JP2003089052A - Grinding device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a grinding device with high grinding efficiency and which is suitable for grinding a three-dimensional shape. SOLUTION: A grinding device grinds a workpiece 1 using a grinding tool 17 made by solidifying or gelatinizing a liquid raw material 9 of a grinding tool including a magnetic body charged in a space of the workpiece 1. Magnetic- field feed parts 10, 11, 12 that give a magnetic field to the liquid raw material 9, are provided in the grinding device, and the magnetic-field feed parts 10, 11, 12 give the magnetic field to the liquid raw material 9 from a plurality of different directions each other to disperse abrasive grains. Abrasive grains can be almost uniformly dispersed three-dimensionally (for instance, like meshes of a net or windows of a building) by giving the magnetic field from a plurality of directions, thereby obtaining projections of abrasive grains on any surface of the solid grinding tool. Thus, the grinding device suitable for grinding any surface of a three-dimensional free shape can be obtained.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a polishing apparatus for polishing a work piece by applying a polishing pressure between a grindstone and processing to cause relative movement.

[0002]

2. Description of the Related Art With the rapid progress of technological innovation, it is required to improve the quality of industrial products, and the demand for finishing such as polishing and grinding is increasing. Modern products such as mobile phones have complicated shapes, are fine, and have high dimensional accuracy. Similarly, jigs and molds for producing products are required to have complicated shapes, fine shapes, and high dimensional accuracy. For this reason, it is necessary to carry out polishing / grinding work in the manufacturing process of the jigs, dies and the like.

Since polishing and grinding of a work requiring such a fine surface finish and high dimensional accuracy is complicated in shape, it still depends on manual work. Although a polishing method by mechanical force using a solid grindstone of a predetermined shape is performed in some productions, it is limited to a simple shape.
Further, even in the case of manual polishing work, there is a certain limit in the processed shape and finish surface accuracy due to lack of skilled workers, skill level, and the like. In addition, the manual work by a skilled worker has an adverse effect on the human body due to polishing dust and dust. If the manual finishing process for such industrial products can be mechanized or labor-saving, the processing cost can be reduced, the working time can be shortened, and the safety can be improved.

Under such circumstances, a solid grindstone is used as a method for realizing highly accurate mirror polishing of a workpiece.
ELID grinding has been performed. This is a method of polishing and grinding while applying an electric field to a solid whetstone and performing dressing. There are few scratches on the polished surface and high finishing accuracy is possible, but the shape such as flat surface or cylinder is limited. It has been applied to other things.

Further, there is a method of polishing a soft lapping grindstone other than the solid grindstone. This is a method in which a polymer wrap material such as polyvinyl acetal or sodium alginate is melted on the surface of the chamois and lapping is performed, but the polishing efficiency is poor because a large polishing pressure (grinding stone pressing pressure) cannot be obtained.

Further, as a method of polishing a free shape, a substance that changes phase between liquid and solid is used as a binder.
There are methods using a konjac grindstone, a gelatin grindstone, and a wax grindstone. By making a shape with a liquid and solidifying these,
Although it has the advantage that any shape of grindstone can be freely made, because there is a capillary phenomenon between the workpiece, the abrasive grains, and the grindstone binder, there is almost no protrusion of the abrasive grains on the surface of the grindstone, Abrasive grains segregate. Therefore, the polishing efficiency is poor.

On the other hand, the inventors of the present application have proposed a polishing method using a magnetic fluid or an MR fluid containing abrasive grains, in which the arrangement of the abrasive grains can be controlled by a magnetic field. The contents are magnetic fluid (including abrasive grains) immersed in the surface of the workpiece,
In this method, a magnetic field having a predetermined strength is applied to the magnetic fluid, and relative motion such as vibration or rocking is performed between the magnetic fluid and the workpiece to perform polishing. Examples of the polishing method using such a magnetic fluid include JP-A-1-135466, JP-A-4-336954, and JP-A-4-41.
173, Japanese Patent No. 3081911, Japanese Patent Laid-Open No. 11-
165252, JP-A-11-165268, and the like.

[0008]

However, these conventional methods for polishing a work piece by immersing a fluid containing abrasive grains in the work surface and applying relative motion to the work piece in this way are as follows. Since the abrasive material is a highly fluid liquid, the pressing pressure of the abrasive particles against the processed surface is weak and the polishing efficiency is low. Therefore, although it can be applied to the final step in the grinding and polishing steps of the workpiece, it is not suitable for the grinding step or the polishing intermediate step.

Further, in the prior art, even if a magnetic fluid is used and polishing is performed in a state where the abrasive grains are array-controlled by applying a magnetic field of a predetermined strength, the fluidity of the magnetic fluid does not provide sufficient polishing efficiency. Absent. Further, when this magnetic fluid polishing method is applied to a three-dimensional shape, there is a problem that the corners and sharp edges, which are the features of the three-dimensional shape, are rounded, causing sagging.

Therefore, an object of the present invention is to provide a polishing apparatus which has a high polishing efficiency and is suitable for polishing a three-dimensional shape.

[0011]

The present inventor has found that the fluid grindstone containing abrasive grains has the advantage of being free-form (the shape can be freely deformed three-dimensionally in accordance with the shape of a work piece, and further, a narrow gap can be formed). By pouring it in from above, the fluid grindstone can be constructed inside a narrow and closed shape that human hands and tools cannot enter, and the fluid grindstone was solidified or gelled. By using the magnetic field stirring action to disperse the abrasive grains in three dimensions (X, Y, Z directions or in the vertical, horizontal, vertical directions), the polishing efficiency is high, and the three-dimensional shaped workpiece is polished. It was found that a polishing apparatus suitable for the above can be obtained.

As is well known, when the solid abrasive grains and the binder are turbid, the segregation of the abrasive grains occurs due to the effects of van der Waals force, surface force, gravity, etc., and the pitch between the abrasive grains varies. In order to make the pitch between the abrasive grains uniform, a magnetic field is applied from a plurality of directions to a grindstone raw material containing three types of abrasive grains, a binder, and a magnetic substance, and stirring is performed. That is, the invention of claim 1 provides a liquid grindstone raw material containing a magnetic material, which is charged in a space of a workpiece,
A polishing apparatus for polishing a workpiece using a solidified or gelled grindstone, wherein a magnetic field supply unit for applying a magnetic field to the liquid grindstone raw material is provided, and the magnetic field supply unit is the liquid grindstone. The above-mentioned problems have been solved by a polishing apparatus which is characterized in that magnetic fields are applied to a raw material from a plurality of different directions to disperse abrasive grains.

According to the present invention, the abrasive grains can be three-dimensionally and substantially evenly dispersed (for example, like a mesh or like a window of a building) by applying magnetic fields from a plurality of directions. Therefore, protrusion of abrasive grains can be obtained on any surface of the solid whetstone. Therefore, a polishing apparatus suitable for polishing an arbitrary surface having a three-dimensional free shape can be obtained. On the other hand, for example, when a magnetic field is applied to the grindstone raw material from only one direction, it is possible to uniformly disperse the abrasive grains only on one surface of the solid grindstone, but the abrasive grains on any surface of the solid grindstone. Cannot be evenly dispersed.

Further, by producing a magnetic field stirring grindstone in a polishing apparatus which makes a relative motion between the work piece and the grindstone, the relative position coordinates of the grindstone and the work piece are set to a fixed position in the grindstone making process. For this reason, the initial positioning (replacement) for the polishing process becomes unnecessary, and the working time is shortened.

Further, the present grindstone is a soft grindstone because it can increase the polishing pressure (grinding stone pressing pressure), which is an advantage of a solid, and further, the capillary phenomenon is alleviated and the protrusion amount of the abrasive grains is secured. Is a grindstone with good polishing efficiency. As a method of polishing a three-dimensional free-form work piece, if a soft grindstone is used for polishing, the surface of the work piece is polished by vibrating the grindstone in all directions, as in barrel polishing. When polishing with a hard grindstone, the shape of the work such as corners and sharp edges is likely to collapse, so it is necessary to apply a polishing pressure to the work surface and to provide relative polishing motion in the tangential direction of the work surface. INDUSTRIAL APPLICABILITY The present invention is a polishing apparatus using a shape transfer grindstone with less segregation of abrasive grains and good dispersibility of abrasive grains, and can use both a soft grindstone and a hard grindstone.

Note that the combined use of magnetic field stirring and stirring by mechanical vibration or the like is also included in claim 1. Further, the grindstone raw material may be composed of magnetic particles, non-magnetic particles and binder, or may be composed of magnetic particles and binder.

The invention of claim 2 is a means for effectively performing magnetic field stirring. That is, the invention of claim 2 is characterized in that the magnetic field supply unit applies a magnetic field to the grindstone raw material in X, Y, and Z directions orthogonal to each other.

According to the present invention, the abrasive grains can be arranged at substantially equal pitches in any of the X, Y and Z directions.

The invention according to claim 3 is characterized in that a grindstone holding portion for holding the grindstone and being a part of the magnetic field circuit is provided.

The closer the magnetic field generation source is to the grindstone, the higher the magnetic field efficiency and the stronger the magnetic field strength. According to this invention, the magnetic field generation source becomes closer to the grindstone.

According to a fourth aspect of the present invention, the magnetic field supply unit has a plurality of coils for applying a magnetic field to the grindstone raw material,
It is characterized in that an alternating current is passed through the coil, or a current passed through the coil is ON-OFF controlled, or a current passed through the coil is changed.

According to the present invention, the magnetic field is applied to the grindstone having magnetism by changing the strength and direction of the magnetic field, so that the magnetic substance uniformly enters between the abrasive grains by the action of the magnetic field. In order to polish a three-dimensional processed product, it is necessary that the pitch between the abrasive grains be three-dimensionally uniform, and the polishing apparatus has means for changing the magnetic force lines to produce a uniformly dispersed high-performance grindstone. To be done.

According to a fifth aspect of the present invention, there is provided a polishing apparatus for polishing a workpiece by using a grindstone placed in a space of the workpiece, and controlling relative movement between the workpiece and the grindstone. A control unit is provided, and the control unit causes the grindstone to move relative to the work piece in a first direction in which the grindstone can move relative to the work piece. Polishing the surface, then using the gap between the first surface and the grindstone of the workpiece caused by wear of the grindstone, to the workpiece in a second direction different from the first direction The above-mentioned problem is solved by a polishing apparatus characterized by polishing the second surface of the workpiece by relatively moving the grindstone.

The present invention is a polishing apparatus suitable for polishing a workpiece such as a die and a bearing represented by a hemispherical shape.
In the present invention, in the initial step, polishing is performed from the direction in which polishing is possible to reduce the abrasion of the grindstone, and the abrasion of the grindstone is related to the polishing operation stroke to the next surface.

Since the clearance between the work piece having a three-dimensional free shape and the shape similar to that of the work piece is very small, it is impossible to perform the polishing movement in the direction of the clearance. Since the shape of the mold, which is a processed product, is a part of a hemisphere, the polishing motion can be performed in one direction (the removal direction). Therefore, by performing the polishing movement in the above-mentioned direction, both the work piece and the grindstone wear down, and the gap between the work piece and the grindstone increases. By performing polishing with a grindstone having a large amount of wear of the grindstone, the surface of the workpiece is polished and a gap capable of polishing movement is secured. By polishing the next surface by utilizing this secured clearance that allows polishing movement, the grindstone further wears down and the next clearance increases. By polishing in this way, the grindstone wears on the polishing surface and gradually becomes smaller, and the three-dimensional free-form surface of the workpiece is polished.

The present invention is a polishing apparatus having a control function of abrading a grindstone by polishing a processed surface and polishing the next surface. A grinding device that detects the amount of wear of the grindstone and controls to grind the next surface, or grinds up to a specified number of times,
A polishing apparatus that controls the polishing operation direction to change and polish the next surface again is also included in claim 5.

According to a sixth aspect of the present invention, the control unit further utilizes a gap between the second surface of the workpiece and the grindstone caused by wear of the grindstone, and is different from the second direction. It is characterized in that the third surface of the workpiece is polished by relatively moving the grindstone in three directions.

According to the present invention, a workpiece having a three-dimensional free shape can be polished.

According to a seventh aspect of the present invention, an urging means for urging the grindstone in a direction intersecting the machining surface of the workpiece and a reciprocating motion of the grindstone relative to the workpiece in a tangential direction of the machining surface. Reciprocating means for rotating, one of the workpiece and the grindstone for rotating, and one of the workpiece and the grindstone for rotating the other of the workpiece and the grindstone. The above-described problems are solved by a polishing apparatus including a follow-up unit.

According to the present invention, the grindstone is pressed against one of the processed surfaces of the workpiece and the relative movement is performed, whereby only the surface in the pressing direction is polished. When one of the workpiece and the grindstone is rotated, the other follows, so that the machined surface of the workpiece and the grindstone surface can be simultaneously changed to polish the next surface. Therefore, with a simple mechanism, the entire circumference of the inner surface of the workpiece (360 degrees)
Can be polished. In the present invention, the workpiece may be rotated, and the grindstone may be made to follow the rotary movement of the workpiece, or conversely, the grindstone may be made to rotationally move and the workpiece may be made to follow the rotary movement of the grindstone. Good.

According to an eighth aspect of the present invention, the urging means has a spring, and the polishing device supports the grindstone or the workpiece so as to be movable in a direction intersecting a processing surface of the workpiece. And a supporting means.

According to the present invention, it is possible to generate a substantially constant polishing pressure with a simple mechanism.

According to a ninth aspect of the present invention, an urging means for urging the grindstone in a direction intersecting a machining surface of the workpiece, and the grindstone relative to the workpiece in a tangential direction of the machining surface. Reciprocating means for reciprocating, the biasing means is X
A polishing apparatus comprising: an X-axis moving mechanism that moves the grindstone or the workpiece in a direction, and a Y-axis moving mechanism that moves the grindstone or the workpiece in a Y direction orthogonal to the X direction. The above-mentioned problems are solved.

According to the present invention, the grindstone or the work piece is X,
By moving the whetstone back and forth relative to the work piece while moving in the Y direction, the entire circumference of the inner surface of the work piece (360
Degree) can be polished.

According to a tenth aspect of the present invention, the reciprocating means is attached to the end of the SCARA type robot arm or the end of the gantry type robot.

The present invention is a polishing apparatus in which a reciprocating means is attached to a terminal end portion of a robot arm so that a workpiece and a grindstone can be relatively moved in a portion having a small inertial amount. By performing the polishing motion at the terminal end, it is not necessary to move the structure such as the robot arm. Since the inertial force for the relative movement is small, high-speed relative movement is possible.

The invention of claim 11 is characterized in that the reciprocating means has a cam for reciprocating the grindstone relative to the workpiece.

When the abrasive grains are dispersed by using a magnetic force, the pitch between the abrasive grains is often about several hundred μm. The stroke of the grindstone is preferably a stroke (specifically, about several mm) larger than the pitch between the abrasive grains. According to the present invention, an appropriate stroke can be secured by reciprocating the grindstone with respect to the workpiece using the cam. On the other hand, when the piezo actuator is used, the stroke becomes shorter than the pitch between the abrasive grains, and there is a possibility that some portions cannot be polished.

According to a twelfth aspect of the present invention, a first link device having a whetstone mounted thereon and having four joints and a second link having a workpiece mounted thereon and having four joints are provided. The above-described problem is solved by a polishing apparatus including an apparatus and an interlocking mechanism that associates the operations of the first link apparatus and the second link apparatus.

The invention of claim 12 is a polishing apparatus having two sets of four joint link structures. Attaching a grindstone holding part or grindstone to a part of the parallelogram which is a 4-joint link feature,
When a work piece is attached to another 4-joint link structure and the crank angle of the link is changed at the same time, the grindstone stays at the fixed point coordinates that are always seen from the work piece. By linking the mutual link devices with an interlocking mechanism such as an angle gear, a link, a belt, and a wire, the structure is simple, and the workpiece and the grindstone posture are always constant. In this structure, when a relative polishing motion is generated in the length direction of the crank, the relative position of the grindstone and the work piece is constant, and the polishing direction is freely selectable. Since the relative posture of the grindstone and the workpiece is always constant, it is possible to configure a polishing apparatus that has good positioning accuracy, is small and lightweight, and has high polishing stroke accuracy.

According to a thirteenth aspect of the present invention, the length of a crank constituting the first link device is changed to perform relative movement between the workpiece and the grindstone.

According to the thirteenth aspect of the present invention, by changing the length of the crank, it is possible to provide a polishing apparatus having a small amount of inertia. A cam, a plunger, an electromagnetic solenoid or the like is used as a means for expanding and contracting the crank. Since the amount of inertia of the movable part is small and the weight is small, and the expansion and contraction dimensional accuracy of the crank is good, a polishing device having a high polishing stroke precision and capable of high speed operation is configured.

According to a fourteenth aspect of the present invention, there is provided a polishing apparatus for polishing a workpiece by reciprocating the grindstone relative to the workpiece, wherein the grindstone moves the workpiece toward the workpiece during the reciprocating movement. The polishing pressure is applied to the processed surface of the workpiece, and when the reciprocating motion returns, the polishing pressure applied to the processed surface of the workpiece is reduced from the grindstone, or the grindstone is separated from the processed surface of the workpiece. The above-mentioned problem is solved by the polishing apparatus.

The present invention is a polishing apparatus having a structure in which polishing is performed in the direction of pulling out a grindstone from a workpiece and no polishing pressure is applied to the processed surface of the workpiece in the direction of pushing operation. By the grindstone performing such an operation, the polishing scraps and grindstone scraps due to the polishing are discharged in one direction. Therefore, it becomes possible to prevent scratches and improve the finish surface accuracy.

According to a fifteenth aspect of the present invention, the polishing apparatus is attached to the frame to which the workpiece is attached and to the frame so as to be movable in a direction intersecting the processing surface of the workpiece, and the grindstone is attached to the processing surface. It is characterized by comprising a first reciprocating part for reciprocating in a tangential direction and a second reciprocating part for reciprocating the first reciprocating part in a direction intersecting the machining surface.

According to the present invention, a polishing pressure is applied from the grindstone to the processed surface of the workpiece during the reciprocating motion, and from the grindstone to the processed surface of the workpiece during the return of the reciprocating motion. The polishing pressure applied can be reduced, or the grindstone can be separated from the processed surface of the workpiece. In addition,
The locus of movement of the grindstone may be square or elliptical.

According to a sixteenth aspect of the present invention, the polishing apparatus uses a grindstone obtained by solidifying or gelling the liquid grindstone raw material containing a magnetic material, which is charged in the space of the work. The polishing apparatus is characterized in that the polishing apparatus is provided with a magnetic field supply unit that applies magnetic fields to the liquid grindstone raw material from a plurality of different directions to disperse the abrasive grains.

According to the present invention, a polishing apparatus having a high polishing efficiency and suitable for polishing a three-dimensional shape can be obtained.

According to a seventeenth aspect of the present invention, in the polishing apparatus, X, Y and Z which are orthogonal to each other with respect to the liquid grindstone raw material
It is characterized in that a magnetic field is applied from the direction to disperse the abrasive grains.

According to the present invention, magnetic field stirring can be effectively performed.

According to the eighteenth aspect of the present invention, the liquid grindstone raw material containing the magnetic material charged in the space of the workpiece is processed by using a solidified or gelled grindstone. A polishing apparatus for polishing an object, comprising: a base, an attachment base rotatably provided on the base, to which the workpiece is attached, an attachment rotation unit that rotates the attachment base, and A support portion that is provided to support the grindstone so as to be movable in the horizontal direction, a spring that urges the grindstone toward the workpiece, and reciprocates the grindstone relative to the workpiece in the tangential direction of the machining surface. A reciprocating part for moving, a revolving part rotatably provided, a grindstone holding part for holding the grindstone, and a magnetic field supplying part for applying a magnetic field to the liquid grindstone raw material. Can also be configured as a polishing device. Can.

According to a nineteenth aspect of the present invention, the liquid grindstone raw material containing a magnetic material charged in the space of the workpiece is processed by using a solidified or gelled grindstone. A polishing apparatus for polishing an object, comprising: a base, an attachment base provided on the base, on which the workpiece is attached, and provided on the base for moving the grindstone in the X direction and the Y direction. The X-axis moving mechanism and the Y-axis moving mechanism for urging the grindstone in a direction intersecting the machining surface of the workpiece, and the X-axis moving mechanism and the Y-axis moving mechanism are provided, and the grindstone is the workpiece. A reciprocating part that relatively reciprocates in the tangential direction of the machining surface, and a magnetic field supply part that applies a magnetic field to the liquid grindstone material are also configured as a polishing apparatus. be able to.

Further, according to the present invention, as described in claim 20, the liquid grindstone raw material containing the magnetic material charged in the space of the workpiece is processed by using a solidified or gelled grindstone. A polishing device for polishing an object, comprising a frame, a 4
A first parallel crank mechanism having a pair of first cranks and a first parallel link that moves in parallel with the frame, and a pair of second cranks. Second parallel crank mechanism having a second parallel link moving parallel to the crank and the frame, and the first parallel link and the second parallel link move without changing their relative positions. Such that the whetstone is attached to the first parallel link and the work piece is attached to the second parallel link, the interlocking mechanism relating the operations of the first crank and the second crank. It can also be configured as a polishing apparatus characterized by being provided.

Further, according to a twenty-first aspect of the present invention, the liquid grindstone raw material containing the magnetic material charged in the space of the workpiece is processed by using a solidified or gelled grindstone. A polishing device for polishing an object, comprising a frame, a work piece attached to the frame, and a movably attached to the frame in a direction intersecting a processing surface of the work piece.
A first reciprocating part that reciprocates the grindstone in a tangential direction of the machining surface; and a second reciprocating part that reciprocates the first reciprocating part in a direction intersecting the machining surface. When going, apply a polishing pressure from the grindstone to the processed surface of the workpiece, reduce the polishing pressure applied from the grindstone to the processed surface of the workpiece when returning from the reciprocating motion, or process the workpiece It can also be configured as a polishing device characterized in that the grindstone is separated from the surface.

[0055]

BEST MODE FOR CARRYING OUT THE INVENTION The present invention relates to a solid grindstone having a shape similar to that of a work piece, which is obtained by filling a work piece coated with a release agent with a powder or liquid containing abrasive grains, stirring in a liquid state, and solidifying the work piece. To produce. Therefore, the present invention is a polishing apparatus that can be used for small-quantity production or single-item production. In addition, it is a polishing device that supports a wide range of application over the entire process, such as places that are out of the reach of people and workpieces with narrow spaces.

A specific field of application of the present invention is in general abrasive processing. Examples of main fields of use include spectacle lenses, prisms of specific shapes, mirrors, and the like as optical fields. Also, molds for various industrial products, casing parts,
Jewelery, watch parts, and other gauges, cylinders, bearings, bearings, cams, etc. that require higher dimensional accuracy.
It can be applied to grinding and polishing of gears. Further, in the field of semiconductors, it can be applied to the finishing of silicon wafers, which are the basis of integrated circuits, and as a special example, medical products such as dentures and artificial bones.

Hereinafter, an example of a polishing apparatus will be described in which a shape transfer grindstone (shape conforming grindstone) is prepared from a grindstone raw material containing abrasive grains according to the present invention and used for polishing.

Since the applicable range of the polishing apparatus according to the present invention covers a wide range as described above, the content of the abrasive grains to be used and the content of the grindstone raw material containing the abrasive grains to be used depend on the material, shape and finish of the workpiece. Will be decided.

As the material of the abrasive grains used, in the case of magnetically sensitive abrasive grains, specifically, iron oxide abrasive grains (Fe ₂ O ₃ , Fe ₃ O ₄ ),
Coated abrasive grains (SiC plated, diamond plated), non-magnetic abrasive grains include alumina (Al ₂ O ₃ ) and silica (S
iO ₃ ), silicon carbide (SiC), diamond (C) and the like. Regarding the particle size of the abrasive grains, the higher the required finishing accuracy, the smaller the particle size used.

When the non-magnetic abrasive grains are used as the raw material of the grindstone, the raw material of the grindstone contains the abrasive grains, the magnetic substance and the binder. _{M n Z n · Fe 2 O} 3 as the material for the _{magnetic, Co-γ-Fe 2 O} 3, BaO-6Fe 2 O 3,
Etc.

The binder may be water, various oils, wax, soap, oleic acid, etc., and there may be one binder or several binders. Further, a surfactant may be added to prevent the abrasive grains and the magnetic substance from coagulating.

As a method for changing the phase of liquid and solid,
There can be mentioned a method utilizing a temperature phase change in which a gel or solid is formed at a melting point temperature or lower, and a sol or a liquid is formed at a melting point temperature or higher. In the case of fats and oils, a method of utilizing a chemical reaction in addition to the temperature phase change can be considered. Further, in the case of a polymer binder, a method utilizing a photopolymerization reaction can be considered.

Controlling the dispersion of the abrasive particles in the liquid before gelling or solidifying is extremely important in the present invention. This is because the grindstone surface in contact with the processed surface of the workpiece has a great influence on the polishing rate, the polishing accuracy, and the polishing efficiency depending on the state of the abrasive grains. The raw material of the grindstone contains a binder, a magnetic substance, and abrasive grains having different specific gravities (when the magnetic sensitive abrasive is used, the binder and the magnetic sensitive abrasive are included).
Therefore, in the liquid state, segregation of abrasive grains occurs and the number of effective abrasive grains on the polished surface varies. When the workpiece has a three-dimensional shape, it is necessary to uniformly control the number of effective abrasive grains within the three-dimensional shape.

When the fluid containing the magnetic substance and the workpiece are placed in a magnetic field environment, the magnetic substances are arranged along the lines of magnetic force. Moreover, since the number of magnetic lines of force per unit area is proportional to the magnetic field strength, the density of the magnetic substance can be controlled by controlling the magnetic field strength. By changing the direction in which the magnetic field strength is applied up and down (Z direction), left and right (X direction), front and back (Y direction), the magnetic substance is stirred in the liquid, and the abrasive grains are also stirred accordingly. . In this way, the distribution of abrasive grains in the liquid can be controlled as required.

As a method of controlling the dispersion of the abrasive grains in the liquid when solidifying, a method of applying a magnetic field to the fluid containing the magnetic substance or the magnetically sensitive abrasive grains from various directions to control the dispersion is used.

In this way, the grindstone containing the gelled or solidified abrasive grains is ground or polished by causing relative motion such as vibration or vibration with the processed surface of the workpiece. The direction of the polishing movement needs to be changed according to the shape of the processed surface of the workpiece. As a polishing motion, a three-dimensional surface can be polished by applying a one-dimensional or two-dimensional operation to each constituent surface of the three-dimensional surface and successively performing partial polishing.

The polishing stroke is adjusted according to the intended processing. If you want to perform large grinding in a unit time,
It is performed by using a grindstone containing large abrasive grains to generate a relative movement of a large stroke with the workpiece, and in the case of mirror-finishing that requires precise dimensional accuracy, the grindstone containing small abrasive grains is used to machine the workpiece. By creating a small stroke of relative motion between and.

Since the setting of the abrasive grains, the polishing movement direction, and the polishing stroke change depending on the finishing purpose of the workpiece, adjustment is made for each workpiece. The grindstone holding unit is attached to the polishing apparatus, and the grinding and polishing are automatically performed under the control adapted to the polishing conditions, the finish degree of the workpiece, the shape of the workpiece, and the like.

A general-purpose robot or machine tool can be used as a processing device using a grindstone capable of polishing with a minute stroke due to the effect of dispersing abrasive grains. However, if magnetic field agitation is prepared in a separate process, the grindstone in which the abrasive grains are dispersed and the workpiece must be attached to the general-purpose processing machine again, and the relative positional relationship between the grindstone and the workpiece must be accurately determined.
Alternatively, it is necessary to incorporate the magnetic stirring function into the existing device.

A processing apparatus using a grindstone capable of polishing with these minute strokes (a soft grindstone, a hard grindstone, and a grindstone to which an abrasive grain stirring step is added in the conventional grindstone manufacturing process) is capable of high-speed minute stroke operation. Required. For this reason,
Ideally, the processing device should have a low inertia of polishing motion and also have a magnetic field stirring function.

As a processing apparatus that satisfies the above requirements, an apparatus in which a magnetic field stirring function, a grindstone holding function, and a grindstone driving function are formed at the end of the three-dimensional positioning mechanism is preferable. In this way, by combining the existing mechanism with the magnetic field stirring function, grindstone holding function, and grindstone driving function, the relative position between the grindstone and the workpiece is secured, eliminating setup changes and enabling high-speed polishing. Is completed.

Next, as a specific example of the present invention, a new polishing apparatus will be described with reference to the drawings. FIG. 1 shows a polishing apparatus according to the first embodiment of the present invention.

In FIG. 1 (1), the machined surface 2 of the workpiece 1
Then, the release agent 3 is applied. The release agent contains components that dissolve the abrasive grains and the binder. The application may be brush painting or spraying. By applying the release agent, a similar space 5 smaller than the space surrounded by the processed surface is formed by the thickness of the release agent layer 4. In this embodiment, the shape of the work piece is concave, and the similar space 5 is slightly smaller than the shape of the work piece. On the other hand, when the shape of the workpiece is convex, the similar space 5 is slightly larger than the shape of the workpiece.

In FIG. 1B, the grindstone raw material 6 and the grindstone holding portion 7 are inserted into the similar space 5. The grindstone raw material contains abrasive grains, a binder and a magnetic material. Liquefaction is performed by raising the temperature in the similar space 5 (the figure shows the case where the temperature is raised by the heater 8). At this time, the temperature of the workpiece 1 may be normal temperature as long as it is close to the melting point of the raw material of the grindstone. When using a grindstone raw material having a high melting point, it is preferable to preheat the workpiece 1 in advance. In this embodiment, the powdery grindstone raw material is charged in the similar space 5, but of course, the liquid grindstone raw material may be poured.

The grindstone holding portion 7 has a plurality of columns.
In order to make the fastening area between the whetstone holding part and the whetstone large,
A groove or a step is formed in the grindstone holding portion, or another component is attached to the grindstone holding portion.

In FIG. 1 (3), a magnetic field is applied to the grindstone raw material 9 in a liquid state and stirring is performed. Three magnetic field generation sources 10, 11 and 12 are provided as magnetic field supply units for applying a magnetic field to the grindstone raw material. Each magnetic field source has a coil 13,1
4,15 are wound. And the coils 13, 14, 15
An electric current is applied to the grinding stone raw material 9 from a plurality of mutually different directions (upper, left and right three directions in this embodiment) to disperse the abrasive grains. The directions of the magnetic fields generated by these coils 13, 14, 15 intersect each other. Then, the magnetic force lines generated from the coil 13 spread radially.

In the present embodiment, magnetic fields are applied to the grindstone raw material from the upper, right, left, and right directions. ), Left and right (X direction), and front and rear (Y direction).

A magnetic field generation source 10 is coupled to the grindstone holding section 7, and the grindstone holding section 7 also becomes a part of the magnetic field circuit. A soft magnetic material is used for the grindstone holding portion 7. In addition, the current flowing through each coil is changed, or an alternating current is applied to the coils, so that the abrasive grain agitation suitable for the shape is performed.
Alternatively, the current passed through the coil may be ON-OFF controlled. In the figure, Δ indicates an abrasive grain.

In FIG. 1 (4), the grindstone is cooled in the similar space 5 to be solidified, and the grindstone is pulled out in the removal direction. At this time, since the grindstone raw material enters the groove 16 of the grindstone holding portion, the solidified grindstone 17 can be easily pulled out. With such a structure that allows a large contact cross-sectional area between the grindstone holding portion 7 and the solidified grindstone 17, a large polishing pressure can be applied to the relative movement of polishing.

FIG. 2 shows a polishing apparatus according to the second embodiment of the present invention.

In FIG. 2 (1), the solidified grindstone 17 (shape transfer grindstone) created in FIG. 1 (4) is placed in the similar space 5, and the grindstone holding portion 7 or grindstone 5 is moved in the left-right direction (the method of processing surface). A polishing pressure is applied in the (line direction) to give relative movement (← →) in the vertical direction (tangential direction of the processing surface) as the first direction in which the grindstone can move relative to the workpiece. At this time, grindstone solution 1
No. 9 is given to polish the first surface while depleting the grindstone. The grindstone solution 19 is also used as a release agent.
The number of reciprocating movements of the grindstone 5 is set in advance, and when the polishing operation of this number is completed, the next surface is polished,
The reciprocating movement of the grindstone 5 is controlled.

In FIG. 2 (2), by grinding in FIG. 2 (1), the grindstone surface in contact with the machined surface as shown in this figure is depleted and the gap between the machined surface and the grindstone increases. Using this gap, as shown in the figure, a polishing pressure is applied to the grindstone holding portion or the grindstone in an oblique direction (the normal direction of the processing surface), and a second direction that is substantially orthogonal to this and different from the first direction Relative motion (← →) is given in the diagonal direction (tangential direction of the machined surface) as the direction of. The stroke of relative movement is set smaller than the gap. Also at this time, the second surface is polished while the grindstone dissolving liquid 19 is appropriately applied to reduce the wear of the grindstone.

In FIG. 2 (3), by grinding in FIG. 2 (2), the grindstone surface in contact with the machined surface as shown in this figure is depleted and the gap between the machined surface and the grindstone increases. Utilizing this gap, as shown in the figure, a polishing pressure is applied to the grindstone holding portion or the grindstone in the up-down direction (radial direction of the processing surface), and the left-right direction as a third direction different from the second direction ( Relative motion (← →) is applied in the tangential direction of the machined surface. The stroke of relative movement is set smaller than the gap. At this time as well, the grindstone dissolving liquid 19 is appropriately applied to polish the third surface while depleting the grindstone.

In FIG. 2 (4), the grindstone finally becomes small, and the transfer shape deteriorates as shown in this figure. According to the polishing method of the present invention, polishing is possible regardless of the combination of inclinations of the processed surface of the workpiece. Further, in the case of improving the dimensional accuracy or polishing to a mirror surface, it is possible to improve the dimensional accuracy and the finished surface roughness by repeating the steps of FIGS. 1 and 2. In order to remove grindstone debris and polishing debris from the work surface, air may be blown to the work surface by a blower (not shown) or the like.

3 and 4 show a polishing apparatus according to the third embodiment of the present invention. This polishing apparatus uses a SCARA type robot arm. The support 201 is attached to the base 200 with screws 202. The first arm 205 is rotatably attached to the column 201. Screw 206 provided on the first arm
A screw shaft 207 is attached to and the vertical height of the first arm 205 is adjusted. The first arm 205 is blocked by the first arm lock screw 208 from rotating and moving up and down.

A second arm shaft 210 and a second arm 211 are attached to the tip of the first arm 205 by screws 212. The second arm 211 is rotatable around the tip of the first arm 205. Second arm lock screw 21
By tightening 3, the rotation of the second arm 211 is blocked. A counterclockwise moment is applied to the second arm 211 by the tension spring 215 as a spring (biasing means) that biases the grindstone in a direction intersecting the machining surface of the workpiece.
Thereby, the grindstone 17 can be pressed against the workpiece 1.

Here, the column 201, the first arm 205,
The second arm shaft 210, the second arm 211, and the like function as a supporting portion (supporting means) that movably supports the grindstone in a direction intersecting the processing surface of the workpiece (horizontal direction in this embodiment).

At the tip portion 216 of the second arm, a grindstone holding portion 220 for holding the grindstone 17 and a reciprocating part (reciprocating means) for reciprocating the grindstone relative to the workpiece in the tangential direction of the machining surface. A whetstone driving unit 230 that functions, a coil 240 that functions as a magnetic field supply unit for applying a magnetic field to the whetstone raw material, and a wire 245 are attached. Wire 24
5 is connected to the grindstone driving unit 230 and the first motor 250,
The power of the first motor 250 is transmitted to the grindstone driving unit 230.

The workpiece 1 is attached to the upper part of the mounting table 260, and the XY coil 265, the lift 270 and the gear A27 are attached.
Attach 1. The mounting base 260 is composed of the gear A 271, the gear B 272, the gear C 273, and the second motor 275.
It is rotated slowly. Here, gear A271 and gear B2
The 72, the gear C273, and the second motor 275 function as a mounting base rotating unit (rotating motion unit) that rotates the workpiece.

The XY coil 265 is for magnetic field stirring.
Lines of magnetic force are generated in the X-Y two dimensions with respect to the workpiece 1. The coil 240 is also for magnetic field stirring, and generates magnetic force lines in the Z direction with respect to the workpiece 1.

The lift 270 is for moving the workpiece 1 up and down, and finely adjusts the vertical height of the workpiece 1.

The work piece 1 is attached to the attachment table 260,
Apply release agent and grindstone raw material inside the work (hatching part)
Insert it in the liquid state. If it is in the solid state at the time of insertion, it should be in the liquid state in the work piece. At the same time, the first arm 205 and the second arm 211 are operated to insert the grindstone holding portion 220 into the workpiece 1. The first arm 205 and the second arm 211 are connected to the first arm lock screw 208 and the second arm lock screw 21.
Fix at 3.

An electric current is passed through the coil 240 and the XY coil 265 to stir the magnetic field adapted to the shape. Cooling and solidifying the raw material of the grindstone is performed in the work piece. Stop stirring before solidification to avoid wasting magnetic field energy. Coil 240 and X-
Since it is orthogonal to the Y coil 265, when a current is passed through the coil 240 and the XY coil 265, the magnetic force lines generated from the coil 240 radially expand downward as shown in FIG.

After the grindstone raw material is solidified, the second arm lock screw 213 is loosened to make the second arm 211 rotatable. The second arm 211 that has become rotatable is pulled by a spring 215.
The whetstone 17 and the surface of the work piece 1 are brought into pressure contact with each other by being pulled by.

An electric current is passed through the first motor 250 and the wire 2
The inner cable 246 of 45 is rotated to transmit the power to the grindstone driving unit 230. The cam 221 of the grindstone driving unit 230 rotates, the pin 222 is interposed, the grindstone driving unit sleeve 223 as a follower moves up and down, and finally the grindstone holding unit 220 and the grindstone 17 move up and down. .

Since the grindstone drive unit plate 225 is attached to the grindstone drive unit sleeve 223, it moves up and down in accordance with the vertical movement of the grindstone drive unit sleeve 223. The grindstone holding portion 220 is provided between the sleeve guide 229 and the grindstone driving portion plate 225.
By putting in, the grindstone holding portion 220 can be freely rotated while performing vertical movement in synchronization with the grindstone driving portion sleeve 223. Here, the grindstone holding part 2 rotatably provided between the sleeve guide 229 and the grindstone drive part plate 225.
The reference numeral 20 functions as a follow-up unit that follows the rotational movement of the workpiece to rotate the grindstone.

While moving the grindstone holding portion 220 up and down, an electric current is passed through the second motor 275 to cause the gear C273 and the gear B27 to move.
2. When the gear A271 is rotated and the mount 260 and the workpiece 1 are slowly rotated, the grindstone 17 and the grindstone holding portion 2
20 also moves up and down and follows the workpiece 1.

At the stage of following and rotating, the tension spring 215
Since the pressing by means of the same direction is in the same direction, the grindstone surface pressed against the working surface of the workpiece 17 changes while moving up and down, which enables vertical polishing of the entire surface (360 ° circumference).

After the vertical polishing is completed, the grindstone holding section 220, the coil 240 and the grindstone driving section 230 are tilted, and the same steps as above are performed, whereby the inclined surface of the workpiece can be ground.

By attaching the grindstone driving unit 230 to the end portion of the SCARA type robot arm, the grindstone moves up and down in a portion having a small amount of inertia. By vertically moving at the terminal end, it is not necessary to vertically move a structure such as a robot arm. Since the inertial force against vertical movement is small, high-speed vertical movement is possible.

The first motor 250 is arranged on the base 200, and the power from the first motor 250 is transmitted to the grindstone driving unit 230 via the wire 245 for remote operation. Therefore, the whetstone is moved up and down in a portion having a smaller inertial amount. When polishing a vertical machining surface, the inertial force due to the vertical movement of the grindstone is not applied to the machining surface, but when polishing an oblique machining surface, the inertial force due to the grindstone trying to move up and down causes machining. Join the surface. When inertial force is applied, the pressure applied to the machined surface increases too much. By arranging the first motor 250 on the base 200 and operating the grindstone driving unit 230 remotely, the inertia of the grindstone driving unit 230 can be further reduced.

FIGS. 5 and 6 show a polishing apparatus according to the fourth embodiment of the present invention. In this embodiment, a gantry type robot is used.

The X motion motor 310 is attached to the base 300 with the screw 3
The X operation table 320 is attached to the slit 301 extending in the X direction of the base 300, and the X operation motor 3 is attached.
The X operation table 320 is inserted into the ball screw 311 of 10.
The X operation table 320 is a female screw, and the X operation motor 3
When 10 rotates, the X operation table 320 moves in the X direction. Here, the X operation motor 310 and the X operation table 320 are X
Functions as an axis moving mechanism.

The lift 330 is attached to the base 300 with screws 331, the XY coil 333 is formed on the upper plate 332 of the lift 330, and the mount 340 is placed on the XY coil.
Attach. The workpiece 1 is lifted and lowered by the lift 330.

The Y operation table 35 is attached to the shaft 325 of the X operation table 320.
0 is attached so that it can slide in the Y direction. The Y operation motor 351 is attached to the X operation table 320. Y operation motor 351
The Y operation table 350 is inserted into the ball screw 352 of. The Y operation table 350 has a female screw, and when the Y operation motor rotates, the Y operation table moves in the Y direction. Here, the Y operation motor 351 and the Y operation table 350 function as a Y axis moving mechanism.

By passing a current through the XY coil 333, the magnetic duct 334 of the XY coil 333 is magnetized, and an XY two-dimensional magnetic field is generated in the workpiece 1.

The grindstone drive unit 36 is attached to the tip 360 of the Y operation table.
1. Attach the drive motor 368. The coil 370 and the grindstone holding unit 375 are connected to the grindstone driving unit 361.

The grindstone 1 is prepared by inserting the grindstone raw material and the grindstone holding portion 375 into the workpiece, stirring the magnetic field with the XY coil 333 and the coil 370, and then cooling.

An electric current is passed through the drive motor 368 to rotate the motor shaft 367 and transmit the power to the grindstone drive unit 361. The cam 362 of the grindstone driving unit 361 rotates and the pin 363 rotates.
, The grindstone drive unit sleeve 364 reciprocates up and down, and the grindstone holding unit 375 and the grindstone 17 move up and down. Here, the drive motor 368 and the grindstone driving unit 361 are arranged so that the grindstone 1
It functions as a reciprocating means for relatively reciprocating the work piece 7 relative to the work piece 1 in the tangential direction of the work surface.

While moving the grindstone holding portion 375 up and down, X
By supplying a current to the operation motor 310 and the Y operation motor 351, and applying the polishing pressure in the XY two-dimensional directions to the grindstone 17, the grinding pressure can be applied to the grindstone in all directions of 360 °. While controlling the polishing pressure according to the shape of the workpiece 1, the drive motor 368 is rotated to move the grindstone holding portion 375 up and down to polish the workpiece 1.

FIG. 7 shows a polishing apparatus according to the fifth embodiment of the present invention. This polishing device uses a 4-joint link.

FIG. 7 (1) is a plan view of the initial position state, and FIG.
(2) shows a side view of the initial position state.

Axis A 401, axis D 404 on frame 400
The provided shaft B402 at the tip of the lever ₁ 405 as a first crank, sector gear ₁ 40 of the first crank
A shaft C403 is provided at the tip of 6, and a workpiece base 410 serving as a first parallel link is inserted, and parallelograms A, B, C,
Let D be configured. Since A and D are points on the frame and are fixed, BC moves parallel to AD. Here, the frame 400, the lever ₁ 405, the fan-shaped gear ₁ 406, and the workpiece base 410 constitute a first link device (first parallel crank mechanism).

The axis E421 and the axis H424 are attached to the frame 400.
And a shaft F422 at the tip of a lever ₂ 425 as a second crank, and a fan-shaped gear ₂ 42 as a second crank.
A shaft G423 is provided at the tip of 6 and a grindstone base 430 as a second parallel link is inserted to form parallelograms E, F, G and H. Since E and H are points on the frame and are fixed, FG moves parallel to EH. Here, the frame 400, the lever ₂ 425, the fan-shaped gear ₂ 426, and the grindstone 430 are the second link device (second parallel crank mechanism).
Make up.

[0115] angle motor 435 is mounted to the frame 400, rotates the sector gear ₁ 406. Gear ₁ 436
Is movably attached to the frame and rotates about the P1 position during the stirring process and polishing angle change. Fan gear
₂ 426 and fan-shaped gear ₁ 406 rotate together when gear ₁ 436 is in the P1 position. When in P2 position, fan-shaped gear ₂ 42
6 is separated from the gear ₁ 436. Here, the fan-shaped gear ₁ 40
6, fan-shaped gear ₂ 426, gear ₁ 436 and angle motor 43
5 functions as an interlocking mechanism that associates the operations of the first link device and the second link device.

When the gear ₁ 436 is in the P1 position, the internal angle T1 of the parallelogram ABCD and the internal angle T2 of the parallelogram EFGH are simultaneously changed by the angle motor 435. At the P1 position, T1 = T2 is always maintained. Further, since the lever ₁ 405 and the sector gear ₁ 406, the lever ₂ 425 and the sector gear ₂ 426 have the same length, and the internal angles T1 and T2 change equally,
The relative position between the work piece and the grindstone holder does not change even if the angle motor 435 is rotated.

The lever ₂ 425 and the fan-shaped gear ₂ 426 have a telescopic mechanism 465. When an electric current is applied, it contracts against the spring 466 and its length becomes shorter.

A lift 440, X- on the workpiece base 410.
The Y coil and the work table 450 are provided on the Y coil, and the grindstone table 43 is provided.
The coil 431 and the grindstone holding portion 432 are attached to the lower part of 0.

Lever constituting parallelogram EFGH
_A clockwise moment is applied to 2425 by a spring 460. This allows the grindstone to apply pressure to the workpiece.

In FIG. 7C, a grindstone is made at the P1 position,
The state where the angle motor 435 is rotated is shown. Angle motor 4
When 35 is rotated against spring 460, grindstone 430
And the workpiece base 410 moves in synchronization.

[0121] FIG. 7 (2) shows a state in which moving the gear ₁ 4361 in the P2 position from P1 position. In this state, when a current is applied to the expansion mechanism 465 to simultaneously contract the lever ₂ 425 and the fan gear ₂ 426, the grindstone holding portion 432 moves upward. When the current is cut off, the spring force of the spring 466 causes the spring 466 to move downward (initial position). By turning the current on and off in this manner, the grindstone holding portion 432 vibrates up and down, and the vertical surface is polished.

FIG. 7 (4) shows a state in which the angle motor 435 is rotated from the state of (3) and stopped in the proper polishing state. In this figure, when the gear is switched from the P1 state to the P2 state, a current is passed through the expansion mechanism 465, and the lever ₂ 425 and the sector gear ₂ 426 are simultaneously contracted, the grindstone holding portion 432 moves diagonally upward. When the current is cut off, the spring force of the spring 466 causes the spring to move diagonally downward (initial position). By turning the current on and off in this way, the grindstone holding portion 432
Vibrates obliquely and the inclined surface is polished. Further, the lift 440, the XY coil 445, the workpiece table 450 and the workpiece 1 are slowly rotated by the workpiece motor 470, and the grindstone 1 and the grindstone holding portion 432 perform follow-up rotation.

As described above, the vertical polishing of the workpiece 1 is performed as shown in FIG.
(2), polishing in the diagonal direction other than the vertical direction is shown in FIG.
It is shown by (4). Further, in each of the above states, the workpiece motor 470 rotates and the workpiece 17 rotates,
The entire inner surface shape from the vertical surface to the oblique surface is polished. In this apparatus, if the interior angles T1 and T2 are set to 180 °, even horizontal surfaces can be polished.

Although the gear mechanism is used as the interlocking mechanism in the above embodiment, a link mechanism such as a link, a belt or a wire may be used instead of the gear.

FIG. 8 shows a polishing apparatus according to the sixth embodiment of the present invention. This polishing apparatus has a mechanism for discharging polishing dust.

FIG. 8A shows the plunger A510 of.
f, the state of the plunger B520 off is shown, and is an example in which the workpiece 1 is attached to the frame 500.

The plunger A 510 is attached to the frame 500 with the screw 511, and the armature 515 of the plunger A 510 and the plunger B 520 are fastened with the screw 521.

The plunger B is attached to the shaft 501 of the frame 500.
A slit 522 elongated in the left-right direction of 520 is inserted, and an armature 515 is inserted into the plunger A510. The plunger B 520 is moved to the right by the spring 518, the grindstone 17 is also moved to the right, and the work surface 5 of the workpiece 1 is moved.
Hit 50.

In FIG. 8 (1), the plunger A510
When an electric current is applied to the armature 515 and the plunger B5
20 moves to the left against the spring force of the spring 518,
When the current is cut off, the spring force of the spring 518 causes the spring 518 to move to the right.

In FIG. 8A, the plunger B520
The armature 525 is pushed downward by the spring force of the spring 528 and abuts on the stopper 503 of the frame. The whetstone holding portion 530 is coupled to the armature 525 of the plunger B520.

In FIG. 8 (2), the plunger B520
When a current is applied to the armature 525, the armature 525, the grindstone holding portion 530, and the grindstone 17 move upward against the spring force of the spring 528. When the current is cut off, the armature B 525, the grindstone holding portion 530, and the grindstone 17 are moved downward by the spring force of the spring 528.

Here, the plunger B 520, the armature 525, the spring 528 and the grindstone holding portion 530 function as a first reciprocating part that reciprocates the grindstone 17 in the tangential direction of the machining surface, and the plunger A 510 and the armature 515.
The spring 518 functions as a second reciprocating part that reciprocates the first reciprocating part in a direction intersecting the machining surface.

FIGS. 8 (1) to 8 (4) show the state in which the plungers A and B are energized or de-energized, and the states are shown in the table below.

[0134]

【table 1】

By operating the plungers A and B in this manner, when the reciprocating motion of the grindstone 17 is performed, a polishing pressure is applied from the grindstone 17 to the machined surface 550 of the workpiece 1, and when the reciprocating motion is returned, The grindstone 1 can be separated from the processed surface 550 of the workpiece 1.

The movements of the grindstone holding portion 530 and the grindstone 1 are different in the forward path and the backward path, and only the operation in one direction contributes to the polishing, so that the polishing dust is discharged. It should be noted that even if the trajectories of the grindstones 1 are not different between the forward path and the return path, the polishing debris may be discharged by reducing the polishing pressure applied from the grindstone 17 to the processing surface 550 of the workpiece 1 during the return path.

[Brief description of drawings]

FIG. 1 shows a polishing apparatus according to a first embodiment of the present invention.

FIG. 2 shows a polishing apparatus according to a second embodiment of the present invention.

FIG. 3 is a plan view showing a polishing device according to a third embodiment of the present invention.

FIG. 4 is a side view showing a polishing device according to a third embodiment of the present invention.

FIG. 5 is a plan view showing a polishing device according to a fourth embodiment of the present invention.

FIG. 6 is a side view showing a polishing device according to a fourth embodiment of the present invention.

FIG. 7 shows a polishing apparatus according to a fifth embodiment of the present invention.

FIG. 8 shows a polishing apparatus according to a sixth embodiment of the present invention.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Workpiece 2, 550 ... Processing surface 6 ... Grindstone raw material 7 ... Grindstone holding part 9 ... Liquid-state grindstone raw material 10 ... Magnetic field generation source (magnetic field supply section) 11 ... Magnetic field generation source (magnetic field supply section) 12 ... Magnetic field generation Source (magnetic field supply unit) 13 ... Coil (magnetic field supply unit) 14 ... Coil (magnetic field supply unit) 15 ... Coil (magnetic field supply unit) 17 ... Grinding stone 200 ... Base 201 ... Strut (supporting means, support unit) 205 ... One arm (supporting means, supporting part) 210 ... Second arm shaft (supporting means, supporting part) 211 ... Second arm (supporting means, supporting part) 215 ... Tension spring (biasing means) 221, 362 ... Cam 230 ... Grindstone drive unit (reciprocating motion unit, reciprocating motion unit) 260 ... Mounting base 271 ... Gear A (rotating motion unit, mounting base rotating unit) 272 ... Gear B (rotating motion unit, mounting base rotating unit) 273 ... Gear C (rotation) Means of exercise Attaching table rotating part) 275 ... Second motor (rotating motion means, mounting table rotating part) 220 ... Grinding stone holding part (following means) 300 ... Base 310 ... X operation motor (X axis moving mechanism, biasing means) 320 ... X operation table (X-axis moving mechanism, biasing means) 350 ... Y operation table (Y-axis moving mechanism, biasing means) 351 ... Y operation motor (Y-axis moving mechanism, biasing means) 361 ... Grindstone drive unit (reciprocating) Movement means, reciprocating part) 375 ... Grindstone holding part 400 ... Frame 405 ... Lever ₁ (first crank) 406 ... Fan gear ₁ (first crank) 410 ... Workpiece base (first parallel link) 425 ... Lever ₂ (second crank) 426 ... Fan-shaped gear ₂ (second crank) 430 ... Grindstone (second parallel crank) 436 ... Gear ₁ (interlocking mechanism) 435 ... Angle motor (interlocking mechanism) 500 ... Frame 510 ... Ranger A (second reciprocating part) 515 ... Armature (second reciprocating part) 518 ... Spring (second reciprocating part) 520 ... Plunger B (first reciprocating part) 525 ... Armature (first) Reciprocating part) 528 ... Spring (first reciprocating part) 530 ... Whetstone holding part (first reciprocating part)

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Tokuji Umehara             Tokyo Hachioji City Bessho 2-chome 46-3-102 (72) Inventor Hagiwara             1241-5 Haguro-cho, Kofu City, Yamanashi Prefecture (72) Inventor Isao Shibata             1198-87 Fuse, Tatomi Town, Nakakoma District, Yamanashi Prefecture (72) Inventor Bun Shun             3-1 Hanglin-dong, Changwon-si, Gyeongsangnam-do, Republic of Korea             Apartment 107-302 F term (reference) 3C058 AA02 AA09 AA12 AA16 CB03

Claims (21)

[Claims] 1. A polishing apparatus for polishing a work by using a grindstone in which a liquid grindstone raw material containing a magnetic material charged in a space of the work is solidified or gelled. A magnetic field supply unit for applying a magnetic field to the grindstone raw material is provided, and the magnetic field supply unit applies magnetic fields to the liquid grindstone raw material from a plurality of different directions to disperse the abrasive grains. Polishing equipment. 2. The polishing apparatus according to claim 1, wherein the magnetic field supply unit applies a magnetic field to the grindstone raw material in X, Y, and Z directions orthogonal to each other. 3. A grindstone holding portion for holding the grindstone and forming a part of a magnetic field circuit is provided.
Or the polishing apparatus according to 2. 4. The magnetic field supply unit has a plurality of coils for applying a magnetic field to the grindstone raw material, and an alternating current is passed through the coils, or an electric current passed through the coils is ON-OFF controlled, Alternatively, the polishing apparatus according to any one of claims 1 to 3, wherein an electric current applied to the coil is changed. 5. A polishing apparatus for polishing a workpiece using a grindstone loaded in the space of the workpiece, wherein a control unit for controlling relative motion between the workpiece and the grindstone is provided. The control unit polishes the first surface of the workpiece by moving the grindstone relative to the workpiece in a first direction in which the grindstone can move relative to the workpiece,
Then, using the gap between the first surface of the workpiece and the grindstone caused by wear of the grindstone, the grindstone relative to the workpiece in a second direction different from the first direction. A polishing apparatus for polishing the second surface of the workpiece by moving the workpiece. 6. The grindstone in a third direction different from the second direction by utilizing a gap between the second surface of the workpiece and the grindstone caused by wear of the grindstone. The polishing apparatus according to claim 5, wherein the third surface of the workpiece is polished by relatively moving the workpiece. 7. An urging means for urging the grindstone in a direction intersecting a machining surface of the workpiece, and a reciprocating means for relatively reciprocating the grindstone with respect to the workpiece in a tangential direction of the machining surface. And a rotary movement means for rotating one of the workpiece or the grindstone, and a follow-up means for rotating the other one of the workpiece or the grindstone by following the rotary movement of one of the workpiece or the grindstone, A polishing apparatus comprising: 8. The biasing means includes a spring, and the polishing device includes a supporting means for supporting the grindstone or the workpiece so as to be movable in a direction intersecting a processing surface of the workpiece. The polishing apparatus according to claim 7, wherein the polishing apparatus is a polishing apparatus. 9. An urging means for urging the grindstone in a direction intersecting a machining surface of the workpiece, and a reciprocating motion for relatively reciprocating the grindstone with respect to the workpiece in a tangential direction of the machining surface. And a biasing means for moving the grindstone or the workpiece in the X direction, and an Y-axis for moving the grindstone or the workpiece in the Y direction orthogonal to the X-axis. A polishing device having a moving mechanism. 10. The polishing apparatus according to claim 7, wherein the reciprocating means is attached to a terminal end of a SCARA type robot arm or a terminal end of a gantry type robot. 11. The polishing apparatus according to claim 7, wherein the reciprocating means has a cam that relatively reciprocates the grindstone with respect to the workpiece. 12. A first link device, to which a grindstone is attached, and which is composed of a link having four joints, and a second link device, to which a workpiece is attached, which is composed of a link having four joints, A polishing apparatus comprising: one link device and an interlocking mechanism that associates the operation of the second link device. 13. The polishing apparatus according to claim 12, wherein a relative motion between the workpiece and the grindstone is performed by changing a length of a crank that constitutes the first link device. 14. A polishing apparatus for polishing a workpiece by reciprocally moving a grindstone with respect to the workpiece, wherein the grindstone grinds a processed surface of the workpiece when the reciprocating movement goes. A polishing apparatus for applying a pressure to reduce the polishing pressure applied from the grindstone to the processed surface of the workpiece when returning from the reciprocating motion, or to separate the grindstone from the processed surface of the workpiece. 15. The polishing apparatus includes a frame to which the workpiece is attached, and a frame that is movably attached to the frame in a direction intersecting a processing surface of the workpiece, and reciprocates the grindstone in a tangential direction of the processing surface. The polishing apparatus according to claim 14, further comprising: a first reciprocating part for moving the first reciprocating part, and a second reciprocating part for reciprocating the first reciprocating part in a direction intersecting a processing surface. 16. The polishing apparatus polishes a workpiece using a grindstone obtained by solidifying or gelling the liquid grindstone raw material containing a magnetic material charged in a space of the workpiece, 16. The apparatus is provided with a magnetic field supply unit that applies magnetic fields to the liquid grindstone raw material from a plurality of different directions to disperse the abrasive grains. Polishing equipment. 17. The polishing apparatus disperses abrasive grains by applying magnetic fields to the liquid grinding stone raw material in X, Y, and Z directions orthogonal to each other. Polishing equipment. 18. A polishing apparatus for polishing a work by using a grindstone obtained by solidifying or gelling the liquid grindstone raw material containing a magnetic material charged in a space of the work, the base being a base. And a mounting base rotatably provided on the base, on which the workpiece is mounted, a mounting base rotating unit that rotates the mounting base, and the mounting base provided on the base so that the grindstone can be moved in the horizontal direction. A support portion that supports the spring, a spring that biases the grindstone toward the machining surface of the workpiece, a reciprocating portion that relatively reciprocates the grindstone in the tangential direction of the machining surface with respect to the workpiece, A grinding apparatus comprising: a grindstone holding section that is rotatably provided with respect to a moving section and holds the grindstone; and a magnetic field supply section that applies a magnetic field to the liquid grindstone raw material. 19. A polishing apparatus for polishing a work by using a grindstone obtained by solidifying or gelating the liquid-state grindstone raw material containing a magnetic material charged in a space of the work, the base being a base. A mounting base provided on the base to which the workpiece is mounted; and a mounting base provided on the base to move the grindstone in the X direction and the Y direction and to move the grindstone with respect to the processed surface of the workpiece. An X-axis moving mechanism and a Y-axis moving mechanism for urging in a direction intersecting with each other; A polishing apparatus comprising: a reciprocating unit that reciprocates; and a magnetic field supply unit that applies a magnetic field to the liquid grindstone raw material. 20. A polishing apparatus for polishing a workpiece using a grindstone obtained by solidifying or gelling the liquid grindstone raw material containing a magnetic material, which is charged in the space of the workpiece, and comprising a frame and a frame. A first parallel crank mechanism having a pair of first cranks and a first parallel link that moves in parallel with the frame, and a pair of links having four joints, A second parallel crank mechanism having a second crank and a second parallel link moving in parallel with the frame, and the relative positions of the first parallel link and the second parallel link without changing their relative positions. An interlocking mechanism that associates movements of the first crank and the second crank so as to move, the grindstone is attached to the first parallel link, and the workpiece is the second parallel link. The polishing device is characterized by being attached to a link. 21. A polishing apparatus for polishing a workpiece using a grindstone obtained by solidifying or gelling the liquid grindstone raw material containing a magnetic material, which is charged in the space of the workpiece, and comprising a frame and A workpiece to be attached to the frame, a first reciprocating portion movably attached to the frame in a direction intersecting a machining surface of the workpiece, and reciprocating a grindstone in a tangential direction of the machining surface; A second reciprocating part that reciprocates one reciprocating part in a direction intersecting the machining surface, and when the reciprocating motion goes, applying a polishing pressure from the grindstone to the machining surface of the workpiece, A polishing apparatus for reducing the polishing pressure applied from the grindstone to the processed surface of the workpiece or returning the grindstone from the processed surface of the workpiece when returning from the movement.