KR20030018520A - A Device for Radiate Heat of Mult Layer PCB - Google Patents

A Device for Radiate Heat of Mult Layer PCB Download PDF

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Publication number
KR20030018520A
KR20030018520A KR1020010052675A KR20010052675A KR20030018520A KR 20030018520 A KR20030018520 A KR 20030018520A KR 1020010052675 A KR1020010052675 A KR 1020010052675A KR 20010052675 A KR20010052675 A KR 20010052675A KR 20030018520 A KR20030018520 A KR 20030018520A
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KR
South Korea
Prior art keywords
electronic component
heat
heat dissipation
pcb
printed circuit
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KR1020010052675A
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Korean (ko)
Inventor
유진오
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삼성전기주식회사
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Priority to KR1020010052675A priority Critical patent/KR20030018520A/en
Publication of KR20030018520A publication Critical patent/KR20030018520A/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the PCB

Abstract

PURPOSE: A heat radiating apparatus for a multi-layer printed circuit board is provided to maximize heat radiation effects by arranging a plurality of heat sinks between the printed circuit boards. CONSTITUTION: An electronic component(120) is mounted on a multi-layer printed circuit board(110), with a lead part(150) interposed between the PCB and the electronic component, and a ground part(130) is arranged at the outer bottom of the electronic component. The ground part of the electronic component is connected to a heat sink(140) mounted on the multi-layer printed circuit board through a soldering process. A heat radiating apparatus comprises heat sinks(140') arranged underneath the electronic component mounted on the multi-layer printed circuit board and among layers of the multi-layer printed circuit board and through holes(160) for connecting the heat sinks arranged among layers of the multi-layer printed circuit board.

Description

다층 인쇄회로기판의 방열장치{A Device for Radiate Heat of Mult Layer PCB}Radiating device for multilayer printed circuit boards {A Device for Radiate Heat of Mult Layer PCB}

본 발명은 다층으로 적층 구성되는 인쇄회로기판(이하 "PCB" 라함)의 방열효과를 극대화시킬 수 있도록한 다층 PCB의 방열장치에 관한 것으로 이는 특히, 다층 PCB의 층간으로 방열판을 설치하고, 이를 홀(Hole)을 통해 연통 연결함으로써, 레귤레이터등과 같은 발열이 많이 발생하는 전자부품의 방열효과를 극대화할 수 있도록한 다층 PCB의 방열장치에 관한 것이다.The present invention relates to a heat dissipation device of a multi-layer PCB to maximize the heat dissipation effect of a printed circuit board (hereinafter referred to as "PCB") is laminated in a multi-layer, in particular, to install a heat sink in the interlayer of the multi-layer PCB, By connecting through a (Hole), the heat dissipation device of a multi-layer PCB to maximize the heat dissipation effect of the electronic components that generate a lot of heat such as regulators.

일반적으로 알려져있는 종래의 PCB 상에 실장되는 전자부품의 방열구조에 있어서는 도 1에 도시한 바와같이, 다층 PCB(10)의 상측으로 리드부(50)를 개재하여 칩 등과 같은 전자부품(20)이 실장되며, 상기 전자부품(20)의 저부(低部)에는 접지부(30)가 마련되어, 상기 전자부품(20)의 접지부(30)가 솔더링에 의해 다층 PCB(10) 상측에 착설되는 방열판(40)과 연설되는 구성으로 이루어진다.In the known heat dissipation structure of an electronic component mounted on a conventional PCB, as shown in FIG. 1, an electronic component 20 such as a chip is provided on the upper side of the multilayer PCB 10 via a lead 50. Is mounted, the ground portion 30 is provided at the bottom of the electronic component 20, the ground portion 30 of the electronic component 20 is installed on the upper side of the multilayer PCB 10 by soldering. The heat sink 40 is composed of a configuration that is addressed.

이와같은 구성으로 이루어진 종래의 다층 PCB의 방열구조는, 다층 PCB(10)의 상측으로 리드부(50)를 통해 전자부품(20)을 실장시키게 되며, 이때 상기 전자부품(20)에서 발생되는 고열을 외부로 방출시키기 위하여, 상기 전자부품(20) 저부의 접지부(30)를 솔더링을 통해 다층 PCB(10)에 착설된 Cu로 구성되는 방열판(40)과 연설시킴으로써, 전자부품(20)의 방열작용을 수행하게 된다.In the heat dissipation structure of the conventional multilayer PCB having such a configuration, the electronic component 20 is mounted through the lead portion 50 to the upper side of the multilayer PCB 10, and at this time, the high temperature generated in the electronic component 20. In order to release the outside to the outside, the grounding portion 30 of the bottom of the electronic component 20 by soldering the heat sink 40 made of Cu mounted on the multilayer PCB 10, thereby extending the It will perform a heat dissipation action.

그러나, 상기와같은 전자부품(20)이 실장된 다층 PCB의 방열구조에 있어서는, 칩(Chip)등으로 이루어진 전자부품(20)의 저부(低部)에 Cu로 구성되는 방열판(40)이 설치됨으로써, 전자부품에서 발생되는 고열이 방열판(40)을 통해 제대로 외부로 방출될 수 없을 뿐만 아니라, 외부 공기와 방열판(40)의 접지 면적이 넓지않기 때문에 효과적인 방열작용을 기대하기 어렵게 됨은 물론, 이에따라 전자부품의 수명이 단축되는 문제점이 있었던 것이다.However, in the heat dissipation structure of the multilayer PCB on which the electronic component 20 is mounted as described above, the heat dissipation plate 40 made of Cu is provided on the bottom of the electronic component 20 made of a chip or the like. As a result, the high heat generated from the electronic components may not be properly released to the outside through the heat sink 40, and because the ground area of the outside air and the heat sink 40 is not wide, it is difficult to expect an effective heat dissipation action, accordingly. There was a problem that the life of the electronic component is shortened.

본 발명은 상기와 같은 종래의 문제점들을 개선시키기 위하여 안출된 것으로서 그 목적은, 다층 PCB의 층간에 방열판을 각각 설치하고, 이를 홀(Hole)을 통해 연통 연결함으로 인하여, 다수의 방열판의 설치에 의해 전자부품의 방열효과를 증대시킬 수 있도록 함은 물론, 상기 층간 설치되는 방열판이 홀을 통해 연통 연설되어 방열판의 접지면적이 증대되고, 이에따라 레귤레이터등과 같은 비교적 발열이 많이 발생하는 전자부품의 방열효과를 극대화할 수 있는 다층 PCB의 방열장치를 제공하는데 있다.The present invention has been made in order to improve the above-mentioned conventional problems, the object of which is to install a heat sink between the layers of the multi-layer PCB, respectively by communicating through the hole (Hole), by the installation of a plurality of heat sinks In addition to increasing the heat dissipation effect of the electronic component, the heat dissipation plate installed between the layers is communicated through the hole, and the ground area of the heat dissipation plate is increased, and accordingly, the heat dissipation effect of the electronic component which generates relatively high heat such as a regulator It is to provide a heat dissipation device of a multilayer PCB that can maximize.

도 1은 종래 다층 PCB에 설치되는 방열판의 적층상태를 도시한 정단면도.1 is a front sectional view showing a laminated state of a heat sink installed in a conventional multilayer PCB.

도 2는 본 발명에 따른 다층 PCB에 설치되는 방열판의 적층상태를 도시한 정단면도.Figure 2 is a front sectional view showing a laminated state of the heat sink installed in the multilayer PCB according to the present invention.

도 3은 본 발명인 다층 PCB에 다수의 층으로 착설되는 방열판의 요부 설치상태도.Figure 3 is a main portion installation state of the heat sink installed in a plurality of layers on the present invention multilayer PCB.

* 도면의 주요부분에 대한 부호의 설명 *Explanation of symbols on the main parts of the drawings

110...다층 PCB 120...전자부품110 ... Multilayer PCB 120 ... Electronic Components

130...접지부 140,140'...방열판130 ... 140,140 '... heat sink

150...리드부 160...관통홀150 ... Lead part 160 ... Through hole

상기와 같은 목적을 달성하기 위한 기술적인 수단으로서 본 발명은, 다층 PCB의 상측으로 리드부를 개재하여 전자부품이 실장되며, 상기 전자부품의 저부에는 접지부가 마련되어, 상기 전자부품의 접지부가 솔더링에 의해 다층 PCB 상측에 착설되는 방열판과 연설되는 다층 PCB의 방열구조에 있어서,As a technical means for achieving the above object, the present invention, the electronic component is mounted on the upper side of the multi-layer PCB via the lead portion, the ground portion is provided on the bottom of the electronic component, the ground portion of the electronic component by soldering In the heat dissipation structure of the multi-layer PCB to the heat sink installed on the upper side of the multi-layer PCB,

상기 다층 PCB에 실장되는 전자부품의 하측 및 상기 다층 PCB의 층간으로 각각 설치되는 방열판;A heat dissipation plate installed at a lower side of the electronic component mounted on the multilayer PCB and between the layers of the multilayer PCB;

상기 다층 PCB의 층간에 각각 설치된 방열판을 연결토록 천설되는 관통홀;을 포함하여 구성됨을 특징으로 한다And through-holes formed to connect heat sinks respectively installed between the layers of the multilayer PCB.

이하, 첨부된 도면에 의거하여 본 발명의 실시예를 상세하게 설명하면 다음과 같다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

도 2는 본 발명에 따른 다층 PCB의 방열장치 적층상태를 도시한 정단면도이고, 도 3은 본 발명인 다층 PCB에 다수의 층으로 착설되는 방열판의 요부 설치상태도로서, 다층 PCB(110)의 상측으로 리드부(150)를 개재하여 칩 등과 같은 전자부품(120)이 실장되며, 상기 전자부품(120)의 저부에는 접지부(130)가 마련되어, 상기 전자부품(120)의 접지부(130)가 솔더링에 의해 다층 PCB(110) 상측에 착설되는 방열판(140)과 연설토록 설치된다.Figure 2 is a front sectional view showing a heat dissipation device laminated state of a multilayer PCB according to the present invention, Figure 3 is a main part installation state diagram of the heat sink installed in a plurality of layers on the multilayer PCB of the present invention, the upper side of the multilayer PCB 110. An electronic component 120 such as a chip is mounted through the lead portion 150. A ground portion 130 is provided at the bottom of the electronic component 120, so that the ground portion 130 of the electronic component 120 is formed. It is installed to be in contact with the heat sink 140 installed on the upper side of the multilayer PCB 110 by soldering.

또한, 상기 다층 PCB(110)에 실장되는 전자부품(120)의 하측 및 상기 다층 PCB(110)의 층간으로 방열판(140')이 각각 설치되며, 상기 다층 PCB(110)의 층간에 각각 설치된 방열판(140')은 관통홀(160)을 통해 상호 연통 연결토록 되는 구성으로 이루어진다.In addition, the heat dissipation plate 140 ′ is installed on the lower side of the electronic component 120 mounted on the multi-layer PCB 110 and the interlayers of the multi-layer PCB 110, respectively. 140 'is configured to be connected to each other through the through-hole 160.

이와같은 구성으로 이루어진 본 발명의 작용 및 효과를 설명하면 다음과 같다.Referring to the operation and effect of the present invention made of such a configuration as follows.

도 2 및 도 3에 도시한 바와같이, 다수의 층으로 적층되는 다층 PCB(110)의 상측에는 리드부(150)를 개재하여 칩 등과 같은 발열 전자부품(120)이 실장되는 상태에서, 상기 전자부품(120)은 그 저부에는 접지부(130)가 마련되어 상기 전자부품(120)의 접지부(130)가 솔더링에 의해 다층 PCB(110) 상측 표면에 착설되는 방열판(140)과 연설토록 됨으로써, 상기 전자부품(120)으로부터 발생되는 열이방열판(140)으로 전달되어 방열시킬 수 있도록 한다.As shown in FIG. 2 and FIG. 3, in the state where the heating electronic component 120 such as a chip is mounted on the upper side of the multilayer PCB 110 stacked in a plurality of layers through the lead unit 150, the electronic The component 120 is provided with a ground portion 130 at the bottom thereof, so that the ground portion 130 of the electronic component 120 is made to speak with the heat sink 140 mounted on the upper surface of the multilayer PCB 110 by soldering. The heat radiating plate 140 generated from the electronic component 120 is transferred to the heat radiating plate 140.

이때, 상기 다층 PCB(110)에 실장되는 전자부품(120)의 방열효과를 증대시키기 위하여, 상기 다층 PCB(110)의 하측은 물론, 다층 PCB(110)의 층간에 방열판(140')을 각각 설치하고, 상기 다층 PCB(110)의 층간에 각각 설치된 방열판(140')을 관통홀(160)을 통해 상호 연통 연결시키게 된다.In this case, in order to increase the heat dissipation effect of the electronic component 120 mounted on the multilayer PCB 110, the heat dissipation plate 140 ′ may be disposed between the layers of the multilayer PCB 110 as well as the lower side of the multilayer PCB 110. The heat sinks 140 ′ installed between the layers of the multilayer PCB 110 are connected to each other through the through holes 160.

이에따라서, 상기 다층 PCB(110)에 실장된 전자부품(120)에서 발생되는 고열이 그 하측으로 설치된 방열판(140)을 거쳐 층간에 설치된 방열판(140')에 차례로 전달됨으로써, 전자부품(120)의 방열효과를 극대화시킬 수 있게 된다.Accordingly, the high heat generated in the electronic component 120 mounted on the multilayer PCB 110 is sequentially transmitted to the heat sink 140 ′ disposed between the layers via the heat sink 140 installed below the electronic component 120. It will be possible to maximize the heat dissipation effect.

한편, 상기 전자부품(120)의 방열을 위하여 설치되는 방열판(140)(140')은, 열의 전달이 우수한 Cu로 구성함으로써, 방열효과를 증대시킬 수 있는 것이다.On the other hand, the heat dissipation plate (140, 140 ') provided for heat dissipation of the electronic component 120 is made of Cu excellent in heat transfer, it is possible to increase the heat dissipation effect.

이상과 같이 본 발명인 다층 PCB의 방열장치에 의하면, 다층 PCB의 층간에 방열판을 각각 설치하고, 이를 관통홀을 통해 연통 연결함으로써, 다수의 방열판의 설치에 의해 전자부품의 방열효과를 증대시킬 수 있게 됨은 물론, 상기 층간 설치되는 방열판이 관통홀을 통해 연통 연설되어 방열판의 접지면적이 증대되고, 이에따라 레귤레이터등과 같은 비교적 발열이 많이 발생하는 전자부품의 방열효과를 극대화할 수 있는 우수한 효과가 있다.As described above, according to the heat dissipation device of the multilayer PCB of the present invention, by installing the heat sinks between the layers of the multilayer PCB, and connecting them through the through-holes, the heat dissipation effect of the electronic components can be increased by installing a plurality of heat sinks. Of course, the heat sink installed between the layers is communicated through the through-holes to increase the ground area of the heat sink, thereby maximizing the heat dissipation effect of the relatively heat-generating electronic components such as regulators.

본 발명은 특정한 실시예에 관련하여 도시하고 설명하였지만, 이하의 특허청구의 범위에 의해 마련되는 본 발명의 정신이나 분야를 벗어나지 않는 한도내에서본 발명이 다양하게 개조 및 변화될수 있다는 것을 당업계에서 통상의 지식을 가진자는 용이하게 알수 있음을 밝혀두고자 한다.While the invention has been shown and described with respect to specific embodiments thereof, it will be appreciated that various changes and modifications can be made in the art without departing from the spirit or scope of the invention as set forth in the following claims. Those of ordinary skill will want to know easily.

Claims (2)

다층 PCB(110)의 상측으로 리드부(150)를 개재하여 전자부품(120)이 실장되며, 상기 전자부품(120)의 저부에는 접지부(130)가 마련되어, 상기 전자부품(120)의 접지부(130)가 솔더링에 의해 다층 PCB(110) 상측에 착설되는 방열판(140)과 연설되는 다층 PCB의 방열구조에 있어서,The electronic component 120 is mounted to the upper side of the multilayer PCB 110 through the lead portion 150. A ground portion 130 is provided at the bottom of the electronic component 120 to contact the electronic component 120. In the heat dissipation structure of the multi-layer PCB in which the branch portion 130 is extended from the heat sink 140 installed on the multi-layer PCB 110 by soldering, 상기 다층 PCB(110)에 실장되는 전자부품(120)의 하측 및 상기 다층 PCB(110)의 층간으로 각각 설치되는 방열판(140');A heat dissipation plate 140 'installed at a lower side of the electronic component 120 mounted on the multilayer PCB 110 and between layers of the multilayer PCB 110; 상기 다층 PCB(110)의 층간에 각각 설치된 방열판(140')을 연결토록 천설되는 관통홀(160);을 포함하여 구성됨을 특징으로 하는 다층 PCB의 방열장치.And a through-hole 160 formed to connect heat sinks 140 'respectively installed between the layers of the multilayer PCB 110. 제 1항에 있어서, 상기 전자부품(120)의 방열을 위하여 설치되는 방열판(140)(140')은, Cu로 구성됨을 특징으로 하는 다층 PCB의 방열장치.The heat dissipation device of claim 1, wherein the heat dissipation plate (140) (140 ') installed for heat dissipation of the electronic component (120) is made of Cu.
KR1020010052675A 2001-08-30 2001-08-30 A Device for Radiate Heat of Mult Layer PCB KR20030018520A (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180007579A (en) * 2016-07-13 2018-01-23 삼성전기주식회사 Printed circuit board
US9949358B2 (en) 2015-12-02 2018-04-17 Samsung Display Co., Ltd. Circuit board and display device having the same
US11896188B2 (en) 2018-04-30 2024-02-13 Lg Electronics Inc. Nozzle for cleaner

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Publication number Priority date Publication date Assignee Title
JPH0396075A (en) * 1989-09-08 1991-04-22 Hitachi Ltd Side pin distortion correction circuit
JPH09307238A (en) * 1996-05-20 1997-11-28 Kyocera Corp Multilayer circuit board
KR20000030091A (en) * 1999-11-17 2000-06-05 배영하 Printed circuit substrate of inserting metal of radiant heat
KR20010063109A (en) * 1999-12-21 2001-07-09 이형도 Radiating apparatus of pcb
KR200232826Y1 (en) * 2001-03-14 2001-10-08 엘지전자 주식회사 Cooling system of printed circuit board

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0396075A (en) * 1989-09-08 1991-04-22 Hitachi Ltd Side pin distortion correction circuit
JPH09307238A (en) * 1996-05-20 1997-11-28 Kyocera Corp Multilayer circuit board
KR20000030091A (en) * 1999-11-17 2000-06-05 배영하 Printed circuit substrate of inserting metal of radiant heat
KR20010063109A (en) * 1999-12-21 2001-07-09 이형도 Radiating apparatus of pcb
KR200232826Y1 (en) * 2001-03-14 2001-10-08 엘지전자 주식회사 Cooling system of printed circuit board

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9949358B2 (en) 2015-12-02 2018-04-17 Samsung Display Co., Ltd. Circuit board and display device having the same
KR20180007579A (en) * 2016-07-13 2018-01-23 삼성전기주식회사 Printed circuit board
US11896188B2 (en) 2018-04-30 2024-02-13 Lg Electronics Inc. Nozzle for cleaner

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