second substrate on which a substance is formed; Loading the first substrate to the lower stage in the combiner chamber and loading the second substrate to the upper stage in the combiner chamber; Bonding the first and second substrates together; Fixing the bonded first and second substrates; Venting the adapter chamber to pressurize the first and second substrates; And unloading the pressurized first and second substrates, wherein the bonding step is performed by lowering the lower stage to the second substrate from the time when the substance contacts the first substrate to the completion of bonding. The pressure applied is varied in at least two stages.

Liquid crystal drop method Liquid crystal display device manufacturing method, Liquid crystal display device bonding method

Description

Method for manufacturing liquid crystal display device

1A to 1F are schematic cross-sectional views showing a conventional liquid crystal display method of a liquid crystal display device.

2A to 2H are schematic cross-sectional views showing the liquid crystal display device process of the liquid crystal dropping method according to the present invention.

3 is a bonding process flow chart according to the present invention

4 is a real layout view for explaining the fixing according to the first embodiment of the present invention.

5 is a real layout view illustrating the fixing according to the second embodiment of the present invention.

6 is a real layout view for explaining the fixing according to the third embodiment of the present invention.

7 is a real layout view illustrating the fixing according to the fourth embodiment of the present invention.

8 is a real layout view for explaining the fixing according to the fifth embodiment of the present invention.

9 is a real layout view for explaining the fixing according to the sixth embodiment of the present invention.

10 is a cross-sectional view of the upper and lower stages and the substrate on the line II ′ of FIG. 4.

Explanation of symbols for the main parts of the drawings

10 vacuum vacuum chamber 11, 13 glass substrate

12: liquid crystal 14: real                 

14a: main entity 14b: dummy entity

15: upper stage 16: lower stage

17 hole 18a, 18b UV irradiation pin or heat mechanism

The present invention relates to a method for manufacturing a liquid crystal display device, and more particularly, to a method for manufacturing a liquid crystal display device of a liquid crystal dropping method.

As the information society develops, the demand for display devices is increasing in various forms, and in recent years, liquid crystal display devices (LCDs), plasma display panels (PDPs), electro luminescent displays (ELDs), and vacuum fluorescent (VFD) Various flat panel display devices such as displays have been studied, and some of them are already used as display devices in various devices.

Among them, LCD is the most widely used as the substitute for CRT (Cathode Ray Tube) for mobile image display because of its excellent image quality, light weight, thinness, and low power consumption. In addition to the use of the present invention, a variety of applications such as a television, a computer monitor, and the like for receiving and displaying broadcast signals have been developed.

As described above, although various technical advances have been made in order for a liquid crystal display device to serve as a screen display device in various fields, the task of improving the image quality as a screen display device is often arranged with the above characteristics and advantages. . Therefore, in order to use a liquid crystal display device in various parts as a general screen display device, the key to development is how much high definition images such as high definition, high brightness, and large area can be realized while maintaining the characteristics of light weight, thinness, and low power consumption. It can be said.

Such a liquid crystal display may be largely divided into a liquid crystal panel displaying an image and a driving unit for applying a driving signal to the liquid crystal panel, wherein the liquid crystal panel has a predetermined space and is bonded to the first and second glass substrates. And a liquid crystal layer injected between the first and second glass substrates.

The first glass substrate (TFT array substrate) may include a plurality of gate lines arranged in one direction at a predetermined interval, a plurality of data lines arranged at regular intervals in a direction perpendicular to the gate lines, and A plurality of pixel electrodes formed in a matrix form in each pixel region defined by crossing each gate line and data line, and a plurality of thin films that transmit signals of the data line to each pixel electrode by being switched by signals of the gate line Transistors are formed.

The second glass substrate (color filter substrate) includes a black matrix layer for blocking light in portions other than the pixel region, an R, G and B color filter layer for expressing color colors, and a common electrode for implementing an image. Is formed.

The first and second substrates are bonded to each other by a seal material having a predetermined space by a spacer and having a liquid crystal injection hole, so that the liquid crystal is injected between the two substrates.                         

At this time, in the liquid crystal injection method, the liquid crystal is injected between the two substrates by osmotic pressure when the liquid crystal injection hole is immersed in the liquid crystal liquid by maintaining the vacuum state between the two substrates bonded by the real material. When the liquid crystal is injected as described above, the liquid crystal injection hole is sealed with a sealing material.

However, the manufacturing method of such a liquid crystal injection type liquid crystal display device has the following problems.

First, after cutting into a unit panel, the liquid crystal injection hole is immersed in the liquid crystal liquid by maintaining the vacuum state between the two substrates, so that the liquid crystal injection takes a lot of time, the productivity is reduced.

Second, in the case of manufacturing a large-area liquid crystal display device, when the liquid crystal is injected by the liquid crystal injection method, the liquid crystal is not completely injected into the panel, which causes a defect.

Third, since the process is complicated and time-consuming as described above, several liquid crystal injection equipment is required, which requires a lot of space.

Therefore, in recent years, the manufacturing method of the liquid crystal display device using the method of dropping a liquid crystal is researched. Among them, Japanese Unexamined Patent Application Publication No. 2000-147528 discloses a technique using the following liquid crystal dropping method.

The manufacturing method of the conventional liquid crystal display device using the liquid crystal dropping method is as follows.

1A to 1F are cross-sectional views of a liquid crystal display device according to a conventional liquid crystal dropping method.                         

As shown in FIG. 1A, an ultraviolet curable material 1 is applied to the first glass substrate 3 on which the thin film transistor array is formed to have a thickness of about 30 μm, and the liquid crystal 2 is disposed inside the material 1 (a thin film transistor array). Dropping At this time, the material 1 is formed without a liquid crystal injection hole.

The first glass substrate 3 as described above is mounted on the table 4 in the vacuum container C that is movable in the horizontal direction, and the entire lower surface of the first glass substrate 3 is mounted on the first adsorption mechanism 5. ) By vacuum adsorption.

As shown in Fig. 1B, the entire lower surface of the second glass substrate 6 on which the color filter array is formed is vacuum-adsorbed and fixed by the second adsorption mechanism 7, and the vacuum vessel C is closed and vacuumed. Then, the second adsorption mechanism 7 is lowered in the vertical direction so that the distance between the first glass substrate 3 and the second glass substrate 6 is 1 mm, and the first glass substrate 3 is mounted. The table 4 is moved in the horizontal direction to preliminarily position the first glass substrate 3 and the second glass substrate 6.

As shown in FIG. 1C, the second adsorption mechanism 7 is lowered in the vertical direction to bring the second glass substrate 6 into contact with the liquid crystal 2 or the actual material 1.

As shown in FIG. 1D, the table 4 on which the first glass substrate 3 is mounted is moved in the horizontal direction to adjust the position of the first glass substrate 3 and the second glass substrate 6.

As shown in FIG. 1E, the second adsorption mechanism 7 is lowered in the vertical direction to bond the second glass substrate 6 to the first glass substrate 3 through the actual material 1, and to press to 5 μm. .

As shown in FIG. 1F, the bonded first and second glass substrates 3 and 6 are taken out of the vacuum container C, and the ultraviolet rays are irradiated to the actual substance 1 to cure the actual substance 1 to provide a liquid crystal display device. Complete

In this case, the real material 1 refers to a main material and a dummy material surrounding the active area of the liquid crystal display.

However, the conventional method of manufacturing the liquid crystal display device of the liquid crystal dropping method has the following problems.

First, since the actual material is formed on the same substrate and the liquid crystal is dropped, the process time until joining the two substrates takes a lot.

Second, since a real material is applied to the first substrate and liquid crystal is dropped, but no process is performed on the second substrate, an unbalance occurs between the processes of the first substrate and the second substrate, thereby efficiently operating the production line. Difficult to do

Third, since the substance is applied to the first substrate and the liquid crystal is dropped, the substrate to which the substance is applied cannot be cleaned by the cleaning equipment USC before bonding. Therefore, it is not possible to wash the material to which the upper and lower substrates are bonded, so that the particles cannot be removed, resulting in the actual contact failure during the bonding.

Fourth, as the size of the substrate increases, misalignment may occur because the substrate is not fixed when the substrate is transferred for unloading or subsequent processing after bonding.

Fifth, as the substrate size increases, it is difficult to maintain the bonding state until the actual hardening of the substrate is performed in a subsequent process.                         

Sixth, when the substrate is distorted, flow occurs in the liquid crystal between the substrates, which causes a liquid crystal alignment defect.

Seventh, when the substrate is misaligned, the alignment of the upper and lower substrates may be misaligned, thereby decreasing the aperture ratio.

Eighth, when a misalignment of the liquid crystal occurs, spots such as scratches and spots associated with luminance may occur.

Ninth, the bonding of the two substrates is bonded only by the physical force of the table and the second adsorption mechanism, so that if the horizontality of the table and the second adsorption mechanism is not correct, no uniform pressure is applied to the entire substrate, resulting in poor adhesion. This can happen.

The present invention has been made to solve the above problems, and an object thereof is to provide a method for manufacturing a liquid crystal display device of a liquid crystal dropping method which can shorten the process time, prevent distortion of the substrate and pressurize uniformly.

According to an aspect of the present invention, there is provided a method of manufacturing a liquid crystal display device, the method including: preparing a first substrate on which liquid crystal is dropped and a second substrate on which a substance is formed; Loading the first substrate to the lower stage in the combiner chamber and loading the second substrate to the upper stage in the combiner chamber; Bonding the first and second substrates together; Fixing the bonded first and second substrates; Venting the adapter chamber to pressurize the first and second substrates; And unloading the pressurized first and second substrates, wherein the bonding step is performed by lowering the lower stage to the second substrate from the time when the substance contacts the first substrate to the completion of bonding. The pressure applied is varied in at least two stages.

Here, the step of loading, the step of adsorbing the first substrate and the second substrate to the lower and upper stage in the adapter chamber, the step of pre-aligning the first and second substrate, the substrate of the adapter It is preferable to include a step of positioning the receiver under the second substrate fixed to the upper stage, and the step of fixing the first and second substrate by the electrostatic adsorption method, respectively.

In the fixing of the bonded substrate, it is preferable that the actual substrate is formed of a light or heat curable material and the two bonded substrates are fixed by applying light or heat to the actual material.

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The real material includes a main real material and a real material for fixing, and in the step of fixing the bonded substrate, it is preferable to harden the real material for fixing to fix the two bonded substrates.

 The actual material includes a plurality of main materials for sealing liquid crystals dropped on the plurality of panel parts, a dummy material for protecting the plurality of main materials, and a fixing material for fixing the two bonded substrates. In the step of fixing the bonded substrate, it is preferable that the fixed first and second substrates are fixed by curing the fixing material.

The fixing material is preferably formed between the edge of the substrate or between each panel portion.

The actual material includes a plurality of main materials for sealing the liquid crystal dropped on the plurality of panel portions, and a plurality of dummy materials for protecting the plurality of main materials, respectively, and the step of fixing the bonded and pressed substrate is It is preferable to fix the two bonded substrates by curing the dummy material.

The step of pressurizing the two substrates by venting the adapter chamber preferably includes raising the upper stage of the adapter and injecting gas or dry air into the adapter chamber.

The process of pressurizing the two substrates by venting the combiner chamber preferably injects gas or dry air into the combiner chamber before starting the rise of the upper stage of the combiner and before completion of the rise.

The process of pressurizing the two substrates by venting the combiner chamber preferably raises the upper stage of the combiner and injects gas or dry air into the combiner chamber.

It is preferable to blow gas or dry air through the vacuum suction groove of the stage while raising the upper stage of the adapter chamber.

The process of pressurizing the two substrates by venting the adapter chamber may include a step of starting gas or dry air injection into the adapter chamber and a step of raising the upper stage of the adapter.

The step of raising the upper stage of the adapter is preferably performed while blowing gas or dry air through the vacuum groove of the upper stage of the adapter.

In the process of pressurizing the two substrates by venting the adapter chamber, it is preferable to inject gas or dry air into the adapter chamber in two stages.                     

Preferably, the step of venting the adapter chamber is pressurized such that the distance between the two bonded substrates is 5 μm or less.

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In the unloading process, it is preferable to load at least one of the first substrate or the second substrate to be subjected to the next bonding process to the upper or lower stage and to unload the fixed substrate.

In addition, the manufacturing method of the liquid crystal display device according to the present invention for achieving the above object comprises the steps of preparing a first substrate and a second substrate in which the liquid crystal is dropped and the actual material; Loading the first substrate to the lower stage in the combiner chamber and loading the second substrate to the upper stage in the combiner chamber; Bonding the first and second substrates together; Venting the coalescer chamber to pressurize the coalesced first and second substrates; And unloading the first and second substrates; In the bonding process, the lower stage is lowered so that the pressure applied to the second substrate is changed in at least two stages from the time when the substance contacts the first substrate to the time when the bonding is completed.

Here, the method may further include a step of aligning the first and second substrates before bonding the first and second substrates.

Hereinafter, a method of manufacturing a liquid crystal display device according to the present invention having such a feature will be described in detail with reference to the accompanying drawings.

2A to 2H are schematic cross-sectional views showing the process of the liquid crystal display device according to the present invention.

2A, the liquid crystal 12 is dripped at the 1st glass substrate 11, and the real material 14 is formed in the 2nd glass substrate 13. As shown in FIG. Here, a plurality of panels are designed on one of the first and second glass substrates 11 and 13 to form a thin film transistor array on each panel, and the plurality of panels are formed on the remaining substrates to correspond to the respective panels. Each panel is designed to form a color filter array including a black matrix layer, a color filter layer, a common electrode, and the like. For ease of explanation, the substrate on which the thin film transistor array is formed is called a first glass substrate 11, and the substrate on which a color filter array is formed is called a second glass substrate 13.

Here, the bonding process is described in more detail as follows.

3 is a flowchart illustrating a bonding process of the liquid crystal display according to the present invention.

In the bonding process according to the present invention, a process of inverting a substrate without large drop of liquid crystal, a process of loading two substrates into a combiner chamber, a process of bonding the two substrates, and curing by fixing the substance bonded in the same chamber The process may be divided into a process of pressurizing the two substrates by venting the adapter chamber, and a process of unloading the bonded substrates from the adapter chamber.

In the step of inverting, as shown in FIG. 2B, the first glass substrate 11 to which the liquid crystal 12 is dropped and the second glass substrate 13 to which the sealant 14 is applied are respectively dropped at the front end thereof. Since the portion and the portion coated with the actual material face upward, the first glass substrate 11 with the liquid crystal 12 dropped therein and the second glass substrate 13 with the actual material 14 coated thereon. In order to bond, one of the two substrates must be reversed. However, since the substrate on which the liquid crystal is dropped cannot be inverted, the second glass substrate 13 is inverted so that the portion of the second glass substrate 13 coated with the real material faces downward. (32S).                     

At this time, the method of inverting, although not shown in the figure, the second substrate is loaded on the table of the inverter to adsorb and clamp the second substrate to the table. Then, the table is rotated to be inverted, and then the inverted second substrate is transferred to the combiner chamber.

In the loading process, as shown in FIG. 2C, the inverted second glass substrate 13 is fixed to the upper stage 15 of the adapter chamber 10 by vacuum adsorption, and the first liquid crystal 12 is dropped. The glass substrate 11 is fixed to the lower stage 16 of the adapter chamber 10 by vacuum adsorption (33S). At this time, the adapter chamber 10 maintains the standby state.

Specifically, the loader of the robot (not shown in the drawing) has a second glass substrate 13 coated with a sealant 14 so that the portion coated with the seal 14 faces downward. ) Mounts a second glass substrate 13 and places it into the amalgamator chamber 10. In this state, the upper stage 15 of the combiner chamber 10 descends to fix the second glass substrate 13 by vacuum adsorption and then rise. At this time, it can be fixed by the electrostatic adsorption method instead of the vacuum adsorption method.

The loader of the robot exits the combiner chamber 10, and the lower stage 16 in the combiner chamber 10 receives the first glass substrate 11 on which the liquid crystal 12 is dropped by the loader of the robot. Position it up.

In the above description, although the liquid crystal 12 is dropped on the first glass substrate 11 having the thin film transistor array and the substance is formed on the second glass substrate 13 having the color filter array, the first glass substrate ( 11), a real material may be applied to the second substrate, and a liquid crystal may be dropped onto the second substrate, and the liquid crystal may be dropped onto the glass substrate of either of the two glass substrates, and the real may be applied. However, the board | substrate with which liquid crystal was dripped may be located in a lower stage, and the remaining board | substrate may be located in an upper stage.

In addition, the first glass substrate 11 and the second glass substrate 13 to which the upper stage 15 which adsorbs the second glass substrate 13 descends and the lower stage 16 move in the horizontal direction and are adsorbed Presort (34S). At this time, the preliminary alignment aligns only a rough alignment mark. Of course, the preliminary alignment may be omitted.

Again, the upper stage 15 is raised, and then a second glass substrate 13 fixed to the upper stage 15 by attaching a substrate receiver (not shown) of the adhering chamber 10 to the upper stage 15. (35S). At this time, the method of placing the substrate receiver on the second substrate is as follows.

First, the upper stage is lowered or the substrate receiver is raised to bring the second glass substrate and the substrate receiver into close proximity, and then the second glass substrate 13 is lowered on the substrate receiver.

Second, the upper stage is first lowered by a predetermined distance and the substrate receiver is secondly raised to bring the second glass substrate 13 and the substrate receiver into close proximity, and then the second glass substrate 13 is moved to the substrate receiver. Put on top.

Third, the upper stage is lowered, the substrate receiver is raised, or the upper stage is first lowered and the substrate receiver is raised secondly, so that the second glass substrate 13 and the substrate receiver have a predetermined distance. The upper stage can then adsorb the second glass substrate.

At this time, the reason why the substrate receiver is positioned below the second glass substrate 13 is that the stages 15 and 16 adsorb the first and second glass substrates by a vacuum adsorption method. Since the degree of vacuum in the adapter chamber becomes higher than the vacuum of each stage while making the chamber 10 into a vacuum state, the suction force of the first and second glass substrates 11 and 13 held by the stage is lost, in particular The second glass substrate adsorbed on the upper stage is to be prevented from falling off and falling on the first glass substrate 11.

 Therefore, before the vacuum chamber is brought into the vacuum state, the second glass substrate 13 adsorbed on the upper stage is placed on the substrate receiver, or the upper stage and the substrate receiver on which the second glass substrate is adsorbed are spaced at a predetermined interval. The second glass substrate 13 may be positioned from the upper stage to the substrate receiver while positioning and vacuuming the chamber. In addition, when the vacuum chamber chamber starts to be vacuumed, there may be additional means for fixing the substrate since the substrate may move due to flow in the chamber at an initial stage.

The adjoining chamber 10 is vacuumed (36S). Here, the vacuum degree of the adapter chamber 10 is different depending on the liquid crystal mode to be bonded, but the IPS mode is about 1.0 x 10 ^-3 Pa to 1Pa, and the TN mode is about 1.1 x 10 ^-3 Pa to 10 ² Pa. Shall be.

In the above, the adapter chamber 10 may be vacuumed in two stages. That is, the substrate is adsorbed to the upper and lower stages, the door of the chamber is closed, and the first vacuum is started. The substrate receiver is positioned below the upper stage so that the substrate adsorbed on the upper stage is placed on the substrate receiver or the substrate is held at a predetermined interval while the upper stage and the substrate receiver maintain a predetermined interval. Second vacuum. At this time, the vacuum is faster at the time of the second vacuum than at the first vacuum, and the primary vacuum ensures that the vacuum degree of the adapter chamber is not higher than the vacuum suction force of the upper stage.

In addition, without separating the vacuum into primary and secondary, the substrate may be adsorbed to each stage, the door of the chamber may be closed, and the vacuum may be started to place the substrate receiver under the upper stage during the vacuum. At this time, the point at which the substrate receiver is positioned below the upper stage should be positioned before the vacuum degree of the adapter chamber becomes higher than the vacuum suction force of the upper stage.

The reason why the vacuum of the adapter chamber is advanced for two times is to prevent this because the substrate in the chamber may be distorted or flowed when the adapter chamber is suddenly vacuumed.

When the adapter chamber 10 reaches a vacuum in a predetermined state, each of the upper and lower stages 15 and 16 may be configured by the first and second glass substrates 11 and 13 by an electrostatic charge method (ESC). (37S), and place the substrate receiver back to its original position (38S).

In the bonding step, as shown in FIGS. 2D and 2E, the upper stage 15 is lowered while the two glass substrates 11 and 13 are loaded on the stages 15 and 16 by electrostatic adsorption. In order to bond the glass substrate 11 and the 2nd glass substrate 13, it presses (primary pressurization) 39S. At this time, in the pressing method, the upper stage 15 or the lower stage 16 is moved in the vertical direction to press the two substrates, and at this time, the moving speed and the pressure of the stage are varied and pressed. That is, when the liquid crystal 12 of the 1st glass substrate 11 and the 2nd glass substrate 13 contact, or the real material 14 of the 1st glass substrate 11 and the 2nd glass substrate 13 is contacted, The stage is moved at a constant speed or constant pressure up to a point in time, and the pressure is gradually increased gradually from the point of contact to the desired final pressure. That is, the load cell is installed on the axis of the moving stage to recognize the point of contact, and the two glasses at a pressure of 0.1 ton at the time of contact, 0.3 ton at the middle stage, 0.4 ton at the last stage and 0.5 ton at the final stage The substrates 11 and 13 are bonded together (see FIG. 2E).

At this time, the upper stage presses the substrate by one axis, but may be installed so that each axis is equipped with a separate load cell (device for measuring pressure) by installing a plurality of axes to press independently on each axis. have. Therefore, when the lower stage and the upper stage are not horizontally aligned and the materials are not uniformly bonded, the shafts of the corresponding portions may be pressed at a relatively higher pressure or at a lower pressure so that the materials may be uniformly bonded.

After pressing and bonding the two substrates, as shown in Figure 2f, by irradiating UV to the material to which the first and second glass substrates (11, 13) are bonded, or by partially transferring heat or pressure to the material The real material is cured to fix the first and second glass substrates 11 and 13 (40S). Here, in the fixing process, since the substrate is enlarged (1000 mm x 1200 mm) and the two substrates are bonded after the dropping of the liquid crystal, the two substrates joined together may be misaligned during the next process or movement after the bonding. Therefore, the fixing is performed to prevent misalignment of the two bonded substrates during the next process or movement after bonding and to maintain the bonded state. However, if necessary, the step of fixing the substrates 11 and 13 may be omitted.

Here, the fixing method will be described in more detail as follows.

First, the fixing method is performed in the coalescing chamber, wherein the coalescing chamber is maintained in a vacuum or standby state. In addition, it is preferable to proceed with the fixing process after the bonding process is made, but may be performed before the bonding process is completed in order to shorten the process time. And, in order to simplify the process, it is preferable to use the same material as the main material as the fixing material, but a material different from the main material may be used to improve the fixing efficiency, and the fixing material may include light (UV) curable resin, Thermosetting resin, light (UV) and thermosetting resin, pressure curable resin, or a material with high adhesive force can be used. Here, the photocurable resin includes a UV curable resin, and when using a UV curable resin, UV irradiation conditions are irradiated with UV of 50 to 500mW for 5 to 40 seconds. Preferably, 200 mW of UV is irradiated for about 14 seconds. And, in the case of using a thermosetting resin, but may vary depending on the material of the fixing material, a temperature of 50 to 200 ℃ is added to about 10 seconds or more. Therefore, the bonded substrate fixing method can be fixed using light, heat, light and heat, or pressure.

4 is a layout view of a substrate for explaining fixing according to the present invention, and FIG. 10 is a cross-sectional view of the upper and lower stages and the substrate on the line II ′ of FIG. 4.

The bonded substrate fixing method according to the first embodiment of the present invention is a light (UV) curable resin, a heat curable resin, a light (UV) and a heat curable resin, or a pressure during the application of the material 14 as described above. Using the curable resin, as shown in FIG. 4, the plurality of main materials 14a for bonding the two substrates to the periphery of each panel unit as well as sealing the liquid crystal between the two substrates, and for each inner main material during the bonding and pressing process ( A plurality of dummy materials 14b formed to surround the plurality of panel parts to protect 14a), and a plurality of fixing materials formed at regular intervals on an edge portion of the twenty-second substrate, that is, an outer portion of the dummy material 14b ( 14c) is formed in the second glass substrate 13. The dummy material 14b is for protecting the main material 14a and the fixing material 14c is only for fixing two substrates and thus is removed during the cutting process.

As described above, the fixing material 14c is formed, the two substrates are bonded and pressed, and then the fixing material 14c is irradiated with UV to harden or fix the fixing material 14c. The fixing material 14c is cured by applying heat or pressure to the sealing material 14c to fix the two bonded substrates. That is, when the fixing material 14c is formed of UV curable resin, the fixing material 14c is irradiated with UV and fixed, and the fixing material 14c is formed of heat or pressure curable resin. Selectively applies heat or pressure only to the fixing material 14c to cure the fixing material 14c.

Here, as shown in FIG. 10, the upper stage 15 or / and the lower stage 16 are provided with a plurality of holes 17 for irradiating UV or applying heat. . Therefore, it is considered that the fixing material 14c and the hole 17 are aligned because each substrate is adsorbed after being aligned at each stage before bonding. Therefore, when the UV irradiation, heat or pressure is applied to the fixing material 14c through the hole 17 toward the upper stage or / and the lower stage where the hole 17 is formed, the fixing material 14c becomes Curing secures the two bonded substrates. At this time, the UV irradiation is the UV irradiation pin (18a, 18b) for irradiating the UV is lowered on the upper side of the adapter chamber or raised from the lower side of the adapter chamber to irradiate UV to the fixing material (14c) and UV Irradiation conditions irradiate 50 to 500 mW of UV for 5 to 40 seconds. Preferably, 200 mW of UV is irradiated for about 14 seconds. In the case of curing with heat, the heat mechanisms 18a and 18b are lowered from the upper side of the adapter chamber or raised from the lower side of the adapter chamber to pass through the hole 17 to apply the fixing material 14c. Heat is applied to the fixing material 14c to the first and second glass substrates 11 and 13 of the portion. The conditions for applying heat may vary depending on the material of the fixing material, but if the temperature of 50 to 200 ° C. is added for about 10 seconds or more, only the fixing material 14c may be selectively cured. In addition, UV irradiation and heat can be fixed in parallel.

Of course, the main material 14a, the dummy material 14b, and the fixing material 14c may be simultaneously formed on the second glass substrate, but in some cases, the dummy material 14b or the fixing material 14c may be the first. It can be formed in the glass substrate 11, and the fixing material 14c can be formed from a material different from the main material 14a. In addition, the main real material 14a is formed on the first glass substrate 11 and the fixing real material 14c is formed on the second substrate 13, or the first glass substrate 11 onto which all the real liquids are dropped. Can also be formed.

5 is a layout view of a substrate for explaining fixing according to the second embodiment of the present invention.

In the bonded substrate fixing method of the second embodiment of the present invention, the above-described materials (UV curable resins, thermosetting resins, UV and thermosetting resins, pressure curable resins, etc.) are applied, and as shown in FIG. Bonding the two substrates to the periphery, as well as the main material 14a for sealing the liquid crystal between the two substrates, and the dummy material formed to surround the plurality of panel parts to protect the internal main material (14a) during the bonding and pressing process ( 14b), and the dummy substrate 14b is partially irradiated with UV or heat or pressure to fix the two substrates.

That is, in the fixing method of the first embodiment of the present invention as shown in Fig. 4, by applying the dummy material 14b to the part to which the fixing material is applied and partially irradiating UV or applying heat or pressure to the dummy material 14b. The dummy material 14b is partially fixed. The remaining UV irradiation conditions and the conditions to which heat was applied are as described in the first embodiment of the present invention, and the UV and heat may be fixed in parallel. In Fig. 5, reference numeral 14d denotes a portion to which the UV irradiation and / or heat is applied.

6 is a layout view of a substrate for explaining fixing according to a third embodiment of the present invention.

According to the fixing method of the third embodiment of the present invention, in the fixing method of the first embodiment of the present invention, the main actual material 14a and the fixing real material 14c are formed without forming a dummy real material, and the fixing real material 14c is provided. Two substrates bonded together by UV irradiation or heat were fixed. The remaining conditions are as described in the first embodiment. Here, the fixing material 14c can be formed like the dummy material in the first and second embodiments.

7 is a layout view of a substrate for explaining fixing according to the fourth embodiment of the present invention.

In the bonded substrate fixing method of the fourth embodiment of the present invention, in the bonded substrate fixing method of the third embodiment of the present invention, the fixing material 14c is fixed not only to the periphery of the substrate but also to the cutting portions between the panel portions at regular intervals. The two sealing substrates 14c are formed, and the two bonded substrates are fixed by applying UV or heat or pressure to each of the fixing materials 14c. The remaining conditions are as described in the first embodiment.

8 is a layout view of a substrate for explaining fixing according to a fifth embodiment of the present invention.

In the fixing method according to the fifth embodiment of the present invention, in the first embodiment of the present invention as shown in FIG. 4, the panel member (main) is not formed so as to surround all the panel parts (main material). A plurality of dummy materials 14b are formed to surround each of the materials, and a fixing material 14c is formed at the edge of the substrate. As described above, UV fixing or heat or pressure is applied to the fixing material 14c. The two bonded substrates are fixed. The remaining conditions are as described in the first embodiment.

9 is a layout view of a substrate for explaining fixing according to the sixth embodiment of the present invention.

In the fixing method according to the sixth embodiment of the present invention, in the fifth embodiment of the present invention as shown in FIG. 8, the fixing method is partially formed in the plurality of dummy materials 14b formed in the panel portions without separately forming the fixing material 14c. This is to fix the two bonded substrates by irradiating UV or applying heat or pressure. The remaining conditions are as described in the first embodiment.

In addition, although not shown in the drawings, in the fixing method according to the seventh embodiment of the present invention, a main material (UV curable resin, thermosetting resin or the like) is formed by bonding the two substrates without forming a separate dummy material and a fixing material on the substrate. UV and thermally curable resins) may be partially cured and fixed by partially irradiating UV or by applying heat or pressure.

In addition, although not shown in the drawings, in the fixing method according to the eighth embodiment of the present invention, in the first, third, fourth, and fifth embodiments, the fixing material is formed at a portion where the fixing material 14c is formed. When the adhesive having excellent curability is applied and the first and second glass substrates are bonded to each other, the two substrates may be fixed by the adhesive.

As such, when the two bonded substrates are fixed, the bonded first and second glass substrates may be prevented from being shifted or deformed when moving for the next process.

As described above, when fixing of the two substrates is completed, the adsorption is stopped by the electrostatic adsorption method (ESC off), and then the upper stage 15 is raised by raising the upper stage 15 as shown in FIG. 2G. It separates from the 1st, 2nd glass substrate 11 and 13 which were made.

In addition, the making of a vacuum laminating machine chamber 10 to a stand-by state in order to uniformly press the said cemented substrate, as shown in Fig. 2h, gas, or dry air of N ₂ and so on to the cemented group chamber 10 ( Clean Dry Air) is supplied to vent the combiner chamber to pressurize the two substrates (41S).

As described above, when the adapter chamber 10 is vented, the first and second glass substrates bonded by the real material 14 are in a vacuum state, and the adapter chamber 10 is in an atmospheric state. The first and second glass substrates 11 and 13 in a vacuum state are pressed at a uniform pressure so as to maintain a uniform gap. Here, the bonded first and second glass substrates 11 and 13 are not only pressurized by atmospheric pressure but also pressurized by an injection force of N ₂ or dry air input during venting.

It is important to ensure that the two substrates are uniformly pressed during the chamber vent. The pressure applied to each part of the two substrates must be uniform, so that the height of the material between the two substrates can be formed uniformly, and the liquid crystal can be spread evenly on each part. Because it can prevent. In order to uniformly apply pressure to each part of the substrate while venting the chamber, the vent direction is important, in which direction the gas vented into the chamber is vented.

Therefore, the present invention is to provide an embodiment as follows.                     

First, a plurality of tubes are formed in the upper part of the chamber to inject gas into the chamber, and second, a plurality of tubes are formed in the lower part of the chamber to inject gas into the chamber. A tube may be formed to inject gas into the chamber, or fourth, the above method may be performed in parallel. Although it is preferable to inject gas from the upper part of the chamber, the vent direction may be determined in consideration of the size of the substrate and the state of the stage.

In addition, the two substrates 11 and 13 are pressurized not only by the atmospheric pressure but also by the injection force of the gas injected during the venting. The pressure applied to the two substrates at the time of venting is atmospheric pressure (10 ⁵ Pa), but a pressure of 0.4 to 3.0 Kg / cm 2 per unit area (cm 2) is appropriate but preferably 1.0 Kg / cm 2. However, the size can be changed in consideration of the size of the substrate, the distance between the substrates, and the thickness of the actual material.

The plurality of gas injection pipes may be formed in at least two or more, preferably determined according to the size of the substrate, and here eight may be formed.

In order to prevent the substrate from shaking during the venting of the chamber, a fixing means or a method capable of preventing the shaking of the substrate may be used.

If the chamber is rapidly vented, the substrate may be shaken and the bonded substrate may be misaligned so that the gas can be vented step by step, and a slow valve for gradually supplying the gas may be further provided. In other words, there is a method of starting the vent in the chamber and completing the vent at once, and slowly starting the vent first to avoid shaking of the substrate, and when the predetermined point is reached, the vent speed is differently changed to reach the atmospheric pressure faster. It may be.

The timing of gas injection is also very important because there is a problem that the bonded substrate on the stage may be shaken by gas or misalignment may occur while venting the chamber.

The vent timing starts when the alignment is completed and pressurization proceeds first to form a vacuum state between the two substrates. The specific vent start method is as follows.

First, the vent may be started after raising the upper stage, but second, the vent may start before the upper stage starts to be completed in order to shorten the process time.

Third, the upper stage may be raised and the vent may be started at the same time, and the upper stage may be raised while blowing gas or dry air through the upper stage. The reason for this is that the bonded substrate from the upper stage does not fall well or the substrate is shaken to fall below the lower stage, so that the upper stage may be raised while blowing gas or dry air to separate the upper stage and the substrate well. Can be.

Fourth, the venting of the chamber can be started without moving the upper or lower stage in the state of bonding. In this case, the upper stage may move the upper stage while the vent of the chamber is completed, or may start the movement of the upper stage before the vent of the chamber is completed. In addition, the upper stage may be raised while blowing gas or dry air through the upper stage. The reason for this is that the bonded substrate from the upper stage does not fall well or the substrate is shaken to fall below the lower stage, so that the upper stage may be raised while blowing gas or dry air to separate the upper stage and the substrate well. Can be.

When the adapter chamber 10 is vented to pressurize the two substrates in this manner, the distance between the substrates is 5 μm or less. That is, when the height of the real material is formed to 35 to 45 μm, and the material is bonded and pressed by the upper and lower stages 15 and 16 in the adapter chamber 10, the distance between the two substrates is 25 to 35 μm. do. When the venting step is performed, the distance between the two substrates is 5 µm or less in the panel portion (cell region) at the portion where the actual material is formed.

Then, the pressed substrate is unloaded (42S). That is, when the vent is completed, the upper stage 15 is raised and unloads the pressurized first and second glass substrates 11 and 13 using the loader of the robot, or the pressurized first and second glass. The loader 11 of the robot unloads from the upper stage 16 after the upper stage 15 is lifted up by the upper stage 15.

At this time, in order to shorten the process time, one of the first glass substrate 11 or the second glass substrate 13 to be subjected to the next bonding process is loaded on the stage and the unloaded first and second glass substrates are unloaded. can do. That is, a second substrate to be bonded next is placed on the upper stage 15 using a loader of a robot so that the upper stage fixes the second substrate by vacuum adsorption, and then on the lower stage 16. The unloaded first and second substrates may be unloaded, or the upper stage 15 may be sucked up by the pressed first and second glass substrates 11 and 13, and the loader of the robot may move to the next bonding process. After the first glass substrate 11 is loaded on the lower stage, the pressurized first and second glass substrates may be unloaded.

In the above, the liquid crystal spreading step of spreading the liquid crystal of the pressed substrate to the real side after pressing the substrate and before unloading may be further performed. Alternatively, after the unloading process is completed, if the liquid crystal does not spread, the liquid crystal spreading process may be further performed in order to spread the liquid crystal evenly toward the actual surface. At this time, the liquid crystal spreading step is performed for 10 minutes or more, and the liquid crystal spreading step can be performed in air or in vacuum.

The manufacturing method of the liquid crystal display device according to the present invention as described above has the following effects.

First, since a liquid crystal is dropped on the first substrate and a substance is formed on the second substrate, the process time before joining the two substrates is shortened, thereby improving productivity.

Second, since liquid crystal is dropped on the first substrate and a substance is applied on the second substrate, the process of the first substrate and the second substrate is balanced so that the production line can be efficiently operated.

Third, since the substrate receiver is positioned below the substrate and the adapter chamber is brought into a vacuum state, the substrate adsorbed on the upper stage may fall and the substrate may not be damaged.

Fourth, since the two substrates are bonded while recognizing the time point at which the two substrates are in contact with each other, the damage that the dropped liquid crystal may affect the alignment layer may be minimized.

Fifth, since the upper stage presses the substrate by a plurality of axes capable of independently pressing each axis, when the lower stage and the upper stage are not horizontal to each other and the material is not uniformly bonded, the axis of the corresponding part is relatively It may be pressurized to a higher pressure or to a lower pressure so that the substance can be uniformly bonded.

Sixth, because the vacuum of the adhering chamber is vacuumed twice, it is possible to prevent the chamber from being suddenly vacuumed, thereby preventing the substrate from breaking and flowing due to sudden vacuum.

Seventh, after the two substrates are bonded together, the dummy or main material is partially cured or the two bonded substrates are fixed by using a separate adhesive, and then the next process or the bonded substrates are moved. Alternatively, the first glass substrate and the second glass substrate may be prevented from being misaligned during the movement.

Eighth, it is possible to improve the productivity of the liquid crystal display device by venting the vacuum chamber chamber in a vacuum state to uniformly press the two bonded substrates.

Ninth, loading and unloading can be done at the same time, reducing the process time.                     

Tenth, since the liquid crystal spreading step is performed, the process time of the liquid crystal display device can be shortened.

Claims (20)

Preparing a first substrate on which liquid crystal is dropped and a second substrate on which a substance is formed; Loading the first substrate to the lower stage in the combiner chamber and loading the second substrate to the upper stage in the combiner chamber; Bonding the first and second substrates together; Fixing the bonded first and second substrates; Venting the adapter chamber to pressurize the first and second substrates; And Unloading the pressurized first and second substrates; In the bonding process, the lower stage is lowered so that the pressure applied to the second substrate is changed in at least two stages from the time when the substance contacts the first substrate to the time when the bonding is completed. Way. The method of claim 1, The loading process, Adsorbing a first substrate and a second substrate to lower and upper stages in the adapter chamber; Pre-aligning the first and second substrates; Positioning the substrate receiver of the adapter together under a second substrate fixed to the upper stage; And fixing the first and second substrates by the electrostatic adsorption method, respectively. delete The method of claim 1, The fixing of the bonded first and second substrates may include forming the material with a light or heat curable material and fixing the two bonded substrates by applying light or heat to the material. Way. The method of claim 1, The actual material includes a main real material and a real material for fixing, The fixing of the bonded first and second substrates comprises hardening the fixing material to fix the bonded first and second substrates. The method of claim 1,  The actual material includes a plurality of main materials for sealing liquid crystals dropped on the plurality of panel parts, a dummy material for protecting the plurality of main materials, and a fixing material for fixing the two bonded substrates. , The fixing of the bonded first and second substrates may include hardening the fixing material to fix the bonded first and second substrates. The method of claim 6, The fixing material is formed on the edge of the substrate or between each panel portion manufacturing method of the liquid crystal display device. The method of claim 1, The actual material includes a plurality of main materials for sealing liquid crystals dropped on the plurality of panel portions, and a plurality of dummy materials for protecting the plurality of main materials, respectively. And the step of fixing the first and second substrates that are pressed and pressurized, hardens the dummy material to fix the first and second substrates that are bonded to each other. The method of claim 1, The process of pressurizing the first and second substrates by venting the adjoining chamber may include the steps of raising the upper stage of the adhering machine; And injecting gas or dry air into the adapter chamber. The method of claim 1, The process of pressurizing the first and second substrates by venting the adapter chamber includes injecting gas or dry air into the adapter chamber before the ascent of the upper stage of the adapter starts before completion. Method of preparation. The method of claim 1, The process of pressurizing the first and second substrates by venting the adapter chamber may raise the upper stage of the adapter and simultaneously inject gas or dry air into the adapter chamber. Way. The method of claim 11, The process of pressurizing the first and second substrates by venting the adapter chamber may include blowing gas or dry air through the vacuum suction groove of the upper stage while raising the upper stage of the adapter chamber. Method for manufacturing a display device. The method of claim 1, The step of pressurizing the first and second substrates by venting the adapter chamber includes: starting gas or dry air injection into the adapter chamber; And a step of raising the upper stage of the cementing machine. The method of claim 13, The step of raising the upper stage of the adapter, the manufacturing method of the liquid crystal display device, characterized in that while blowing the gas or dry air through the vacuum groove of the upper stage of the adapter. The method of claim 1, The process of pressurizing the first and second substrates by venting the adapter chamber comprises injecting gas or dry air into the adapter chamber in two stages. The method of claim 1, The step of venting the adapter chamber includes pressurizing the gap between the bonded first and second substrates to be 5 μm or less. delete The method of claim 1, The unloading process may include loading at least one of a first substrate and a second substrate on which the next bonding process is to be performed on the upper or lower stage and unloading the fixed substrate. Preparing a first substrate and a second substrate on which a liquid crystal is dropped and a substance is formed; Loading the first substrate to the lower stage in the combiner chamber and loading the second substrate to the upper stage in the combiner chamber; Bonding the first and second substrates together; Venting the coalescer chamber to pressurize the coalesced first and second substrates; And Unloading the first and second substrates; In the bonding process, the lower stage is lowered so that the pressure applied to the second substrate is changed in at least two stages from the time when the substance contacts the first substrate to the time when the bonding is completed. Way. The method of claim 19, And aligning the first and second substrates before attaching the first and second substrates.

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