KR20030043327A - 피시비테스터용 지그의 전원연결장치 - Google Patents
피시비테스터용 지그의 전원연결장치 Download PDFInfo
- Publication number
- KR20030043327A KR20030043327A KR1020010074417A KR20010074417A KR20030043327A KR 20030043327 A KR20030043327 A KR 20030043327A KR 1020010074417 A KR1020010074417 A KR 1020010074417A KR 20010074417 A KR20010074417 A KR 20010074417A KR 20030043327 A KR20030043327 A KR 20030043327A
- Authority
- KR
- South Korea
- Prior art keywords
- jig
- tester
- pcb
- probe
- pattern
- Prior art date
Links
- 239000000523 sample Substances 0.000 claims abstract description 16
- 238000012360 testing method Methods 0.000 description 16
- FPWNLURCHDRMHC-UHFFFAOYSA-N 4-chlorobiphenyl Chemical compound C1=CC(Cl)=CC=C1C1=CC=CC=C1 FPWNLURCHDRMHC-UHFFFAOYSA-N 0.000 description 7
- 238000007689 inspection Methods 0.000 description 6
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000001179 sorption measurement Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 3
- 238000009413 insulation Methods 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
- G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
- G01R1/07328—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support for testing printed circuit boards
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
Description
Claims (1)
- 테스터의 상면에 각 단자와 연결되게 복수열의 콘택핀을 설치하고 지그의 일측에는 상기 콘택핀이 끼워져 전기적으로 통하여지도록 도전층을 갖는 통공을 형성하며 상기 통공과 프로브사이에는 와이어역할을 하는 패턴을 형성하여 각 프로브에 테스터의 전원이 인가되도록 구성된 것을 특징으로 하는 피시비테스터용 지그의 전원연결장치.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020010074417A KR20030043327A (ko) | 2001-11-27 | 2001-11-27 | 피시비테스터용 지그의 전원연결장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020010074417A KR20030043327A (ko) | 2001-11-27 | 2001-11-27 | 피시비테스터용 지그의 전원연결장치 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR2020010036754U Division KR200265959Y1 (ko) | 2001-11-28 | 2001-11-28 | 피시비테스터용 지그의 전원연결장치 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20030043327A true KR20030043327A (ko) | 2003-06-02 |
Family
ID=29571718
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020010074417A KR20030043327A (ko) | 2001-11-27 | 2001-11-27 | 피시비테스터용 지그의 전원연결장치 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR20030043327A (ko) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100582925B1 (ko) * | 2005-02-22 | 2006-05-23 | (주)티아이에스코리아 | 인쇄회로기판의 전기적 검사용 지그 |
TWI818976B (zh) * | 2019-04-12 | 2023-10-21 | 博計電子股份有限公司 | 低壓降電子負載連接裝置 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60227175A (ja) * | 1984-04-25 | 1985-11-12 | Fujitsu Ltd | プリント板の試験方法 |
KR19980024658U (ko) * | 1996-10-31 | 1998-07-25 | 김광호 | 테스트 지그 |
KR19990002747A (ko) * | 1997-06-23 | 1999-01-15 | 윤종용 | 복수의 전원배선이 형성된 검사용 기판 |
JPH11118829A (ja) * | 1997-10-14 | 1999-04-30 | Linear Circuit:Kk | プリント基板の検査用アタッチメント |
JP2000187044A (ja) * | 1998-10-12 | 2000-07-04 | Alps Electric Co Ltd | 測定器用プロ―ブ装置 |
-
2001
- 2001-11-27 KR KR1020010074417A patent/KR20030043327A/ko not_active Application Discontinuation
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60227175A (ja) * | 1984-04-25 | 1985-11-12 | Fujitsu Ltd | プリント板の試験方法 |
KR19980024658U (ko) * | 1996-10-31 | 1998-07-25 | 김광호 | 테스트 지그 |
KR19990002747A (ko) * | 1997-06-23 | 1999-01-15 | 윤종용 | 복수의 전원배선이 형성된 검사용 기판 |
JPH11118829A (ja) * | 1997-10-14 | 1999-04-30 | Linear Circuit:Kk | プリント基板の検査用アタッチメント |
JP2000187044A (ja) * | 1998-10-12 | 2000-07-04 | Alps Electric Co Ltd | 測定器用プロ―ブ装置 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100582925B1 (ko) * | 2005-02-22 | 2006-05-23 | (주)티아이에스코리아 | 인쇄회로기판의 전기적 검사용 지그 |
TWI818976B (zh) * | 2019-04-12 | 2023-10-21 | 博計電子股份有限公司 | 低壓降電子負載連接裝置 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US9329227B2 (en) | Method and apparatus for testing interconnection reliability of a ball grid array on a testing printed circuit board | |
US6870381B2 (en) | Insulative covering of probe tips | |
CN101231322B (zh) | 集成电路开路/短路的测试连接方法 | |
CN212749137U (zh) | 具有可配置探头固定装置的测试设备 | |
KR20090082783A (ko) | Eds 공정용 프로브 카드 어셈블리 | |
JP5351171B2 (ja) | 回路ボードアッセンブリ及び誤挿入検出装置 | |
US6054720A (en) | Apparatus and method for evaluating the surface insulation resistance of electronic assembly manufacture | |
KR200265959Y1 (ko) | 피시비테스터용 지그의 전원연결장치 | |
US6326797B2 (en) | Apparatus and method for evaluating printed circuit board assembly manufacturing processes | |
KR20030043327A (ko) | 피시비테스터용 지그의 전원연결장치 | |
KR20090031663A (ko) | 기판 검사 방법 및 기판 검사 장치 | |
KR20110087539A (ko) | 프로브 카드 및 이의 제조방법 | |
JPH0829475A (ja) | 実装基板検査装置のコンタクトプローブ | |
CN201051111Y (zh) | 刺穿式探针 | |
JP2000074991A (ja) | 半導体チップ用パッケージの良否検査方法及びその装置とこれに用いるプローブピン構造 | |
KR101350793B1 (ko) | 인쇄회로기판 통전 검사 지그 | |
JP2008060162A (ja) | ランドパターンの設計の適否を試験する実装試験装置及びその実装試験方法 | |
KR20090058862A (ko) | 반도체 패키지 테스트 보드 | |
TWI385391B (zh) | 高效率和高準確度之測試治具 | |
JPH1038970A (ja) | 検査治具および自動検査装置 | |
JP6733199B2 (ja) | 検査装置、検査方法及び検査プログラム | |
KR0176519B1 (ko) | Qep, ic의 검사 장치 및 검사 방법 | |
KR100421662B1 (ko) | 인쇄 회로 기판의 회로 시험용 단자의 구조 | |
JP2591453B2 (ja) | バーンインボード検査装置およびバーンインボード検査方法 | |
KR200457867Y1 (ko) | 인쇄회로기판 테스트 장치 및 그 탐침구조 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
PA0109 | Patent application |
Patent event code: PA01091R01D Comment text: Patent Application Patent event date: 20011127 |
|
PA0201 | Request for examination | ||
PG1501 | Laying open of application | ||
E902 | Notification of reason for refusal | ||
PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20030930 Patent event code: PE09021S01D |
|
E601 | Decision to refuse application | ||
PE0601 | Decision on rejection of patent |
Patent event date: 20040126 Comment text: Decision to Refuse Application Patent event code: PE06012S01D Patent event date: 20030930 Comment text: Notification of reason for refusal Patent event code: PE06011S01I |