KR200247107Y1 - Cooling system for cpu - Google Patents
Cooling system for cpu Download PDFInfo
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- KR200247107Y1 KR200247107Y1 KR2019990003291U KR19990003291U KR200247107Y1 KR 200247107 Y1 KR200247107 Y1 KR 200247107Y1 KR 2019990003291 U KR2019990003291 U KR 2019990003291U KR 19990003291 U KR19990003291 U KR 19990003291U KR 200247107 Y1 KR200247107 Y1 KR 200247107Y1
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Abstract
본 고안은 CPU 냉각구조에 관한 것으로, 방열판(4)의 방열돌기(5) 사이의 분할홈(6)에 위치되어 고정클립(7)의 좌우 유동을 방지하도록 고정클립(7)의 연결편(10) 일측에 지지돌기(11)가 돌출형성되고, 방열을 극대화시키도록 상기 방열판(4)의 높이가 가로 길이 또는 세로 길이의 1/2에 해당하는 높이를 갖도록 형성된 CPU 냉각구조를 구비하였다.The present invention relates to a CPU cooling structure, which is located in the split groove 6 between the heat dissipation protrusions 5 of the heat sink 4, the connecting piece 10 of the fixed clip 7 to prevent the left and right flow of the fixed clip 7 Support protrusions 11 are formed on one side thereof, and the heat dissipation plate 4 has a CPU cooling structure formed such that the height of the heat sink 4 has a height corresponding to one half of a horizontal length or a vertical length to maximize heat dissipation.
그러므로, 방열판(4)의 높이가 종래에 비해 두 배 이상 증가되어 방열면적이 극대화되므로 CPU(3)가 확실하게 냉각되고, 고정클립(7)의 지지돌기(11)가 방열판(4)의 방열돌기(5) 사이에 지지되므로 고정클립(7)이 방열판(4)에 결합된 상태에서 좌우로 유동되지 않기 때문에 방열판(4)과 CPU(3)를 더욱 확실하게 밀착지지시킬 수 있어 열전도율을 향상시킬 수 있도록 하였다.Therefore, since the height of the heat sink 4 is increased more than twice as compared to the prior art, the heat dissipation area is maximized, so that the CPU 3 is surely cooled, and the support protrusion 11 of the fixing clip 7 radiates heat of the heat sink 4. Since it is supported between the projections 5, the fixing clip 7 does not flow from side to side in a state where it is coupled to the heat sink 4, so that the heat sink 4 and the CPU 3 can be held in close contact with each other, thereby improving thermal conductivity. To make it work.
Description
본 고안은 CPU 냉각구조에 관한 것으로, 특히 고정클립이 좌우로 이동되지 않고 CPU의 냉각이 확실한 CPU 냉각구조에 관한 것이다.The present invention relates to a CPU cooling structure, and more particularly, to a CPU cooling structure in which the cooling of the CPU is sure without moving the fixed clip from side to side.
CPU의 방열조건 중 가장 중요한 점은 방열 면적이 넓어야 하며, 방열판과CPU가 확실하게 밀착지지되어야 한다.The most important thing among the heat dissipation conditions of the CPU is that the heat dissipation area should be large, and the heat sink and the CPU must be tightly supported.
그런데 종래 CPU 냉각구조를 보면 방열판의 두께가 비교적 작아서 방열면적이 그다지 크지 않으므로 방열 효과가 저하되었고, 특히 고정클립이 방열판의 방열돌기 사이에서 좌우로 유동되므로 방열판과 CPU가 확실하게 밀착지지되지 못하여 CPU의 열이 방열판에 확실하게 전달되지 못하였다.However, in the conventional CPU cooling structure, the heat sink is relatively small and the heat dissipation area is not so large that the heat dissipation effect is lowered. The heat of was not transmitted to the heat sink reliably.
상술한 문제를 해결하기 위한 본 고안의 목적은, 방열판의 높이가 커서 방열면적이 극대화되고, 고정클립이 방열판의 방열돌기 사이에 지지되어 좌우로 유동되지 않도록 한 CPU 냉각구조를 제공하는데 있다.An object of the present invention for solving the above problems is to provide a CPU cooling structure in which the height of the heat sink is maximized, the heat dissipation area is maximized, and the fixed clip is supported between the heat dissipation protrusions of the heat sink to prevent flow from side to side.
이와 같은 목적을 달성하기 위한 본 고안 CPU 냉각구조는, CPU와 방열판이 고정클립으로 결합지지되고 방열판 상에 냉각팬이 결합되어 구비된 CPU 냉각구조에 있어서, 방열판의 방열돌기 사이의 분할홈에 위치되어 고정클립의 좌우 유동을 방지하도록 고정클립의 연결편 일측에 지지돌기가 돌출형성되고, 방열을 극대화시키도록 방열판의 높이가 가로 길이 또는 세로 길이의 1/2에 해당하는 높이를 갖도록 형성된 것을 특징으로 한다.The CPU cooling structure of the present invention for achieving the above object is located in the divided groove between the heat dissipation projections of the heat sink in the CPU cooling structure, the CPU and the heat sink are supported by a fixed clip and the cooling fan is coupled to the heat sink. And a support protrusion is formed on one side of the connecting piece of the fixed clip to prevent the left and right flow of the fixed clip, and the height of the heat sink is formed to have a height corresponding to 1/2 of the horizontal length or the vertical length to maximize heat dissipation. do.
따라서 방열판의 높이가 종래에 비해 두 배 이상 증가되어 방열면적이 극대화되므로 CPU가 확실하게 냉각되고, 고정클립의 지지돌기가 방열판의 방열돌기 사이에 지지되므로 고정클립이 방열판에 결합된 상태에서 좌우로 유동되지 않기 때문에 방열판과 CPU를 더욱 확실하게 밀착지지시킬 수 있어 열전도율을 향상시킬 수 있는 등의 효과가 있다.Therefore, since the height of the heat sink is more than doubled compared to the conventional, the heat dissipation area is maximized, so that the CPU is reliably cooled, and the support protrusion of the fixed clip is supported between the heat sinks of the heat sink, so that the fixed clip is connected to the heat sink from side to side. Since it does not flow, the heat sink and the CPU can be held in close contact with each other, thereby improving the thermal conductivity.
도1은 본 고안 CPU 냉각구조를 보이는 분해 사시도1 is an exploded perspective view showing the CPU cooling structure of the present invention
도2는 도1의 결합 측면도Figure 2 is a side view of the combination of Figure 1
*도면의 주요 부분에 대한 부호의 설명** Description of the symbols for the main parts of the drawings *
1 ; 회로기판 2 ; 걸림돌기One ; Circuit board 2; Jamming
3 ; CPU 4 ; 방열판3; CPU 4; Heatsink
5 ; 방열돌기 6 ; 분할홈5; Heat dissipation projection 6; Split groove
7 ; 고정클립 8 ; 파지부7; Fixed clip 8; Grip
9 ; 관통구멍 10 ; 연결편9; Through hole 10; Connection
11 ; 지지돌기 12 ; 냉각팬11; Support protrusion 12; Cooling fan
13 ; 볼트 14 ; 플러그13; Bolt 14; plug
본 고안의 특징 및 이점은 첨부된 도면을 참조한 이하의 설명으로 더욱 명확해 질 것이다.The features and advantages of the present invention will become more apparent from the following description with reference to the accompanying drawings.
도1 또는 도2에서, 회로기판(1) 상의 CPU(3)에는 본 고안 CPU 냉각구조가 설치되는바, 이는 CPU(3) 상에 방열판(4)이 구비되고 이에 고정클립(7)이 결합되어 CPU(3)와 방열판(4)을 밀착지지시키며, 방열판(4) 상에 냉각팬(12)이 결합된다.1 or 2, the CPU 3 on the circuit board 1 is provided with a CPU cooling structure of the present invention, which is provided with a heat sink (4) on the CPU (3) coupled to the fixing clip (7) Thus, the CPU 3 and the heat sink 4 are closely attached to each other, and the cooling fan 12 is coupled to the heat sink 4.
먼저, 방열판(4)은 다수의 방열돌기(5)가 배열구비되어 있어 이들 사이에 분할홈(6)이 형성되어 있으며, 이 방열판(4)은 본 고안의 특징에 따라 그 두께가 종래의 방열판에 비해 2배 정도 두껍게 형성되어 있다.그리고 양측의 방열돌기(5')의 높이에 비해 내측의 방열돌기(5)의 높이가 약간 작게 형성되어 열을 팬쿨러(fan cooler)로 효과적으로 전달할 수 있도록 되어 있다.First, the heat dissipation plate 4 has a plurality of heat dissipation protrusions 5 are arranged in the arrangement groove 6 is formed therebetween, the heat dissipation plate 4 has a thickness of the conventional heat sink according to the characteristics of the present invention The heat dissipation protrusion 5 is slightly smaller than the heat dissipation protrusions 5 'on both sides, so that the heat can be efficiently transferred to the fan cooler. It is.
따라서 방열 면적은 종래에 비해 4배 정도 더 증가하므로 CPU(3)의 냉각이 더욱 확실해 진다.Therefore, the heat dissipation area is increased by four times as compared with the conventional one, so that the cooling of the CPU 3 is more sure.
한편 고정클립(7)은 양측의 파지부(8)가 구비되고 파지부(8) 하측으로 관통구멍(9)이 형성되어 CPU(3) 양측의 걸림돌기(2)에 결합고정되며, 파지부(8) 사이에는 연결편(10)이 구비되어 있으며, 이 연결편(10) 일측에는 본 고안의 특징에 따라 지지돌기(11)가 돌출형성되어 있다.On the other hand, the fixing clip 7 is provided with holding parts 8 on both sides, and a through hole 9 is formed below the holding part 8 to be fixed to the locking projections 2 on both sides of the CPU 3. A connection piece 10 is provided between the eight pieces, and one side of the connection piece 10 has a supporting protrusion 11 protruding in accordance with a feature of the present invention.
그리고 방열판(4) 상에 냉각팬(12)이 구비되어 볼트(13)로 결합되어 있고, 냉각팬(12)에는 플러그(14)가 연결되어 전원에 접속되도록 되어 있다.The cooling fan 12 is provided on the heat sink 4 and is coupled to the bolt 13, and the plug 14 is connected to the cooling fan 12 so as to be connected to a power source.
이러한 구성의 본 고안 CPU 냉각구조는 CPU(3)의 용량 초과 및 사용 시간이 길어 짐에 따라 CPU(3)에서는 과열이 발생되어 PC가 제대로 동작되지 않게 된다.The CPU cooling structure of the present invention has such a configuration that overheating occurs in the CPU 3 as the capacity of the CPU 3 exceeds and the usage time becomes long, thereby preventing the PC from operating properly.
따라서 CPU(3)에 발생되는 고열을 충분히 전달받아서 방열시킬 구조가 필요하다.Therefore, there is a need for a structure in which high heat generated in the CPU 3 is sufficiently received and dissipated.
종래의 방열판(4)은 그 두께가 비교적 얇기 때문에 CPU(3)에서 고열이 발생될시 그 열을 충분히 전달받지 못하였는데, 본 고안 방열판(4)은 종래의 방열판에 비해 그 두께가 두배 정도 더 크기 때문에 방열 면적도 극대화되므로 CPU(3)에서 발생되는 열을 충분히 전달받아 방출시킬 수 있게 된다.Since the heat sink 4 is relatively thin in thickness, the heat is not sufficiently transmitted when high heat is generated in the CPU 3. The heat sink 4 of the present invention is twice as thick as the heat sink 4. Because of its size, the heat dissipation area is also maximized, so that heat generated from the CPU 3 can be sufficiently received and released.
한편 고정클립(7)의 연결편(10)을 방열판(4)의 방열돌기(5) 사이에 끼우면 연결편(10)의 지지돌기(11)가 방열돌기(5) 사이의 분할홈(6)에 위치된다.Meanwhile, when the connecting piece 10 of the fixing clip 7 is sandwiched between the heat radiating protrusions 5 of the heat sink 4, the supporting protrusion 11 of the connecting piece 10 is located in the split groove 6 between the heat radiating protrusions 5. do.
따라서 고정클립(7)은 전후로 움직이지 못할 뿐 아니라 지지돌기(11)에 의해 좌우로도 유동되지 않는다.Therefore, the fixed clip 7 does not move back and forth, but also does not flow from side to side by the support protrusion (11).
그러므로 고정클립(7)이 CPU(3)와 방열판(4) 사이에 결합된 상태에서 유동되지 않으므로 방열판(4)과 CPU(3)를 더욱 확실하게 밀착지지시키게 되므로 CPU(3)에서 발생되는 열이 방열판(4)에 확실하게 전달되므로 CPU(3)의 냉각을 촉진시키게 된다.Therefore, since the fixing clip 7 does not flow in a state in which it is coupled between the CPU 3 and the heat sink 4, the heat generated by the CPU 3 is more firmly supported by the heat sink 4 and the CPU 3. Since it is transmitted to this heat sink 4 reliably, the CPU 3 is accelerated.
이상에서와 같은 본 고안에 따른 CPU 냉각구조에 의하면, 방열판(4)의 높이가 종래에 비해 두 배 이상 증가되어 방열면적이 극대화되므로 CPU(3)가 확실하게 냉각되고, 고정클립(7)의 지지돌기(11)가 방열판(4)의 방열돌기(5) 사이에 지지되므로 고정클립(7)이 방열판(4)에 결합된 상태에서 좌우로 유동되지 않기 때문에 방열판(4)과 CPU(3)를 더욱 확실하게 밀착지지시킬 수 있어 열전도율을 향상시킬 수 있는 등의 효과가 있다.According to the CPU cooling structure according to the present invention as described above, since the height of the heat sink 4 is increased more than twice as compared to the prior art, the heat dissipation area is maximized, the CPU 3 is surely cooled, and the fixing clip 7 Since the support protrusion 11 is supported between the heat dissipation protrusions 5 of the heat dissipation plate 4, the heat sink 4 and the CPU 3 because the fixing clip 7 does not flow from side to side in a state where the fixing clip 7 is coupled to the heat dissipation plate 4. There is an effect such that it can be supported more securely to improve the thermal conductivity.
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019990003291U KR200247107Y1 (en) | 1999-03-03 | 1999-03-03 | Cooling system for cpu |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019990003291U KR200247107Y1 (en) | 1999-03-03 | 1999-03-03 | Cooling system for cpu |
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| Publication Number | Publication Date |
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| KR19990034712U KR19990034712U (en) | 1999-09-06 |
| KR200247107Y1 true KR200247107Y1 (en) | 2001-09-29 |
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| KR2019990003291U KR200247107Y1 (en) | 1999-03-03 | 1999-03-03 | Cooling system for cpu |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7023694B2 (en) | 2003-06-04 | 2006-04-04 | Samsung Electronics Co., Ltd. | Computer |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20010066771A (en) * | 1999-12-06 | 2001-07-11 | 이형도 | Cooling apparatus for electron-parts |
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1999
- 1999-03-03 KR KR2019990003291U patent/KR200247107Y1/en not_active IP Right Cessation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7023694B2 (en) | 2003-06-04 | 2006-04-04 | Samsung Electronics Co., Ltd. | Computer |
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| KR19990034712U (en) | 1999-09-06 |
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