JPH11165268A - Polishing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a polishing device by a fluid grindstone capable of displaying comparatively strong polishing force, freely and stereoscopically deforming its shape in accordance with a shape of a working. surface and polishing a narrow and closed inner surface which a human hand and a solid grinding stone cannot enter. SOLUTION: A work is polished by using a polishing material 11 solidified or gelatinized in accordance with a shape of a working surface of the work and generation relative motion between the polishing material 11 and the work. It is carried out by giving mechanical vibration between the polishing material 11 and the work. The relative motion is generated by giving an alternating magnetic field in case of magnetic fluid free to control arrangement of abrasive grains by a magnetic field. Additionally, the relative motion is carried out by giving the alternating magnetic field in the case when the polishing material 11 is fluid containing the abrasive grains charged with plus or minus charge and it is solidified or gelatinized in the state of giving an electric field.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a polishing apparatus for polishing a workpiece by causing relative movement between the abrasive and the workpiece.

[0002]

2. Description of the Related Art With the rapid progress of technological innovation, industrial products and parts used therein are required to have high precision and high quality. Along with this demand, the shapes of these industrial products and parts (hereinafter, referred to as “workpieces”) are complicated, and fine and precise dimensional accuracy is often required. For this reason, polishing or grinding work is required in the final stage of the manufacturing process of these workpieces.

[0003] In many cases, polishing or grinding of a workpiece requiring such fine surface finish or fine dimensional accuracy still has to be performed manually.
In reality, a method using mechanical force using a solid whetstone having a predetermined shape is precisely limited to grinding or rough polishing. In addition, there is a certain limit in the precision of mirror polishing on the processed and polished surface regardless of whether it is a manual polishing operation or a skilled operation.

[0004] Therefore, if the manual polishing work in the final finishing step can be mechanized or labor-saving, the processing cost can be reduced and the working process time can be shortened.

[0005] Under such circumstances, research has been conducted on a so-called soft lapping wheel as a method for realizing a sophisticated and precise mirror polishing of a workpiece. In this method, a polymer wrapping agent such as polyvinyl acetal, sodium alginate or the like is dissolved in the surface of chamois to perform wrapping. Such soft lapping has been used mainly for mirror-polishing the surface of a silicon wafer used in the manufacture of integrated circuits.

On the other hand, the inventors of the present application have used a magnetic fluid containing abrasive grains whose arrangement of abrasive grains can be controlled by a magnetic field,
A method of polishing a workpiece by immersing a workpiece in the magnetic fluid and performing relative motion such as vibration or oscillation of the magnetic fluid on the workpiece in a state where a magnetic field having a predetermined strength is applied to the workpiece. Or have proposed a device. Examples of disclosing a polishing method or a polishing apparatus using such a magnetic fluid are disclosed in JP-A-1-135466 and JP-A-4-336.
954 and JP-A-4-41173.

[0007]

As described above, the method of polishing or grinding by mechanical force using a solid whetstone having a predetermined shape is limited to grinding or rough polishing in terms of dimensional accuracy. In addition, polishing by a mechanical device using a solid grindstone is conventionally used only for two-dimensional planar processing because of the rigidity of the shape of the solid grindstone.
It was rarely used for three-dimensional curved surface processing.

[0008] A method of polishing a workpiece by immersing a fluid containing abrasive grains into a processing surface of the workpiece and imparting relative motion between the workpiece and the workpiece involves a method in which the abrasive is a liquid having a high fluidity. Therefore, the polishing force is extremely weak because the contact pressure of the abrasive grains on the processing surface is weak. Therefore, although it can be used for uniform precision mirror polishing of the entire final processed surface in the grinding and polishing steps of a workpiece, it is not suitable for rough polishing before grinding or precision polishing. In addition, the prior art method of polishing in a state in which the arrangement of the abrasive grains is controlled by applying a magnetic field of a predetermined strength using a magnetic fluid also requires a three-dimensional method due to the high fluidity of the magnetic fluid. There has been a difficulty in using the polishing for polishing that requires strict dimensional accuracy in arbitrary dimensions.

[0009]

According to the present invention, a relatively strong polishing force, which is an advantage of polishing or grinding using a solid whetstone, can be exhibited, and the shape can be three-dimensionally adjusted according to the shape of the processing surface. Processing of workpieces to provide a polishing device that has the advantages of polishing with a fluid whetstone that can be freely deformed and that can polish a narrow and closed inner surface where human hands and solid whetstones cannot enter. The workpiece is polished by using a solidified or gelled abrasive according to the shape of the surface, and by causing relative movement between the abrasive and the workpiece. The relative movement is performed by applying mechanical vibration between the abrasive and the workpiece. However, when the abrasive is a magnetic fluid capable of controlling the arrangement of abrasive grains by a magnetic field, it is possible to cause relative movement by applying an alternating magnetic field. Further, when the abrasive is a fluid containing abrasive grains charged with a positive or negative charge, and is solidified or gelled in a state where an electric field is applied, relative movement is performed by applying an alternating electric field. Is possible.

These relative movements are performed not only in one-dimensional or two-dimensional but also in three-dimensional directions in consideration of the case where the processing surface of the workpiece has a three-dimensional curved surface shape. The relative movement in each direction may be performed in a time series for each dimension, or may be performed in a plurality of directions simultaneously.

Further, in the polishing apparatus according to the present invention, there is provided a driving means for causing relative movement between an abrasive formed according to the shape of the processing surface of the workpiece and the workpiece. Pressure detecting means for detecting a pressure value between the abrasive and the workpiece caused by the relative movement,
Control means for controlling a stroke width of the relative movement in accordance with the pressure value detected by the pressure detection means, wherein a predetermined value of the pressure is input to the control means, and the control means Means are configured to cause the relative movement such that the pressure value is the predetermined value.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS In a polishing apparatus according to the present invention, a polishing material obtained by pouring a fluid containing abrasive grains directly into a polishing surface of a workpiece and solidifying the fluid as it is is processed. Since the polishing is performed by causing a relative movement between the workpiece and the object, the polishing can be applied to the polishing operation of a small amount or a single product.

For this reason, the polishing apparatus of the present invention can be used in the optics field for polishing glass or plastic materials such as prescription spectacle lenses, prisms and mirrors having a specific shape, and casings for various industrial products. Jewelry, watch parts, and other gauges that require high dimensional accuracy,
Applicable to grinding and polishing of metal materials such as cylinders, bearing parts, cams and bearing balls. Further, it can also be used for the final mirror finish of a silicon wafer serving as a base of an integrated circuit. As a special example, it can be used for dentures, grinding and polishing of ceramic materials of artificial bones.

Since the application field of the polishing apparatus of the present invention covers a wide range as described above, the types and specifications of the abrasive grains and the fluid containing the abrasive grains used here are determined depending on the type of workpiece to be polished or ground. It is determined according to the material and the required polishing accuracy.

As the material of the abrasive grains used, in the case of magnetic abrasive grains, specific examples include iron oxide (Fe3O4, Fe2O3, etc.),
Non-magnetic abrasive grains include alumina (Al2O3) and silica (Si
O2), diamond and the like. The smaller the particle size, the higher the required polishing accuracy is. For example, when the processed product is required to have a shape accuracy of 0.01 μm or less, abrasive grains having a particle size of 10 nm or less are used.

As the fluid, water and various kinds (animals,
Vegetable oil, mineral oil). In the case of a magnetic fluid, water is mainly used, and in the case of charged abrasive, oil is preferably used. In order to prevent the agglomeration of the abrasive grains in the fluid, a surfactant may be added.

As a method of solidifying or gelling,
For example, when the fluid is water, the temperature is lowered to a temperature below the freezing point. When the fluid is oil, a chemical reaction may be used in addition to such temperature control.

In the polishing apparatus of the present invention, since the polishing is performed by solidifying the fluid containing the abrasive grains and causing the fluid to move relative to the workpiece, the abrasive particles in the fluid when the fluid is solidified It is extremely important to control the sequence distribution in. This is because the distribution density of the abrasive grains in contact with the surface to be processed of the workpiece greatly affects the polishing rate and the polishing accuracy. Since the specific gravity of the abrasive grains is different from the specific gravity of the fluid, even if the abrasive grains are added to the fluid and sufficiently stirred, the abrasive grains are unevenly distributed in the fluid before solidifying or gelling. Therefore, it is necessary to control the arrangement distribution or distribution density of the abrasive grains before solidification or gelation.

The method of controlling the arrangement distribution of the abrasive grains in the fluid at the time of solidification is performed in a magnetic field environment in the case of a magnetic fluid, and in an electric field environment in the case of using charged abrasive grains.

When the magnetic fluid and the workpiece are placed in a magnetic field environment, the magnetic abrasive grains are arranged along the lines of magnetic force.
In addition, since the number of lines of magnetic force per unit area is proportional to the magnetic field strength, the density of the abrasive grain array can be controlled by controlling the magnetic field strength. In this way,
The distribution density of the magnetic fluid in the fluid can be controlled according to the application and demand.

When charged abrasive grains are used, the abrasive grains are charged to one of positive and negative charges. Therefore, unlike charged magnetic particles which always have both polarities (N-pole and S-pole), the charged particles are charged. There is a repulsive force between each other. Therefore, since a force is exerted on the charged particles to distribute them uniformly in the fluid, it is not always necessary to perform the solidification or gelation in an electric field environment. However, by applying an electric field, the distribution of charged abrasive grains in the fluid can be controlled according to the electric field intensity distribution.For example, when it is desired to distribute and arrange more abrasive grains on the contact surface with the workpiece, It is necessary to solidify or gel in an electric field environment.

The abrasive containing the solidified or gelled abrasive grains causes a relative motion, such as vibration or oscillation, between the abrasive and the surface to be processed of the workpiece, thereby grinding or polishing the abrasive. However, depending on the mode of solidification, there is a case where the main abrasive and the surface to be processed are bonded in a close contact state. In such a state, even if the relative movement is attempted between them, the polishing efficiency is poor. Therefore, in such a case, the relative movement is performed while the contact surface between the solidified main abrasive and the surface to be processed is thinly melted. As a method of melting the contact surface between the abrasive and the work surface used in the present polishing apparatus, temperature control is performed so that the temperature of the work is higher than the freezing point of the fluid, or the fluid is previously applied to the work surface of the work. There is also a method of applying a chemical having a low freezing point or the like.

In the polishing apparatus according to the present invention, as means for causing relative movement between the abrasive and the workpiece, vibration is generated by using mechanical force. When using charged abrasive grains, electric force due to an alternating electric field is used.

Regardless of which of these forces is used,
The direction of the relative motion depends on the shape of the work surface of the workpiece.
If it is a plane, it is one-dimensional or two-dimensional, and if it is a three-dimensional surface, it is three-dimensional. These multidimensional relative motions are 1
It may be performed in a time series in each dimension, or may be performed in parallel.

Next, as an example of solidifying a fluid containing abrasive grains used in the polishing apparatus according to the present invention, a method of freezing and solidifying a magnetic fluid in accordance with a work surface of a workpiece will be described with reference to the drawings.

In FIG. 6A, a magnetic fluid 1 containing a predetermined amount of magnetic abrasive grains is poured into a work surface 4 'of a workpiece 4. The fluid is agitated in advance with a surfactant added to prevent coagulation of the magnetic abrasive grains. The magnetic fluid 1 flows into the processing surface 4 ', and fills the processing surface 4' and comes into close contact with it.

In FIG. 6 (2), the workpiece 4 in which the magnetic fluid 1 is filled on the processing surface 4 ′ is placed on the magnetic field generating means 5. The magnetic field generating means 5 may be a permanent magnet having a predetermined magnetic field strength, or may be an electromagnet obtained by winding a magnetic material such as a silicon steel sheet laminate or a ferrite material. In the case of an electromagnet, the magnetic field strength can be adjusted to an arbitrary value. By placing the magnetic fluid 1 in a magnetic field environment generated by the magnetic field generating means 5, the arrangement and distribution density of the magnetic abrasive grains can be controlled.

In FIG. 6 (3), the workpiece 4 filled with the magnetic fluid 1 placed in a magnetic field environment on the processing surface is solidified in the above-described state by placing the workpiece 4 in a low temperature environment. Let it. The freezing point of a magnetic fluid containing water as its main component depends on the content ratio of water, but is usually minus several tens degrees Celsius, so a refrigerator may be used. Depending on the type of fluid,
If the solidification temperature is less than minus 100 degrees Celsius, use liquid nitrogen.

In FIG. 6D, when the contact surface between the work 4 and the solidified magnetic fluid 1 is in a tightly bonded state, the work surface 4 is heated to a temperature slightly higher than the melting point of the magnetic fluid 1 to be solidified. The contact surface of the formed magnetic fluid with the processing surface 4 'is thinly melted. As a heating method, high-frequency heating, heater heating, and the like are generally used. This facilitates the relative movement between the solidified magnetic fluid and the workpiece 4. However, if the degree of melting is too large, dimensional accuracy will be adversely affected.

In FIG. 6 (5), one holding means 7 of a mechanical vibration generator (not shown) is driven into the upper part of the solidified magnetic fluid. Then, the other fixing device of the same device is fixed to the workpiece 4 to cause relative movement between the two holding means to perform a grinding or polishing operation.

In FIG. 6 (6), the grinding or polishing of the workpiece is performed by using the abrasive thus formed to cause relative movement between the workpiece and the workpiece by the polishing apparatus of the present invention. That would be.

FIG. 1 relates to a polishing apparatus according to the present invention, and shows an example of an overall mechanism of the polishing apparatus for generating the above-described relative motion in a three-dimensional direction by using mechanical force. As described above, the abrasive 11 formed according to the shape of the processing surface of the workpiece 12
Is placed on the polishing apparatus 10 together with the workpiece 12. Here, the polishing apparatus 10 includes a mechanism block X for generating vibration in the X-axis direction, a mechanism block Y for generating vibration in the Y-axis direction, and a mechanism block for generating vibration in the Z-axis direction. Z. In the present embodiment, the distance between the workpiece 12 and the abrasive 11 is 3
In order to cause relative movement in the dimensional direction, the workpiece 12 is vibrated in the X-axis direction and the Y-axis direction shown in the drawing, and the abrasive 11 is vibrated in the Z-axis direction.

On the base frame 19 of the polishing apparatus, an X-axis slide plate 21 vibrating in the X-axis direction with respect to the frame 19 is provided, and on the X-axis slide plate 21, the X-axis slide plate 21 is further moved in the Y-axis direction. A Y-axis slide plate 22 that vibrates is provided, and a table 18 for fixing the workpiece 12 is mounted on the Y-axis slide plate 22. The table 18 is fixed to the Y-axis slide plate 22 by mounting brackets 16 and 17. As will be described in detail later, the X-axis slide plate 21 is configured to vibrate only in the X-axis direction by the mechanism block X, and the Y-axis slide plate 22 is configured to vibrate only in the Y-axis direction by the mechanism block Y. Is done. Thus, the workpiece 12 is configured to move in the XY-axis directions with respect to the abrasive 11 in a state where the workpiece 12 is fixed in the Z-axis direction. Further, abrasive 1
1 is fixed to the chuck plate 13 by brackets 14 and 15 for chucks. The chuck plate 13 is fixed to the Z-axis vibration member 23. The Z-axis vibration member 23 is configured to vibrate in the Z-axis direction by the mechanism block Z. Thus, the abrasive 11 is configured to move in the Z-axis direction with respect to the workpiece 12 while being fixed in the XY-axis directions.

The workpiece 12 and the abrasive 11 placed on the polishing apparatus 10 having the above-described structure are relatively moved in the X, Y and Z-axis directions by the mechanical blocks X and Z of the polishing apparatus 10, respectively. However, in order to increase the efficiency and accuracy of the polishing operation, the abrasive 11
It is necessary to control the pressing force. Therefore, the work 12
Pressure sensors 24 (in the X-axis direction), 25 (in the Y-axis direction), and 26 (in the Z-axis direction), which are load cells, are installed to detect the respective pressing forces in the respective axial directions between the polishing material 11 and the abrasive material 11. . Thereby, it is possible to perform a constant pressing force stroke control in which the polishing pressing force in each axial direction is maintained at a predetermined value, and a pressing force variation stroke control in which the pressing force is changed with time in grinding or rough polishing and in precision polishing. .

FIG. 2 shows a vibration generating mechanism illustrated in a mechanism block X that generates vibration in one direction (X axis) in the polishing apparatus shown in FIG.

The X-axis slide plate 21 carries the Y-axis slide plate 22 shown in FIG. 1 and vibrates in the X-axis direction by the X-axis vibration pin 35. The pressure sensor 24 detects the pressure of the X-axis slide plate 21 in the X-axis direction. The X-axis slide plate 21 is provided with two slits 31 of a predetermined length in the X-axis direction, and the guide shaft 33 fixed to the base frame 19 of the polishing apparatus passes through the slits 31. Thus, the X-axis slide plate 21 can vibrate with respect to the base frame 19 by a stroke equal to the length of the slit 31. The X-axis slide plate 21 includes
Another slit 34 is provided.
5 engage. As shown in the figure, the slit 34 is cut long in the Y-axis direction.
Consideration is given so that the vibration in the axial direction is released and is not transmitted to the X-axis slide plate 21. The vibration pin 35 vibrates the X-axis slide plate 21 in the X-axis direction, and is fixed to the vibration plate 36.

The diaphragm 36 is provided with an arc-shaped slit 37 for setting a stroke width and a slit 38 for receiving a vibration driving force. A shaft 39 is fixed to the vibration plate 36, and an end of the shaft 39 is engaged with a slit 41 provided in the upper guide plate 40. The shaft 39 fixed to the diaphragm 36 engages with the slit 41 of the guide plate 40. Since the slit 41 is shorter in the Y-axis direction and longer in the X-axis direction, Regulate vibration. Further, a shaft 42 is fixed to the guide plate 40, and an end of the shaft is engaged with another slit 32 provided in the diaphragm 36. The slit 32 has a Y shape, like the slit 41 on the guide plate 40.
Since the shaft method is short and long in the X-axis direction, the vibration of the diaphragm 36 in the Y-axis direction is regulated. Information board 4
0 is fixed to the base plate 50 by a plurality of support shafts 43.

A vibration drive motor 52 and a vibration stroke control motor 53 are attached to the base plate 50 and are fixed to the base frame 19 by a plurality of columns 56. It is desirable that each of the motors 52 and 53 has a built-in reduction gear mechanism for reducing the rotation speed to a predetermined rotation speed. The rotation output shaft 55 of the vibration drive motor 52 extends to the vibration plate 36 through a hole provided on the guide plate 40. An eccentric shaft 44 is attached to the tip of the eccentric shaft 44, and the eccentric shaft 44 performs a rotational swinging movement with the rotation of the rotation output shaft 55 of the vibration drive motor 52.
Since the eccentric shaft 44 is engaged with the slit 38 provided on the diaphragm 36, the rotational swinging motion of the eccentric shaft 44 causes the diaphragm 36 to swing.

On the other hand, a gear 49 is attached to the tip of the rotation output shaft 54 of the vibration stroke control motor 53, and the sector gear 46 meshes with the gear 49. The fan-shaped gear 46 has a collar 47 fitted with a rotating shaft 51, and the rotating shaft 51 is supported by a base plate 50. A pin 45 is attached to a tip end of the sector gear 46 extending in a tongue shape from one side in a state of extending downward. The pin 45 is engaged with an arcuate slit 37 provided at the center of the diaphragm 36. The vibration stroke control motor 53 is a DC that can rotate in the forward and reverse directions and can freely control the rotation angle of the rotating shaft.
Use a motor. Thereby, the position of the pin 45 in the arc-shaped slit of the diaphragm 36 can be set freely.
Then, on the opposite side of the slit 38 engaging with the eccentric shaft 44 with the arc-shaped slit 37 interposed therebetween, the vibration pin 3 described above is provided.
5 is attached.

In the vibration mechanism configured as described above,
When the vibration drive motor 52 is driven to rotate, the rotation shaft 5
The eccentric shaft 44 at the distal end of No. 5 performs rotational swinging motion. Since the vibration plate 36 receives the eccentric shaft 44 in the slit 38, the vibration plate 36 swings with the rotational swing motion of the eccentric shaft 44. However, since the slit 38 is largely cut in the Y-axis direction, the vibration operation in the Y-axis direction is absorbed here, and the vibration operation in the X-axis direction is transmitted to the diaphragm 36. Also, as described above, the diaphragm 3
The shaft 39 fixed to 6 engages with the slit 41 of the guide plate 40. Since the slit 41 has a short Y-axis method and is cut long in the X-axis direction, the vibration of the vibration plate 36 in the Y-axis direction is reduced. Absorbed. Further, a shaft 42 is fixed to the guide plate 40, and the end of the shaft 42 is connected to another slit 3 provided on the diaphragm 36.
2, the slit 32 is short in the Y-axis direction and long in the X-axis direction, like the slit 41 on the guide plate 40, so that the vibration of the diaphragm 36 in the Y-axis direction is absorbed. It is.

The vibration force in the X-axis direction of the vibration drive motor 52 transmitted as described above causes the vibration pin 35 to finally vibrate the X-axis slide plate 21 in the X-axis direction.

FIG. 3 shows a mechanism for adjusting the vibration stroke width in the vibration mechanism shown in FIG. In FIG. 3A, the position of the pin 45 described above is set closest to the eccentric shaft 44 of the arc-shaped slit 37 on the diaphragm 36.
Since the diaphragm 36 vibrates around the position of the pin 45 as a fulcrum,
In this case, since the vibration stroke in the X-axis direction transmitted by the eccentric shaft 44 is enlarged, the X-axis slide plate 2
1 is the maximum vibration stroke in the X-axis direction. Also, in FIG. 3B, the position of the pin 45 is
7 is set closest to the vibrating pin 35. In this case, since the vibration stroke in the X-axis direction transmitted by the eccentric shaft 44 is reduced, the vibration stroke of the X-axis slide plate 21 in the X-axis direction is minimized.

Although the vibration mechanism in the X-axis direction has been described above, the work piece 12 and the abrasive 11 are provided in the Y-axis direction and the Z-axis direction by providing similar mechanism blocks.
It is possible to cause a relative motion by a three-dimensional mechanical force therebetween. The relative movement in the three-dimensional direction may be performed with time in each of the three-dimensional directions or may be performed simultaneously.

FIG. 4 shows an outline of a vibration mechanism using a magnetic force for causing the above-described relative movement by applying an alternating magnetic field to an abrasive obtained by solidifying or gelling a magnetic fluid containing abrasive grains.

Electromagnets each having a coil wound around a magnetic material are arranged in six directions of the X axis, the Y axis, and the Z axis, and an alternating current having a predetermined frequency is applied to each coil.
It is possible to cause a relative movement between the workpiece 12 and the abrasive 11 in a three-dimensional direction. In consideration of the moment of inertia of the solidified or gelled magnetic fluid, it is possible to adjust the stroke width of the relative motion and the polishing pressure by adjusting the frequency value and the magnetic flux density of the alternating current flowing through the electromagnet in each axial direction. is there.

FIG. 5 shows an outline of a vibration mechanism using an electric force for causing the above-described relative motion by applying an alternating electric field to an abrasive obtained by solidifying or gelling a fluid containing charged abrasive grains.

Electrode plates are arranged in each of the six directions of the X, Y, and Z axes, and by applying an AC voltage of a predetermined frequency to each of the electrode plates, the workpiece 12 and the abrasive 11
It is possible to cause a relative movement in the three-dimensional direction between them. In consideration of the moment of inertia of the abrasive containing the solidified or gelled charged abrasive grains, by adjusting the frequency value and the voltage value of the AC voltage applied to the electrode plate in each axial direction, the stroke width of the relative motion and the polishing are adjusted. It is possible to adjust the pressure.

The stroke of the relative movement between the workpiece and the solidified or gelled abrasive material according to the processing surface of the workpiece is adjusted according to the intended processing. If you want to perform large grinding in a unit time, use this abrasive containing high-density abrasive grains at a high density.
In the case of mirror-finish processing where precise dimensional accuracy is required by producing a large stroke relative motion between the workpiece and the workpiece, a solidified or gelled abrasive containing small abrasive grains is used. , By making a small relative motion between the workpiece and the workpiece. The setting of these strokes can be adjusted to be large in the first grinding stage and gradually reduced in the final polishing stage. And
The final target dimension of the polished workpiece is input in advance to a control device of the polishing apparatus for performing the polishing according to the present invention, and while automatically detecting the dimension of the workpiece and the polishing stress pressure on the processed surface, the automatic processing is performed. It is also possible to perform grinding and polishing by control.

[Brief description of the drawings]

FIG. 1 shows an example of an overall mechanism of a polishing apparatus using mechanical force according to the present invention.

FIG. 2 shows a vibration mechanism in one direction (X axis) in the polishing apparatus of FIG.

FIG. 3 shows a mechanism for adjusting a vibration stroke width in the vibration mechanism of FIG. 2;

FIG. 4 shows an outline of a vibration mechanism using a magnetic force.

FIG. 5 shows an outline of a vibration mechanism using electric force.

FIG. 6 shows an example in which a fluid containing abrasive grains is solidified in accordance with a processing surface of a workpiece.

[Explanation of symbols]

 10: Polishing device 11: Abrasive material 12: Workpiece 21: X-axis slide plate 22: Y-axis slide plate 23: Z-axis vibration member 36: Vibration plate (X-axis) 52: Vibration drive motor 53: Vibration stroke control motor

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁶ Identification code FI // B24B 13/01 B24B 13/01

Claims (10)

[Claims] An object is polished by using a polishing material formed in accordance with the shape of a processing surface of a processing object and causing relative movement between the polishing material and the processing object. Polishing device configured in. 2. The polishing apparatus according to claim 1, wherein said polishing material is obtained by solidifying or gelling a fluid containing abrasive grains. 3. The polishing apparatus according to claim 1, wherein the relative movement is performed by applying mechanical vibration between the abrasive and the workpiece. 4. The abrasive is a magnetic fluid capable of controlling the arrangement of abrasive grains by a magnetic field, and is solidified or gelled in a state where a magnetic field is applied, and the relative movement is performed by applying an alternating magnetic field. The polishing apparatus according to claim 2, wherein the polishing apparatus is used. 5. The abrasive material solidifies or gels a fluid containing abrasive grains charged with a positive or negative charge while applying an electric field, and the relative movement is performed by applying an alternating electric field. The polishing apparatus according to claim 2. 6. The polishing apparatus according to claim 3, wherein said relative movement is performed in a one-dimensional, two-dimensional or three-dimensional direction. 7. The polishing apparatus according to claim 6, wherein the relative movement in each of the one-dimensional, two-dimensional, and three-dimensional directions is performed in time series for each dimension. 8. The polishing apparatus according to claim 6, wherein the relative movement in each of the one-dimensional, two-dimensional, and three-dimensional directions is performed simultaneously in a plurality of directions. 9. A driving means for causing relative movement between an abrasive formed in accordance with the shape of the processing surface of the workpiece and the workpiece, and the abrasive produced by the relative movement And a pressure detecting means for detecting a pressure value between the workpieces, and a control means for controlling a stroke width of the relative movement according to the pressure value detected by the pressure detecting means. 10. The apparatus according to claim 9, wherein a predetermined value of said pressure is inputted to said control means, and said control means is configured to cause said relative movement so that said pressure value becomes said predetermined value. The polishing apparatus according to the above.