KR20020073663A - Heat sink for cooling - Google Patents

Abstract

PURPOSE: A heat-sink for cooling is provided to emit heat generated from electric components by maximizing a heat-sink area. CONSTITUTION: A plurality of guide grooves(12) is constantly formed on a heat-sink portion which is located on an upper side of a base(11) of a main body(10). A bending portion(14) is slid into the guide groove(12). A plate type pin(13) is used for emitting heat which is transferred from a heat absorbing portion to a heat-sink portion of the base(11). A contact resistance is reduced by improving a contact state between the heat absorbing portion and the heat-sink portion when the bending portion(14) is inserted into the guide groove(12). Accordingly, the cooling capacity of the main body(10) is improved by reducing the contact resistance. In addition, a contact projection(15) is formed at a side of the plate type pin(13) in order to emit uniformly the heat.

Description

Cooling Heat Sink {HEAT SINK FOR COOLING}

The present invention relates to a heat sink for cooling.

As is commonly known, heat-generating electronic components include high power amplifiers (HPAs) and linear power amplifiers (LPAs) for mobile repeaters, central processor units (CPUs) for personal computers, and multiple processor units for server-class workstations. The surface temperature rises due to the heat generated when the electronic components operate at the maximum load, and the possibility of malfunction and damage of the electronic components increases due to the overheating phenomenon of the electronic components. Cooling heat sinks are installed to prevent possible malfunction and damage.

The heat sink effectively dissipates heat generated in the electronic components to the outside to lower the temperature of the electronic components below a certain level.

In the conventional heat sink for cooling, as shown in FIGS. 1 and 2, the heat sink body 1 is formed by dividing into an integral extrusion type and a bonding type adhesive type. The former extrusion type is based on an extrusion process. The thickness and spacing of the pins (3) on the (2), that is, the aspect ratio (pin height / pin pitch) cannot be reduced below a certain level, and the latter type of adhesion is applied after the adhesive is applied to the base 2 and the pins. Since (3) is combined and fixed, the thickness, spacing, height, etc. of the pin 3 can be made appropriate.

However, the heat sink for cooling described above has a problem that the heat dissipation area is somewhat limited since the heat sink main body 1 cannot be appropriately limited in shape and height of the fins 3 when manufactured. When the heat sink main body 1 is a bonded adhesive type, the heat sink body 1 can be manufactured in a desired shape. There were also disadvantages that could not be exercised.

In addition, the conventional heat sink is unable to exert sufficient heat dissipation performance due to lack of heat dissipation area even for cooling the CPU of a personal computer, and the fan becomes larger and larger, and as the fan becomes larger, a special shape for packaging inside the system In the case of applying a heat sink having a sufficient heat dissipation performance can be secured, but there was a problem that the price is increased due to a complicated process.

SUMMARY OF THE INVENTION An object of the present invention is to provide a cooling heat sink for mitigating the above problems and maximizing a heat dissipation area so that heat of an electronic component can be effectively released.

In order to achieve the above object, the present invention is made of a guide groove which is formed at equal intervals in the base of the heat sink body, and a plate-shaped pin slidingly coupled to the guide groove and dissipates heat of the base to the outside, the guide Forming the positioning projection in the inner center of the groove and to form the first, second plate-like pin to be located on both sides with respect to the positioning projection.

1 is a perspective view showing a conventional extrusion type heat sink,

2 is a front view showing a conventional adhesive type heat sink,

3 is an exploded view of a first embodiment of the present invention;

4 is a front view of a first embodiment of the present invention;

5 is a perspective view of a second embodiment of the present invention;

6 is an exploded view of a second embodiment of the present invention;

7 is a sectional view of a second embodiment of the present invention;

8 is a cross-sectional view of a state in which the push rod of the second embodiment of the present invention is coupled,

9 is an exploded view of a third embodiment of the present invention;

10 is a cross-sectional view showing an example of a third embodiment of the present invention;

11 is a sectional view showing another example of the third embodiment of the present invention;

12 is a cross-sectional view of a state in which the push rod of the third embodiment of the present invention is coupled.

<Description of the code used in the main part of the drawing>

10: heat sink main body 11: base

12: guide groove 13: plate pin

14 bending part 17 heat pipe

18: Positioning projection 19, 19 ': First and second plate pin

20: Spring fin 21, 21 ': Heat dissipation support pin

3 and 4, the first embodiment of the present invention includes a plurality of guide grooves 12 formed at equal intervals in the heat dissipation portion on the upper side of the base 11 of the cooling heat sink body 10, and The bending part 14 is formed to be slidably coupled to the guide groove 12, and also includes a plate-shaped pin 13 for dissipating heat transferred from the heat absorbing portion of the base 11 to the heat dissipating portion to the outside.

The bending part 14 of the plate-shaped pin 13 is formed by bending the length center of the plate-shaped pin 13. When the bending part 14 is inserted into the guide groove 12, the heat absorbing part and the heat dissipating part are in contact with each other. As a result, the contact thermal resistance is reduced, thereby improving the cooling performance of the heat sink body 10.

And to form a contact protrusion 15 on the side of the plate-shaped pin 13, the contact protrusion 15 is generated in each plate-shaped pin 13 while maintaining a constant spacing of the plate-shaped pin (13) The heat is to be evenly radiated.

The first embodiment of the present invention as described above is to maximize the heat dissipation area so that heat of the electronic components can be effectively released, and the guide grooves 12 are formed at equal intervals in the base 11 and the guide grooves. The plate-shaped pin 13 is inserted into 12 to be crimped. And the contact projections 15 are formed on the side of the plate-shaped pin 13 so that each plate-shaped pin 13 is maintained at a predetermined interval.

The bending part 14 of the plate-shaped pin 13 fitted into the guide groove 12 is compressed to the inner surface of the guide groove 12 to maximize the heat dissipation area of the base 11, and as the heat dissipation area is maximized, The heat generated from the electronic components is effectively released, and as the heat is released smoothly, the temperature of the electronic components is rapidly lowered below a certain level. As the bending portion 14 is pressed onto the inner surface of the guide groove 12, the cross-sectional shape is matched to reduce the heat resistance from the heat absorbing portion to the heat radiating portion of the base 11.

5 to 8, the plurality of guide grooves 12 are formed at equal intervals in the heat dissipation portion of the upper side of the base 11 of the cooling heat sink body 10, and The bending part 14 is formed to be slidably coupled to the guide groove 12, and also includes a plate-shaped pin 13 for dissipating heat transferred from the heat absorbing portion of the base 11 to the heat dissipating portion to the outside.

When the bending part 14 of the plate fin 13 is inserted into the guide groove 12, the contact with the heat absorbing part and the heat dissipating part is improved, thereby reducing the contact thermal resistance, thereby improving the cooling performance of the heat sink body 10. As it is, the pipe 16 is inserted into the bending portion 14 of the plate-shaped pin 13 coupled to the guide groove 12, and the pipe 16 is expanded to the plate-shaped pin on the inner surface of the guide groove 12 (13) is to be compressed, and if the base (16) and the plate-shaped fin (13) is integrated by expanding the pipe (16), the contact thermal resistance is further reduced and the cooling performance of the heat sink body (10) is further improved. will be.

In addition, the pipe 16 located inside the bending part 14 is processed by a heat pipe 17, and the heat pipe 17 includes an evaporation part and a condensation part, and the electrons transferred to the base 11. By repeatedly absorbing and dissipating heat of the component, heat is rapidly released to one side of the plate-shaped pin 13 and the base 11.

In place of the pipe 16 and the heat pipe 17, the press-fit rod 16 'is fitted into the bending portion 14 of the plate-shaped pin 13, and the press-fit rod 16' is a bending portion ( Formed slightly larger than the inner diameter of 14) is to be bonded by the indentation method.

In addition, the bending angle α of the plate-shaped pin 13 and the radius of the bending portion 14 are properly adjusted to be installed in the guide groove 12, and the bending angle α of the plate-shaped pin 13 is 45 °. The pitch interval of the plate-shaped pin 13 can be maintained by maintaining the pitch of the plate-shaped pin 13 properly by maintaining the angle at 90 °, and the radius of the bending portion 14 is 0.5-20 mm. By increasing the number of guide grooves 12 and the number of the plate-shaped pin 13 is to maximize the heat dissipation area.

The second embodiment of the present invention as described above is to maximize the heat dissipation area so that the heat of the electronic component can be effectively released, and the guide groove 12 is formed in the base 11 at equal intervals, and the guide groove The plate-shaped pin 13 is inserted into the 12 to be crimped, and then the pipe 16 is inserted into the bending portion 14. After inserting the pipe 16 into the bending part 14, the pipe 16 is expanded so that the plate-shaped pin 13 is pressed into the guide groove 12, and the pipe 16 is expanded. Alternatively, the pipe 16 may be converted into a heat pipe 17 and used.

The pipe 16 and the press rod 16 ′ or the heat pipe 17 minimize the contact thermal resistance by causing the plate fin 13 to be pressed into the guide groove 12, in particular, the heat pipe 17. Minimizes contact thermal resistance and speeds up heat transfer.

The parts except for the pipe 16, the press rod 16 ', and the heat pipe 17 are the same as those of the first embodiment described above, and thus, detailed description thereof will be omitted.

9 to 12, the heat sink body 10 is formed at equal intervals on the upper heat dissipation portion of the base 11 of the cooling heat sink body 10 and is positioned to protrude upward in the inner center. The guide groove 12 in which the setting protrusion 18 is formed, and the bending portion 14 are formed to be slidably coupled to the guide groove 12, and divided to be installed at both sides based on the positioning protrusion 18. The first and second plate-shaped pins (19, 19 ') are formed.

The positioning projection 18 of the guide groove 12 specifies the fixing position of the first and second plate-shaped pins 19 and 19 ', as well as the contact rows of the first and second plate-shaped pins 19 and 19'. Minimize the resistance.

When the bending portions 14 of the first and second plate-shaped fins 19 and 19 'are inserted into the guide grooves 12, the contact between the heat absorbing portion and the heat dissipating portion is improved, thereby reducing the contact thermal resistance thereof. 10, the cooling performance of the pipe 10 is improved into the bending part 14 of the first and second plate-shaped pins 19 and 19 ′ supported and coupled to the positioning protrusion 18 of the guide groove 12. 16 is inserted into the pipe 16 so that the first and second plate-shaped pins 19 and 19 'are pressed against the inner surface of the guide groove 12, and the pipe 16 is expanded to the base 11. ) And the first and second plate fins (19, 19 ') is to significantly reduce the contact thermal resistance while improving the cooling performance of the heat sink body (10).

In addition, the pipe 16 located inside the bending part 14 is used as a heat pipe 17, and the heat pipe 17 includes an evaporation part and a condensation part, and the electrons transferred to the base 11. By repeatedly absorbing and dissipating the heat of the component, heat is rapidly released to one side of the first and second plate-shaped pins 19 and 19 'and the base 11.

In addition, when the spring fin 20 having a large modulus of elasticity is installed in place of the pipe 16 or the heat pipe 17, the contact heat resistance between the heat absorbing portion and the heat dissipating portion can be significantly reduced and the first and second plate shapes The pins 19 and 19 'are crimped appropriately. The spring pin 20 is to be used to reduce the contact thermal resistance by using a material having a high heat transfer coefficient as well as elastic modulus.

In place of the pipe and the heat pipe, the press rod 16 'is fitted inside the bending part 14 of the first and second plate pins 19 and 19', and the press rod 16 'is bent at both sides. It is formed to be slightly larger than the inner diameter of the portion 14 to be bonded by a press-fit method.

The heat dissipation support pins 21 and 21 'are divided inside the first and second plate fins 19 and 19' so as to minimize thermal resistance of the first and second plate fins 19 and 19 '. After the installation is to install the pipe 16 and the heat pipe 17 or the spring fin 20.

Meanwhile, the first and second plate pins are installed in the guide groove 12 by appropriately adjusting the bending angle α and the radius of the bending part 14 of the first and second plate pins 19 and 19 '. The bending angle α of (19, 19 ') is maintained at 45 ° to 90 ° so that the pitch interval of the first and second plate pins 19, 19' is properly maintained, and the first and second plate pins are It is possible to increase the number of pitches (19, 19 '), the radius of the bending portion 14 is maintained at 0.5 to 20 mm, the number of guide grooves 12 and the first and second plate-shaped pins (19, 19') Increase the number of) to maximize the heat dissipation area.

The third embodiment of the present invention as described above is to maximize the heat dissipation area so that the heat of the electronic component can be effectively released, the positioning projection 18 in the inner center of the guide groove 12 formed in the base 11 And inserting the first and second plate-shaped pins 19, 19 ′ into both sides of the positioning protrusion 18 of the guide groove 12, and inserting the pipe 16 into the bending part 14. will be. After inserting the pipe 16 into the bending part 14, the pipe 16 is expanded to compress the first and second plate-shaped pins 19 and 19 ′ into the guide groove 12. It is also possible to convert the pipe 16 into a heat pipe 17 and then use it after expanding (16).

The pipe 16 and the press rod 16 'or the heat pipe 17 minimize the contact thermal resistance by causing the first and second plate fins 19 and 19' to be pressed into the guide grooves 12. In particular, the heat pipe 17 minimizes contact thermal resistance and allows rapid heat transfer. When the spring fin 20 is installed in place of the heat pipe 17, the first and second plate-shaped fins 19 and 19 'are appropriately compressed into the guide groove 12 by the elastic force of the spring fin 20. In this case, the heat dissipation effect is maximized, and the heat dissipation effect is remarkably improved even when the heat dissipation support pins 21 and 21 'are installed inside the first and second plate fins 19 and 19'.

In addition, as the bending angle α and the radius of the bent portion 14 of the first and second plate fins 19 and 19 'can be adjusted appropriately, the heat dissipation area can be appropriately enlarged. By adjusting the bending angle α and the radius of the bending part 14, the number and pitch spacing of the first and second plate-shaped pins 19 and 19 'are simply changed.

In addition, since it is the same as that of 1st, 2nd embodiment excepting the above-mentioned description, detailed description is abbreviate | omitted.

As described above, the present invention is to form a guide groove in the base of the heat sink body, as well as sliding the plate-shaped fins coupled to the guide groove to maximize the heat dissipation area, the heat generated from the electronic components is effectively released.

In addition, by installing a pipe and a heat pipe inside the plate-shaped fin coupled to the guide groove, the contact thermal resistance is reduced and the cooling performance of the heat sink body is improved.

In addition, the first and second plate-shaped pins are installed to form positioning protrusions inside the guide grooves and located on both sides of the positioning protrusions, and the pipes, the press rods, and the heat are formed inside the bending portions of the first and second plate-shaped pins. By installing a pipe or a spring pin, the contact thermal resistance between the heat absorbing portion and the heat radiating portion can be greatly reduced.

The heat dissipation support pin is selectively installed inside the first and second plate fins to maximize the heat dissipation effect, and the pitch angle and the number of the pins are adjusted by appropriately adjusting the bending angle and radius of the plate and first and second plate fins. Can be easily changed.

Claims (12)

Guide grooves 12 formed at equal intervals on the base 11 of the heat sink body 10, and plate-shaped fins 13 that are slidably coupled to the guide grooves 12 and dissipate heat from the base 11 to the outside. Cooling heat sink, characterized in that consisting of. The method of claim 1, Cooling heat sink, characterized in that to form a contact projection (15) on the side of the plate-shaped fin (13). The method of claim 1, Cooling heat sink, characterized in that the fitting by fitting the pipe (16) inside the bending portion (14) of the plate-shaped fin (13). The method of claim 1, The heat sink for cooling, characterized in that the heat pipe (17) is fitted to the inside of the bending portion (14) of the plate-shaped fin (13). The method of claim 1, Cooling heat sink, characterized in that the coupling by fitting the push rod (16 ') inside the bending portion (14) of the plate-shaped fin (13). Guide grooves 12 are formed at equal intervals on the base 11 of the heat sink body 10 and the positioning protrusions 18 are formed at the inner center thereof, and are slidably coupled to the guide grooves 12 and are positioned. The heat sink for cooling, characterized in that the first and second plate-shaped fins (19, 19 ') are formed by dividing on both sides with respect to the projection (18) and discharge the heat of the base (11) to the outside. The method of claim 6, Cooling heat sinks, characterized in that the fitting by fitting the pipe (16) inside the bending portion (14) of the first, second plate-shaped fins (19, 19 '). The method of claim 6, The heat sink for cooling, characterized in that the heat pipe (17) is fitted to the inside of the bending portion (14) of the first and second plate-shaped fins (19, 19 '). The method of claim 6, Cooling heat sink, characterized in that the spring pin 20 is fitted to the inside of the bending portion 14 of the first and second plate-shaped fins (19, 19 '). The method of claim 6, Cooling heat sink, characterized in that the first and second plate-shaped fins (19, 19 ') of the bending part 14 is fitted inside the bending portion (14). The method of claim 6, A heat sink for cooling, characterized in that the heat dissipation support pins (21, 21 ') are provided in the inner side of the first and second plate-shaped fins (19, 19'). The method according to claim 1 or 6, Characterized in that the bending angle (α) and the bending portion 14 of the plate-shaped pin 13, the first plate-shaped pin 19 and the second plate-shaped pin 19 'is installed in the guide groove 12 Heatsink for cooling.