KR200295936Y1 - Heatsink in Notebook computer - Google Patents

Abstract

The present invention is a notebook computer consisting of a main body on which the keyboard unit 50 is mounted and an upper cover 60 on which an LCD, which is a display display unit, is mounted, and the CPU 30 is usually disposed on the same substrate 20 as other components. The VGA chip 31 is structured such that the upper end of each chip is directly in contact with the main body case 10 of the notebook computer on the back of the board 20 on which the other components are mounted. It is designed to solve the problems such as frequent failure of the notebook computer due to the heat generation of the chip by releasing it quickly and efficiently through the main body case 10 which is directly exposed to the atmosphere.

Description

Heat dissipation structure of notebook computer {Heatsink in Notebook computer}

The present invention relates to a heat dissipation structure of a notebook computer. More specifically, the CPU and VGA chips, which are mounted on the same board surface as other components in the main body of the notebook computer, are mounted on the back of the board so that the notebook computer operates on each chip. It is to release the high heat generated into the atmosphere quickly and efficiently.

In the heat dissipation structure of the conventional notebook computers, the CPU and the VGA chip, which are high heat generating elements, are mounted on the same board surface as other components, and a heat sink metal element is attached to the CPU to release heat generated from the CPU into the notebook computer. Either allow the heat to be released to the outside or attach a heat sink metal rod to the top of the CPU to move the heat generated from the CPU to a location where it can be easily discharged. There is an example of attempting heat dissipation through the hinge of the main body case and the hinge of the upper cover coupled to it without discharging it to a medium or using a cooling fan.

Attaching a heat sink metal element to the top of the CPU can be used in low performance notebook computers, but it is difficult to apply to a notebook using a high performance CPU that generates a large amount of heat. Due to the structure of the notebook computer where the parts are densely assembled, a long and long metal rod is used, so the heat transfer path becomes longer, and if it is just released into the air, the heat dissipation efficiency is lowered. The heat dissipation efficiency is rather good, but there are other problems such as noise of the cooling fan and power consumption due to the cooling fan.

In addition, the method of dissipating the heat generated by the CPU induced by the heat sink metal rod through the hinge of the main body case and the upper cover can be easily moved to the main body case if the heat generated from the CPU is made as large as the heat sink metal rod. Once the hinge is reached, the heat transfer is very small.

Because the hinge is designed to move in its structure, the contact area is very small.

As described above, if only the heat sink metal element or only the heat sink metal rod is used among the heat dissipation methods of the conventional notebook computer, the heat dissipation is not easy because the size of the notebook computer is limited. When the metal rod and cooling fan are used together, the heat dissipation efficiency is somewhat increased, but the secondary problem of cooling fan noise and power consumption occurs. The conventional methods, however, do not solve the problems of notebook computer failure, error, and shortened life due to heat generation of CPU and VGA chips. Therefore, the present invention solves all the problems caused by the heat generation of the conventional notebook computer by mounting the CPU, VGA chip mounted on the same board surface as other components of the notebook computer.

1 is a partially cut away side view of a conventional notebook computer.

Figure 2 is a partial cutaway side view of the present invention notebook computer.

* Explanation of symbols for the main parts of the drawings.

10: body case 20: substrate

30: CPU 31: VGA chip

40: Metal rod for heat sink 50: Keyboard part

60: upper cover

The structure and operation of this draft based on the drawings are as follows.

In a notebook computer composed of a keyboard unit 50, a main body case 10, and an upper cover 60 equipped with an LCD (not shown) of a display display unit, components are placed on a substrate 20 in the main body case 10. The CPU 30 and the VGA chip 31 are mounted on the rear surface of the substrate 20 so that the upper end thereof is in direct contact with the main body case 10.

Reference numeral 40 is a metal rod for heat sinking.

Referring to the operation of the notebook computer as described above are as follows.

When power is supplied to the notebook computer, high heat is generated in the CPU 30 mounted on the back of the substrate 20, and the heat is directly transmitted to the main body case 10 in which the upper end of the CPU 30 is in contact. The heat transferred to the main body case 10 is made of a material having a good thermal conductivity of the main body case 10, and the main body case 10 is directly exposed to the air to quickly release heat transferred to the outside. In this case, the heat transfer path is directly discharged from the CPU 30 to the main body case 10 and into the air. There is almost no heat transfer loss, and the heat sink metal element used in a conventional notebook computer has a small area. The heat dissipation element of the notebook computer can be treated more efficiently by using the main body case 10 having a much larger area than the heat sink metal bar 40 for the heat sink having low heat transfer efficiency.

Heat generated from the VGA chip 31, which is another heating component, is also released into the air through the same path, thereby solving the heat generation problem of the notebook computer.

On the other hand, although not shown, if the motherboard control chip, which is another heating component, also needs to be configured such that the upper end is in direct contact with the main body case 10, such as the CPU 30 or VGA chip 31 can solve the heat problem. .

Excessive force is applied when the computer is assembled between the main body case 10, the CPU 30, and the VGA chip 31 to prevent the chips from being broken, and the size of each chip is different so that the chips and the main body case 10 do not come into contact with each other. In order to compensate for this, metal pieces (not shown) having good heat transfer efficiency may be inserted.

In addition, the lower end of the main body case 10 may be provided with a protrusion or a projection to increase the heat dissipation efficiency.

As described above, the present invention is configured to directly contact high-temperature generating parts such as the CPU 30 and the VGA chip 31 directly with the main body case 10, thereby quickly and effectively dissipating the heat generated from the chips, thereby reducing the heat-sink element of low efficiency. By not using separate parts such as heat sink metal rod or cooling fan, it is possible to effectively reduce the problems caused by notebook computer's heat generation while saving cost, and consequently, heat sink metal element, metal rod (40) or cooling fan. This space can be saved, and the beneficial effect of freeing the layout design of the components of the notebook computer can be obtained. In addition, the reduction of notebook computer failure or error caused by heat problem can improve the reliability of the product.

Claims (1)

In a notebook computer composed of a keyboard unit 50, a main body case 10, and an upper cover 60 equipped with an LCD (not shown) of a display display unit, components are placed on a substrate 20 in the main body case 10. The heat dissipation structure of the notebook computer mounted on the back of the board 20 so that the CPU 30 and the VGA chip 31 is in direct contact with the main body case 10.