JPS58192737A - Method of polishing machining - Google Patents

Method of polishing machining

Info

Publication number
JPS58192737A
JPS58192737A JP57071821A JP7182182A JPS58192737A JP S58192737 A JPS58192737 A JP S58192737A JP 57071821 A JP57071821 A JP 57071821A JP 7182182 A JP7182182 A JP 7182182A JP S58192737 A JPS58192737 A JP S58192737A
Authority
JP
Japan
Prior art keywords
polishing
magnetic field
pressure
gap
tool
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP57071821A
Other languages
Japanese (ja)
Inventor
Kiyoshi Inoue
潔 井上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Inoue Japax Research Inc
Original Assignee
Inoue Japax Research Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Inoue Japax Research Inc filed Critical Inoue Japax Research Inc
Priority to JP57071821A priority Critical patent/JPS58192737A/en
Publication of JPS58192737A publication Critical patent/JPS58192737A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B35/00Machines or devices designed for superfinishing surfaces on work, i.e. by means of abrading blocks reciprocating with high frequency
    • B24B35/005Machines or devices designed for superfinishing surfaces on work, i.e. by means of abrading blocks reciprocating with high frequency for making three-dimensional objects

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

PURPOSE:To improve machining speed and efficiency, by using a mixture wherein the granular bodies of a material whose volume is changed by the application of a magnetic field or an electric field is mixed with grinding granules as a polishing agent, applying electric field, magnetic field, and changing pressure, thereby performing the machining. CONSTITUTION:A polishing agent is supplied to a polishing gap on a body to be machined 1 in which a polishing tool 2 is movably placed. In the polishing agent used in the gap, grinding granules are put in a machining liquid such as a machine oil and the like, and the granules of a material whose volume is changed by the action of a magnetic field is further mixed. TiC, W2C, and the like are used as the grinding granules. A magnetic strain material such as ferrite and Co steel is used as the granules whose volume is changed. The polishing agent is compressed into the polishing gap, pressure is applied by a spring 7, and lateral vibration is applied by a vibrating device 4. By the polishing action of the grinding granules compressed into the gap by the application of the pressure to the tool 2 and the body to be machined 1, the polishing machining is performed.

Description

【発明の詳細な説明】 本発明は研磨間隙に砥粒を供給しながら加Fする磨き加
I7i法の改良に関する。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an improvement in the polishing I7i method in which F is applied while supplying abrasive grains to the polishing gap.

従来の磨き加工は、砥粒を工作液に含ませて研磨間隙に
供給し加圧と相対運動を行っτ加工4るが、砥粒の運動
が単純方向に揃ってしまうため磨き面に方向性が現われ
たり加工能率が低い欠点があった。
In conventional polishing, abrasive grains are immersed in working fluid and supplied to the polishing gap, pressurized and moved relative to each other for τ machining4, but since the motion of the abrasive grains is aligned in a simple direction, there is no directionality on the polished surface. There were drawbacks such as the appearance of problems and low machining efficiency.

本発明はこの点の改良として、磨き剤に特別なものを用
い、即ち工作液に砥粒の他に電界、11界らしくは圧ツ
ノの作用によって体積変化を起す物質の粒子を混入した
ものを用いる。そしてこれを相対運動もしくは振動など
する研磨間隙に供給し変化電界、変化磁界もしくは変動
圧力を作用して磨き加「することを特徴とする。
As an improvement on this point, the present invention uses a special polishing agent, that is, in addition to abrasive grains, the working fluid contains particles of a substance that causes a volume change due to the action of an electric field or a pressure horn. use It is characterized in that it is supplied to a polishing gap that undergoes relative motion or vibration, and is polished by applying a varying electric field, varying magnetic field, or varying pressure.

以下図面の一実施例により本発明を説明する。The present invention will be explained below with reference to an embodiment of the drawings.

第1図に於て、1は機械加工、放電加工、或いは焼結加
工等によって所定形状に形成゛された被加工体、2は磨
き加工用の総型工具で、これは前記被IJII T体の
型加工を放電加]土で加工行ったときは加り電極がイの
まま工具として利用でき、又新規に作る場合は、被加工
体1の加工穴よりも僅かに小径に成形して利用する。3
は工具2に振動を与える娠動桿で、一端は工具の中心軸
に結合し細端は振動装置4に連結している。5は振動力
を弾性的に与える振動バネ、6は前記振動運動と直角な
対向方向に加圧する加圧桿、7が加圧バネ、8は研磨間
隙に磁界を作用する磁界発生コイルで、端子9にパルス
もしくは交流電圧を加えて変化磁界を発生するようにす
る。
In Fig. 1, 1 is a workpiece formed into a predetermined shape by machining, electrical discharge machining, sintering, etc., and 2 is a full-form tool for polishing. When machining the mold using soil, the electrode can be used as a tool as it is, or when making a new one, it can be used by forming it into a slightly smaller diameter than the machined hole of workpiece 1. do. 3
is a movable rod that vibrates the tool 2; one end is connected to the central axis of the tool, and the narrow end is connected to the vibrating device 4. 5 is a vibration spring that elastically applies vibration force; 6 is a pressure rod that applies pressure in a direction perpendicular to the vibration motion; 7 is a pressure spring; 8 is a magnetic field generating coil that applies a magnetic field to the polishing gap; A pulse or alternating current voltage is applied to 9 to generate a changing magnetic field.

L具2を遊嵌させた被加工体1との研磨間隙には磨き剤
が供給される。磨き剤は、マシン油、スピンドル油、グ
リス等の工作液に砥粒を加え、更に磁界の作用によって
体積変化をR1物質粒子を混入したものを用いる。砥粒
は周知のように1’ i C、W 2 C、S I C
、B a C、タイヤ。
A polishing agent is supplied to the polishing gap between the L tool 2 and the workpiece 1 into which it is loosely fitted. The polishing agent used is one in which abrasive grains are added to a working fluid such as machine oil, spindle oil, or grease, and R1 material particles are mixed in so that the volume changes due to the action of a magnetic field. As is well known, the abrasive grains are 1' i C, W 2 C, and S I C.
, B a C, Tire.

△l 203 、7r 02 、 Si 02 、 F
e 203 。
Δl 203 , 7r 02 , Si 02 , F
e203.

Fe5s4.その他を用い、磁界によって体積変化する
粒子にはフエライ、ト、81 F2 、Co−鋼。
Fe5s4. Others were used, and the particles whose volume changed depending on the magnetic field were ferrite, To, 81 F2, and Co-steel.

Ni−鋼、ニッケル、その他の磁歪材が用いられる。砥
粒の混入量は30〜50%(重量比)付近C研磨量が最
大になるの(・、これを目安に混合し、磁界により体積
変化する粒体は同程度がそれ以下の混合とプる。混合量
によって加工性が変るので目釣船]−に応じて最適量の
配合をする。このような混合磨き剤を研磨間隙に圧入し
ておき、その状態でバネ7により加圧を行い、振動装置
4により横方向の振動を行わせる。振動は回転振動とが
、みイ摺り状の振動、丙振り振動等を任意に行わせるこ
とができる。勿論]二具2を振動源と4の振動と共に手
動で前後、左右に隈無く動がして被加工体1の全面を加
圧研磨するようにしてもよい。この工具2と被加工体1
の加圧圧接に従って間隙に圧入された砥粒の研磨作用に
より磨き加工が行われる。この加工中、コイル8によっ
て変化磁界が加えられる。この変化磁界の作用によって
砥粒と共に4作液中に混入しである体積変化物質粒子は
磁界の変化に応動して体積膨張、収縮する変動を行い、
イの力を周りの砥粒に作用し、砥粒はこれにより外部か
ら作用する振動等0に加えて内部的に振動、転勤等の挙
動をし、この振動方向も任意の方向に作用し、従ってこ
れにより磨き効果を促進さぜることができる。
Ni-steel, nickel, and other magnetostrictive materials are used. The amount of abrasive grains mixed in is around 30-50% (weight ratio).The amount of C polishing reaches its maximum (・, this is used as a guideline, and grains whose volume changes due to the magnetic field should be mixed with the same amount but less. Since workability changes depending on the amount of mixture, mix the optimum amount according to the amount of the polishing agent.Press this mixed polishing agent into the polishing gap, pressurize it with the spring 7 in that state, Vibration device 4 is used to vibrate in the lateral direction. Vibration can be rotational vibration, grinding vibration, cylindrical vibration, etc. as desired. Of course] The entire surface of the workpiece 1 may be polished under pressure by manually moving the tool 2 and the workpiece 1 back and forth, left and right with vibration.
Polishing is performed by the abrasive action of abrasive grains press-fitted into the gap according to the pressure welding process. During this machining, a varying magnetic field is applied by the coil 8. Due to the action of this changing magnetic field, the volume-changing material particles, which are mixed into the working liquid together with the abrasive grains, expand and contract in volume in response to changes in the magnetic field.
This force acts on the surrounding abrasive grains, and as a result, the abrasive grains internally vibrate, shift, etc. in addition to the vibrations that act from the outside, and this vibration direction also acts in any direction. Therefore, this can promote the polishing effect.

第2図は、他の実施例で、10は加工によって成形され
た穴であり、この内面磨きを行う。11は回転磨き工具
で、筒体11aの先に研磨用の線材11bを複数本を箒
状に植設してなるものである。線材♂ 11bk1.tl:’7/線、真鍮線、wc線、CI 
Be線。
FIG. 2 shows another embodiment, in which numeral 10 indicates a hole formed by processing, and the inner surface of this hole is polished. Reference numeral 11 denotes a rotary polishing tool, which has a plurality of polishing wire rods 11b planted in the shape of a broom at the tip of a cylindrical body 11a. Wire rod ♂ 11bk1. tl: '7/ wire, brass wire, wc wire, CI
Be line.

Ni11a、その伯任意の材料の線材が用いられ、線杆
は通常0.1〜21111φ程度のものを、筒体11a
−への装着本数は2本以上の複数本とし、多い場合は2
0木程度装着づる。11cは中心回転軸でモータ12に
より 500−・20,0OORP M程度の高速回転
が行われる。13は通電ブラック、14は工具11と被
加工体10との間にパルス的電圧を加えて変化電界を形
成する通電電源の接続端子である。
A wire rod made of Ni11a or any material thereof is used, and the wire rod is usually about 0.1 to 21111φ.
-The number of cables to be installed is two or more, and if there are many
Installed about 0 trees. Reference numeral 11c denotes a central rotating shaft which is rotated at a high speed of approximately 500-20.0 OORPM by the motor 12. Reference numeral 13 denotes an energizing black, and 14 a connecting terminal of an energizing power source that applies a pulsed voltage between the tool 11 and the workpiece 10 to form a changing electric field.

工具11と被加[休10との研磨間隙には磨き剤として
工作液に砥粒と電界作用によって体積変化を起す物質粒
子を混合したものを供給する。電界によって体積変化を
起り物質としては3aTtO3゜17丁、PLZT、P
CM、その他の電歪材が用いられる。このような混合磨
き剤を研磨間隙に供給し介在させた状態Cモータ12に
より一■貝11を高速回転させる。T具11は高速回転
によって円筒11aに装着した線111tlが外側に広
がる力、即ち遠心力が作用し、液加1体10挿入穴壁面
に圧接し摩擦摺動4るようになり、間に介在する摩擦剤
と共に研磨加工を覆ることができる。加工穴が図のよう
に回転り具11よりも大きい場合は、工具11又は被加
工体10を移動し相対移動により被加工体10穴壁面全
体に研磨加[を行う。研磨加工中、工具11と被加圧体
10間には端子14よりパルス電圧が印加され、変化型
Wが形成作用する。この変化電界の作用によって砥粒と
共に1作液に混入した体積変化物質粒子は電界の変動に
応動して体積膨張、収縮づる変動を行い、その変動力を
周りの砥粒等に作用し、砥粒はこれにより外部作用の回
転摩擦に加えて内部圧力により振動、転勤等行い研磨効
果を助長させる。
In the polishing gap between the tool 11 and the workpiece 10, a polishing agent containing a working fluid mixed with abrasive grains and material particles whose volume changes due to the action of an electric field is supplied. Substances that change in volume due to an electric field include 3aTtO3゜17th, PLZT, and P.
CM and other electrostrictive materials are used. The single shell 11 is rotated at high speed by the state C motor 12 in which such a mixed polishing agent is supplied to the polishing gap. When the T tool 11 rotates at high speed, the force that causes the wire 111tl attached to the cylinder 11a to spread outward, that is, the centrifugal force, acts on the T tool 11, and the liquid member 10 comes into pressure contact with the wall surface of the insertion hole and frictionally slides 4. The abrasive process can be covered with a friction agent. If the hole to be machined is larger than the rotary tool 11 as shown in the figure, the tool 11 or the workpiece 10 is moved and the entire wall surface of the hole in the workpiece 10 is polished by relative movement. During the polishing process, a pulse voltage is applied from the terminal 14 between the tool 11 and the pressurized body 10, and the variable type W is formed. Due to the action of this changing electric field, the volume-changing material particles mixed into a single working solution along with the abrasive grains expand and contract in volume in response to the fluctuations in the electric field, and apply this changing force to the surrounding abrasive grains, etc. This causes the grains to vibrate, shift, etc. due to internal pressure in addition to external rotational friction, thereby promoting the polishing effect.

尚勿論、前記工具の回転運動に加えて振動を作用させて
もよく、振動は20に〜50KH2の超音波撮動を行う
ことによって有効に作用する。
Of course, vibration may be applied in addition to the rotational movement of the tool, and the vibration is effectively applied by performing ultrasonic imaging at 20 to 50 KH2.

次に実験例について説明する。Next, an experimental example will be explained.

磨き剤としで、アマニ油に体積比で100メツシ」のP
 L 7 T 15%と 100メツシユのダイヤ粒子
15%及び84015%を混合したものを用い、Si3
N4を1%Y2O3を混合して成形した被加工体の型磨
きに於て、総型丁具に28.6K Hz 、  150
Wの振動を行わせ、工具と液加]二体間に560vの電
圧C通電時間が10m5 、体1L時間がsoomsの
パルス電ffを印加して研磨したとき、加工速痩は約1
20mq/minであった。電圧印加を除去したときは
88111q/mln程頃に低下した。
As a polishing agent, add 100 tons of P by volume to linseed oil.
Using a mixture of 15% L7T, 15% 100 mesh diamond particles, and 15% 840,
When polishing the mold of a workpiece molded by mixing N4 with 1% Y2O3, the total mold cutting tool was heated at 28.6 KHz, 150 kHz.
Vibration of W and application of tool and liquid] When polishing by applying a 560V voltage C between the two bodies for 10m5 and applying a pulsed electric power of SOOOMS for 1L of the body, the machining speed was approximately 1.
It was 20 mq/min. When the voltage application was removed, it decreased to about 88111q/mln.

また磨き剤として、5IIIF2粒子15%とダイヤ粒
子20%を7シン油に加えたものを用い、工具に12本
のピアノ線を植設した回転工具を11,0OORPMで
回転しながら被加工体に圧接した間隙に供給し、磁界3
,0OOGの1Hzで文種づる変化磁界を加えたとぎ、
磁界を作用しない場合に比較した加1丁速度は、約3倍
に向上した。
In addition, as a polishing agent, 15% of 5IIIF2 particles and 20% of diamond particles were added to 7thin oil, and a rotary tool with 12 piano wires embedded in the tool was applied to the workpiece while rotating at 11.0 OORPM. Supplied to the pressure-welded gap, magnetic field 3
When a varying magnetic field is applied at 1Hz of 0OOG,
Compared to the case where no magnetic field is applied, the cutting speed was improved by about three times.

なお体積変化粒子としては前記の磁界、電界によって体
積形状変化するものに限らず、加圧によッ’(体積変化
するT! Fe 、la N! 6.MnN:a、M(
12Ni等を単独または混合して利用りることができ、
振動圧9回転圧等の作用C体積形状変化させながら加工
効果を高めることができる。
Incidentally, the volume-change particles are not limited to those whose volume and shape change due to the above-mentioned magnetic field or electric field, but also those whose volume changes due to pressure (T! Fe, la N! 6. MnN: a, M (
12Ni etc. can be used alone or in combination,
The machining effect can be enhanced while changing the volume and shape of the action C such as vibration pressure and rotational pressure.

以1−のように本発明は、磨き剤として砥粒の他に磁界
、電界または加圧によって体積変化する物質の粒体を混
合したものを用い、これを■貝、母林間の研磨間隙に供
給し、外部から変化電界、変化磁界もしくは変動圧力を
作用して加工するようにしたから研磨加工速度が向上し
極めて能率のよい型磨きをすることができる。
As described in 1-1 above, the present invention uses a mixture of abrasive grains and particles of a substance whose volume changes depending on a magnetic field, an electric field, or pressure, and applies this to the polishing gap between the shellfish and the mother forest. Since the mold is supplied and processed by applying a changing electric field, changing magnetic field, or changing pressure from the outside, the polishing speed is increased and mold polishing can be performed extremely efficiently.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は、本発明の一実施例構成図、第2図は、他の実
施例構成図である。 1・・・・・・・・・被加工体 2・・・・・・・・・工具 3・・・・・・・・・振動桿 4・・・・・・・・・振動装置 5・・・・・・・・・振動バネ 6・・・・・・・・・加圧桿 7・・・・・・・・・加圧バネ 8・・・・・・・・・磁気コイル 10・・・・・・・・・被加工体 11・・・・・・・・・回転工具 12・・・・・・・・・回転モータ
FIG. 1 is a block diagram of one embodiment of the present invention, and FIG. 2 is a block diagram of another embodiment. 1... Workpiece 2... Tool 3... Vibrating rod 4... Vibrating device 5. ..... Vibration spring 6 ..... Pressure rod 7 ..... Pressure spring 8 ..... Magnetic coil 10. ......Workpiece 11...Rotary tool 12...Rotary motor

Claims (1)

【特許請求の範囲】 磨き剤として工作液に砥粒の他に電昇、磁界。 もしくは圧力の作用によって体積変化を起す物質の粒子
を混入したものを用い、これを相対運動もしくは振動な
どづる研磨間隙に供給し変化電界。 変化磁界もしくは変動圧力を作用して加工することを特
徴とする磨き加工方法。
[Claims] As a polishing agent, in addition to abrasive grains, electrophoresis and a magnetic field are added to the working fluid. Alternatively, particles of a substance that causes a volume change due to the action of pressure are mixed in, and this is supplied to the polishing gap due to relative motion or vibration to create a changing electric field. A polishing method characterized by applying a varying magnetic field or varying pressure.
JP57071821A 1982-04-28 1982-04-28 Method of polishing machining Pending JPS58192737A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57071821A JPS58192737A (en) 1982-04-28 1982-04-28 Method of polishing machining

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57071821A JPS58192737A (en) 1982-04-28 1982-04-28 Method of polishing machining

Publications (1)

Publication Number Publication Date
JPS58192737A true JPS58192737A (en) 1983-11-10

Family

ID=13471596

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57071821A Pending JPS58192737A (en) 1982-04-28 1982-04-28 Method of polishing machining

Country Status (1)

Country Link
JP (1) JPS58192737A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03178767A (en) * 1989-12-04 1991-08-02 Matsushita Electric Ind Co Ltd Micropolishing method and micropolishing tool
KR20030001236A (en) * 2001-06-27 2003-01-06 문병준 Method for manufacturing of abrasives and method of polishing
KR20030024549A (en) * 2001-09-17 2003-03-26 문병준 Apparatus of polishing

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS513113A (en) * 1974-05-27 1976-01-12 Siemens Ag

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS513113A (en) * 1974-05-27 1976-01-12 Siemens Ag

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03178767A (en) * 1989-12-04 1991-08-02 Matsushita Electric Ind Co Ltd Micropolishing method and micropolishing tool
KR20030001236A (en) * 2001-06-27 2003-01-06 문병준 Method for manufacturing of abrasives and method of polishing
KR20030024549A (en) * 2001-09-17 2003-03-26 문병준 Apparatus of polishing

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