KR20030001236A - Method for manufacturing of abrasives and method of polishing - Google Patents

Abstract

PURPOSE: A method for fabricating a grindstone and a grinding method thereof are provided to grind an object having three-dimensional shape by forming the grindstone in an object to be processed. CONSTITUTION: A mold release agent is coated on a processing surface(2) of a workpiece(1) to be processed in order to prevent a grinding stone from sticking to the processing surface(2) of the workpiece(1). The coating process is carried out by using a brush or a spray. As the mold release agent is coated on the processing surface(2) of the workpiece(1), a small space section(5) is formed. Since the workpiece(1) has a concave shape, the small space section(5) has a size smaller than a size of the workpiece(1). If the workpiece(1) has a convex shape, the size of the small space section(5) is larger than the size of the workpiece(1).

Description

Method for manufacturing of abrasives and method of polishing

This invention relates to the shape transfer grindstone to which the shape of the workpiece was transferred, the manufacturing method of a shape transfer grindstone, and the grinding | polishing method using a shape transfer grindstone.

Along with the rapid development of technological innovation, the precision of industrial products is required. In response to this demand, the shape of workpieces, such as industrial products or parts, which are subject to grinding or grinding processing, is also complicated, and there are many cases where fine, high precision dimensions and high finishing surface roughness are required.

By the way, the final event of the workpiece which requires such a fine surface finish or high precision dimension is often still dependent on manual labor. If this manual process can be mechanized or hardened, it can reduce machining costs and shorten working time. In addition, in the manual polishing operation, even a skilled worker has a limit in the degree of mirror polishing of the machined surface.

Under such a situation, ELID grinding using solid grindstone was performed as a method of realizing high-precision mirror polishing of a workpiece. This is a method of polishing and grinding while dressing by giving an electric field to a solid stone. It is applied to a limited number of workpieces, such as planes and cones, although it has less scratches on the surface and high accuracy. Besides the solid grindstone, there is a polishing method using a soft lapping grindstone. This is a method of lapping a polymer lap material such as polyvinyl, acetal, sodium alginate, etc. onto the surface of the tax leather, but lapping is poor, and thus the polishing efficiency is poor.

As a method of polishing the free-form phase, there is a method using konjac grindstone, zebra grindstone and candle grindstone using a substance which changes state from liquid to solid as a binder. They have the advantage of being able to freely make any shape of grindstones by forming liquids and solidifying them, but there is a capillary phenomenon between the workpiece, the abrasive grains and the binder. Therefore, polishing efficiency is bad.

On the other hand, the inventor of the present application proposes a polishing method using a magnetic fluid containing an abrasive grain, an MR fluid, or the like, which can control the arrangement and dispersion of the abrasive grain by a magnetic field. This is a method of injecting magnetic fluid (containing abrasive grains) into the surface of a workpiece and applying a relative strength such as vibration or oscillation between the magnetic fluid and the workpiece while applying a magnetic field of constant strength to the magnetic fluid. As an example of the grinding | polishing method using such a magnetic fluid, Unexamined-Japanese-Patent No. 1-35466, Unexamined-Japanese-Patent No. 4-41173, Unexamined-Japanese-Patent No. 4-41173, etc. are mentioned.

However, as these fluids containing abrasive grains infiltrate the processing surface and give relative movement between the workpieces, these conventional methods of polishing the workpieces are abrasive liquids with high flowability, so that the abrasives are Low pressing pressure results in low polishing efficiency. Therefore, it is applicable to the final process of grinding and polishing of the workpiece, but is not suitable for the intermediate process of grinding or polishing.

Moreover, in the prior art, even if polishing is carried out in a state in which abrasive grains are arranged and controlled by giving a magnetic field having a predetermined strength with a magnetic fluid, the polishing efficiency is not sufficient according to the fluidity of the magnetic fluid. Moreover, when this magnetic fluid polishing method is applied to a three-dimensional shape, the corners and sharp edges of the three-dimensional shape are rounded and collapsed.

The present invention has been made to solve the above problems, and an object of the present invention is to provide a method for producing a grindstone, a grindstone, and a grinding method suitable for grinding a three-dimensional shape with a high pressing pressure of the abrasive.

1A to 1E are process drawings showing the method of manufacturing a shape-transfer grindstone corresponding to an embodiment according to the present invention.

2A to 2D are process drawings showing a polishing method of an embodiment according to the present invention.

<Description of the symbols for the main parts of the drawings>

One … Workpiece 2. Surface to be processed

3…. Release agent 4. Release agent layer

5... Difference space 6. Raw stone

7. Grindstone holding part 8. Heater

9. Liquid grindstone raw material 10. Magnetic field source

11. Magnetic field generating source 12. Magnetic field source

13, 14, 15... Coil 16... Groove of the grindstone support

17. Solidifying stone 18. Grinding

19. Zeolite solution

Next, as a specific example of this invention, the manufacturing method of a new grindstone is demonstrated based on FIGS. 1A-1D.

In Fig. 1A, a release agent 3 is applied to prevent the grindstone from sticking to the processed surface 2 of the workpiece 1. The mold release agent contains components that dissolve the abrasive grains and the binder. The application may be a brush or spray. The application of the release agent 3 results in a different release space 5 which is smaller than the space enclosed by the surface to be processed by the thickness of the release agent layer 4. In this specific example, the shape of the workpiece is concave, and the different mold space 5 is slightly smaller than the shape of the workpiece. On the other hand, when the shape of the workpiece is convex, the difference space 5 is slightly larger than the shape of the workpiece.

In FIG. 1B, the grindstone raw material 6 and the grindstone holding part 7 of the powder state are inserted into the different space 5. The grindstone raw material contains abrasive grains, binders and magnetic field sensitive substances. Then, the temperature of the grindstone raw material is raised in the different space 5 to liquefy (the figure shows a case where the temperature of the grindstone raw material 6 of the powder is increased by a heater 8). At this time, if the temperature of the workpiece 1 is close to the melting point of the grindstone raw material, it may be a room temperature state. When using a high-melting-stone grindstone raw material, the workpiece 1 may be preheated. In addition, in this embodiment, the grindstone raw material in the powder state is charged in the different space 5, but of course, the grindstone raw material in the liquid state may be poured.

The grindstone holding portion 7 has a plurality of props. In order to enlarge the fastening area of a grindstone holding part and a grindstone, a groove | channel or a step | step may be formed in a grindstone holding part, or another part may be attached to a grindstone holding part.

In Fig. 1C, a magnetic grindstone 9 in a liquid state is applied to a leggings. 3, three magnetic field generating sources 10, 11 and 12 are provided, and coils 13, 14 and 15 are wound around each magnetic field generating source. Then, a current flows through the coils 13, 14, and 15, and magnetic field is applied to the grindstone raw material 9 from a plurality of different directions (in this embodiment, three directions of top, left and right). The directions of the magnetic fields generated from these coils 13, 14 and 15 cross each other. And the magnetic lines of force generated in the coils 13, 14 and 15 spread radially.

The grindstone holder 7 is coupled to the magnetic field generating source 10, and the grindstone holder 7 is also part of the magnetic field circuit. A soft magnetic body is used for this grindstone holding part 7. In addition, the current flowing through each coil may be changed, alternating current flows, or the current flowing in the coil may be controlled on-off so as to become an abrasive leg adapted to shape. △ represents an abrasive grain in this figure.

In this embodiment, the grindstone raw material is applied by applying a magnetic field to the grindstone raw material, but in addition to the grindstone raw material, any one of mechanical vibration or electric field may be given to the grindstone raw material or combined together.

In FIG. 1D, in the different space 5, the grindstone is cooled and pulled in the direction in which the grindstone is solidified. At this time, since the grindstone raw material enters the groove 16 of the grindstone holding part, the solidified grindstone 17 is easy to be pulled out. In this way, the contact cross-sectional area of the grindstone holding portion 7 and the solidified grindstone 17 can be increased to provide a large polishing pressure to the relative polishing movement.

FIG. 1E is an enlarged view of the polishing unit 18 of FIG. 1D, showing a contact state between the grindstone, the release agent layer 4, and the workpiece surface. As the abrasive grains in the release agent 4 move as in this diagram, the difficulty of pulling out due to the roughness of the surface roughness is alleviated, and the extraction difficulty due to the surface adhesion is alleviated due to the solvent of the release agent 3.

Next, a new polishing method as an embodiment of the present invention will be described based on FIGS. 2A to 2D.

In FIG. 2A, the solidified grindstone 17 (shape transfer grindstone) created in FIG. 1D is placed in the difference space 5, and it is left-right direction (normal direction of a processing surface) to the grindstone holding part 7 or grindstone 5 The polishing pressure is applied to the workpiece to apply relative movement (<->) in the vertical direction (tangential direction of the workpiece) as the first direction in which the grindstone can move relative to the workpiece. At this time, the grindstone solution 19 is suitably given, and the first surface is polished while the grindstone is worn. This grindstone solution 19 is combined with a release agent. The number of reciprocating motions of the grindstone 5 is controlled so that the next surface is polished when the predetermined number of grinding operations are completed.

In FIG. 2B, by grinding | polishing in FIG. 2A, the grindstone surface which contact | connects a process surface like this diagram wears down, and the space | interval of a process surface and a grindstone increases. In this way, as shown in this diagram, the grinding wheel is applied to the grindstone holding part or the grindstone in the inclined direction (normal direction of the processing surface), and the inclined direction as the second direction different from the first direction almost parallel to this (processing) Give relative movement (<->) in the tangential direction of the plane. The stroke of relative motion is set smaller than. At this time, the grindstone solution 19 is appropriately given and the second surface is polished while the grindstone is worn.

In FIG. 2C, with the grinding | polishing in FIG. 2B, the grindstone surface which contacted the to-be-processed surface like this diagram wears down, and the space between a process surface and a grindstone increases. Using this interval, the polishing pressure is applied in the vertical direction (the radial direction of the surface to be processed) of the grindstone holding portion or the grindstone as shown in this diagram, and the left and right directions (the tangential direction of the surface to be processed) are different from the second direction. ) Relative movement (<->). The stroke of relative motion is set smaller than. At this time as well, the grindstone solution 19 is appropriately polished while the third surface is polished.

In FIG. 2D, the grindstone finally becomes small, and the transfer shape deteriorates like this figure. According to the polishing method of the present invention, it is possible to polish any combination of inclined surfaces of the workpiece. Further, when the degree of dimension is improved or mirror polishing is performed by repeating the steps of FIGS. 1A-1E and 2A-2D, the degree of dimension and the roughness of the finishing surface can be increased.

In addition, in order to remove grindstone crumb powder and grinding | polishing powder from a process surface, you may blow into a process surface with a blower etc. which are not shown in figure.

In the above embodiment, an example in which a grindstone is made in a workpiece to be polished and the workpiece is polished by the grindstone has been described. The present invention is not limited to this embodiment and can be modified in various ways. For example, a grindstone may be manufactured in a model of a workpiece and a different type, and the grindstone may be removed from the model, the grindstone may be inserted into the workpiece, and the workpiece may be polished.

Specific applications of the present invention are widely available throughout the processing using abrasive particles.

The main fields of use include optical lenses, prisms, mirrors, etc., as well as molds, exterior parts, jewelry, watch parts, and gauges, cylinders, bearings, and bearings that require high precision. It can also be applied to grinding and polishing of wheels, cams and gears.

In addition, the semiconductor field can be applied to the idea of silicon wafers, which are the basis of integrated circuits, as well as medical products such as dentures and artificial bones.

Claims (5)

Applying a releasing agent to prevent the sticking of the grindstone on the surface of the workpiece, charging the grindstone raw material containing at least the abrasive, the binder and the self-sensitive substance into the workpiece and the different mold space, and electric grindstone raw material in the space And a step of solidifying or gelling the electric grindstone raw material in a liquid state. The method of claim 1, A process for producing a grindstone raw material in an electric space, wherein any one of magnetic field, mechanical vibration, or electric field is given to the grindstone raw material, or a combination thereof is used to feed the grindstone raw material. The method of claim 2, When giving a magnetic field to the electric grindstone raw material, a method for producing a grindstone, characterized in that the magnetic grind material is magnetically supplied in a plurality of different directions using a plurality of magnetic field generating sources. Manufacture of a grindstone comprising the step of injecting a grindstone raw material containing at least an abrasive and a binder and a grindstone holding part for holding a grindstone into a space between a workpiece and a different type, and solidifying or gelling a liquid electric grindstone raw material. Way. In a polishing method of giving a relative movement between a workpiece and a grindstone while pressing a solid grindstone or a liquid grindstone containing at least a grain and a binder in accordance with the shape of the workpiece to the workpiece surface. The first step of abrasion of the grinding wheel by polishing the first surface of the workpiece by grinding the grinding wheel in the first direction in which the grinding wheel can move relative to the workpiece, and the first electrical work of the workpiece resulting from the grinding of the grinding wheel. A polishing method comprising a secondary process of polishing a second surface of a workpiece by performing a relative movement of the ground stone in a second direction different from the first electric direction by using the surface and the ground stone.