KR100341316B1 - Low temperature curable anisotropic conductive film for bonding circuit - Google Patents
Low temperature curable anisotropic conductive film for bonding circuit Download PDFInfo
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- KR100341316B1 KR100341316B1 KR1019990058304A KR19990058304A KR100341316B1 KR 100341316 B1 KR100341316 B1 KR 100341316B1 KR 1019990058304 A KR1019990058304 A KR 1019990058304A KR 19990058304 A KR19990058304 A KR 19990058304A KR 100341316 B1 KR100341316 B1 KR 100341316B1
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- anisotropic conductive
- conductive film
- low temperature
- resin
- temperature
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- 239000003822 epoxy resin Substances 0.000 claims abstract description 7
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 7
- 150000002978 peroxides Chemical class 0.000 claims abstract description 5
- 229920005989 resin Polymers 0.000 claims description 14
- 239000011347 resin Substances 0.000 claims description 14
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 7
- 239000003795 chemical substances by application Substances 0.000 claims description 7
- 239000000203 mixture Substances 0.000 claims description 6
- DBCAQXHNJOFNGC-UHFFFAOYSA-N 4-bromo-1,1,1-trifluorobutane Chemical compound FC(F)(F)CCCBr DBCAQXHNJOFNGC-UHFFFAOYSA-N 0.000 claims description 4
- STVZJERGLQHEKB-UHFFFAOYSA-N ethylene glycol dimethacrylate Substances CC(=C)C(=O)OCCOC(=O)C(C)=C STVZJERGLQHEKB-UHFFFAOYSA-N 0.000 claims description 4
- YIVJZNGAASQVEM-UHFFFAOYSA-N Lauroyl peroxide Chemical compound CCCCCCCCCCCC(=O)OOC(=O)CCCCCCCCCCC YIVJZNGAASQVEM-UHFFFAOYSA-N 0.000 claims description 3
- 125000003236 benzoyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C(*)=O 0.000 claims description 2
- 239000002313 adhesive film Substances 0.000 abstract description 11
- 239000000853 adhesive Substances 0.000 abstract description 5
- 230000001070 adhesive effect Effects 0.000 abstract description 5
- 229920001187 thermosetting polymer Polymers 0.000 abstract description 5
- 239000004925 Acrylic resin Substances 0.000 abstract description 4
- 229920000178 Acrylic resin Polymers 0.000 abstract description 4
- 239000002184 metal Substances 0.000 abstract description 4
- 229910052751 metal Inorganic materials 0.000 abstract description 4
- 239000000843 powder Substances 0.000 abstract description 4
- -1 azo compound Chemical class 0.000 abstract description 3
- 230000002950 deficient Effects 0.000 abstract 1
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 9
- 238000001723 curing Methods 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 3
- 238000013035 low temperature curing Methods 0.000 description 3
- 230000000704 physical effect Effects 0.000 description 3
- 238000005303 weighing Methods 0.000 description 3
- XFCMNSHQOZQILR-UHFFFAOYSA-N 2-[2-(2-methylprop-2-enoyloxy)ethoxy]ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCCOC(=O)C(C)=C XFCMNSHQOZQILR-UHFFFAOYSA-N 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 2
- 229920000459 Nitrile rubber Polymers 0.000 description 2
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- KUBDPQJOLOUJRM-UHFFFAOYSA-N 2-(chloromethyl)oxirane;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical compound ClCC1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 KUBDPQJOLOUJRM-UHFFFAOYSA-N 0.000 description 1
- HWSSEYVMGDIFMH-UHFFFAOYSA-N 2-[2-[2-(2-methylprop-2-enoyloxy)ethoxy]ethoxy]ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCCOCCOC(=O)C(C)=C HWSSEYVMGDIFMH-UHFFFAOYSA-N 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 229920000468 styrene butadiene styrene block copolymer Polymers 0.000 description 1
- 238000007725 thermal activation Methods 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
- C08L33/10—Homopolymers or copolymers of methacrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
Abstract
본 발명은 전자부품의 상회로와 하회로를 결합하여 고정시키고 전기적으로 접속시켜 주는 회로접착용 저온 경화 이방성 전도필름에 관한 것으로, 종래의 열경화성 에폭시 수지로 이루어진 도전성 접착필름에서 접착시 접착온도를 높게 하거나 시간이 길어져 전자부품의 불량율이 높아지는 문제점을 해결하기 위하여 아크릴 수지를 포함하는 활성 접착제와, 아크릴 수지를 경화시킬 수 있는 과산화물과 아조 화합물, 그리고 도전성을 부여하는 금속분말로 구성되며, 상기 과산화물과 아조 화합물의 무게함량 성분은 아크릴 수지의 0.1 - 30%로 하여 낮은 온도 및 접착시간을 줄여 제품수율을 높이도록 한다.The present invention relates to a low-temperature hardening anisotropic conductive film for bonding circuits by combining the upper circuit and the lower circuit of an electronic component to fix and electrically connect the same. The present invention provides a high adhesive temperature upon adhesion in a conductive adhesive film made of a conventional thermosetting epoxy resin. In order to solve the problem of increasing the defective rate of electronic components due to a long time, the active adhesive comprising an acrylic resin, a peroxide and azo compound capable of curing the acrylic resin, and a metal powder to impart conductivity, the peroxide and The weight component of the azo compound is 0.1-30% of the acrylic resin to reduce the low temperature and adhesion time to increase the product yield.
Description
본 발명은 저온 경화가 가능한 도전성 접착 필름 조성물에 관한 것으로, 상세하게는 전자부품의 상(上)회로와 하(下)회로를 결합하여 고정시키고 전기적으로 접속시켜 주는 회로접착용 저온 경화 이방성 전도필름에 관한 것이다.The present invention relates to a conductive adhesive film composition that can be cured at low temperatures, and in particular, a low temperature cured anisotropic conductive film for bonding a circuit to which an upper circuit and a lower circuit of an electronic component are fixed and electrically connected. It is about.
전자 부품의 크기와 두께가 점점 작아지고 얇아짐에 따라 회로의 밀도와 정교함은 더욱 높아졌다. 이러한 전자부품의 상회로와 하회로를 물리적으로 접속, 고정시키기 위하여 처음에는 접착제로써 스티렌-부타디엔-스티렌 블럭 혼성 중합체 또는 기준 중합체 같은 것들로 구성된 열가소성 수지 구성물이 접착 필름으로써 간편하게 사용되어 왔다.As the size and thickness of electronic components become smaller and thinner, the density and sophistication of the circuits become higher. In order to physically connect and fix the upper and lower circuits of such electronic components, a thermoplastic resin composition composed of styrene-butadiene-styrene block copolymers or reference polymers as an adhesive has been conveniently used as an adhesive film.
그러나, 접착재료가 사용되는 분야가 점점 확산됨에 따라 내열, 내습에 대한 요구와 미세회로의 적용성 및 접착 강도를 향상시켜 신뢰성을 개선하는 것이 요구되어 왔다.However, as the field of use of the adhesive material is gradually spreading, there has been a demand for improving the reliability by improving the demand for heat and moisture resistance, the applicability of the microcircuit, and the adhesive strength.
이와 같은 요구에 대하여 열가소성 수지 구성물로 조성된 접착필름으로는 만족될 수 없기 때문에 경화 작용이 가능한 열경화성 수지 구성물로 이루어진 접착필름이 사용되고 있다. 일반적으로 이러한 열경화성 접착 필름은 열 경화성 수지인 에폭시 수지와 경화를 시켜주는 경화제로 이루어져 왔다.(한국특허공고 93-2935)In order to meet such demands, an adhesive film composed of a thermoplastic resin component is not used, and thus an adhesive film made of a thermosetting resin component capable of curing can be used. In general, such a thermosetting adhesive film has been composed of an epoxy resin, which is a thermosetting resin, and a curing agent for curing (Korean Patent Publication 93-2935).
그러나. 이러한 열경화성 에폭시 수지는 경화가 충분히 일어나서 일반적인 도전성 접착필름의 역할을 하기 위해서는 충분한 열량을 가하여 주어야만 한다. 이렇게 충분한 열량을 가하기 위해서는 접착시 접착온도를 높게 하거나 시간을 길게 하는 방법이 있을 수 있다.But. Such a thermosetting epoxy resin should be given a sufficient amount of heat in order for curing to occur sufficiently to serve as a general conductive adhesive film. In order to apply sufficient calories, there may be a method of increasing the adhesion temperature or lengthening time during adhesion.
그러나, 전자부품의 상회로와 하회로의 전기적 접속, 물리적 접착에 너무 높은 온도나 긴 시간을 가했을 때 크게 세 가지의 문제점을 야기시킨다.However, when too high a temperature or a long time is applied to the electrical connection and physical bonding between the upper circuit and the lower circuit of the electronic component, three major problems are caused.
첫째, 너무 높은 온도에서의 접착조건은 열을 가해 주는 히팅바에 무리를 초래하여 히팅바의 내구성에 영향을 미친다.First, adhesion conditions at too high a temperature cause a heating bar to heat, which affects the durability of the heating bar.
둘째, 높은 온도에서의 접착조건은 상,하회로를 포함하는 접착하고자 하는 전자 부품자체에 무리가 가서 제품의 불량률을 높게 가져 갈 수 있다.Second, the adhesion conditions at high temperatures can lead to a high failure rate of the product to go to the electronic component itself to be bonded, including the upper and lower circuits.
셋째, 너무 긴 접착시간은 공정상의 제품수율을 낮게 한다.Third, too long adhesion time results in low product yields in the process.
따라서, 본 발명은 상술한 문제점을 해결하고자 안출된 것으로, 낮은 온도와 짧은 시간하에서 전자부품의 상,하회로를 전기적 접속 및 물리적 접착이 가능한 접착필름을 제공하는 것을 그 목적으로 한다.Accordingly, an object of the present invention is to provide an adhesive film capable of electrically connecting and physically connecting upper and lower circuits of electronic components at low temperatures and short time periods.
상기 목적을 달성하기 위한 본 발명에 따른 회로 접착용 이방성 전도필름은, 에폭시 수지 70wt%와 에틸렌 글리콜 디메타크릴레이트 수지 30wt%로 구성된 수지 혼합물 100 중량부와, 라우로일 퍼옥사이드 및 벤조일 퍼옥사이트의 과산화물로부터 선택된 1종의 경화제 0.1 내지 30 중량부와, 소정량의 니켈 분말로 구성된 것이 바람직하다.The anisotropic conductive film for circuit bonding according to the present invention for achieving the above object, 100 parts by weight of a resin mixture consisting of 70 wt% epoxy resin and 30 wt% ethylene glycol dimethacrylate resin, lauroyl peroxide and benzoyl peroxite It is preferable that it consists of 0.1-30 weight part of 1 type of hardening | curing agents selected from the peroxide of this, and a predetermined amount nickel powder.
또한, 본 발명의 저온 경화 이방성 전도필름은 열활성화 온도가 60 - 130℃가 되는 것이 바람직하다.In addition, the low temperature curing anisotropic conductive film of the present invention is preferably a thermal activation temperature is 60-130 ℃.
또한, 본 발명의 저온 경화 이방성 전도 필름을 구성하는 아크릴 수지인 에틸렌 글리콜 디메타크릴레이트 수지는 모노-, 디-, 트리-에틸렌 글리콜 디메타크릴레이트 수지를 포함한다.Moreover, ethylene glycol dimethacrylate resin which is an acrylic resin which comprises the low temperature hardening anisotropic conductive film of this invention contains mono-, di-, tri- ethylene glycol dimethacrylate resin.
또한, 본 발명의 저온 경화 이방성 전도필름을 구성하는 경화제인 과산화물은 10시간 반감기 온도가 100℃ 미만인 것이 바람직하다.Moreover, it is preferable that the peroxide which is a hardening agent which comprises the low temperature hardening anisotropic conductive film of this invention has a half life temperature of less than 100 degreeC for 10 hours.
아울러, 본 발명의 저온 경화 이방성 전도필름을 구성하는 금속분말은 10미크론 이하의 크기를 갖는 니켈 분말인 것이 바람직하다.In addition, the metal powder constituting the low temperature curing anisotropic conductive film of the present invention is preferably a nickel powder having a size of 10 microns or less.
이하, 본 발명의 실시예를 통해 본 발명을 상세히 설명한다.Hereinafter, the present invention will be described in detail through embodiments of the present invention.
실시예1.Example 1
베코폭스 이피 401(비스페놀 A형 에폭시 수지, 비아노바 레진스사)과 에틸렌 글리콜 디메타크릴레이트 수지(알드리치사)를 무게비로 70 : 30으로 혼합하고 톨루엔 중의 40% 용액으로 만들었다. 여기에 수지 혼합물 100 중량부에 대해 경화제인 라우로일 퍼옥사이드(알드리치사) 15 중량부와 도전성을 부여하는 5미크론의 니켈 금속분말 5 중량부을 넣고 잘 섞어주었다. 이렇게 만든 용액을 PET 필름(50미크론) 상에 25미크론으로 코팅하고 80℃에서 3분간 건조시킨 후 물성을 평가하였다.Bépofox Epi 401 (bisphenol A epoxy resin, Vianova resin) and ethylene glycol dimethacrylate resin (Aldrich) were mixed in a weight ratio of 70:30 and made into a 40% solution in toluene. 15 parts by weight of lauroyl peroxide (Aldrich), which is a curing agent, and 5 parts by weight of a 5 micron nickel metal powder to impart conductivity were added to 100 parts by weight of the resin mixture and mixed well. The solution thus prepared was coated with 25 microns on a PET film (50 microns) and dried at 80 ° C. for 3 minutes to evaluate physical properties.
4㎎의 접착필름을 무게를 달아 DSC(퍼킨 엘머 DSC 7) 상에서 10℃/분의 속도로 상승시켜 얻은 발열량의 피크 온도는 85℃이었다.The peak temperature of the calorific value obtained by weighing 4 mg of the adhesive film and raising it at a rate of 10 ° C / min on DSC (Perkin Elmer DSC 7) was 85 ° C.
실시예2.Example 2.
베코폭스 이피401(비스페놀 A형 에폭시 수지, 비아노바 레진스사)과 디에틸렌 글리콜 디메타크릴레이트(알드리치사)를 무게비로 70 : 30으로 혼합하고 톨루엔 중의 40% 용액으로 만들었다.Bépofox Epi 401 (bisphenol A epoxy resin, Vianova resin) and diethylene glycol dimethacrylate (Aldrich) were mixed in a weight ratio of 70:30 and made into a 40% solution in toluene.
여기에 수지 혼합물 100 중량부에 대해 경화제인 벤조일 퍼옥사이드(알드리치사) 20 중량부와, 도전성을 부여하는 5미크론의 니켈 금속분말 10 중량부을 넣고 잘 섞어주었다. 이렇게 만든 용액을 PET 필름(50미크론) 상에 25미크론으로 코팅하고 80℃에서 3분간 건조시킨 후 물성을 평가하였다.20 weight part of benzoyl peroxide (Aldrich) which is a hardening | curing agent with respect to 100 weight part of resin mixtures, and 10 weight part of 5 micron nickel metal powders which give electroconductivity were mixed, and it mixed well. The solution thus prepared was coated with 25 microns on a PET film (50 microns) and dried at 80 ° C. for 3 minutes to evaluate physical properties.
5.2㎎의 접착필름을 무게를 달아 DSC(퍼킨 엘머 DSC7) 상에서 10℃/분의 속도로 상승시켜 얻은 발열량의 피크온도는 97℃이었다.The peak temperature of the calorific value obtained by weighing 5.2 mg of the adhesive film and rising on a DSC (Perkin Elmer DSC7) at a rate of 10 ° C / min was 97 ° C.
비교예.Comparative example.
에피코테(Epikote) 1002 (비스페놀형 에폭시 수지), 니폴(Nipol)1072 (카르복실-변성 니크릴 고무, 니뽄게온사)를 무게비로 70 : 30으로 혼합하고 톨루엔 중의 40% 용액으로 만들었다. 여기에 수지 혼합물 100 중량부에 대해 경화제인 HX-3742(변성 이미다졸을 가교된 폴리우레탄으로 코팅 및 마이크로 캡슐화하여 액체 에폭시 수지에 분산시켜 제조된 분산액, 아사히 케미컬사) 25 중량부와, 도전성을 부여하는 구형인 유연성 에폭시 수지의 경화 생성물의 표면을 무전해 도금하여 얻은 5.2 미크론의 도전볼 10 중량부을 잘 섞어 주었다.Epikote 1002 (bisphenol-type epoxy resin) and Nipol 1072 (carboxyl-modified nitrile rubber, Nipponeon Co.) were mixed at a weight ratio of 70:30 and made into a 40% solution in toluene. 25 parts by weight of HX-3742 (a dispersion prepared by coating and microencapsulating a modified imidazole with a crosslinked polyurethane and dispersed in a liquid epoxy resin, Asahi Chemical Co., Ltd.) as a curing agent based on 100 parts by weight of the resin mixture, 10 parts by weight of the 5.2 micron conductive balls obtained by electroless plating the surface of the cured product of the spherical flexible epoxy resin to be imparted were mixed well.
이렇게 만든 용액을 폴리 프로필렌 필름(50미크론) 상에 코팅하고 90℃에서 15분간 건조시킨 후 물성을 평가하였다.The solution thus prepared was coated on a polypropylene film (50 micron) and dried at 90 ° C. for 15 minutes to evaluate physical properties.
1.5㎎의 접착 필름을 무게를 달아 DSC(듀퐁1090) 상에서 10℃/분의 속도로 상승시켜 얻은 발열량의 피크 온도는 148℃이었다.The peak temperature of the calorific value obtained by weighing a 1.5 mg adhesive film and raising it at a rate of 10 ° C / min on DSC (Dupont 1090) was 148 ° C.
실시예1,2와 비교예에서 얻어진 발열량의 피크온도를 대비하여 보면, 실시예 1,2의 발열량 피크온도는 각각 85℃, 97℃인 반면, 비교예의 발열량 피크온도는 148℃로서 51 - 63℃의 온도하감의 결과를 볼 수 있다.Comparing the peak temperatures of the calorific values obtained in Examples 1 and 2 and the comparative example, the calorific value peak temperatures of Examples 1 and 2 were 85 ° C and 97 ° C, respectively, while the calorific value peak temperature of the comparative example was 148 ° C. The result of the temperature fall of ℃ can be seen.
상술한 바와 같이 본 발명의 저온 경화용 이등방 전도필름에 의하면, 낮은 온도와 짧은 시간하에서 전자부품의 상,하회로에 대한 전기적 접속 및 물리적 접착이 가능함으로써 접착하고자 하는 전자 부품자체에 무리를 줄여 제품수율을 개선시키는 효과를 제공한다.As described above, according to the anisotropic conductive film for low temperature curing, the electrical connection and physical adhesion to the upper and lower circuits of the electronic component are possible under low temperature and short time, thereby reducing the burden on the electronic component itself to be bonded. Provides the effect of improving product yield.
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100423237B1 (en) * | 2001-11-21 | 2004-03-18 | 엘지전선 주식회사 | Anisotropic conductive films with enhanced adhesion |
| KR100477914B1 (en) * | 2001-12-28 | 2005-03-18 | 제일모직주식회사 | Resin Composition for Anisotropic Adhesive Having Conductivity |
| KR100527990B1 (en) * | 2001-11-30 | 2005-11-09 | 미쯔이카가쿠 가부시기가이샤 | Paste for circuit connection, anisotropic conductive paste and uses thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| KR20030037017A (en) * | 2001-11-01 | 2003-05-12 | 엘지전선 주식회사 | Anisotropic conductive adhesive film |
| KR20030041572A (en) * | 2001-11-20 | 2003-05-27 | 엘지전선 주식회사 | Anisotropic conductive films using acrylate-modified polyurethane |
| KR100673778B1 (en) | 2005-08-19 | 2007-01-24 | 제일모직주식회사 | Fast curable anisotropic conductive film composition, anisotropic conductive film using the composition and method for fabricating the same |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100423237B1 (en) * | 2001-11-21 | 2004-03-18 | 엘지전선 주식회사 | Anisotropic conductive films with enhanced adhesion |
| KR100527990B1 (en) * | 2001-11-30 | 2005-11-09 | 미쯔이카가쿠 가부시기가이샤 | Paste for circuit connection, anisotropic conductive paste and uses thereof |
| KR100477914B1 (en) * | 2001-12-28 | 2005-03-18 | 제일모직주식회사 | Resin Composition for Anisotropic Adhesive Having Conductivity |
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