KR200223111Y1 - Apparatus for automatically supplementing anode material of electroplating bath for circuit board - Google Patents

Abstract

The present invention is an automatic refilling device for the anode material of the electroplating bath, the electroplating bath has a circuit board and the anode basket, and the top of the electroplating tank has a reciprocating ceiling crane. There is an automatic refilling device next to the ceiling crane, and the automatic refilling device can move along the ceiling crane, so that when the ceiling crane stops at a fixed position, the written circuit board is removed from the electroplating bath or the circuit board is placed in the electroplating bath. The replenishment device can replenish the anode material in the anode basket. This eliminates the need to complete these tasks manually, which not only saves time and human costs, but also ensures the quality of electroplating and prevents industrial accidents from occurring.

Description

Automatic material replenishment device for circuit board electroplating tank {APPARATUS FOR AUTOMATICALLY SUPPLEMENTING ANODE MATERIAL OF ELECTROPLATING BATH FOR CIRCUIT BOARD}

The present invention is an automatic refilling device for anode material of electroplating bath, especially, it is possible to replenish anode material at any time during the electroplating process, so that it can replace the inconvenience and time-consuming manual replenishment method and prevent industrial accidents. It is about a structure.

The electroplating process for printing circuit boards is divided into primary copper plating and secondary copper plating. The primary copper plating plays a role in the connection hole plating and reinforcement of the original copper layer, and in addition to reinforcing the copper layer of the primary plating, the circuit is used during the etching process of the printed circuit board. It protects and prevents etching. Here, this protective layer is used for circuit protection by tin or tin graphite soldering.

Both primary copper plating and secondary copper plating or tin (tin graphite) plating are used to place printed circuit boards on the anodes of the electroplating baths. Plating material (i.e. anode material) is placed on the anodes of the electroplating baths. The positive electrode material is to be deposited on the positive electrode plated material (ie, a circuit board).

The structure of the electroplating bath for copper or tin plating on the printed circuit board is shown in FIG. Having a single electroplating tank 50, the fixed frame 52 is placed across each of the interlocking seat 51 in order to place the corresponding seating seat 51 on both tops of the electroplating bath 50. The stator 53 may be provided on the fixing frame 52 so that the circuit board 54 may be vertically immersed in the electrolytic solution of the electroplating bath 50. In addition, a plurality of positive electrode baskets 55 are placed in the electroplating bath 50, and the positive electrode material is placed in the positive electrode basket 55. The anode material may be copper kernel or tin kernel. When the copper plating process is performed, the anode material is copper kernel, and in the tin plating order, tin is the anode material. After electrification, the anode material is directly ionized and deposited on the circuit board 54. In addition, each side of the electroplating tank 50 has one trajectory 60, respectively, the ceiling crane 61 is placed between the two trajectory 60. The ceiling crane 61 reciprocates on the rail track 60 through the drive motor 62, and a standing mechanism 63 capable of moving up and down with a fixed frame 52 inside the ceiling crane 61. Install.

The electroplating principle is to allow the anode material to be ionized by electricity, and the anode material after the electricity is attached to the circuit board through the medium of the electrolyte. Therefore, since the anode material in the anode basket is continuously consumed during the process of electroplating, the electroplating should proceed smoothly by continuously replenishing the anode material in the anode basket.

In the past, all anode materials in the anode basket were supplemented regularly by manual work. At this time, the cell plating operation had to be stopped and the anode material had to be replenished manually in the electroplating bath, which resulted in the loss of production. This method wasted waste of manpower and time, and errors can easily occur during artificial manipulation. Although the small electroplating tank of FIG. 6, if the large electroplating tank used in the industry, the number of anode baskets of the electroplating tank will reach hundreds. It is not easy to add anode material to each anode basket one by one manually. This wastes manpower and time, and because the amount of anode basket is too large, the worker may miss it when the anode material is replenished, which may result in poor electroplating of the circuit board. In addition, the electrolytic solution in the electroplating tank should be 20% or more acidic liquid, which may cause some injury when directly in contact with the human body. However, in the past, when workers supplemented the anode material directly, everyone had to step on the separator plates on both sides of the anode basket and replenish the anode material. The electrolyte creates a lot of acid gas during electroplating, and it can be harmful to human health if the anode supplement worker accumulates excessive acid gas for a long time.

In light of this, the inventor made an automatic refilling device for the anode material of the circuit board electroplating system of the present invention, thereby automatically replenishing the anode material at all times during the electroplating operation to replace the manual replenishment method which was inconvenient and time-consuming in the past, resulting in industrial accidents. To provide a structure that can prevent the.

The main objectives of the present invention are as follows. In the past, it can replace the inconvenience and time-consuming manual anode material replenishment method and provide automatic anode material replenishment device of circuit board electroplating tank to prevent industrial accidents. The electroplating tanks have circuit boards and anode baskets, and the top of the electroplating tanks have reciprocating overhead cranes. An automatic replenishment device is placed next to the ceiling crane. The automatic replenishment can move along the ceiling crane, so that the ceiling crane stops at a fixed position and removes the circuit board from the electroplating bath or places the circuit board in the electroplating bath. During operation, the automatic replenishment device replenishes the anode material in the anode basket. This process does not have to be done manually, which not only saves manpower and time, but also ensures electroplating quality and prevents occupational injuries. Therefore, it is possible to achieve a design goal that replaces the passive anode material replenishment method which was inconvenient and time-consuming in the past.

1 is a front plan view of the present invention.

Figure 2 is a side plan view of the present invention.

3 is an overhead view of the present invention.

Figure 4 is a local cross-sectional view of the dropping device of the present invention.

Figure 5 is a local cross-sectional view and operation explanatory drawing of the fall device of the present invention.

6 is a front plan view of a conventional structure.

*** Explanation of symbols for the main parts of the drawing ***

(10) Plating Tank (11) Hanger

(12) Section (13) Anode Basket

(14) Fixing cover (141) Connecting hole

(142) Connector (20) Fast Track

(21) Ceiling crane (22) Drive motor

23. Stand structure 30 Automatic replacement device

(31) Mounting frame (32) Guide rail

(33) Sliding frame (34) Guide wheel (導 輪)

(35) Hopper (36) Supply Line

(37) Proximity switch (38) Sensor

39 stepping motor 391 main wheel

(392) subordinate wheels (393) belt

(40) Dropping device (41) Joint

(42) Moving Pieces (43) Supporters

(44) Drive Mechanism (45) Drilling

(50) Electroplating Tanks (51) Steps

(52) Fixed Frame (53) Stator

(54) Circuit Board (55) Anode Basket

(60) Rail Track (61) Ceiling Crane

(62) Drive Motor (63) Standing Mechanism

It will be described in detail with the accompanying drawings for a detailed understanding of the structure and features of the present invention and the emphasis of the main design thereof. The present invention is an automatic replenishment mechanism for anode material of a circuit board electroplating tank, the configuration of which is referred to Figures 1 and 2 and 3. At the top of each side of the electroplating tank 10, there are several sets of mating seats 11 corresponding to each other, and a fixed frame is placed between the mating seats 11 of each group. Supplied so that the circuit board can be submerged vertically in the electrolyte of the electroplating bath 10. Corresponding lower portions between the respective seating seats 11 in the electroplating tank 10 are sections 12 for laying circuit boards, and two rows of anode baskets 13 arranged side by side between each adjacent section 12. Release. Anode material can be placed in the anode basket 13, and one fixing cover 14 is mounted at the same time on the anode basket 13 arranged side by side. The top surface of the fixing cover 14 forms a funnel-shaped connection hole 141 corresponding to the anode basket 13 portion, and the lower portion of the connection hole 141 is connected to the connection pipe 14. In addition, each side of the electroplating tank 10 is provided with one rail track 20, respectively, between the two rail track 20, one overhead crane 21 spans. The ceiling crane is capable of reciprocating on the rail orbit 20 with a drive motor 22 mounted on one side thereof, and is equipped with a standing mechanism 23 capable of moving up and down a fixed frame inside the ceiling crane 21. do.

Automatic refilling device 30 is mounted on the side of the ceiling crane 21, one automatic refilling device 30 is mounted on one side of the ceiling crane 21, two sets of automatic at the same time on both sides of the ceiling crane 21 The supplementary device 30 may be mounted. The automatic replenishment device 30 is fixedly coupled to the ceiling crane 21 so that the mounting frame 31 is interposed between the rails 20 so that the mounting frame 31 can move along the ceiling crane 21. . A sliding frame 33 is placed on the mounting frame 31, and the guide wheel 34 is mounted on the slide frame 33 to move horizontally on the rail 32. Two hoppers 35 are mounted on the upper part of the guide wheel 34, and the hoppers 35 are connected to supply pipes 36 spiraling downward, respectively, as shown in FIGS. 4 and 5. Dropping device 40 is placed on the bottom portion of the sliding frame 33 on the supply pipe 36, the dropping device 40 is installed on the supply pipe 36, two joints 41 at appropriate intervals. In the arthropod 41, one moving piece 42 is passed horizontally, one end of the two moving pieces 42 are connected to each other by a support 43. The support 43 is connected to one drive mechanism 44, which may be a hydraulic mechanism or a pneumatic mechanism. In addition, the two moving pieces 42 intersect each other and install one perforation 45 at staggered positions.

In addition, the stepping motor 39 is fixedly mounted on one side of the mounting frame 31. A main wheel 391 is placed on the stepping motor 39, a subordinate wheel 392 is placed on one side of the mounting frame 31, and fixed to one side of the sliding frame 33 on one side of one belt 393. After the belt 393 winds up the slave wheel 392, the lower portion of the slide 33, and the main wheel 391, another side of the belt 393 is fixed to the other side of the sliding frame 33. As shown in FIG. In this way, the stepping motor 39 moves the sliding frame 33 via the belt 393 to reciprocate on the mounting frame 31. In addition, the proximity switches 37 are attached to positions near both sides on the mounting frame 31, respectively. The two sides of the slide 33 each have a sensor portion 38 so that when the sliding frame 33 is moved and the sensor portion 38 receives the reaction of the proximity switch 37, the proximity switch 37 is a stepping motor. By controlling 39 to drive in a massive direction, the sliding frame 33 can be returned to its original position in the opposite direction.

When all of the fixed frames are positioned with the ceiling cranes 21 sequentially placing the fixed frames on which the circuit boards are fitted, the first circuit boards fitted on the fixed frames to complete the electroplating. The ceiling crane then moves the fixed frame back to the electroplating tank 10 in turn. Thus, the ceiling crane 21 continues to reciprocate on the electroplating tank 10. Since the automatic refill device 30 moves its position along the ceiling crane 21, when the ceiling crane 21 stops at one position, the standing mechanism 23 takes the circuit board out of the electroplating tank 10 or the circuit board 21. When operating by placing the up and down of the electroplating tank 10, the automatic refilling device 20 can replenish the positive electrode material to the positive electrode basket 13 on its side. When the ceiling crane 23 moves again and stops at another position, and when the standing mechanism 23 moves up and down, the automatic refilling device 30 replenishes the positive electrode material to the remaining positive electrode basket 13 again. Done. Therefore, when the ceiling crane 21 continuously reciprocates on the electroplating tank 10, the automatic replenishment device 30 will replenish the positive electrode material in each positive electrode basket 13 in turn, the positive electrode material The silver is previously contained in the funnel 35 so that the anode material falls along the supply pipe 36.

The perforations 45 of the two moving pieces 42 of the dropping device 40 are designed to intersect with each other, so that the drive mechanism 44 moves the two moving pieces 42 to the upper left joint frame 41 of them. ) Will be left open. When the upper joint frame 41 is open, a suitable anode material in the supply pipe 36 falls between the lower joint frames 41 and is blocked by the moving piece 42 of the lower joint frame 41. When the lower joint frame 41 is an open type, the above-described positive electrode material is dropped into the positive electrode basket 13 by the connection hole portion 141 of the fixing cover 14.

According to the above structure, the anode material automatic refilling device of the circuit board electroplating tank of the present invention has the following effects. First, cost savings in time and labor costs can be achieved. When the automatic replenishment device is placed on the side of the ceiling crane of the electroplating tank and this automatic replenishment device moves along the ceiling crane, when the overhead crane stops and the circuit board is taken out of the electroplating tank or the circuit board is placed in the electroplating tank, At the same time, the automatic replenishment device replenishes the anode material in the anode basket in the electric circuitry, thereby saving time and human costs because it can replenish the anode material without additional human expenses and time. Secondly, the effect of protecting the health of the worker can be obtained. The automatic refilling device replenishes the anode material in the anode basket of the electroplating tank when the ceiling crane stops at the fixed position, so that the operator does not need to access the electroplating tank in the process of electroplating. This prevents workers from being injured and prevents workers from falling into the electroplating tank because it does not need to supplement the manual anode material, thereby preventing occupational injuries. Third, high yields can be achieved. The automatic refilling device does not need to stop the operation because the reinforcing operation of the positive electrode material can be performed simultaneously with the electroplating operation by replenishing the positive electrode material in the positive electrode basket of the electroplating tank when the overhead crane is stopped and working at the fixed position. The impact of downtime on production effects can be avoided. Finally, cheaper equipment costs. The automatic refilling device can be added to the side of the ceiling crane without modifying the existing electroplating tank structure, so the equipment cost is not high and the existing equipment is not replaced. Can achieve production efficiency.

Claims (5)

Automatic plate replenishing device for circuit board electroplating tanks with sections for placing circuit boards in electroplating tanks, two rows of anode baskets arranged side by side between neighboring sections, and top cranes with reciprocating ceiling cranes. At the same time, cover the fixed cover at the top of the anode baskets arranged side by side, and at the top of the fixed cover, place the connection holes corresponding to the anode basket, and fix the automatic replenishment device on the side of the ceiling crane. A mounting frame in a directional direction, above which there is a sliding frame which slides up and moves with it, a hopper above the sliding frame, a hopper connected downward to the supply pipe, and a drop device mounted on the supply pipe. Automatic replacement of anode material in circuit board electroplating bath. The apparatus for automatically replenishing anode material for an electroplating circuit of a circuit board according to claim 1, wherein the connecting hole is a funnel and the lower part of the connecting hole is connected to the connecting pipe. The method according to claim 1, wherein two guide rails in the same direction as the ceiling crane are mounted on the mounting frame, and a guide wheel for moving the guide rail on the bottom of the sliding frame is mounted, and a servo motor is mounted on one outside of the mounting frame. The main motor is placed on the server motor, and the slave wheel is fixed on the other side of the mounting frame, and the belt is fixed on one side of the sliding frame so that the belt winds up the slave wheel, the lower part of the sliding frame and the main wheel, The other side is fixed to the other side of the sliding frame, the anode plate automatic refilling device of the electroplating bath. According to claim 1, wherein the dropping device is installed between the supply is installed on the bottom of the sliding frame and the two joints are installed at a suitable interval of the supply pipe, there is a moving piece that extends horizontally in the joint, one side of the two moving pieces as a supporter Connected, the supporter is equipped with a drive mechanism to enable the left and right movement, and the anode material automatic refilling device of the circuit board electroplating bath, characterized in that the perforations are placed in the staggered position alternately on the two moving pieces. The apparatus for automatically replenishing anode material of an electroplating bath according to claim 1, wherein a proximity switch is mounted on both sides near the mounting frame, and a sensor part is mounted on both sides of the sliding frame to receive an access switch response.