KR20030031831A - Glass temporary fixing member and glass temporary fixing method - Google Patents

Abstract

PURPOSE: To provide a glass temporary fastening member which eliminates the need for an in-process stagnation period for a primer treatment to glass and for curing of the adhesives of a double coated adhesive tape and yields high-reliability adhesive portions which do not give rise to slippage by the load of the glass and a class temporary fastening method. CONSTITUTION: The glass temporary fastening member 10 which is bonded to the glass 19 and temporarily fastens the glass to an engaging section 18a of another member 18 has a locking section 3 to be locked to the engaging member of the other member, a base section 2 existing on the root side of the locking section and facing the glass and a hot melt resin 5 arranged in the base section.

Description

GLASS TEMPORARY FIXING MEMBER AND GLASS TEMPORARY FIXING METHOD}

The present invention relates to a glass temporary fixing member and a glass temporary fixing method, and more particularly, to a glass temporary fixing member and a glass temporary fixing method used when fixing glass such as a rear side window of an automobile to a window frame.

It is a figure which shows the location where the temporary fixing member for temporarily fixing glass to the rear side window frame of a motor vehicle is used. The glass of the rear side window does not open and close after being fixed to the main body. When fixing the glass to the main body, the glass is temporarily fixed using a glass temporary fixing member.

FIG. 7: is a figure explaining the process of temporarily fixing the glass 119 to the rear side window frame 118. As shown in FIG. 8 and 9 are perspective views showing the glass temporary fixing member. The glass temporary fixing member 110 is comprised from the clip part 113, the base 112, and the double-sided tape 115. As shown in FIG. One side of the double-sided tape 115 is adhered to the base 112, and the other side is adhered to the glass.

In FIG. 7, the glass 119 is bonded to the double-sided tape adhered to the base of the glass temporary fixing member 110 and temporarily fixed to the window frame 118. The glass temporary fixing member 110 is provided with a clip portion 113 that is elastically deformable to be caught by the hole 118a of the window frame. The clip portion 113 is elastically deformed so as to exit the hole diameter when inserted into the hole 118a, and restored after the exit, thereby realizing a latch.

By the above structure, the glass of the rear side window can be temporarily fixed easily. Thereafter, the peripheral edge portion of the glass is pressed against the edge portion by a molten material of vinyl chloride, and fixed by caulking treatment. As a result, the glass is provided for use as a rear side window with the glass temporary fixing member attached. The glass temporary fixing member is not visible from the outside because the glass is fixed to the peripheral portion of the glass so that the inside of the glass is not visible.

However, in the case where the glass temporary fixing member is used, it is necessary to apply a primer treatment to the surface of the glass and the adhesive surface of the temporary fixing member in order to reliably adhere the heavy glass with the double-sided tape. In addition, even if the primer treatment is applied to glass, it is not possible to proceed to the next step in the period until the adhesive strength of the double-sided tape is maximized. This residence time is up to 24 hours in the long case. For this reason, it will stay in the state of a manufactured product, and productivity will be restrict | limited greatly. In addition, since the caulking which fixes the glass completely requires a considerable period of time to completely solidify, during this time, the acrylic foam constituting the base of the double-sided tape is deformed and shifted by the weight of the glass, resulting in misalignment of the glass. For this reason, the rear side window which is inferior to glass position precision is formed.

The present invention does not require a fabrication retention period for primer treatment on a glass or hardening of a double-sided tape adhesive, and also provides a glass temporary fixing member and a glass temporary to obtain a highly reliable adhesive portion that does not cause misalignment by glass load. It is an object to provide a fixing method.

1 is a partial cross-sectional perspective view showing a glass temporary fixing member in an embodiment of the present invention.

2 is a front view of a glass temporary fixing member viewed from the resin side for dielectric heating bonding.

3 is a perspective view of a glass temporary fixing member as seen from the clip side;

4 is a perspective view from the side of the glass temporary fixing member of FIG.

5 is a cross-sectional view of the glass attached to the window frame by the glass temporary fixing member of FIG.

6 is a view showing a location where a glass temporary fixing member is used in an automobile;

7 is a view for explaining a conventional method for temporarily fixing a glass by using a glass temporary fixing member.

8 is a perspective view of a conventional glass temporary fixing member viewed from a double-sided tape side;

9 is a perspective view of a conventional glass temporary fixing member viewed from the clip side;

Explanation of symbols on the main parts of the drawings

2-base 2a-convex

3-Clip 5-Resin for dielectric heating adhesive

10-Glass Temporary Lock 18-Window Frame

18a-Hole in the window frame 19-Glass

The glass temporary fixing member of the present invention is a glass temporary fixing member that is bonded to glass and temporarily fixes the glass to another member. This glass temporary fixing member is provided below the locking part and the locking part which hang on another member, and can be provided with the hot melt resin arrange | positioned at the base and the base which face glass (claim 1).

The hot melt resin is melted by heating, and easily fuses with the glass surface or the base surface, and can achieve good adhesion with the surface of the adherend even without a primer treatment. For this reason, a base can be formed from arbitrary materials which emphasized intensity | strength, for example, engineering plastics, such as a metal, polybutylene terephthalate (PBT), and acryl butadiene styrene (ABS). As a result, it is possible to prevent the base from being deformed by the weight of the glass from the temporary fixing to the end of the main fixing. In addition, the above hot melt resin can be obtained by cooling after hot melting to obtain the original adhesive strength without giving a period. For this reason, the situation where a product stays in the state of a manufactured product until adhesive strength becomes optimal can be avoided. As a result, it is possible to improve the production efficiency and to improve the production yield, thereby reducing the manufacturing cost.

In said glass temporary fixing member, the convex part of predetermined height can be formed in the area | region of the base with a hot melt resin (claim 2).

This configuration can avoid the situation where the glass and the base adhere to each other as much as the molten adhesive resin layer is removed. When heat-melting and bonding, the thickness of the adhesive resin layer is left in the base by the height of the convex part. For this reason, the thickness of the adhesive resin layer can be adjusted by adjusting the height of a convex part. Therefore, by adjusting the thickness of the resin for bonding with high precision, it becomes possible to temporarily fix glass with high manufacturing yield.

In the glass temporary fixing member described above, the hot melt resin can be a resin for dielectric heating bonding (claim 3).

According to this configuration, the hot melt resin can be heated mainly by high frequency induction in heating the hot melt resin. For this reason, energy saving is realized and the base and the locking portion of the glass temporary fixing member are not damaged by heating. In addition, the work space is also reduced, and the need for high-temperature work or the like is eliminated. For this reason, it becomes possible to maintain the work environment similar to the conventional work environment.

The glass temporary fixing method of this invention is a glass temporary fixing method of temporarily fixing glass to another member using the glass temporary fixing member containing resin for dielectric heat bonding. The glass temporary fixing method includes a step of setting the position of the glass to bond the resin for dielectric heating bonding, and a force on the glass temporary fixing member to press the resin for dielectric heating bonding of the glass temporary fixing member to the bonding position of the glass. In addition, a step of high-frequency dielectric heating of the portion of the bonding position is provided (claim 4).

According to this temporary fixing method, the glass can be temporarily fixed easily and reliably, and sufficient cooling strength is obtained after cooling. For this reason, it is not necessary to hold the manufactured product until the adhesive strength is improved, so that the production efficiency can be greatly improved. Two-color shaping | molding method etc. can be used for adhesion | attachment of said resin for dielectric heat bonding adhesives to the glass temporary fixing member.

Embodiment of the Invention

EMBODIMENT OF THE INVENTION Next, embodiment of this invention is described using drawing.

(1) Structure of glass temporary fixing member

1 is a partial cross-sectional perspective view of a glass temporary fixing member in an embodiment of the present invention. The glass temporary fixing member 10 includes a base portion 2 spread in a planar shape, a latch portion 3 extending to intersect the surface of the base portion, and a resin for dielectric heating adhesion, which is a hot melt resin applied on the base portion 2. ). Moreover, the base part 2 is provided with the convex part 2a which protrudes toward the resin 5 for dielectric heating bonding. 2 is a front view seen from the side of the dielectric heating adhesive layer. As shown in FIG. 2, it is preferable that this convex part 2a is arrange | positioned so that at least 3 may not line up in a straight line. However, it does not necessarily need to be three or more, and it may be any as long as the space between glass can be maintained without difficulty. For example, one convex portion having a flat top portion having a predetermined area or more may be used.

3 is a perspective view of the glass temporary fixing member viewed from the engaging portion side. 4 is a perspective view seen from the side of the glass temporary fixing member of FIG. The locking portion 3 and the base 2 are preferably made of engineering plastic, and are preferably processed by an integral molding process from the viewpoint of not generating stress concentration points. In addition, it is preferable to attach the resin 5 for dielectric heating bonding to the base 2 by two-color molding. By this two-color molding, the resin 5 for dielectric heating bonding can be attached to the convex part 2a and also to the planar part of a base. The shape of the locking part 3 is not limited to the thing of FIG. 3 and FIG. 4, Any shape may be sufficient as it is a shape which can be hooked to the window frame hole of a motor vehicle.

FIG. 5: is sectional drawing which showed the state which stuck by the glass temporary fixing member of this embodiment to the glass 19, and inserted the locking part 3 in the hole 18a of the window frame 18 of a motor vehicle. It can be seen that the dielectric heating adhesive layer 5 having the same thickness as the height of the convex portion 2a is formed to bond the glass and the base.

By using the glass temporary fixing member described above, the glass can be easily adhered to the temporary fixing member, and the locking portion can be inserted into the hole of the window frame so that the glass can be easily hooked. The biggest characteristic in the said embodiment is that the resin for dielectric heat bonding which is a hot-melt resin was used for the contact bonding layer. For this reason, after melt-heating and adhering, it becomes possible to immediately send to a next process, without rectifying a manufactured product.

(2) Hot Melt Resin

In the present embodiment, the resin for dielectric heating bonding is used as the hot melt resin. However, in the present invention, any resin can be used as long as it is a resin that is once melted by heating and cooled to room temperature. However, since the resin for dielectric heating bonding is easy to heat and has good workability, it is very suitable for use as a glass temporary fixing member.

The resin for dielectric heating bonding used in the present invention contains 1 to 30 vol% of a conductive material having a volume resistivity of 10 ⁻² Pa · cm or less in a polyolefin resin having a melting point of 80 ° C. to 200 ° C., at a frequency of 40 MHz. A resin composition for high frequency bonding comprising a resin as a main component, wherein the dielectric loss tangent is 0.03 or more. Moreover, it is preferable that it is a resin composition for high frequency adhesions whose dielectric loss tangent is 0.05 or more. The volume resistivity of the conductive material is 10 ⁻⁴ Pa · cm or less, and more preferably 5% by volume or more of the resin composition for high frequency bonding.

As the conductive material used in the resin for dielectric heating bonding, iron, copper, silver, carbon fiber, carbon black and the like having a volume resistivity of 10 ⁻² Pa · cm or less are used. Among these, iron-based conductors and carbon fibers are preferable in terms of the influence on the resin and economical efficiency. As a volume resistivity, 10 ^-4 Pa.cm or less is preferable, and so-called iron, (alpha) iron, (beta) iron, (gamma) iron, carbon steel, etc. are not specifically limited. As content, 1-30 volume% is needed, Preferably 5-25 volume% is required. In particular, the effect of heating the resin for dielectric heating bonding by dielectric heating from 7% by volume or more is remarkably large. If the conductive material is 1% by volume or less, it is not preferable because the amount of heat generated is insufficient and a long time is required to rise to the adhesive temperature. Moreover, since adhesive force falls at 30 volume% or more, it is unpreferable. The shape may be powder, needle shape, scale shape, net shape, or the like, and is selected according to the shape of the adhesive bed or the like. From a viewpoint which can cope with any shape, Preferably powder form is preferable. In the case of powder form, needle form, and scale form, it is often used to penetrate. Moreover, in a net shape, it is used by laminating | stacking or insert molding. In addition, the size of the heat generating element is preferably 60 mesh passes when used in a winch. By lowering the volume resistivity by containing more than 1% by volume, in particular 5% by volume, of the conductive material, the reason is not yet clear, but the dielectric power factor becomes large when the high frequency voltage is applied. Grows When applying a high frequency, a large dielectric loss coefficient increases the heating rate due to the large amount of heat generated, and shortens the process since the hot melt adhesive melts in a short time.

Induction heating is for generating an eddy current or the like in a conductor which is a heating object by electromagnetic induction and generating heat by resistance, and dielectric heating uses internal frictional heat generated by polarization by applying a voltage to a nonconductor. Internal friction is measured as a dielectric loss tangent. The resistivity is very small, and therefore, a conductor having a very small dielectric loss tangent of 0.0001 or less is incorporated into a resin having a dielectric loss tangent of 0.01 to 0.03, for example, a polyolefin resin, and the dielectric loss tangent of 0.03 or more is not known until now.

The resin having a melting point of 80 ° C. to 200 ° C., for example, a polyolefin-based resin, which is used for the above dielectric heating adhesive resin, is particularly preferably composed of these copolymers as the main component in terms of adhesiveness. The melting point is preferably 80 ° C. or higher, preferably 90 ° C. or higher in view of the adhesive strength at high temperature, and it is not preferable because the melting point may take time to melt the adhesive when the melting point is 180 ° C. or higher, particularly 200 ° C. or higher. When adhering with glass, it is preferable to contain a coupling agent having a silanol group and a reactive functional group introduced by the terminal or modification of the resin in order to improve the adhesiveness. γ-aminopropyltriethoxysilane, β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane, γ-methacryloxypropyltrimethoxysilane, N. β- (aminoethyl) -γ-aminopropyltrimethoxysilane is mentioned as an example.

As polyolefin resin, what consists of at least 1 sort (s) chosen from copolymer polypropylene type, copolymer polyethylene type, ethylene and a propylene copolymer, ethylene propylene diene type, and ethylene- alpha olefin type resin is preferable. Moreover, it is preferable that 3-50 mol% of vinyl acetate, methyl methacrylate, ethyl acrylate, butyl acrylate, methacrylic acid, acrylic acid, methacrylate, etc. are copolymerized as a monomer component in order to improve adhesiveness. Moreover, it is especially preferable that the monomer containing anhydrous carboxylic acid group, an epoxy group, a hydroxyl group, and an isocyanate group is copolymerized or graft-polymerized. Copolymerization of an unsaturated carboxylic acid monomer or glycidyl methacrylate and graft modification of maleic anhydride are preferable. The introduction of this functional group improves the stabilization of the silanol compound and the adhesion of the reinforced thermoplastic resin.

In the present invention, the material to be bonded to which the above dielectric heating adhesive resin is used is a material constituting the glass temporary fixing member, for example, a glass of a counterpart to which a resin, in particular, an engineering plastic and a glass temporary fixing member are bonded. . As a material which comprises a glass temporary fixing member, any of ceramics, a metal, etc. other than the said resin may be sufficient, It does not specifically limit. As resin, it can be a to-be-adhered body also about any of thermosetting resin and a thermoplastic resin. In the case of using the above dielectric heating adhesive resin, since only the adhesive layer is selectively heated, a thermoplastic resin having a melting point of 200 ° C. or lower may be used as the adherend. It is preferable to introduce a functional group into the polyolefin resin by the adhesive to increase the adhesive strength.

In the resin for dielectric heating bonding, the conductive material is melt-mixed with a resin having a melting point of 80 ° C. to 200 ° C., for example, a polyolefin-based resin in advance by an extruder, a kneader or a roll, or the resin is molded into a sheet shape. It is provided by lamination, sandwich molding or injection molding by inserting a net heating element into a mold. There is no particular restriction on the type of extruder, kneader or roll used, or mixing conditions.

Moreover, you may add a compatible additive, a hydrolysis agent, and a pigment to the composition for dielectric heat bonding. As a heat stabilizer, a hindered phenol type, a thioether type, a phosphite type, etc., and these combination are mentioned. As a weathering agent, carbon black, benzophenone, a triazole type, a hindered amine type, etc. are mentioned. Moreover, carbodiimide, bisoxazoline, an epoxy, an isocyanate compound is mentioned as a hydrolysis agent. Moreover, as a pigment, the compatible heat-resistant pigment of polyolefin resin is used.

(3) Bonding method

Next, the procedure to adhere | attach glass is demonstrated. First, the resin 5 for dielectric heating bonding of the glass temporary fixing member shown in FIG. 1 is arrange | positioned so that it may contact with glass. At this time, it is laminated as (base resin of glass temporary fixing member / resin / glass plate for dielectric heating adhesion of glass temporary fixing member).

In the high frequency dielectric heating, the base is pressed to be pressed against the glass plate, and the pressed portion is disposed between the upper electrode and the lower electrode. Next, a high frequency voltage is applied from the high frequency oscillator between the two electrodes to generate dielectric heat. As time passes, the temperature of the adhesive composition rises, and when it reaches or exceeds its melting point, it flows and bonds. Since the adhesive resin is in a molten state or a state close thereto, it is pressed in smoothly and easily by pressure, and is excluded to the outside as the gap between the base and the glass is narrowed. However, since the convex part 2a is arrange | positioned at the base 2, when the front-end | tip part of a convex part contacts glass, the base and glass of a glass temporary fixing member will no longer approach. For this reason, the adhesive resin layer corresponded to the height of a convex part is arrange | positioned between base and glass, and can contribute to adhesion | attachment. Cut off the high frequency voltage in the bonded state and cool by air cooling or air. The bonding composition of the present invention is bonded above the melting point and the bonded assembly is used below the melting point of the bonding composition.

When a high frequency voltage is applied to the above dielectric heating adhesive layer, only the adhesive layer is heated by high frequency dielectric heating. Therefore, it is not necessary to treat the entire adherend in a heating furnace, which is particularly effective for a large adherend. Moreover, since only a contact bonding layer can be selectively heated, it is effective also in the assembly in the case where a part with a to-be-adhered body contains a low heat resistance part.

(Example)

Next, the adhesive strength will be specifically described using Examples. In addition, the physical property evaluation in this Example was measured by the following method.

(a) Preparation of Adhesive Pellets: As shown in Table 1, a polyolefin-based hot melt adhesive having a dielectric loss tangent of 0.027 and a conductive powder were premixed. About melting | fusing point of resin, PO-1 is 105 degreeC, PO-2 is 120 degreeC, and all are in the range of 80 degreeC-200 degreeC. The conductive material is contained in the range of 1 to 30% by volume. Thereafter, the preliminary mixture was supplied to a hopper of a twin screw extruder PCM3Oø (manufactured by CHAPAN STEEL CO., LTD.) Whose temperature was adjusted from 170 to 180 ° C to 180 ° C from the hopper side, and melted at a screw speed of 60 rpm. Mixed. Thereafter, the strands were cooled in a water bath, and then cut to obtain pellets of a hot melt adhesive containing a conductive material.

(b) Test piece molding: The adhesive pellet was put into the injection molding machine in which the barrel was temperature-controlled from 180 to 200 ° C to 200 ° C from the hopper side. And it injected | poured into the test piece metal mold | die temperature-controlled at 40 degreeC, and obtained the adhesive plate which is 100x100x1mm, and 100x100x3mm. This adhesive plate is a hot melt resin before adhering to the base 2 of the glass temporary fixing member shown in FIG.

In addition, injection of pellets of 30 wt% glass fiber-reinforced modified polybutylene terephthalate (EMC 430 manufactured by Dongyang Spinning Co., Ltd.) dried at 140 ° C. for 3 hours was performed at a temperature of 250 ° C. to 260 ° C. to 260 ° C. from the hopper side. Into the hopper of the molding machine, a tensile test piece of Type 1 of ASTMD 638 was molded. This tensile test piece corresponds to the base of the glass temporary fixing member.

(c) Adhesive strength: The test piece obtained by shape | molding by (b) was cut | disconnected in the center of the longitudinal direction. These correspond to the base before adhesion layer adheres. The adhesive layer cut to 12.7x25.4x1mm was superimposed on this linear part 12.7x25.4mm by the 100x100x1mm adhesive plate obtained by (b). This wrap member, ie, the glass temporary fixing component equivalent, was set in a straight line on both sides of a glass plate of 33 × 100 × 3 mm. This was heated for 1 minute with a high frequency dielectric heating apparatus (made by Pearl Industrial Co., Ltd.) in the state which pressurized 2 kgf to the 20 mø air cylinder, and it cooled by air for 1 minute, and used as the test piece for adhesive strength evaluation. This state corresponds to the state which adhere | attached the base and glass. However, due to the ease of the tensile shear test, the configuration of the test piece sandwiched between two bases of glass.

This evaluation test piece was left in a laboratory controlled at 23 ° C. and 50% RH (Relative Humidity) for at least 5 hours. A test piece made of EMC 43O adhered to both ends of a glass plate was placed on a chuck of the universal testing machine UTMI type (Oritic Co., Ltd.) equipped with a thermostat temperature controlled at 50 ° C, and the tensile shear was conducted at a strain rate of 5 mm / min. The adhesive strength at 50 ° C. was measured.

(d) Dielectric properties: between 8 x 8 mm test pieces cut out from a plate of 3 mm thickness formed in (b) between conductor terminals having a terminal area (Ds) of 5 cm ² connected to a high frequency power supply circuit (manufactured by Pearl Industries, Ltd.). Set to. A high frequency charge Q having a frequency of 40 MHz was given, and the capacitance Cs and the dielectric tangent tan δ were measured from the potential difference V between the terminals. The dielectric loss coefficient (ε-tanδ) was obtained from Eq. (1) by setting the dielectric constant epsilon (o) in the vacuum to 8.85 x 10 ^-14 F / cm.

ε · tanδ = Cs × Ds / (εo · S). (One)

Inventive Examples 1 to 12: (Dielectric tangent and composition of the adhesive fall within the recommended range)

The high frequency adhesive plate was shape | molded after compounding the premix of the compounding ratio shown in Table 1 as mentioned above. The dielectric loss tangent and dielectric loss factor were measured for this plate. In addition, using a glass and a glass fiber reinforced polybutylene terephthalate resin molded article (EMC 430) as an adhesive, high frequency dielectric bonding was performed over 1 minute or 5 minutes of the high frequency heating time, and the adhesive strength thereof was measured.

Inventive Example No.1 No.2 No.3 No.4 No.5 No.6 No.7 No.8 No.10 No.11 No.12 Compounding (volume%) PO-1 97.5 95 92 92 92 92 - 97.5 95 92 97.5 PO-2 - - - - - - 92 - - - - Fe100 (Conductive Material) 2.5 5 8 - - - 8 2.5 5 8 2.5 Fe200 (Conductive Material) - - - 8 - - - - - - - Cu100 (Conductive Material) - - - - 8 - - - - - - CF (Conductive Material) - - - - - 8 - - - - - Oscillation time (minutes) One One One One One One One 5 5 5 20 Genetic Tangent 0.032 0.055 0.24 0.26 0.22 0.19 0.31 0.032 0.055 0.24 0.24 Dielectric loss factor (cm ^-1 ) 1.9 3 72 76 48 40 71 1.9 3 72 1.9 Adhesive strength (MPa) 1.1 3.1 4.6 4.1 3.9 5.5 5.1 1.9 6 4.5 6.8

PO-1: Silane-Modified G197 (Polyolefin Type, Cleha Elastomer Co., Ltd.) Melting Point 105 ° C

PO-2: Silane-Modified G1019 (Polyolefin-Based, Kleha Elastomer Co., Ltd.) Melting Point 120 ° C

Fe100: ASC100 (iron powder, Heganes Co., Ltd.) Average particle size 100 microns, volume resistivity 1.4

× 10 ^-5 Ωcm

Fe200: KIP3100 (iron powder, Cheunggi Steel Co., Ltd.) Average particle size 200 micron, volume resistivity 1.6

× 10 ^-6 Ωcm

Cu100: CE-6 (Copper powder, Futian Metal Powder Co., Ltd.) Average particle size 100 micron, volume

Resistivity 1.7 × 10 ^-6 Ωcm

CF: HTA (carbon fiber, Dongbu Rayon Co., Ltd.) 3 mm length, volume resistivity 1.5 × 10 ^-3 Ω · cm

Comparative Examples 1 to 4: (Dielectric tangent or composition of the adhesive is outside the recommended range)

Adhesive strength was measured with respect to the plate which compounded and shape | molded the premix of the compounding ratio shown in Table 2 similarly to the example of this invention. For some, adhesion was evaluated by changing the oscillation time, which is a high frequency heating time.

Comparative example No.1 No.2 No.3 No.4 Compounding (volume%) PO-1 100 100 99.5 99.5 PO-2 - - - - Fe100 - - 0.5 35 Fe200 - - - - Cu100 - - - - CF - - - - Oscillation time (minutes) One 20 20 One Genetic Tangent 0.027 0.027 0.027 0.16 Dielectric loss factor (cm ^-1 ) 1.4 1.4 1.6 55 Adhesive strength (MPa) 0 0 0 0.2

As can be clearly seen by comparing the adhesive strengths of Table 1 and Table 2, all of the examples of the present invention show a high adhesive strength of 1.1MPa or more. On the other hand, in the comparative example, No. Tetra represents only 0.2 MPa, and all other comparative examples cannot exhibit finite adhesive strength. Thus, the example of this invention which shows the high adhesive strength of this invention is a thing adhere | attached by a hot-melt type adhesive agent in a short time. Therefore, after adhering to a glass temporary fixing member without stagnating a manufactured product for a long time, it becomes possible to immediately send to a next process. For this reason, it becomes possible to main-fix glass with high productivity. In addition, since the thickness of the resin 5 for dielectric heating bonding can be arbitrarily adjusted by the height of the convex part provided in the base, it becomes possible to ensure the optimal thickness of an easily bonding layer easily.

In the above, although embodiment of this invention was described, embodiment of this invention disclosed above is an illustration to the last and the scope of the present invention is not limited to embodiment of these invention to the last. For example, the hot melt resin is not limited to the resin for dielectric heat bonding, and other hot melt resins may be used. The scope of the invention is indicated by the description of the claims, and includes all modifications within the meaning and range equivalent to those of the claims.

By using the glass temporary fixing member of the present invention, it does not require primer treatment on the surface of the glass or the adhesive surface of the temporary fixing member, or the production retention period for curing the adhesive, and prevents misalignment, thereby ensuring high reliability. Can be realized. For this reason, the window glass of an automobile can be temporarily fixed to a rear side window frame with high productivity and high positional precision.

Claims (4)

A glass temporary fixing member bonded to glass and temporarily fixing glass to another member, A catch portion to be hooked to the other member, A base located below the locking portion and facing the glass; A glass temporary fixing member comprising a hot melt resin disposed on the base. The method according to claim 1, The convex part of predetermined height is formed in the area | region of the said base with said hot melt resin attached, The glass temporary fixing member characterized by the above-mentioned. The method according to claim 1 or 2, And the hot melt resin is a resin for dielectric heating bonding. As a glass temporary fixing method of temporarily fixing a glass to another member using the glass temporary fixing member containing resin for dielectric heating bonding, Setting a position of the glass for adhering the resin for dielectric heating bonding; And applying a force to the glass temporary fixing member so as to press the dielectric heating adhesive resin of the glass temporary fixing member to the bonding position of the glass, and to perform a high frequency dielectric heating of the portion of the bonding position. Glass temporary fixing method.