KR20030024922A - Thin Alloy Sheet of Low Thermal Expansion and Shadow Mask Using the Same - Google Patents
Thin Alloy Sheet of Low Thermal Expansion and Shadow Mask Using the Same Download PDFInfo
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- KR20030024922A KR20030024922A KR10-2003-7002951A KR20037002951A KR20030024922A KR 20030024922 A KR20030024922 A KR 20030024922A KR 20037002951 A KR20037002951 A KR 20037002951A KR 20030024922 A KR20030024922 A KR 20030024922A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J29/00—Details of cathode-ray tubes or of electron-beam tubes of the types covered by group H01J31/00
- H01J29/02—Electrodes; Screens; Mounting, supporting, spacing or insulating thereof
- H01J29/06—Screens for shielding; Masks interposed in the electron stream
- H01J29/07—Shadow masks for colour television tubes
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C38/00—Ferrous alloys, e.g. steel alloys
- C22C38/04—Ferrous alloys, e.g. steel alloys containing manganese
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C38/00—Ferrous alloys, e.g. steel alloys
- C22C38/08—Ferrous alloys, e.g. steel alloys containing nickel
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- C—CHEMISTRY; METALLURGY
- C21—METALLURGY OF IRON
- C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
- C21D8/00—Modifying the physical properties by deformation combined with, or followed by, heat treatment
- C21D8/02—Modifying the physical properties by deformation combined with, or followed by, heat treatment during manufacturing of plates or strips
- C21D8/0205—Modifying the physical properties by deformation combined with, or followed by, heat treatment during manufacturing of plates or strips of ferrous alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2229/00—Details of cathode ray tubes or electron beam tubes
- H01J2229/07—Shadow masks
- H01J2229/0727—Aperture plate
- H01J2229/0733—Aperture plate characterised by the material
Abstract
본 발명은, 실질적으로, 질량%로, Ni: 35.0~ 37.0%, Mn: 0.01~ 0.09%, Si: 0.01~ 0.04%, A1: 0.01~ 0.04%, 잔부: Fe로 이루어지고, 또한 Mn/S: 20~ 300 및 Mn+ Si+ Al≤ 0.15%인 1.0×10-6/K이하의 20~ 100℃의 평균열팽창계수를 갖는 저열팽창 합금박판에 관한 것이다. 본 발명의 저열팽창 합금박판에서는, 제조시에 균열이나 파단, 혹은 압흔이 발생하지 않고, 또한 새도우 마스크 제조시에 양호한 에칭성과 치수정밀도가 얻어진다.The present invention is substantially made of, in mass%, Ni: 35.0 to 37.0%, Mn: 0.01 to 0.09%, Si: 0.01 to 0.04%, A1: 0.01 to 0.04%, balance: Fe, and Mn / S The present invention relates to a low thermal expansion alloy thin plate having an average thermal expansion coefficient of 20 to 100 ° C. of 1.0 × 10 −6 / K or less having 20 to 300 and Mn + Si + Al ≦ 0.15%. In the low thermal expansion alloy thin plate of the present invention, cracks, fractures, or indentations do not occur at the time of manufacture, and good etching property and dimensional accuracy are obtained at the time of shadow mask manufacture.
Description
Ni를 약 36% 함유하는 Fe- Ni합금은, 실온 부근에서 극히 낮은 열팽창율을 갖기 때문에, 온도 변동에 의한 치수변화를 꺼리는 정밀기기, 바이메탈(bimetal), 컴퓨터나 텔레비젼 브라운관의 새도우 마스크 등에 폭넓게 사용되고 있다.Since Fe-Ni alloys containing about 36% Ni have extremely low thermal expansion rates near room temperature, they are widely used in precision instruments, bimetals, shadow masks of computers and television CRTs, which are reluctant to change in dimensions due to temperature fluctuations. have.
그 대부분은, 실온으로부터 100℃의 온도범위에서 약 1.2~ 2.0×10-6/K 정도의 평균열팽창계수를 갖고 있지만, 근래, 고휘도화(高輝度化)와 고화질화(高畵質化)의 요망이 강한 브라운관의 새도우 마스크에는, 보다 낮은 열팽창율을 갖는 재료가 요청되고 있다.Most of them have an average coefficient of thermal expansion of about 1.2 to 2.0 × 10 -6 / K in the temperature range from room temperature to 100 ° C. However, in recent years, high brightness and high image quality are desired. In this strong CRT shadow mask, a material having a lower coefficient of thermal expansion is required.
그 때문, 예컨대 특허 제2694864호 공보에는, Ni를 34% 이상, Mn을 0.1% 이하, C를 0.009% 미만 함유하고, 잔부가 Fe 및 불가피한 불순물이고, 실온 부근에서 100℃의 평균열팽창계수가 1×10-6/K 미만인 보다 낮은 저열팽창 철니켈합금이 새도우 마스크용으로 제안되고 있다.For this reason, for example, Japanese Patent No. 2694864 contains Ni at least 34%, Mn at most 0.1%, and C at less than 0.009%, the balance being Fe and an unavoidable impurity, and the average coefficient of thermal expansion of 100 캜 near room temperature is 1. Lower low-expansion iron nickel alloys of less than x 10 −6 / K have been proposed for shadow masks.
그러나, 특허 제2694864호 공보에 기재된 저열팽창 철니켈합금의 박판을 제조할 때, 분괴압연, 열간압연, 냉간압연 등의 압연공정에서 균열이나 파단, 혹은 압흔이 발생하기도 하거나, 목적으로 하는 저열팽창율이 안정적으로 얻어지지 않는다는 문제가 있다. 또한, 새도우 마스크 제조시에는, 에칭불량이나 치수정밀도 불량 등의 문제도 생긴다.However, when manufacturing a thin sheet of low-expansion iron nickel alloy disclosed in Japanese Patent No. 2694864, cracks, fractures, or indentations may occur in rolling processes such as crack rolling, hot rolling, and cold rolling, or the desired low thermal expansion coefficient. There is a problem that this is not obtained stably. Further, in the manufacture of shadow masks, problems such as poor etching and poor dimensional accuracy also occur.
본 발명은, 저열팽창 합금박판, 특히, 브라운관의 새도우 마스크 등에 사용되어, 제조성 및 에칭성이 우수한 1.0×10-6/K 이하의 20~ 100℃의 평균열팽창계수를 갖는 저열팽창 합금박판 및 이를 이용한 새도우 마스크에 관한 것이다.The present invention is used in low thermal expansion alloy thin plate, in particular, shadow mask of a CRT, low thermal expansion alloy thin plate having an average thermal expansion coefficient of 20 ~ 100 ℃ of 1.0 × 10 -6 / K or less excellent in manufacturability and etching and It relates to a shadow mask using the same.
도 1은, Mn+ Si+ A1과 20~ 100℃의 평균열팽창계수와의 관계를 나타내는 그래프이다.1 is a graph showing a relationship between Mn + Si + A1 and an average thermal expansion coefficient of 20 to 100 ° C.
본 발명의 목적은, 제조시에 균열이나 파단, 혹은 압흔이 발생하지 않고, 안정하게 1.0×10-6/K 이하의 20~ 100℃의 평균열팽창계수가 얻어지며, 또한 새도우 마스크 제조시에 양호한 에칭성과 치수정밀도가 얻어지는 저열팽창 합금박판을 제공하는 데에 있다.It is an object of the present invention to obtain a mean coefficient of thermal expansion of 20 to 100 ° C. of 1.0 × 10 −6 / K or less stably without cracks, fractures or indentations during manufacture, and also good for shadow mask manufacture. An object of the present invention is to provide a low thermal expansion alloy thin plate obtained by obtaining etching properties and dimensional accuracy.
상기 목적은, 실질적으로, 질량%로, Ni: 35.0~ 37.0%, Mn: 0.01~ 0.09%, Si: 0.01~ 0.04%, A1: 0.01~ 0.04%, 잔부: Fe로 이루어지고, 또한 Mn/S: 20~ 300 및 Mn+ Si+ A1≤ 0.15%인 1.0×10-6/K 이하의 20~ 100℃의 평균열팽창계수를 갖는 저열팽창 합금박판에 의해 달성된다.The said objective consists of Ni: 35.0-37.0%, Mn: 0.01-0.09%, Si: 0.01-0.04%, A1: 0.01-0.04%, remainder: Fe by the mass% substantially, Mn / S It is achieved by a low thermal expansion alloy thin plate having an average thermal expansion coefficient of 20 to 100 ° C. of 1.0 × 10 −6 / K or less, which is 20 to 300 and Mn + Si + A1 ≦ 0.15%.
본 발명자들은, 제조시에 균열이나 파단, 혹은 압흔이 발생하지 않고, 안정하게 1.0×10-6/K 이하의 20~ 100℃의 평균열팽창계수가 얻어지며, 또한 새도우 마스크 제조시에 양호한 에칭성과 치수정밀도가 얻어지는 저열팽창 합금박판에 대하여 검토한 결과, 이하와 같은 사실을 발견하였다.MEANS TO SOLVE THE PROBLEM The present inventors can obtain the mean thermal expansion coefficient of 20-100 degreeC of 1.0x10 <-6> / K or less stably without crack, rupture, or indentation at the time of manufacture, and also the favorable etching property at the time of shadow mask manufacture. As a result of studying the low thermal expansion alloy thin plate from which dimensional accuracy is obtained, the following facts were discovered.
1) 열팽창율을 저감하기 위해서 Mn, Si, A1양을 저감하는 것은 유효하지만, 이들 강력한 황화물 형성원소나 탈산원소의 양을 과도하게 저감하면, 고용 S나 산화물계 개재물이 증가하여, 열간압연시 균열이나 파단, 냉간압연시의 균열이나 압흔, 에칭불량을 야기한다.1) It is effective to reduce the amount of Mn, Si, and A1 in order to reduce the coefficient of thermal expansion, but excessively reducing the amount of these strong sulfide forming elements and deoxidizing elements increases the solid solution S and oxide inclusions, resulting in hot rolling. It causes cracks, breaks, cracks, indentations during cold rolling, and poor etching.
2) 이들 원소량을 적정범위로 제어하지 않은 경우에는 개재물의 양이 변동하여, 그것이 조직형성에도 영향을 미치게 하고 1.0×10-6/K 이하의 열팽창율이 얻어지지 않는다.2) If the amount of these elements is not controlled in an appropriate range, the amount of inclusions fluctuates, affecting the formation of the structure, and a thermal expansion rate of 1.0 × 10 −6 / K or less is not obtained.
3) 또한, 이들 원소의 합계량 Mn+ Si+ A1을 0.15% 이하로 함으로써, 안정하게 1.0×10-6/K 이하의 열팽창율을 얻을 수 있다.3) Moreover, by making the total amount Mn + Si + A1 of these elements into 0.15% or less, the thermal expansion rate of 1.0x10 <-6> / K or less can be obtained stably.
본 발명은, 이러한 견지에 기초하여 행하여진 것으로, 이하에 그 상세한 설명을 한다.The present invention has been made based on these findings and will be described in detail below.
Ni: Ni는, 저열팽창율을 얻기 위한 필수의 원소이다. 20~ 100℃의 평균열팽창계수를 1.0×10-6/K 이하로 하기 위해서는, 그 양을 35.0~ 37.0%로 한다.Ni: Ni is an essential element for obtaining low thermal expansion coefficient. In order to make the average thermal expansion coefficient of 20-100 degreeC into 1.0x10 <-6> / K or less, the quantity shall be 35.0-37.0%.
Mn, Si, A1: 열간압연이나 냉간압연에서 파단, 균열, 압흔의 발생을 방지하고, 열팽창율을 1.0×10-6/K 이하로 하고, 새도우 마스크의 에칭불량이나 치수정밀도 불량을 방지하기 위해서는, Mn, Si, A1의 각각을 적어도 0.01% 첨가할 필요가 있다. 한편, 이러한 원소를 지나치게 첨가하면, 제조공정에서 열처리시에 박판 표층에 미세산화물이 형성되어 에칭성을 열화시키거나, 새도우 마스크의 경우와 같이전자선 산란방지나 열방산성 증가를 목적으로 한 치밀하고 흑색도가 높은 피막형성을 저해하며, 또한 열팽창율을 증가시키는 경우가 있다. 그 때문, Mn, Si, A1의 각각의 양을 0.09%, 0.04% 이하, 0.04% 이하로 할 필요가 있다. 또한, 도 1에 도시한 바와 같이, 1.0×10-6/K 이하의 열팽창율을 안정하게 얻기 위해서는, Mn+ Si+ A1≤ 0.15%로 할 필요가 있다.Mn, Si, A1: In order to prevent breakage, cracking and indentation in hot rolling or cold rolling, to set the thermal expansion ratio to 1.0 × 10 -6 / K or less, and to prevent poor etching or poor dimensional accuracy of the shadow mask. It is necessary to add at least 0.01% of each of Mn, Si, and A1. On the other hand, when such an element is added excessively, fine oxides are formed on the thin surface layer during the heat treatment in the manufacturing process to deteriorate the etching property, or, as in the case of the shadow mask, to provide a dense black color for the purpose of preventing electron beam scattering or increasing heat dissipation. High degree of film formation is inhibited, and the coefficient of thermal expansion may be increased. Therefore, it is necessary to make each amount of Mn, Si, and A1 into 0.09%, 0.04% or less, and 0.04% or less. In addition, as shown in FIG. 1, in order to stably obtain a thermal expansion rate of 1.0 × 10 −6 / K or less, it is necessary to set Mn + Si + A1 ≦ 0.15%.
Mn은, 강력한 황화물 형성원소이고, 열간가공시에 입계취화를 가져오는 S를 황화물로서 고정하여 열간가공성을 개선하며, 분괴압연, 단조, 열간압연 등에서 균열이나 파단을 방지하는 기능이 있다. 그 때문에는, Mn/S를 20 이상으로 할 필요가 있다. 또한, Mn/S가 300을 넘으면, 가령 Mn이 0.09% 이하이더라도 Mn량이 지나치 게 되어 상기와 같은 문제를 야기하기 때문에 Mn/S를 300 이하로 할 필요가 있다.Mn is a strong sulfide-forming element, which fixes S, which brings grain embrittlement during hot working, as a sulfide to improve hot workability, and has a function of preventing cracks and fractures in cracked rolling, forging and hot rolling. Therefore, it is necessary to make Mn / S 20 or more. If Mn / S exceeds 300, for example, even if Mn is 0.09% or less, the amount of Mn will be excessive and cause the above problems. Therefore, Mn / S needs to be 300 or less.
O: O는, 산화물을 형성하여 열간압연시의 균열, 냉간압연시의 압흔, 에칭불량의 원인이 될 뿐만 아니라, 열처리시의 결정립성장을 저해하여 조직형성에 영향을 미치고, 저열팽창율의 안정적 확보가 곤란하게 되는 경우 가 있기 때문에, 0.005% 이하로 하는 것이 바람직하다.O: O not only causes oxides to cause cracks during hot rolling, indentation during cold rolling, and poor etching, but also inhibits grain growth during heat treatment, affects the formation of tissues, and ensures low thermal expansion rate. In some cases, it is preferable that the content be made 0.005% or less.
S: S는, 열간가공시에 입계취화를 가져오기 때문에, 분괴압연, 단조, 열간압연에서 균열이나 파단의 원인이 되는 동시에, Mn 등으로 고정할 수 없는 S가 증가하면 편석이 강한 부분에서 열간가공성이나 에칭성이 크게 저하하는 원인이 되기 때문에, 0.002% 이하로 하는 것이 바람직하다.S: Since S has grain boundary embrittlement during hot working, it causes cracking or fracture during fracture rolling, forging, and hot rolling, and when S that cannot be fixed with Mn increases, hot rolling is performed in areas with high segregation. Since workability and etching property will cause a big fall, it is preferable to set it as 0.002% or less.
본 발명의 저열팽창 합금박판은, 통상 실시되고 있는 용융제조, 정련, 주조,열간압연, 냉간압연, 소둔에 의해 제조할 수가 있다. 예컨대, 상기 성분조성을 갖는 합금을 용융제조하여, 연속주조법 또는 조괴법(造塊法)에 의해, 두께 100~ 400mm의 슬라브로 한다. 이때, 주괴 또는 슬라브에 대하여 1050℃ 이상으로 충분한 균질화 열처리를 행하거나, 또는 주조처리에 의해 편석을 저감하는 것이 바람직하다. 이어서, 800℃ 이상에서 열간압연을 행하여, 두께 2~ 4mm의 판으로 하고, 또한 냉간압연 및 소둔을 1회부터 복수회 행함으로써 원하는 박판으로 한다.The low thermal expansion alloy thin plate of the present invention can be produced by melt manufacturing, refining, casting, hot rolling, cold rolling, and annealing which are usually carried out. For example, an alloy having the above-mentioned composition is melted and manufactured into a slab having a thickness of 100 to 400 mm by the continuous casting method or the ingot method. At this time, it is preferable to perform sufficient homogenization heat treatment at 1050 degreeC or more with respect to an ingot or slab, or to reduce segregation by a casting process. Subsequently, hot rolling is performed at 800 degreeC or more, and it is set as the board of thickness 2-4 mm, and cold rolling and annealing are performed once from several times, and it is set as desired thin plate.
표1에 나타내는 성분조성의 Fe-Ni합금 No.1~21를 용융제조하여, 분괴압연, 열간압연에 의해 열연판으로 하고, 산세를 실시한 후 냉간압연과 소둔, 필요에 따라서 Tension Leveler처리나 회복소둔을 하여, 판두께 0.1mm와 0.2mm의 박판을 제작하였다. 이때, 박판의 제조성에 관해서, 문제없이 제조할 수 있던 것에 관하여는 Ｏ, 파단이나 압흔이 생긴 것에 관하여는 ×로 나타내었다. 또한, 이렇게 하여 얻어진 박판에 관해서, 850℃에서 15min의 열처리를 행한 후, 광간섭식(光干涉式) 열팽창계에 의해 20~ 100℃의 평균열팽창계수를 측정하였다. 이때, 각 합금에 관해서 10개씩 측정하여 그 최대치를 구하는 동시에, 최대치와 최소치와의 차가 0.5×10-6/K를 넘는 것은 제조 안정성이 불량한 것으로 하여 ×로 나타내었다. 또한, 얻어진박판 표면에 지름 90㎛의 원형 구멍을 다수 배치한 레지스트막을 형성하고, 용액온도 40℃ 이상, 농도 40% 이상의 염화제이철액을 30~50MPa의 압력으로 분사하여, 박판에 지름 100~200㎛의 구멍을 에칭천공하고, 100개의 구멍에 관해서 구멍 형상의 이상 유무와, 평균지름에 대한 치수정밀도, 즉 구멍 지름의 편차를 조사하였다. 그리고, 구멍의 진원도가 높고, 치수정밀도가 ±3% 이하의 것을 O, 진원도가 낮고, 치수정밀도가 ±3%를 넘는 것을 ×로 나타내었다.Fe-Ni alloys Nos. 1 to 21 of the composition shown in Table 1 are melted and hot-rolled to form a hot rolled sheet by hot rolling or hot rolling. After pickling, cold rolling and annealing are performed. Annealing was carried out to produce thin plates having a plate thickness of 0.1 mm and 0.2 mm. At this time, regarding the manufacturability of a thin plate, about what was able to manufacture without a problem, it was represented by x about the thing which O, the fracture, or the indentation generate | occur | produced. Moreover, about the thin plate obtained in this way, after heat-processing for 15 minutes at 850 degreeC, the average coefficent of thermal expansion of 20-100 degreeC was measured with the optical interference type thermal expansion system. At this time, each of the alloys was measured by 10 pieces to obtain the maximum value, and the difference between the maximum value and the minimum value exceeding 0.5 × 10 −6 / K was represented by x as poor manufacturing stability. Further, a resist film having a large number of circular holes having a diameter of 90 μm was formed on the surface of the obtained thin plate, and the ferric chloride solution having a solution temperature of 40 ° C. or higher and a concentration of 40% or higher was sprayed at a pressure of 30 to 50 MPa, and the diameter of the thin plate was 100 to 200 Etching holes of 占 퐉 were etched, and 100 holes were examined for abnormalities in the shape of holes and dimensional accuracy with respect to the average diameter, that is, deviation of the hole diameter. The roundness of the hole is high, the dimensional accuracy is ± 3% or less, the O, the roundness is low, and the dimensional accuracy is greater than ± 3%.
결과를 표2에 나타낸다.The results are shown in Table 2.
본 발명예의 합금 No.1~10에서는, 어떠한 열간압연이나 냉간압연에서 균열이나 파단의 발생이 없고 제조성이 양호하였다. 또한, 에칭성도 양호한 동시에, 극히 낮은 열팽창율이 얻어졌다.In Alloy Nos. 1 to 10 of the examples of the present invention, there was no occurrence of cracking or breaking in any hot rolling or cold rolling, and the manufacturability was good. Moreover, etching property was also favorable and extremely low thermal expansion coefficient was obtained.
이에 반하여, 비교예의 합금 No.11~21에서는, 어떠한 특성도 뒤떨어져 있었다. 즉, No.11에서는, Mn+ Si+ A1의 값이 본 발명범위를 벗어나기 때문에 저팽창율이 얻어지지 않는다. No.12에서는, Mn량, Si량, Mn+ Si+ A1의 값, Mn/S의 값이 본 발명범위를 벗어나기 때문에 저팽창율이 얻어지지 않는다. No.13에서는, Mn량, Mn/S의 값이 본 발명범위를 벗어나기 때문에 열간압연에서 균열, 파단이 발생하고, 제조성이 떨어진다. No.14에서는, Mn량, Mn+ Si+ A1의 값이 본 발명범위를 벗어나기 때문에, No.15에서는, Si량, Mn+ Si+ A1의 값이 본 발명범위를 벗어나기 때문에, 어느 것도 저열팽창율이 얻어지지 않는다. No.16에서는, Si량, A1 량이 본 발명범위 밖이고, 열간압연에서 균열, 파단이 발생하고, 제조성이 떨어진다. No.17에서는, Si량, A1량이 본 발명범위를 벗어나기 때문에, No.18에서는, A1량이 본 발명범위를 벗어나기 때문에, 어느 것이나 냉간압연에서 압흔이 발생하고, 제조성이 떨어진다. 또한, 열팽창계수나 에칭의 구멍지름의 편차도 크다. No.19에서는, A1량이 본 발명범위를 벗어나기 때문에, 저열팽창율이 얻어지지 않으며, 에칭성도 떨어진다. No.20에서는, Ni량이 본 발명범위를 벗어나기 때문에, No.21에서는, Ni량, Si량이 본 발명범위를 벗어나기 때문에, 어느 것이나 저열팽창율이 얻어지지 않는다.On the other hand, in the alloy Nos. 11 to 21 of the comparative example, any characteristics were inferior. That is, in No. 11, since the value of Mn + Si + A1 is out of the scope of the present invention, low expansion coefficient is not obtained. In No. 12, a low expansion ratio is not obtained because the amount of Mn, amount of Si, value of Mn + Si + A1, and value of Mn / S are outside the scope of the present invention. In No. 13, since the value of Mn amount and Mn / S is out of the scope of the present invention, cracking and fracture occur in hot rolling, and the manufacturability is inferior. In No. 14, since the Mn amount and the value of Mn + Si + A1 are out of the scope of the present invention, in No. 15, since the Si amount and the value of Mn + Si + A1 are out of the scope of the present invention, neither low thermal expansion coefficient is obtained. . In No. 16, the amount of Si and the amount of A1 are outside the scope of the present invention, and cracks and fractures occur in hot rolling, resulting in poor manufacturability. In No. 17, since the amount of Si and A1 are out of the scope of the present invention, in No. 18, since A1 is out of the scope of the present invention, indentation occurs in cold rolling in all, and the manufacturability is inferior. In addition, the variation in the coefficient of thermal expansion and the hole diameter of etching is also large. In No. 19, since the A1 amount is out of the scope of the present invention, a low thermal expansion coefficient is not obtained, and the etching property is also poor. In No. 20, since the amount of Ni is out of the scope of the present invention, in No. 21, since the amount of Ni and Si are out of the scope of the present invention, neither low thermal expansion coefficient is obtained.
Claims (5)
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| JPJP-P-2001-00204212 | 2001-07-05 | ||
| JP2001204212 | 2001-07-05 | ||
| PCT/JP2002/006785 WO2003004715A1 (en) | 2001-07-05 | 2002-07-04 | Thin alloy sheet of low thermal expansion and shadow mask using the same |
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| KR20030024922A true KR20030024922A (en) | 2003-03-26 |
| KR100519615B1 KR100519615B1 (en) | 2005-10-07 |
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| EP (1) | EP1403393A4 (en) |
| KR (1) | KR100519615B1 (en) |
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| JP3854121B2 (en) * | 2001-10-22 | 2006-12-06 | 日本冶金工業株式会社 | Fe-Ni alloy for shadow mask material with excellent corrosion resistance and shadow mask material |
| CN105648323A (en) * | 2016-01-13 | 2016-06-08 | 铜陵百荣新型材料铸件有限公司 | Ferronickel material and preparation technique thereof |
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| DE4402684C2 (en) * | 1993-05-27 | 2001-06-21 | Krupp Vdm Gmbh | Use of a low-expansion iron-nickel alloy |
| JPH09176797A (en) * | 1995-12-27 | 1997-07-08 | Nikko Kinzoku Kk | Fe-ni-cr alloy stock for shadow mask, and shadow mask produced therefrom |
| DE19920144C1 (en) * | 1999-05-03 | 2000-08-03 | Krupp Vdm Gmbh | Iron-nickel alloy is used for shadow masks and frame parts of screens, passive components of thermo-bimetals, in the production, storage and transport of liquefied gases or for components of laser technology |
| JP2001192775A (en) * | 2000-01-05 | 2001-07-17 | Nisshin Steel Co Ltd | Fe-Ni ALLOY THIN SHEET FOR SHADOW MASK OF EXTENSION SYSTEM |
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2002
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| CN1464915A (en) | 2003-12-31 |
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