CN216864055U

CN216864055U - Conductive adhesive film with exposed copper foil

Info

Publication number: CN216864055U
Application number: CN202220082761.6U
Authority: CN
Inventors: 吕文坛
Original assignee: Shenzhen Hesheng Xingye Technology Co ltd
Current assignee: Shenzhen Hesheng Xingye Technology Co ltd
Priority date: 2022-01-13
Filing date: 2022-01-13
Publication date: 2022-07-01
Anticipated expiration: 2032-01-13

Abstract

The utility model provides a conductive adhesive film with an exposed copper foil, which comprises conductive adhesive release paper, a conductive adhesive layer, a copper foil and a matte black mylar adhesive layer which are sequentially laminated; the side edge of the copper foil protrudes out of the covering area of the matt black mylar adhesive layer to form a cantilever type structure, and at least one die cutting notch is formed in the cantilever type structure; the copper foil at the bottom of the die-cutting notch is flush with the matte rye glue drawing layer and the conductive glue layer; through the cooperation that has conductive adhesive layer and copper foil, with the stability of the whole electric conductivity of improvement conductive adhesive film, expose the copper foil simultaneously, can improve its holistic ground connection stability, and can lead the volatile substance of conductive adhesive layer to the cantilever type structural discharge of copper foil under high temperature environment or humid environment, and increased conductive adhesive film's sol volume, make conductive adhesive layer and copper foil, it is inseparabler that the combination is between copper foil and the dumb rye rubber drawing layer, be difficult to peel off, further improve its electric connection stability.

Description

Conductive adhesive film with exposed copper foil

Technical Field

The utility model relates to the technical field of conductive adhesive films, in particular to a conductive adhesive film with an exposed copper foil.

Background

The conductive adhesive film provides mechanical and electrical connection between the device and the circuit board, and thus is gradually and widely used in various electronic fields such as microelectronic packaging, printed circuit boards, conductive circuit bonding, and the like.

At present, a conventional conductive adhesive film generally includes a conductive adhesive layer, wherein the conductive adhesive layer has conductive particles therein, and the conductive adhesive film is adhered between conductors, and one surface of the conductive adhesive film is adhered to one of the conductors, and the other surface of the conductive adhesive film is adhered to the other conductor, so as to achieve conduction between the conductors. However, in the process of implementing the utility model, the inventor finds that the prior art has at least the following problems: due to the influence of factors such as stress, climate and the like, the volume or the shape of the substrate of the conductive adhesive film is easy to change gradually or suddenly, so that the stacking state of the conductive particles in the conductive adhesive film is easy to change, the conductive path in the conductive adhesive film is easy to change, the conduction effect of the conductive adhesive film and the ground layer of the circuit board is not ideal, and the grounding stability of the conductive adhesive film is poor; and the adhesive layer may creep and deform in long-term use, resulting in inaccurate adhesion, so a conductive adhesive film with better grounding property and less variation of conductive performance by shape is needed.

SUMMERY OF THE UTILITY MODEL

Aiming at the problems that the adhesive layer in the technology can creep and deform in long-term use, so that the adhesion is inaccurate; and the grounding performance is poor; provides a technical scheme for solving the problem.

In order to achieve the purpose, the utility model provides a conductive adhesive film with an exposed copper foil, which comprises conductive adhesive release paper, a conductive adhesive layer, a copper foil and a matte black mylar adhesive layer which are sequentially laminated; the side edge of the copper foil protrudes out of the covering area of the matte black mylar adhesive layer to form a cantilever type structure, and at least one die cutting notch is formed in the cantilever type structure; the bottom of cross cutting breach the copper foil with mute black mylar glue film, conductive adhesive layer parallel and level.

Preferably, one side of the conductive adhesive release paper, which is far away from the conductive adhesive layer, is also provided with a silica gel protective film.

Preferably, the conductive adhesive release paper part protrudes out of the conductive adhesive layer to form a hand tearing position.

Preferably, the thickness of the silica gel protective film is 0.02-0.03 mm.

Preferably, the thickness of the conductive adhesive layer is 0.05-0.06 mm.

Preferably, the copper foil and the conductive adhesive layer have the same thickness.

Preferably, the thickness of the dumb rye tensile layer is 0.05-0.06 mm.

The beneficial effects of the utility model are: the utility model provides a conductive adhesive film with an exposed copper foil, which comprises conductive adhesive release paper, a conductive adhesive layer, a copper foil and a matte black mylar adhesive layer which are sequentially laminated; the side edge of the copper foil protrudes out of the covering area of the matt black mylar adhesive layer to form a cantilever type structure, and at least one die cutting notch is formed in the cantilever type structure; the copper foil at the bottom of the die-cutting notch is flush with the matte rye glue drawing layer and the conductive glue layer; through the cooperation that has conductive adhesive layer and copper foil, with the stability of the whole electric conductivity of improvement conductive adhesive film, expose the copper foil simultaneously, can improve its holistic ground connection stability, and can lead the volatile substance of conductive adhesive layer to the cantilever type structural discharge of copper foil under high temperature environment or humid environment, and increased conductive adhesive film's sol volume, make conductive adhesive layer and copper foil, it is inseparabler that the combination is between copper foil and the dumb rye rubber drawing layer, be difficult to peel off, further improve its electric connection stability.

Drawings

FIG. 1 is a cross-sectional view of the present invention;

FIG. 2 is an exploded view of the present invention;

fig. 3 is a top view of the present invention.

The main element symbols are as follows:

1. conductive adhesive release paper; 11. a hand tearing position;

2. a conductive adhesive layer;

3. copper foil; 31. a cantilever structure; 311. die cutting a notch;

4. a matte black mylar layer;

5. and (5) a silica gel protective film.

Detailed Description

In order to more clearly describe the present invention, the present invention will be further described with reference to the accompanying drawings.

In the following description, details of general examples are given to provide a more thorough understanding of the present invention. It is to be understood that the described embodiments are merely exemplary of the utility model, and not restrictive of the full scope of the utility model. It should be understood that the specific embodiments are illustrative of the utility model and are not to be construed as limiting the utility model.

It will be understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or groups thereof.

The present invention provides a conductive adhesive film with an exposed copper foil, please refer to fig. 1-3; the conductive adhesive release paper comprises conductive adhesive release paper 1, a conductive adhesive layer 2, a copper foil 3 and a dumb rye glue drawing layer 4 which are sequentially laminated; wherein, the side edge of the copper foil protrudes out of the covering area of the dumb black mylar glue layer to form a cantilever type structure 31, and at least one die cutting notch 311 is arranged on the cantilever type structure 31; the bottom copper foil of the die-cutting notch is flush with the matte black mylar adhesive layer and the conductive adhesive layer. In the prior art, a puncture type film layer is probably adopted to realize more stable electric conduction, but the preparation is easy to cause poor performance, and the stress is concentrated, so that the bonding of a conductive adhesive layer is easy to crack and gap at a hole, thereby influencing the electric conduction performance; the conductive adhesive layer on the bottom layer of the copper foil can be completely adhered to the copper foil, so that the tolerance of the cantilever type structure size can be used during production and preparation, and the production difficulty is reduced; meanwhile, the edge of the conductive adhesive layer can be formed by non-cutting and curing the coating colloid, so that the combination stability is greatly improved, and the stability and the conductivity of the whole conductive adhesive film are improved. The die cutting notch can play a role in positioning in the production process, and can be oriented and attached when in use, so that the whole structure is wider in application range and can be used under complex conditions.

In the embodiment, a silica gel protective film 5 is further arranged on one side of the conductive adhesive release paper 1 away from the conductive adhesive layer 2; the protection of the transportation process is achieved through the transparent silica gel protective film, more swing spaces can be provided for the cantilever type structure of the copper foil, and the integrity of products in the transportation process is improved.

In the embodiment, the conductive adhesive release paper 1 partially protrudes out of the conductive adhesive layer to form a hand tearing position 11; the convenience of customers tears when using, and the position of position is in the one side of keeping away from cantilever type structure is torn to the hand simultaneously.

In this embodiment, the thickness of the silicone protective film is 0.02 to 0.03 mm. Preferably, the thickness of the conductive adhesive layer is 0.05-0.06 mm; the conductive adhesive is an adhesive which has certain conductivity after being cured or dried. It can connect multiple conductive materials together to form an electrical path between the connected materials. In the electronics industry, conductive adhesives have become an indispensable new material. Preferably, the copper foil and the conductive adhesive layer have the same thickness. Preferably, the thickness of the matte black mylar layer is 0.05 to 0.06 mm. The matt black mylar PET is a poly terephthalic acid plastic, mainly comprises poly terephthalic acid (PET) and poly terephthalic acid diester (PBT) PET, has high symmetry of molecular structure and certain crystal orientation capability, and therefore has high film forming property and formation property.

The utility model has the advantages that:

through the cooperation that has conductive adhesive layer and copper foil, with the stability of the whole electric conductivity of improvement conductive adhesive film, expose the copper foil simultaneously, can improve its holistic ground connection stability, and can lead the volatile substance of conductive adhesive layer to the cantilever type structural discharge of copper foil under high temperature environment or humid environment, and increased conductive adhesive film's sol volume, make conductive adhesive layer and copper foil, it is inseparabler that the combination is between copper foil and the dumb rye rubber drawing layer, be difficult to peel off, further improve its electric connection stability.

The above disclosure is only for a few specific embodiments of the present invention, but the present invention is not limited thereto, and any variations that can be made by those skilled in the art are intended to fall within the scope of the present invention.

Claims

1. A conductive adhesive film with an exposed copper foil is characterized by comprising conductive adhesive release paper, a conductive adhesive layer, a copper foil and a matte black mylar adhesive layer which are sequentially laminated; the side edge of the copper foil protrudes out of the covering area of the matte black mylar adhesive layer to form a cantilever type structure, and at least one die cutting notch is formed in the cantilever type structure; the bottom of cross cutting breach the copper foil with mute black mylar glue film, conductive adhesive layer parallel and level.

2. The adhesive conductive film with an exposed copper foil as claimed in claim 1, wherein a silicone protective film is further disposed on a side of the release paper away from the adhesive conductive layer.

3. The adhesive conductive film with an exposed copper foil as claimed in claim 2, wherein the release paper portion of the adhesive conductive film protrudes from the adhesive conductive layer to form a hand-tearing position.

4. The adhesive film of claim 2, wherein the thickness of the silicone protective film is 0.02-0.03 mm.

5. The adhesive conductive film with an exposed copper foil as claimed in claim 1, wherein the adhesive conductive layer has a thickness of 0.05-0.06 mm.

6. The adhesive film of claim 5, wherein the copper foil and the adhesive layer have the same thickness.

7. The conductive adhesive film with an exposed copper foil as claimed in claim 1, wherein the thickness of the matte black mylar layer is 0.05-0.06 mm.