KR200294602Y1 - A forming apparatus for transistor lead-wire - Google Patents

Abstract

The present invention relates to a forming apparatus of a lead wire, such as a transistor, and more particularly, comprising a forming unit for applying a force to the lead wire laterally by interlocking with the push rod forward and the lateral movement in conjunction with the push rod. Means to prevent plating film damage of lead wire and to prevent the occurrence of deformation that lead wire extends forward, improve the quality characteristics of products and improve the assembly, significantly reducing manpower and time The present invention relates to a transistor lead wire forming apparatus that reduces the cost of a product using the same.

The present invention is formed by a reciprocating reciprocating by a separate cam, a fixed side fixed to the reciprocating member and the fixed side and the spring is connected to the front end side formed with a guide groove for guiding the forming of the lead wire A guide section; Forming means for fixing one side to the upper portion of the forming guide portion to open the lead wire of the transistor; The upper side of the forming means, the fixed side fixed to the fixed side of the forming guide portion, the other end is fixed to the front end side of the forming guide portion, is supported by a spring provided therein for pressing and supporting the head of the transistor Transistor lead wire forming apparatus comprising a head support pin is installed, the upper support portion having an upper support piece formed with a guide groove for holding the upper end portion of the lead wire below the head support pin; To

The forming means may include a push rod having one side fixed to the fixed side of the forming guide part;

Characterized in that it comprises a; forming a force for applying a force to the lead wire in the lateral direction by the angular movement to the left and right about the hinge point by the advance of the push rod;

The push rod is composed of a fixed part fixed to the fixed side of the forming guide portion, a tip portion formed in a narrow step and provided with a long hole in the fixed portion and formed a symmetrical symmetry of the inclined surface, the forming part is the tip end of the push rod The two sides are hinged and fixed at a predetermined distance from the step, and the inner surface of the tip portion is formed with a comb surface corresponding to the bevel surface of the tip portion of the push rod at a predetermined distance from the tip of the push rod, and the lead wire is pushed sideways at the tip. Protruding piece is provided for

It is characterized in that the return spring is provided on the outer side of the foamer provided for the return of the foamer.

Description

Transistor Leadwire Forming Equipment {A FORMING APPARATUS FOR TRANSISTOR LEAD-WIRE}

The present invention relates to a forming apparatus of a lead wire, such as a transistor, and more particularly, comprising a forming unit for applying a force to the lead wire laterally by interlocking with the push rod forward and the lateral movement in conjunction with the push rod. By preventing the plating film damage of the lead wire by the means and by eliminating the cause of the deformation of the lead wire to extend forward, it improves the quality characteristics of the product and improves the assembly properties, thereby drastically reducing the manpower and time The present invention relates to a transistor lead wire forming apparatus for reducing the cost of a product to be used.

In general, a transistor for amplifying a current is provided with three lines of lead wires having different roles depending on the type in order to attach current to the substrate to the head, and the three lines of wires are to be attached to the substrate. Connected to the hole of the assembly.

1 shows a type of transistor, in which a is a state before forming of the lead wire and b is a state after forming.

Since the substrate has connection holes for connecting lead wires such as transistors to be arranged in a checkerboard shape, the lead wires of the transistors must be formed so as to correspond to an interval and a direction corresponding to the arrangement of the connection holes formed in the substrate. As described above, the three lead wires are followed by a lead wire forming process for spreading lead wires on both sides about a middle lead wire at predetermined intervals.

The prior art transistor lead wire forming apparatus for a lead wire forming process of a transistor is configured to push the lead support of the transistor supported on the supply support and the lead wire of the transistor supported by the supply support to the inclined plane.

Figure 2 is a perspective view showing the configuration of the transistor leadwire forming apparatus 100 of the prior art, Figure 3 is a partially omitted longitudinal cross-sectional view of Figure 2, Figure 4 is a cross-sectional view taken along line AA of Figure 3, Figure 5 is a part of Figure 2 Top view of foamer.

As shown in Figs. 2 to 5, the transistor leadwire forming apparatus 100 of the prior art has a separate cam 2 in order to spread the tip of the leadwire 5b of the transistor 5 at predetermined intervals. It is connected to the reciprocator 110, and the fixed side 121 and the fixed side (121) and the spring 123 fixed to the reciprocator 110, to guide the forming of the lead wire at the tip Forming guide portion 120 composed of the front end side 122 is formed with a guide groove 124,

On the upper portion of the forming guide portion 120, one side is fixed to the fixed side 121, the other side is a forming member 130 is fixed to the front end side 122 in the long hole 131,

The fixed side 141 fixed to the fixed side 121 of the forming guide part and the other end side 142 fixed to the tip side 122 of the forming guide part on the upper side of the forming member 130. The head support pin 144 supported by the inner spring 143 is installed, the upper portion formed with a guide groove 145 for holding the upper end of the lead wire (5b) below the head support pin 144 A forming bundle having an upper support portion 140 provided with a support piece 147 is supported by the body 150.

In the order in which the tip protrudes from the forming bundle toward the transistor 5, the head support pin 144 protrudes the most, followed by the upper support piece 147, and then the forming member 130 and the forming guide. The portion 120 protrudes to the same length.

Looking at the operation of the prior art of such a configuration,

When it is supported by the supply support (2) for aligning and supplying the transistor (5), the whole forming bunch is advanced toward the transistor (5) while the reciprocator (110) is advanced by a separate cam (3),

Firstly, the head support pin 144 is brought into contact with the head 5a of the transistor and is elastically pressed by the spring 143. Secondly, the upper support piece 147 is connected to the upper end of the lead wire 5b. In the third direction, the front end side 122 of the forming unit 130 and the forming guide portion 120 is advanced at the same time.

At this time, the forming guide part tip side 122 and the upper support part tip side 142 fixed to the reciprocator 110 by the spring 123 are the transistor 5 and the supply support part 2 on which the transistor is supported. Advancement of the reciprocator 110 is continued in the state of being in close contact with each other and no further advancement is continued accordingly.

In particular, as shown in FIG. 5, the forming member 130 is formed in a slanted surface so that the outer side becomes gradually wider when viewed from a plane, thereby pushing forward the lead wire 5b and opening the lead wire 5b. And the reciprocator 110 is retracted by the cam 3, and at the same time, the front end side of the forming bundle is also returned, and the supply support 2 supporting the transistor 5 is rotated by a predetermined angle for the next operation and the forming process is performed. The finished transistor 5 is aligned and glued to a separate tape for packaging.

Since the lead wire 5b of the prior art transistor lead wire forming apparatus 100 is pushed to the side by the force and the inclined surface pushing forward of the former 130, that is, in the forward direction and the lateral direction At the same time, due to the force applied, the plating film of the lead wire is damaged due to friction with the foamer generated during the forming process, resulting in peeling, which leads to oxidation and weakening of the lead wire, resulting in poor quality products. ,

Although the lead wires should be opened only in the lateral direction, the lead wires 5b of the transistor 5 removed from the device are pushed and extended forward and simultaneously in the lateral direction, as shown in the enlarged plan view in FIG. 6. There was a problem that deformation occurs.

As such, the lead wire 5b is pushed forward along with the left and right directions, so that the connection position is not matched with the connection holes of the board in which the vertical columns are arranged in a straight line in a checkerboard shape. There is a problem in that the assembly workability is significantly lowered and the cost of the product using the same is increased.

The present invention has been devised to solve the above problems,

An object of the present invention is to form a predetermined distance between the lead wires of the transistor, the lateral movement in the lateral direction in conjunction with the push rod forward and the push rod to form a force applied to the lead wire in the lateral direction only By providing a forming means including a forming machine to achieve this,

It prevents the damage of the plating film of the lead wire and also eliminates the cause of deformation which leads the lead wire to the front, thereby improving the product's quality characteristics and drastically improving the assemblability, thus reducing manpower and time. It is to provide a transistor lead wire forming apparatus that can reduce the cost.

1 is a configuration diagram of a type of transistor,

a or before leadwire forming

b is the state after lead wire forming

Figure 2 is a perspective view showing the configuration of the prior art

3 is a partially omitted longitudinal cross-sectional view of FIG.

4 is a cross-sectional view taken along the line A-A of FIG.

5 is a plan view of the former of FIG.

6 is an enlarged plan view of a transistor formed by the prior art;

7 is a cross-sectional view showing the configuration of an embodiment according to the present invention

8 is a cross-sectional view taken along the line B-B of FIG.

9 is an operating state diagram of FIG.

* Explanation of symbols for the main parts of the drawings

1: transistor leadwire forming device of the present invention

2: feed support 3: cam

5: transistor 5a: head

5b: leadwire 10: shuttle

20: forming guide portion 21: fixed side

22: tip side 23: spring

24: guide groove 30: forming means

31: pusher 31a: fixed part

31b: tip 31c: step

31d: The Greater 32: Former

33: return spring 33a: ball

40: upper support part 41: fixed side

42: tip side 43: spring

44: head support pin 45: guide groove

47: upper support piece 50: body

100: conventional transistor leadwire forming device

110: reciprocator 120: forming guide portion

121: fixed side 122: tip side

123: spring 124: guide groove

130: Former 131: Longsmith

140: upper support portion 141: fixed side

142: tip side 143: spring

144: head support pin 145: guide groove

147: upper support piece 150: body

Transistor lead wire forming apparatus according to the present invention for achieving the above object,

Forming guide part consisting of a reciprocating reciprocating by a separate cam, a fixed side fixed to the reciprocating member and a spring connected to the fixed side and a front end formed with a guide groove for guiding the forming of the lead wire at the front end; ; Forming means for fixing one side to the upper portion of the forming guide portion to open the lead wire of the transistor; The upper side of the forming means, the fixed side fixed to the fixed side of the forming guide portion, the other end is fixed to the front end side of the forming guide portion, is supported by a spring provided therein for pressing and supporting the head of the transistor The head support pin is installed, the upper support portion provided with a support piece formed with a guide groove for holding the upper end portion of the lead wire below the head support pin; In

The forming means,

A push rod having one side fixed to the fixed side of the forming guide unit;

It is characterized in that it comprises a; forming a force for applying a force to the lead wire in the lateral direction by the angular movement to the left and right about the hinge point by the advance of the push rod.

As an embodiment according to the present invention,

The forming means,

A push rod consisting of a fixed part fixed to the fixed side of the forming guide part, a tip part formed in a narrow step and provided with a long hole in the fixed part, and having a long side and a symmetrical inclination surface;

Opposite sides of the tip of the tip of the push rod is hinged and fixed at a predetermined distance, the inner surface of the tip portion is formed with a comb surface corresponding to the bevel of the tip of the tip of the push rod at a predetermined distance from the tip of the push rod and a lead wire at the tip A foamer having a protrusion for pushing sideways;

It characterized in that it comprises a return spring which is provided for the return of the foamer on the outside of the foamer.

As an embodiment according to the present invention,

The front end of the return spring is characterized in that the ball is provided for smoothing the connection with the forming.

Hereinafter, an embodiment of a transistor leadwire forming apparatus according to the present invention will be described in more detail with reference to the accompanying drawings.

7 is a cross-sectional view showing the configuration of an embodiment according to the present invention, Figure 8 is a cross-sectional view taken along the line B-B of Figure 7, Figure 9 is an operating state diagram of FIG.

As shown in FIGS. 7 to 9, the transistor leadwire forming apparatus 1 according to the present invention includes a reciprocator 10 reciprocated by a separate cam 3 and the reciprocator 10. Forming guide portion which is connected to the fixed side 21 and the fixed side 21 and the spring 23 is fixed to the end side formed with a guide groove 24 for guiding the forming of the lead wire 5b 20; Forming means (30) fixed at one side of the forming guide part (20) to open the lead wire (5b) of the transistor; The upper side of the forming means 30, the fixed side 41 is fixed to the fixed side 21 of the forming guide portion, the other end side 42 is fixed to the front end side 22 of the forming guide portion, A head support pin 44 for supporting the head 5a of the transistor 5 is supported by a spring 43 provided therein, and a lead wire 5b is provided below the head support pin 44. The forming support is formed by being supported on the body consisting of; the upper support portion 40 is provided with a support piece 47 formed with a guide groove 45 for holding the upper end of the

The forming means 30,

A push rod 31 having one side fixed to the fixed side 21 of the forming guide part,

By forming the angular movement to the left and right about the hinge (32a) point by the advance of the pusher 31 is to comprise a forming member 32 for applying a force to the lead wire (5b) in the lateral direction .

The push rod 31 of the forming means 30 according to the present invention has a fixing part 31a fixed to the fixing side 21 of the forming guide part, and a stepped portion 31c at the fixing part 31a. It is formed narrowly and is provided with a long hole (31d) and consists of a tip portion (31b) formed in the left and right symmetrical inclined plane in the shape of an arrowhead,

The forming member 32 is fixed to the hinge (32a) at a predetermined distance from the stepped portion 31c to face both ends of the tip portion 31b of the push rod 31, the inner surface of the tip portion (32b) is the push rod (31) It is formed with a comb surface corresponding to the comb surface of the tip portion 31b of the push rod at a predetermined distance from the tip of the tip and is provided with a protruding piece 32c for pushing the lead wire to the side,

The outer side of the former 32 is configured to include a return spring 33 is provided for the return of the former 32.

The front end of the return spring 33 is preferably provided with a ball 33a for smoothing the connection with the forming member (32).

It looks at the operating state of the transistor lead wire forming apparatus 1 according to the present invention having such a configuration.

As the reciprocator 10 is advanced by the separate cam 3, the whole forming bundle is advanced toward the transistor 5, and the head support pin 44 is first brought into contact with the head 5a of the transistor. 43) by pressing elastically, and the support piece 47 of the upper support second to hold the upper end of the lead wire (5b), and thirdly the forming means 30 and the forming guide portion 20 The front end side 22 and the upper support side tip side 42 of the forming guide part 22 which are simultaneously advanced to the reciprocator 10 and consequently fixed to the reciprocator 10 are the transistors 5 and the transistors. Advancing of the reciprocator 10 is continued in a state in which it is in close contact with the supplied support support 2 and is no longer advanced, and accordingly, the forwarding of the forming means 30 is also continued.

Up to now, the operation process of the prior art is the same, and the characteristic operation of the present invention starts from now on.

When the push rod 31 of the forming means 30 is advanced through the long hole 31d, the arrowhead-shaped tip portion 31b is pushed forward by pushing the internal inclined surface of the forming machine 32 sideways, The forming member 32 pushed by the tip portion 31b is angularly moved laterally about the hinge 32a point.

That is, the push rod 31 is moved forward, but the forming member 32 linked to the push rod 31 is lateral movement in the lateral direction, so that only the lateral force is applied to the lead wire 5b.

Accordingly, the protruding piece 32c formed at the tip of the forming member 32 applies a force in the lateral direction of the lead wire 5b to form.

When the forming of the lead wire is completed, the pusher 31 is retracted by a separate cam 3 and at the same time, the forming member 32 is also returned by the return spring 33 to return to the original position together with the whole forming bundle. do.

The present invention does not damage the plating film of the lead wire 5b because the force is applied to the lead wires immediately in the lateral direction during the forming process, and even after the transistor 5 is removed from the forming apparatus, there is a problem in the prior art. The plastic deformation which leads the lead wire 5b to the front side does not occur.

In the present invention, the lead wire is pushed to the side by a force applied to the front side, so that the force applied to the lead wire in the forward direction and the lateral direction is simultaneously applied. Because it only works in the direction.

In this way, the forming process is completed, the transistor 5 is followed by a taping process of sorting and packaging using a separate adhesive tape.

As described above, the transistor lead wire forming apparatus 1 according to the present invention, in forming a predetermined interval between the lead wires of the transistor 5, to the push rod 31 and the push rod 31 to move forward By providing a forming means including a forming member 32 to form a lateral movement in the lateral direction in conjunction with the force applied to the lead wire only by lateral movement,

This product prevents damage to the coating film of the lead wire and eliminates the cause of deformation which leads to the extension of the lead wire, and improves the quality characteristics of the product and significantly improves the assembly ability, thereby reducing manpower and time. To reduce the cost of

In the above embodiment, the present invention has been described in the case where the present invention is applied to the lead wire of the transistor, but it will be apparent that the present invention can be similarly applied to any case in the field applicable to the forming of the lead wire as well as the transistor.

The present invention is not limited to the above-described embodiments and drawings because various substitutions, modifications, and changes are possible to those skilled in the art without departing from the technical spirit of the present invention. .

As described in detail above, the transistor leadwire forming apparatus according to the present invention,

In forming the gap between the lead wires of the transistor to have a predetermined interval, the former is pushed forward to form a lateral movement in conjunction with the push rod to form a lateral force by applying a force to the lead wire only in the lateral direction By having a forming means comprising:

It prevents the damage of the plating film of the lead wire and also eliminates the cause of deformation which leads the lead wire to the front, thereby improving the product's quality characteristics and drastically improving the assemblability, thus reducing manpower and time. It is a technology that has the advantage of reducing costs.

Claims (3)

Forming guide part consisting of a reciprocating reciprocating by a separate cam, a fixed side fixed to the reciprocating member and a spring connected to the fixed side and a front end formed with a guide groove for guiding the forming of the lead wire at the front end; ; Forming means for fixing one side to the upper portion of the forming guide portion to open the lead wire of the transistor; The upper side of the forming means, the fixed side fixed to the fixed side of the forming guide portion, the other end is fixed to the front end side of the forming guide portion, is supported by a spring provided therein for pressing and supporting the head of the transistor The head support pin is installed, the upper support portion provided with a support piece formed with a guide groove for holding the upper end portion of the lead wire below the head support pin; In The forming means, A push rod having one side fixed to the fixed side of the forming guide unit; And a forming machine for exerting a lateral force on the lead wire by angularly moving left and right about the hinge point by the advancement of the push rod. The method of claim 1, The forming means, A push rod consisting of a fixed part fixed to the fixed side of the forming guide part, a tip part formed in a narrow step and provided with a long hole in the fixed part, and having a long side and a symmetrical inclination surface; Opposite sides of the tip of the tip of the push rod is hinged and fixed at a predetermined distance, the inner surface of the tip portion is formed with a comb surface corresponding to the bevel of the tip of the tip of the push rod at a predetermined distance from the tip of the push rod and a lead wire at the tip A foamer having a protrusion for pushing sideways; And a return spring provided on the outside of the former to return the former. The method of claim 1, And a ball for softening the connection with the forming machine at the tip of the return spring.