KR20030041692A - Anisotropic conductive films with enhanced adhesion - Google Patents
Anisotropic conductive films with enhanced adhesion Download PDFInfo
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- KR20030041692A KR20030041692A KR1020010072756A KR20010072756A KR20030041692A KR 20030041692 A KR20030041692 A KR 20030041692A KR 1020010072756 A KR1020010072756 A KR 1020010072756A KR 20010072756 A KR20010072756 A KR 20010072756A KR 20030041692 A KR20030041692 A KR 20030041692A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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- Macromonomer-Based Addition Polymer (AREA)
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Abstract
Description
본 발명은 이방성 도전필름에 관한 것으로, 보다 상세하게는 빛에 장시간 노출되어도 물성에 변화를 받지 않는 것을 특징으로 하는 이방성 도전 필름에 관한 것이다.The present invention relates to an anisotropic conductive film, and more particularly, to an anisotropic conductive film, characterized in that the physical properties do not change even when exposed to light for a long time.
일반적으로 전자 패키징(packaging) 기술은 반도체 소자에서부터 최종제품 까지의 모든 단계를 포함하는 매우 광범위하고 다양한 시스템 제조 기술이며, 최종 전자제품의 성능, 크기, 가격, 신뢰성 등을 결정하는 매우 중요한 기술이다. 최근 전자 패키징에서는 회로의 미세 간극화와 접속 밀도의 증가에 따라 많은 수의 좁은 간격을 가진 전극을 한 번에 접속시킬 필요성이 증가하고 있다.In general, electronic packaging technology is a very wide variety of systems manufacturing technology including all stages from semiconductor devices to final products, and is a very important technology for determining performance, size, price, reliability, etc. of final electronic products. In recent years, in electronic packaging, the necessity of connecting a large number of narrow-gap electrodes at one time has increased as the circuits have finer gaps and increase in connection density.
이에 따라 LCD 패키징에서는 다중접속 회로라인(ex. FPC, flexible printed circuit)과 글래스 디스플레이(glass display)와의 기계적, 전기적 접속용으로 전도성 접착제가 이용되고 있으며 그 중에서도 특히 이방성 도전필름(anisotropic conductive film)이 주로 사용되고 있다.Accordingly, in LCD packaging, conductive adhesives are used for mechanical and electrical connection between multiple printed circuit lines (ex. FPC, flexible printed circuits) and glass displays. Among them, anisotropic conductive films are particularly used. Mainly used.
전도성 접착제는 크게 이방성 도전필름, 등방성 도전접착제(isotropicconductive adhesive) 등의 제품형태가 있으며, 기본적으로 Ni, Ag, Ni/고분자(Polymer) 등의 도전성 입자와 열경화성/열가소성의 절연성 레진(insulating resin)으로 구성되어 있다.Conductive adhesives are mainly in the form of anisotropic conductive films and isotropicconductive adhesives.They are basically conductive particles such as Ni, Ag, Ni / Polymer, and thermosetting / thermoplastic insulating resins. Consists of.
이방성 도전필름은 도전입자와 절연성 접착제로 구성되어 있는데 전기적 전도 역할을 하는 도전 입자로는 초기에 카본 파이버를 사용하였으며 그 후 솔더볼(solder ball)이 쓰였다가 니켈볼(nickel ball)이나 은볼(silver ball)이 그 뒤를 이어 현재까지 사용되고 있다. 은이 사용되는 이유는 가격이 적당하고 전기 전도도가 높으며 화학안정성이 좋아서 도전입자로 사용하기 용이한 점이 많으나 전기적 이온 이동의 문제를 수반하고 있다. 니켈은 낮은 가격과 비교적 좋은 전기 전도도를 가지고 있으나 고온고습한 상태에 노출될 경우 표면에서 부식이 일어나거나 산화가 되는 등의 문제점이 있다.The anisotropic conductive film is composed of conductive particles and an insulating adhesive. Carbon conductive particles were initially used as conductive particles for electric conduction, and then solder balls were used, followed by nickel balls or silver balls. ) Is followed by now. The reason why silver is used is that it is easy to use as a conductive particle due to its reasonable price, high electrical conductivity and good chemical stability, but it is accompanied with the problem of electrical ion migration. Nickel has a low price and relatively good electrical conductivity, but when exposed to high temperature and high humidity conditions, there is a problem such as corrosion or oxidation on the surface.
또한, 종래의 절연성 접착제는 접착력이 600 ~ 800g/cm로서 인쇄회로기판과 유연성 기판 사이의 결합력이 약해지는 문제점이 있으며 빛에 장시간 노출된 경우 물성에 변화를 받게 되는 문제점이 있다.In addition, the conventional insulating adhesive has a problem that the bonding strength between the printed circuit board and the flexible substrate is weakened as the adhesive strength is 600 ~ 800g / cm, and there is a problem that the physical properties are changed when exposed to light for a long time.
본 발명은 상기와 같은 문제점을 해결하기 위하여 창작된 것으로서, 본 발명의 목적은 이방성 도전필름의 다른 물성에 대해 저하를 가져오지 않으면서 낮은 온도, 짧은 시간에서부터 높은 온도, 긴시간에 걸쳐 현저한 접착력의 증가를 가져오는 결합력이 강화된 이방성 도전필름을 제공하는 것이다.The present invention has been made to solve the above problems, and an object of the present invention is to provide a remarkable adhesion force over a low temperature, a short time to a high temperature, and a long time without bringing about a decrease in other physical properties of the anisotropic conductive film. It is to provide an anisotropic conductive film with enhanced bonding force that leads to an increase.
상기와 같은 본 발명의 목적은 반도체 제품의 접착용으로 사용되는 이방성도전필름에 있어서, 에폭시 고분자 수지 37 중량부, 우레탄 변성에폭시 수지 12 중량부, 톨루엔 30 중량부, 메틸에틸케톤 15 중량부, 니켈 3.5 중량부, 2,2'-azo-bis-isobutyronitrile(AIBN) 1 중량부, 이관능성 우레탄아크릴레이트 1 중량부 및 tert-amyl peroxybenzoate 0.5 중량부로 구성되는 것을 특징으로 하는 접착력이 우수한 이방성 도전필름에 의하여 달성된다.The above object of the present invention is an anisotropic conductive film used for bonding semiconductor products, 37 parts by weight of epoxy polymer resin, 12 parts by weight of urethane-modified epoxy resin, 30 parts by weight of toluene, 15 parts by weight of methyl ethyl ketone, nickel 3.5 parts by weight, 1 part by weight of 2,2'-azo-bis-isobutyronitrile (AIBN), 1 part by weight of difunctional urethane acrylate, and 0.5 part by weight of tert-amyl peroxybenzoate. Is achieved.
즉, 본 발명에서는 이관능성 우레탄 아크릴레이트(difunctional urethane acrylate) 경화시스템을 사용하여 종래의 이방성 도전필름 보다 높은 접착력을 구현하였다.That is, in the present invention, using a difunctional urethane acrylate curing system to achieve a higher adhesion than the conventional anisotropic conductive film.
본 발명의 그 밖의 목적, 특정한 장점 및 신규한 특징들은 이하의 발명의 상세한 설명과 바람직한 실시예로부터 더욱 분명해질 것이다.Other objects, specific advantages and novel features of the present invention will become more apparent from the following detailed description of the invention and the preferred embodiments.
이하 본 발명에 따른 접착력이 우수한 이방성 도전필름의 구성에 대하여 설명하기로 한다.Hereinafter, the configuration of the anisotropic conductive film excellent in the adhesive force according to the present invention will be described.
상기 접착력이 우수한 이방성 도전필름은 에폭시 고분자 수지 37 중량부, 우레탄 변성에폭시 수지 12 중량부, 톨루엔 30 중량부, 메틸에틸케톤 15 중량부, 니켈 3.5 중량부, 2,2'-azo-bis-isobutyronitrile(AIBN) 1 중량부, 이관능성 우레탄아크릴레이트(difunctional urethane acrylate) 1 중량부 및 tert-amyl peroxybenzoate 0.5 중량부로 구성되어 있다.The anisotropic conductive film excellent in adhesion strength is 37 parts by weight of epoxy polymer resin, 12 parts by weight of urethane modified epoxy resin, 30 parts by weight of toluene, 15 parts by weight of methyl ethyl ketone, 3.5 parts by weight of nickel, 2,2'-azo-bis-isobutyronitrile (AIBN) 1 part by weight, 1 part by weight of difunctional urethane acrylate (difunctional urethane acrylate) and tert-amyl peroxybenzoate 0.5 part by weight.
본 발명에 사용된 고분자 아크릴은 akzo novel社의 상품명 Actilane 120TP25로서 이관능성 우레탄 아크릴레이트(difunctional urethane acrylate)이며 분자량이 1600으로 아크릴 모노머 중에서는 분자량이 높은 편에 속하여 가교반응을 통해 높은 접착력을 구현하게 된다.The polymer acryl used in the present invention is a product name of Actilane 120TP25 by akzo novel, which is a difunctional urethane acrylate and has a molecular weight of 1600. do.
퍼옥사이드(peroxide)는 많은 개시제 중에서 가장 널리 이용되고 있다. 이들은 열과 압력에 대한 안정성이 부족하여 일정 온도에서 라디칼(radical)로 분해된다. 본 발명에서 사용한 과산화물은 tert-Amyl peroxybenzoate로서 이는 열적 균형분해반응을 거쳐 퍼옥시 라디칼이 형성된다.Peroxides are the most widely used among many initiators. They lack stability to heat and pressure and decompose into radicals at constant temperatures. The peroxide used in the present invention is tert-Amyl peroxybenzoate, which is thermally balanced to form peroxy radicals.
이러한 퍼옥시 라디칼(peroxy radical)은 본 발명의 핵심인 고분자아크릴에 부가되어 화학적 가교를 통해 접착력을 내게 된다. 이 외에 퍼옥시 라디칼들은 재결합, 이산화탄소로의 분해 및 라디칼 결합과 같은 다양한 반응을 통해 소모된다. 또한, 이러한 퍼옥시 라디칼들은 이방성 도전필름(Anisotropic conductive film)을 구성하는 다른 조성물들과는 반응하지 않으므로 이방성 도전필름의 다른 물성에는 전혀 영향을 주지 않는다.These peroxy radicals are added to the polymer acryl, which is the core of the present invention, to give adhesion through chemical crosslinking. In addition, peroxy radicals are consumed through various reactions such as recombination, decomposition into carbon dioxide and radical bonding. In addition, these peroxy radicals do not react with other compositions constituting the anisotropic conductive film, and thus do not affect other physical properties of the anisotropic conductive film.
이와 같이 이방성 도전필름에 고분자아크릴 경화시스템을 사용하여 접착력이 현저히 증가된 이방성 도전필름을 만들 수 있다.As described above, an anisotropic conductive film having a significantly increased adhesive strength can be made by using a polymer acrylic curing system for the anisotropic conductive film.
이하 상기와 같은 구성을 갖는 본 발명에 따른 접착력이 우수한 이방성 도전필름의 실시예에 대하여 설명하기로 한다.Hereinafter, an embodiment of an anisotropic conductive film having excellent adhesive strength according to the present invention having the configuration as described above will be described.
<비교예 1>Comparative Example 1
비교예 1에서는 2-ethylhexyl acrylate 1중량부를 배합하여 이방성 도전필름을 제조하였으며, 본딩 조건(온도와 시간변수)별로 30개씩 ITO-TCP(indium tin oxide - tape carrier package) 간에 본딩하여 접착력을 측정하였다. 표 1, 2에서는 그 배합비율과 본딩 시간과 온도에 따른 접착력 측정결과를 나타내었다.In Comparative Example 1, an anisotropic conductive film was prepared by mixing 1 part by weight of 2-ethylhexyl acrylate, and bonding strength was measured by bonding 30 pieces of ITO-TCP (indium tin oxide-tape carrier package) according to bonding conditions (temperature and time variables). . Tables 1 and 2 show the results of the measurement of adhesive strength according to the blending ratio, bonding time and temperature.
(1) 에폭시 고분자 수지 : KDU-651. 국도화학 제품(1) Epoxy polymer resin: KDU-651. Kukdo Chemical Products
(2) 우레탄 변성에폭시 수지 : UME-315. 국도화학 제품(2) Urethane modified epoxy resin: UME-315. Kukdo Chemical Products
(3) 2,2'-azo-bis-isobutyronitrile : aldrich catalog no.44, 109-0(3) 2,2'-azo-bis-isobutyronitrile: aldrich catalog no.44, 109-0
(4) 2-ethylhexyl acrylate : aldrich catalog no.01760(4) 2-ethylhexyl acrylate: aldrich catalog no.01760
(5) tert-amyl peroxybenzoate : aldrich catalog no.44, 146-5(5) tert-amyl peroxybenzoate: aldrich catalog no.44, 146-5
*압력은 2.5MPa로 고정* Pressure is fixed at 2.5MPa
*접착력의 단위는 gf/cm임* The unit of adhesion is gf / cm
*push-pull gauge로 측정* Measured by push-pull gauge
표 2에서 나타난 바와 같이 종래의 이방성 도전필름의 접착력은 600 ~ 800g/cm으로 측정되었으며, 온도와 시간에 대한 의존성을 갖는 것으로 나타났다. 즉, 온도가 높을수록 시간이 길수록 접착력은 향상되는 것으로 나타났다. 또한 접속저항 측정결과는 0.5 ~ 0.8Ω이므로 도전성은 충분한 것으로 판단된다.As shown in Table 2, the adhesive force of the conventional anisotropic conductive film was measured to be 600 ~ 800g / cm, appeared to have a dependency on temperature and time. That is, the higher the temperature, the longer the adhesion was found to improve. In addition, the connection resistance measurement result is 0.5 ~ 0.8Ω, the conductivity is judged to be sufficient.
<실시예 1><Example 1>
본 발명에 따른 실시예 1에서는 고분자 아크릴-퍼옥사이드 경화시스템을 도입한 배합으로 이방성 도전필름을 제조하였으며, 본딩 조건(온도와 시간변수)별로 30개씩 ITO-TCP(indium tin oxide - tape carrier package) 간에 본딩하여 접착력을 측정하였다. 표 3, 4에서는 그 배합비율과 본딩 시간과 온도에 따른 접착력 측정결과를 나타내었다.In Example 1 according to the present invention, an anisotropic conductive film was prepared by incorporating a polymer acryl-peroxide curing system, and 30 pieces of ITO-TCP (indium tin oxide-tape carrier package) for each bonding condition (temperature and time variables). Adhesion was measured by bonding to the liver. Tables 3 and 4 show the results of the measurement of adhesive force according to the blending ratio, bonding time and temperature.
(1) 에폭시 고분자 수지 : KDU-651. 국도화학 제품(1) Epoxy polymer resin: KDU-651. Kukdo Chemical Products
(2) 우레탄 변성에폭시 수지 : UME-315. 국도화학 제품(2) Urethane modified epoxy resin: UME-315. Kukdo Chemical Products
(3) 2,2'-azo-bis-isobutyronitrile : aldrich catalog no.44, 109-0(3) 2,2'-azo-bis-isobutyronitrile: aldrich catalog no.44, 109-0
(4) 이관능성 우레탄 아크릴레이트 : AKZO NOBEL 제품(4) Bifunctional urethane acrylate: AKZO NOBEL products
(5) tert-amyl peroxybenzoate : aldrich catalog no.44, 146-5(5) tert-amyl peroxybenzoate: aldrich catalog no.44, 146-5
*압력은 2.5MPa로 고정* Pressure is fixed at 2.5MPa
*접착력의 단위는 gf/cm임* The unit of adhesion is gf / cm
*push-pull gauge로 측정* Measured by push-pull gauge
표 4에서 나타난 바와 같이, 종래의 이방성 도전필름의 접착력은 450 ~ 800g/cm인데 비해 본 발명에 따른 이방성 도전필름의 접착력은 다양한 온도와 시간의 범위 내에서 1700g/cm 이상으로 현저히 향상되었다. 또한 접속저항 측정결과도 0.5 ~ 0.8Ω이므로 도전성 또한 충분한 것으로 판단된다.As shown in Table 4, the adhesive strength of the conventional anisotropic conductive film is 450 ~ 800g / cm, the adhesive strength of the anisotropic conductive film according to the present invention is significantly improved to 1700g / cm or more within a range of temperature and time. In addition, the connection resistance measurement result is 0.5 ~ 0.8Ω, so the conductivity is also considered to be sufficient.
상기 언급한 바와 같이 본 발명에 따른 접착력이 우수한 이방성 도전필름에 의하면, 낮은 온도, 짧은 시간에서부터 높은 온도, 긴시간에 걸쳐 접착력이 종래에대비하여 현저하게(약 3배 정도) 증가되는 효과가 있다.As mentioned above, according to the anisotropic conductive film having excellent adhesive strength according to the present invention, the adhesive strength is significantly increased (about 3 times) as compared to the prior art during low temperature, short time to high temperature, and long time. .
비록 본 발명이 상기 언급된 바람직한 실시예와 관련하여 설명되어졌지만, 발명의 요지와 범위로부터 벗어남이 없이 다양한 수정이나 변형을 하는 것이 가능하다. 따라서 첨부된 특허청구범위는 본 발명의 요지에 속하는 이러한 수정이나 변형을 포함한다.Although the present invention has been described in connection with the above-mentioned preferred embodiments, it is possible to make various modifications or variations without departing from the spirit and scope of the invention. Accordingly, the appended claims include such modifications and variations as fall within the spirit of the invention.
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| JP2001126541A (en) * | 1999-10-28 | 2001-05-11 | Sumitomo Bakelite Co Ltd | Anisotropic-conductive film and electric/electronic parts |
| JP4635287B2 (en) * | 1999-12-07 | 2011-02-23 | 株式会社ブリヂストン | Anisotropic conductive film |
| JP2001164210A (en) * | 1999-12-13 | 2001-06-19 | Sumitomo Bakelite Co Ltd | Anisotropic conductive film and electronic equipment using the same |
| KR100341316B1 (en) * | 1999-12-16 | 2002-06-22 | 권문구 | Low temperature curable anisotropic conductive film for bonding circuit |
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