KR20030047005A - Vacuum forming equipment for semiconductor manufacturing equipment having improved exhaust structure - Google Patents
Vacuum forming equipment for semiconductor manufacturing equipment having improved exhaust structure Download PDFInfo
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- KR20030047005A KR20030047005A KR1020010077371A KR20010077371A KR20030047005A KR 20030047005 A KR20030047005 A KR 20030047005A KR 1020010077371 A KR1020010077371 A KR 1020010077371A KR 20010077371 A KR20010077371 A KR 20010077371A KR 20030047005 A KR20030047005 A KR 20030047005A
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- vacuum
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- 239000004065 semiconductor Substances 0.000 title abstract description 13
- 238000004519 manufacturing process Methods 0.000 title abstract description 8
- 238000007666 vacuum forming Methods 0.000 title 1
- 238000000034 method Methods 0.000 claims abstract description 8
- 238000005192 partition Methods 0.000 claims description 11
- 238000005086 pumping Methods 0.000 claims description 4
- 238000000638 solvent extraction Methods 0.000 claims description 2
- 238000004064 recycling Methods 0.000 abstract description 2
- 239000003921 oil Substances 0.000 description 43
- 239000010419 fine particle Substances 0.000 description 5
- 239000010408 film Substances 0.000 description 4
- 238000005461 lubrication Methods 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 230000007613 environmental effect Effects 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 230000007423 decrease Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000005380 borophosphosilicate glass Substances 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D35/00—Filtering devices having features not specifically covered by groups B01D24/00 - B01D33/00, or for applications not specifically covered by groups B01D24/00 - B01D33/00; Auxiliary devices for filtration; Filter housing constructions
- B01D35/14—Safety devices specially adapted for filtration; Devices for indicating clogging
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B37/00—Pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B25/00 - F04B35/00
- F04B37/10—Pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B25/00 - F04B35/00 for special use
- F04B37/14—Pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B25/00 - F04B35/00 for special use to obtain high vacuum
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Compressors, Vaccum Pumps And Other Relevant Systems (AREA)
- Applications Or Details Of Rotary Compressors (AREA)
Abstract
Description
본 발명은 반도체제조설비용 진공설비에 관한 것으로서, 특히, 고 진공을 얻기위한 진공펌프와 가스를 배기시키는 덕트 사이를 연결하는 연결라인 상에 상기 진공펌프의 내부로부터 배출되는 오일이 차서 배기가 잘되지 않아 환경 안전 사고를 유발하게 될 위험성을 해소시키는 개선된 배기구조를 갖는 반도체 제조설비용 진공설비에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a vacuum facility for semiconductor manufacturing equipment, and in particular, the oil discharged from the inside of the vacuum pump is well ventilated on a connection line connecting a vacuum pump for obtaining a high vacuum and a duct for exhausting gas. The present invention relates to a vacuum facility for a semiconductor manufacturing facility having an improved exhaust structure that eliminates the risk of causing an environmental safety accident.
일반적으로 반도체기판에 반도체소자를 위한 일부 구조를 형성한 후 반도체기판의 단차를 줄이기 위한 층간 절연막으로서 적층되거나, 반도체 소자를 위한 최종 금속배선을 형성한 후 보호막으로서 적층되는 BPSG(BOROPHOSILICATE GLASS)막을 형성시키는 것과 같은 박막형성 공정이나 또는 실리콘 기판에 산화막을 형성시키는 열처리공정 등 반도체 소자를 가공하기 위한 공정은 보통 대기압 보다 약간 낮은 압력 조건의 진공챔버에서 이루어지고 있다.Generally, a BPSG (BOROPHOSILICATE GLASS) film is formed by forming a structure for a semiconductor device on a semiconductor substrate and then stacking it as an interlayer insulating film to reduce the step difference of the semiconductor substrate, or forming a final metal wiring for the semiconductor device and then stacking it as a protective film. BACKGROUND OF THE INVENTION Processes for processing semiconductor devices, such as thin film formation processes such as those described above, or heat treatment processes for forming oxide films on silicon substrates, are usually performed in a vacuum chamber at a pressure slightly lower than atmospheric pressure.
도 1은 상술한 바와 같이 진공챔버를 진공 처리하기 위한 진공설비의 구성을 도시한 도면으로서, 도시된 바와 같이 진공챔버(1)의 내부에 고 진공을 형성하도록 펌핑을 실시하는 진공펌프(3)와, 상기 진공펌프(3)를 통해 배기되는 배기가스를 배출시키는 덕트(5)가 배기라인(7)을 매개로 연결되어 있다.1 is a view showing the configuration of a vacuum facility for vacuum processing a vacuum chamber as described above, a vacuum pump (3) for pumping to form a high vacuum inside the vacuum chamber (1) as shown And, the duct 5 for discharging the exhaust gas exhausted through the vacuum pump 3 is connected via the exhaust line (7).
상기 진공펌프(3)는 액체 실링수단으로 오일을 사용하고 동시에 그 오일은 펌프 장치 내를 순환하면서 펌프를 냉각시키고, 베어링 및 각 부품의 윤활 및 기밀을 유지시켜 주는 오일펌프이다.The vacuum pump 3 is an oil pump that uses oil as a liquid sealing means and at the same time the oil cools the pump while circulating in the pump device and maintains lubrication and airtightness of the bearing and each component.
그러나, 상술한 바와 같이 오일을 사용하는 진공펌프를 사용할 경우 배기 압력 등에 의한 요인으로 상기 진공펌프의 내부에서 작용하는 오일이 배기라인(7)으로 배출되어 상기 배기라인(7)을 막게 됨에 따라 진공챔버(1)로부터 배출되는 가스가 상기 덕트(5)로 원활하게 배기되지 못하여 환경 안전 사고를 유발시킬 위험성을 갖게 된다는 문제점이 있다.However, in the case of using the vacuum pump using oil as described above, the oil acting inside the vacuum pump is discharged to the exhaust line 7 due to the exhaust pressure, etc., thereby blocking the exhaust line 7. There is a problem that the gas discharged from the chamber 1 may not be smoothly exhausted into the duct 5 to cause an environmental safety accident.
따라서, 본 발명은 상술한 문제점을 해결하기 위하여 안출 된 것으로서, 본 발명의 목적은 진공펌프의 오일이 배기라인을 통해 배출될 경우 그 오일을 드레인시키도록 하여 배기라인상에 오일이 차게 되는 것을 해소시키는 개선된 배기구조를 갖는 반도체 제조설비용 진공설비를 제공하는 데 있다.Accordingly, the present invention has been made to solve the above problems, the object of the present invention is to drain the oil on the exhaust line when the oil of the vacuum pump is discharged through the exhaust line to eliminate the filling To provide a vacuum facility for semiconductor manufacturing equipment having an improved exhaust structure.
본 발명의 두 번째 목적은 상기와 같이 오일을 드레인 시키도록 함에 따라 그 드레인 된 오일을 재활용할 수 있도록 하는 배기구조가 개선된 반도체 제조설비용 진공설비를 제공하는데 있다.It is a second object of the present invention to provide a vacuum facility for semiconductor manufacturing equipment having an improved exhaust structure for recycling the drained oil as the oil is drained as described above.
상술한 목적을 달성하기 위하여 본 발명은 소정의 공정과정을 진행하는 진공챔버와; 상기 진공챔버에 진공라인을 매개로 연결되어 펌핑동작에 의해 상기 진공챔버의 내부를 진공분위기로 만드는 진공펌프와; 상기 진공라인에 연결되어 상기 오일펌프를 통해 배출되는 배기가스를 배기시키는 배기덕트 및; 상기 진공펌프 및 배기덕트의 사이의 배기라인 상에 설치되어 상기 진공펌프로부터 배출되는 오일을 드레인시키는 오일드레인수단을 포함한다.In order to achieve the above object, the present invention provides a vacuum chamber for performing a predetermined process; A vacuum pump connected to the vacuum chamber via a vacuum line to make the inside of the vacuum chamber into a vacuum atmosphere by a pumping operation; An exhaust duct connected to the vacuum line to exhaust exhaust gas discharged through the oil pump; And oil drain means installed on an exhaust line between the vacuum pump and the exhaust duct to drain oil discharged from the vacuum pump.
상기 오일드레인수단은 상기 배기라인 상에 설치된 복수개의 분기라인을 갖는 연결라인과; 상기 연결라인의 내부 중앙측에 설치된 필터부재와; 상기 필터부재의 하부측에 설치되어 상기 연결라인의 일부를 구획하는 구획판과; 상기 구획판의하부와 접하도록 설치됨과 아울러 그 타단측이 회전 가능하게 결합된 개폐부재 및; 상기 개폐부재 및 상기 연결라인의 일측에 연결되어 상기 개폐부재를 탄력적으로 지지하는 스프링부재를 포함한다.The oil drain means includes a connection line having a plurality of branch lines provided on the exhaust line; A filter member installed at an inner center side of the connection line; A partition plate installed at a lower side of the filter member to partition a portion of the connection line; An opening and closing member which is installed to be in contact with the lower portion of the partition plate and whose other end is rotatably coupled; And a spring member connected to one side of the opening and closing member and the connection line to elastically support the opening and closing member.
도 1은 종래의 반도체제조설비용 진공설비의 구성을 개략적으로 도시한 도면,1 is a view schematically showing the configuration of a vacuum equipment for a conventional semiconductor manufacturing equipment,
도 2은 본 발명의 일 실시 예에 의한 반도체제조설비용 진공설비의 구성을 개략적으로 도시한 도면,2 is a view schematically showing the configuration of a vacuum facility for semiconductor manufacturing equipment according to an embodiment of the present invention,
도 3은 상기 도 2의 A표시부를 확대해서 도시한 도면이다.3 is an enlarged view of the display unit A of FIG. 2.
<도면의 주요 부분에 대한 부호의 설명><Explanation of symbols for the main parts of the drawings>
11 : 진공챔버13 : 배기라인11: vacuum chamber 13: exhaust line
15 : 진공펌프17 : 덕트15 vacuum pump 17 duct
20 : 오일드레인수단21 : 연결라인20: oil drain means 21: connection line
23 : 필터부재25 : 구획판23 filter element 25 partition plate
27 : 스프링부재29 : 개폐부재27: spring member 29: opening and closing member
이하, 첨부된 도면 도 2 및 도 3을 참조로 하여 본 발명의 일 실시 예에 의한 구성 및 작용에 대해서 상세히 설명한다.Hereinafter, with reference to the accompanying drawings, Figures 2 and 3 will be described in detail the configuration and operation according to an embodiment of the present invention.
상기 도면에 도시된 바와 같이 소정의 공정과정을 진행하는 진공챔버(11)와, 상기 진공챔버(11)에 배기라인(13)을 매개로 연결되어 상기 진공챔버(11)의 내부를 고 진공의 상태로 만들도록 펌핑동작을 수행하는 진공펌프(15)와, 상기 진공펌프(15)로부터 펌핑된 배기가스를 배기시키는 덕트(17)로 구성된다.As shown in the figure, a vacuum chamber 11 undergoing a predetermined process and a vacuum line 11 are connected to the vacuum chamber 11 via an exhaust line 13 to allow the inside of the vacuum chamber 11 to have a high vacuum. And a duct 17 for exhausting the pumped exhaust gas from the vacuum pump 15 to perform a pumping operation to bring it into a state.
상기 진공펌프(15)는 액체 실링수단으로 오일을 사용하고 동시에 그 오일은 펌프 장치 내를 순환하면서 펌프를 냉각시키고, 베어링 및 각 부품의 윤활 및 기밀을 유지시켜 주는 오일펌프이다.The vacuum pump 15 is an oil pump that uses oil as a liquid sealing means and at the same time the oil cools the pump while circulating in the pump device and maintains lubrication and airtightness of the bearing and each component.
상기 진공펌프(15) 및 덕트(17)의 사이를 연결하는 배기라인(13)상에는 상기 진공펌프(15)의 내부에 실링작용을 함과 아울러 윤활 작용을 돕는 오일이 배출될 경우 그 오일을 드레인시키도록 오일드레인수단(20)이 설치된다.On the exhaust line 13 which connects between the vacuum pump 15 and the duct 17, the oil is drained when the oil which helps to seal the inside of the vacuum pump 15 and assists in lubrication is discharged. Oil drain means 20 is installed to make.
상기 오일드레인수단(20)은 그 형상이 대략 “Y”자 형상인 두 개의 분기라인을 갖는 연결라인(21)과, 상기 연결라인(21)의 대략 중앙부에 설치되어 상기 진공펌프(15)의 내부로부터 배출되는 오일을 필터링함과 아울러 상기 진공챔버(11)로부터 배기되는 배기가스에 포함된 미세 입자를 통과시키는 필터부재(23)와, 상기필터부재(23)의 하측에 설치되어 상기 필터부재(23)로부터 드레인되는 오일을 받쳐주도록 상기 연결라인(21)의 내부를 일부 구획하는 구획판(25)과, 상기 구획판(25)의 하부와 접하도록 설치됨과 아울러 그 타단측이 회전 가능하게 결합된 개폐부재(29)와,The oil drain means 20 has a connection line 21 having two branch lines having a shape of approximately “Y” shape, and is installed at an approximately center portion of the connection line 21 to provide the vacuum pump 15. A filter member 23 for filtering oil discharged from the inside and allowing fine particles contained in exhaust gas exhausted from the vacuum chamber 11 to pass therethrough, and a filter member 23 disposed below the filter member 23. Partition plate 25 for partially partitioning the interior of the connection line 21 to support the oil drained from the (23), and is installed to contact the lower portion of the partition plate 25 and the other end is rotatable Coupled opening and closing member 29,
상기 개폐부재(29) 및 상기 연결라인(21)의 일측에 연결되어 상기 개폐부재(29)를 탄력적으로 지지하는 스프링부재(27)로 구성된다.It is composed of a spring member 27 connected to one side of the opening and closing member 29 and the connection line 21 to elastically support the opening and closing member 29.
상기 필터부재(23)의 메시(MESH)는 상기 배기가스에 포함된 미세 입자를 통과시키고, 상기 진공펌프(25)로부터 기화되어 배출된 오일가스가 액화된 오일가스입자는 통과시키지 못하는 크기로 함이 바람직 할 것이다.The mesh MESH of the filter member 23 passes through the fine particles contained in the exhaust gas, and the oil gas vaporized and discharged from the vacuum pump 25 does not pass through the liquefied oil gas particles. This would be desirable.
다음은 상술한 바와 같이 구성된 오일드레인수단(20)의 구체적 동작원리에 대해서 설명한다.Next, a detailed operation principle of the oil drain means 20 configured as described above will be described.
먼저, 진공펌프(15)가 펌핑 동작되어 진공챔버(11)의 내부를 고 진공의 상태로 만들게 되면, 상기 진공펌프(15)의 배기 동작에 의해 상기 진공챔버(11)로부터 미세 입자를 포함하는 배기가스가 배기라인(13)을 통해 덕트(17)로 배출된다.First, when the vacuum pump 15 is pumped to bring the interior of the vacuum chamber 11 into a high vacuum state, the vacuum pump 15 includes fine particles from the vacuum chamber 11 by the exhaust operation of the vacuum pump 15. The exhaust gas is discharged to the duct 17 through the exhaust line 13.
그와 같은 동작을 연속적으로 수행하는 동안 상기 진공펌프(15)의 내부에서 작용하고 있던 오일이 기화되어 배기라인(13)을 통해 배출된다.While continuously performing such an operation, the oil acting inside the vacuum pump 15 is vaporized and discharged through the exhaust line 13.
그 기화되어 배출된 오일은 온도저하에 따라 냉각되어 액화상태의 오일덩어리 입자를 이루게 된다.The vaporized and discharged oil is cooled according to the temperature decrease to form liquefied oil mass particles.
따라서, 미세 입자를 포함하는 배기가스 및 액화상태의 오일덩어리가 배기라인(13)을 통해 함께 유동하게 되어 연결라인(21)에 이르게 되면, 그 입자가 작은미세 가스를 포함하는 배기가스는 필터부재(23)를 그대로 통과하거나, 또는 점선 화살표방향을 따라 상기 필터부재(23)를 우회하여 덕트(17)로 배출된다.Therefore, when the exhaust gas containing the fine particles and the oil mass in the liquefied state flow together through the exhaust line 13 to reach the connection line 21, the exhaust gas containing the fine particles of small particles is a filter member. Passed through 23 as it is, or bypassed the filter member 23 in the direction of the dotted arrow is discharged to the duct 17.
한편, 그 입자가 큰 액화상태의 오일은 상기 필터부재(23)를 통과하지 못하고 실선화살표 방향을 따라 드레인된다.On the other hand, the oil of the liquefied state whose particle | grains are large does not pass through the said filter member 23, but is drained along the solid arrow direction.
그 드레인 된 오일은 구획판(25) 및 개폐부재(29)에 의해 소정량 만큼 수용상태를 이루게 되다가 그 양이 많아져 오일의 무게가 스프링부재(27)의 지탱력보다 크게 되면 상기 개폐부재(29)가 상기 구획판(25)으로부터 떨어져 유로가 형성됨으로써 오일이 빠져나가게 된다.The drained oil is accommodated by a predetermined amount by the partition plate 25 and the opening / closing member 29, and the amount thereof increases so that the weight of the oil is greater than the holding force of the spring member 27. 29 is separated from the partition plate 25 so that oil flows out.
그후 다시 오일의 무게가 작아지게 되면 스프링부재(27)의 복원력에 의해 개폐부재(29)는 원래의 상태로 복원되어 다시 구획판(25)과 접하는 상태를 이루어 오일을 소정량 만큼 수용하는 상태를 이루게 된다.Then, when the weight of the oil decreases again, the opening / closing member 29 is restored to its original state by the restoring force of the spring member 27 to come into contact with the partition plate 25 again to accommodate the predetermined amount of oil. Is achieved.
한편, 상기와 같이 드레인 된 오일은 다시 진공펌프(15)로 공급되어 실링목적이나 윤활 목적으로 재활용하게 된다.On the other hand, the oil drained as described above is supplied to the vacuum pump 15 is recycled for sealing purposes or lubrication purposes.
상술한 바와 같이 본 발명은 진공펌프로부터 배출되는 오일을 드레인시키는 오일드레인수단을 마련하여 배기라인 상에 오일이 막혀 배기가스가 원활한 배기동작을 하지 못하게 되어 환경 안전 사고를 유발하게 되는 문제점을 해소시킨다.As described above, the present invention provides an oil drain means for draining the oil discharged from the vacuum pump, thereby solving the problem that the oil is clogged on the exhaust line so that the exhaust gas does not perform smooth exhaust operation and causes an environmental safety accident. .
또한, 상기 진공펌프로부터 배출되는 오일을 드레인하여 다시 진공펌프로 공급하도록 함에 따라 오일 소모량을 줄일 수 있는 이점을 갖는다.In addition, by draining the oil discharged from the vacuum pump to supply to the vacuum pump again has the advantage of reducing the oil consumption.
이와 같이 본 발명의 상세한 설명에서는 구체적인 실시 예에 관해 설명하였으나, 본 발명의 범주에서 벗어나지 않는 한도 내에서 여러 가지 변형이 가능함은 물론이다. 그러므로, 본 발명의 범위는 설명된 실시 예에 국한되어 정해져서는 안되며 후술하는 특허청구범위 뿐만 아니라 이 특허청구범위와 균등한 것들에 의해 정해져야 한다.As described above, in the detailed description of the present invention, specific embodiments have been described. However, various modifications may be made without departing from the scope of the present invention. Therefore, the scope of the present invention should not be limited to the described embodiments, but should be defined by the claims below and equivalents thereof.
Claims (2)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020010077371A KR20030047005A (en) | 2001-12-07 | 2001-12-07 | Vacuum forming equipment for semiconductor manufacturing equipment having improved exhaust structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020010077371A KR20030047005A (en) | 2001-12-07 | 2001-12-07 | Vacuum forming equipment for semiconductor manufacturing equipment having improved exhaust structure |
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| Publication Number | Publication Date |
|---|---|
| KR20030047005A true KR20030047005A (en) | 2003-06-18 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020010077371A KR20030047005A (en) | 2001-12-07 | 2001-12-07 | Vacuum forming equipment for semiconductor manufacturing equipment having improved exhaust structure |
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| Country | Link |
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| KR (1) | KR20030047005A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0599181A (en) * | 1991-10-02 | 1993-04-20 | Hitachi Ltd | Lubricating oil automatic recovery device for dry vacuum pump |
| KR20000002608A (en) * | 1998-06-22 | 2000-01-15 | 윤종용 | Device for preventing oil from evaporating |
| JP2000031074A (en) * | 1998-03-31 | 2000-01-28 | Canon Inc | Exhaust device/method and deposited film forming device/ method |
-
2001
- 2001-12-07 KR KR1020010077371A patent/KR20030047005A/en not_active Application Discontinuation
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0599181A (en) * | 1991-10-02 | 1993-04-20 | Hitachi Ltd | Lubricating oil automatic recovery device for dry vacuum pump |
| JP2000031074A (en) * | 1998-03-31 | 2000-01-28 | Canon Inc | Exhaust device/method and deposited film forming device/ method |
| KR20000002608A (en) * | 1998-06-22 | 2000-01-15 | 윤종용 | Device for preventing oil from evaporating |
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