JP3100594U - Integrated heat dissipation device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an integrated heat dissipation device capable of exhibiting an instantaneous cooling effect.
SOLUTION: It has a first heat dissipation element 11, a second heat dissipation element 12, a heat conduction heat sink 10, and at least one L-shaped heat pipe 13. The heat conduction heat sink 10 has a connection surface 100 and a heat conduction surface 101 on the opposite side of the connection surface 100. The first heat dissipation element 11 is attached to the heat conducting surface 101. A plurality of thermal conductors 102 having a thermal conductivity larger than the thermal conductivity of the thermal conductive heat sink 10 are attached to the connection surface 100. The L-shaped heat pipe 13 has two ends 130 and 131, one of the ends 130 is serially connected to the second heat dissipating element 12, and the other 131 of the ends extends. It is connected to a heat conductor 102 on a heat conductive heat sink 10.
[Selection] Fig. 2

Description

The present invention combines an integrated heat dissipation device, more specifically, heat pipe technology, to effectively dissipate the heat generated by a heat-generating electronic device generally operating under a uniform and constant temperature. The present invention relates to an integrated heat dissipating device for dissipating heat to a device.

発 展 With the development of computer industry, various kinds of high precision electronic devices are being developed. With the technological advancement of electronic devices, the function and operation speed are continually improving, resulting in the generation of large amounts of heat. Therefore, how to effectively dissipate the heat generated by these precision electronic devices has become a major topic for those engaged in research and development in the art.

FIG. 1 shows a conventional heat dissipation device 1a, which is mounted on a heat-generating electronic device such as a central processing unit (CPU) 2a. The heat dissipation device 1a has a heat sink 10a and a fan 11a attached to the heat sink 10a. The heat sink 10a has a base 100a fixed to the upper surface of the central processing unit 2a. A plurality of fins 101a are formed on the base 100a. A groove 102a is formed between each pair of adjacent fins 101a, and accommodates a heat flow generated by the central processing unit 2a. The fan 11 is used to blow cool air into the groove 102a, and is capable of cooling and circulating the heat flow accumulated in the groove 102a. Therefore, the central processing unit 2a can normally operate under the allowable temperature.

However, the heat dissipation device 1a dissipates heat generated by the central processing unit 2a by a conventional method. That is, heat is absorbed by the heat sink 10a, and the resulting heat flow is accumulated in the groove 102a before being dissipated. For electronic devices where the heat generated is greatly increased, such heat dissipation devices are unable to provide instantaneous cooling effects and provide poor heat dissipation to the electronic device.

The present invention has been made to solve the problems associated with the above-described conventional technology, and has as its object to provide an integrated heat dissipation device that can exert an instantaneous cooling effect.

In order to achieve the above object, the present invention is an integrated heat dissipation device having a first heat dissipation element, a second heat dissipation element, a heat conduction heat sink, and at least one heat pipe. The heat conduction heat sink has a connection surface and a heat conduction surface opposite the connection surface. The first heat dissipation element is attached to the heat conduction surface. A plurality of heat conductors are attached to the connection surface. The thermal conductor has a thermal conductivity that is greater than a thermal conductivity of the thermal conductive heat sink. The heat pipe has two ends, one of the ends is serially connected to the second heat dissipating element, and the other of the ends extends and extends on the heat conducting heat sink. Connected to heat conductor.

According to the present invention configured as described above, most of the heat can be carried by the heat pipe and dissipated by the second heat dissipating element, and the first heat dissipating element can reduce the residual heat of the heat conducting heat sink. Continue to dissipate. That is, it is possible to provide an integrated heat dissipation device capable of exhibiting an instantaneous cooling effect.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. It should be noted that, like the other features according to the present invention, the above features will become clear with reference to the drawings.

FIG. 2 is an exploded view of the heat dissipation device according to the present invention, FIG. 3 is an exploded view illustrating a fan structure of the heat dissipation device according to the present invention, and FIG. 4 is an assembly of the heat dissipation device according to the present invention. FIG.

The heat dissipation device 1 has a heat conduction heat sink 10, a first heat dissipation element 11, a second heat dissipation element 12, and at least one heat pipe 13. The heat conductive heat sink 10 is formed from a material having good thermal conductivity, such as aluminum.

Preferably, the heat conducting heat sink 10 has a flat panel shape, and has a connecting surface 100 at the bottom and a heat conducting surface 101 at the top. Connection surface 100 has a plurality of thermal conductors 102 formed thereon. The thermal conductivity of the thermal conductor 102 is larger than the thermal conductivity of the thermal conductive heat sink 10.

凹 As shown in FIG. 3, a concave slot 103 is provided on the connection surface 100 and accommodates the heat conductor 102. Further, a concave slot 104 is provided in the heat conducting surface 101, and the heat pipe 13 is fitted therein. The slot 104 is aligned with the recess or slot 103 and provides a connection between the connection surface 100 and the heat transfer surface 101.

The first heat dissipation element 11 is attached to the heat conducting surface 101 of the heat conducting heat sink 10. The first heat-dissipating element 11 is attached or soldered to the heat-conducting surface 101 by a heat-conducting adhesive or another heat-conducting solder medium (for example, tin).

FIG. 5 is a cross-sectional view of the assembly of FIG. In the present embodiment, the first heat dissipation element 11 has two sets of fins 110 and 111 extending along both sides in the longitudinal direction of the slot 104, as shown in FIG. That is, the heat pipe 13 is disposed between the two sets of the fins 110 and 111.

Each of the sets of fins 110 and 111 has a plurality of fins 112. The fins 112 are snap-fit at a distance from each other. Grooves 113 for circulating the heat flow are formed between the adjacent fins 112. The fins 112 are arranged perpendicular to the heat transfer surface 101. Preferably, the fins 112 are formed integrally with the heat conducting heat sink 10.

The second heat dissipation element 12 has a plurality of fins 120 which are snap-fitted at intervals from each other, and a groove 121 is formed between the adjacent fins 120. Each fin 120 has a through hole 122 formed therein, and the number of the through holes 122 matches the number of the heat pipes 13.

The first heat dissipation element 11 and the second heat dissipation element 12 can be formed from a heat conductive material such as copper or aluminum. In addition, when the first heat dissipation element 11 is formed integrally with the heat conduction heat sink 10, it is possible to use aluminum to form the first heat dissipation element 11.

Preferably, the heat pipe 13 is bent in an L shape, and has two ends 130 and 131 and a curved pipe 132 extending between the ends 130 and 131. The end 130 of the heat pipe 13 is inserted into the through hole 122 of the fin 120 of the second heat dissipation element 12 to maintain good heat conduction between the fin 120 and the heat pipe 13. The other end 131 of the heat pipe 13 extends toward the heat conductor 102 on the heat conductive heat sink 10.

In the present embodiment, since the slot 104 is disposed on the slot 103 and is in communication with the slot 103, the heat pipe 13 and the heat conductor 102 are in contact with each other and provide direct heat conduction.

Furthermore, the heat dissipation device according to the present invention has a fan 14 installed on one side of the heat conduction heat sink 10. The fan 14 generates airflow in the grooves 113 and 121 of the first heat dissipation element 11 and the second heat dissipation element 12 by operating. Therefore, the heat accumulated in the grooves 113 and 121 can be circulated and removed by the airflow. It is also possible to arrange a wind mask 140 around the fan 14. The wind mask 140 is connected across one side of the heat conductive heat sink 10.

FIG. 6 is a cross-sectional view of the assembly of FIG. 4 at another viewing angle different from FIG. As shown in FIG. 6, the window mask 140 is opposed to the first heat dissipation element 11 and the second heat dissipation element 12 by the first heat dissipation element 11 arranged on the other side of the heat conduction heat sink 10. In addition, the airflow generated by the fan 14 is guided by the wind mask 140 toward the first heat dissipation element 11 and the second heat dissipation element 12 to enhance the heat dissipation action.

に し た が っ て According to the above, an integrated heat dissipation device is obtained.

を Refer to FIG. 7 and FIG. FIG. 7 is an exploded perspective view illustrating a fastening tool (fastening member) of the heat dissipation device according to the present invention, and FIG. 8 is a diagram illustrating an application of the heat dissipation device according to the present invention to an electronic device. It is sectional drawing.

In a practical application of the heat dissipation device 1, a fastening member 15 can be used to attach the heat dissipation device 1 to the motherboard 4. The fastening member 15 is engaged with the central processing unit slot 3 of the motherboard 4. In the present embodiment, the central processing unit 2 is installed in the central processing unit slot 3, and the fastening member 15 is pressed and engaged with the central processing unit 2. Thereby, the bottom surface of the heat conductor 102 comes into contact with the upper surface of the central processing unit 2.

The fastening member 15 can also be engaged with the heat dissipation device 1. In this case, the lower fins 120 of the second heat dissipation element 12 are shorter than the upper fins 120 of the second heat dissipation element 12, forming an installation (accommodation) space 123 (FIG. 6).

The window mask 140 further has an opening 141 near the first heat dissipation element 11 and the second heat dissipation element 12. The opening 141 is aligned with the installation space 123, and the fastening member 15 is inserted into the opening 141, introduced into the installation space 123, and pressed by the central processing unit 2.

By pressing the fastening member 15 against the heat dissipating device, the fins 112 and the fins 120 of the first heat dissipating element 11 and the second heat dissipating element 12 are prevented from being damaged. It is also possible to form the support member 142 between them. The support member 142 is locked on one side by the inner wall of the window mask 140, and the fastening member 15 can be pressed there. Therefore, the fin 112 and the fin 120 are prevented from being targets to which the pressing force of the fastening member 15 is applied.

Therefore, referring to FIG. 9 which is a cross-sectional view at another viewing angle different from FIG. 8, when the operation of the central processing unit 2 is started, most of the heat generated thereby is transferred by the heat pipe 13 to the second heat pipe. It is guided towards the dissipating element 12. Therefore, the central processing unit 2 can be instantaneously cooled down. On the other hand, the residual heat remaining in the heat conduction heat sink 10 is dissipated by using the first heat dissipation element 11. Therefore, the heat generated by the central processing unit 2 is instantaneously dissipated or discharged, and the temperature of the central processing unit 2 is kept uniform and constant.

Further, heat guided by the first heat dissipation element 11 and the second heat dissipation element 12 is accumulated in the grooves 113 and 121. The accumulated heat is discharged from the grooves 113 and 121 by the airflow generated by the fan 14. Therefore, it is possible to store the added heat in the first heat dissipation element 11 and the second heat dissipation element 12.

As described above, the present invention uses a heat pipe connected to a heat conductor, and instantaneously discharges the heat generated by the electronic device to the distal end of the heat pipe. I will provide a. Thus, the electronic device is kept away from the dynamic heat generation thereby, preventing normal functional operation from being affected.

In addition, two heat dissipation elements are incorporated, providing a first pass and a second pass for heat dissipation. Also, a fan is used to create a circulating airflow for dissipating heat. Thus, the electronic device can perform normal functional operation under uniform and constant temperature.

The present invention is not limited to the above-described embodiment, and can be variously modified within the scope of the claims for utility model registration. That is, the present disclosure provides an example of an embodiment according to the present invention, and the scope of the present disclosure is not limited by the example of the present embodiment. Many modifications that are explicitly provided herein or implied by this specification, such as changes in shape, structure, size, type of material, or manufacturing process, may be disclosed by those skilled in the art. It can be executed from the viewpoint of.

It is sectional drawing of the conventional heat dissipation device. FIG. 3 is an exploded view of the heat dissipation device according to the present invention. FIG. 3 is an exploded view illustrating a fan structure of the heat dissipation device according to the present invention. FIG. 3 is a perspective view showing an assembly of the heat dissipation device according to the present invention. FIG. 5 is a cross-sectional view of the assembly of FIG. FIG. 6 is a cross-sectional view of the assembly of FIG. 4 at another viewing angle different from that of FIG. 5. FIG. 4 is an exploded perspective view illustrating a fastening tool of the heat dissipation device according to the present invention. FIG. 4 is a cross-sectional view illustrating an application of the heat dissipation device according to the present invention to an electronic device. FIG. 9 is a cross-sectional view at another viewing angle different from FIG. 8.

Explanation of reference numerals

1,1a ... heat dissipation device,
2.2a Central processing unit,
3. Central processing unit slot,
4. Motherboard,
10,10a heat sink,
11,11a fan
11. First heat dissipation element,
12. Second heat dissipation element,
13. Heat pipe,
14. Fan,
15 ... fastening members,
100 ... connection surface,
100a ... base,
101 heat conduction surface,
101a ... fin,
102 ・ ・ Heat conductor,
102a ... groove,
103, 104 slots
110-112 fins,
113, 121, groove 120, fin,
122 · through hole,
123 ... installation space,
130,131 ... end,
132 ... curved tube
140 wind mask,
141 ... opening,
142 support member.

Claims (7)

A first heat dissipation element,
A second heat dissipation element,
A heat conducting heat sink having a connecting surface and a heat conducting surface opposite the connecting surface and to which the first heat dissipating element is attached;
A heat conductor attached to the connection surface and having a thermal conductivity greater than a thermal conductivity of the thermal conductive heat sink; and
At least one heat pipe having two ends, one of the ends being serially connected to the second heat dissipating element, and the other of the ends extending and connecting to the heat conductor. An integrated heat dissipation device. The connection surface has a concave slot for housing the heat conductor therein, and the heat conduction surface has a concave slot for fitting the other end of the heat pipe therein, 2. The heat pipe of claim 1, wherein the concave of the heat conducting surface is aligned with and communicates with the concave of the connecting surface, and the heat pipe is in contact with the heat conductor. An integrated heat dissipation device as described. The integrated heat dissipation device according to claim 1, wherein the first heat dissipation element has two sets of fins arranged along two longitudinal sides of the heat pipe. The integrated heat dissipation device according to claim 1, further comprising a fan installed on one side of the heat conduction heat sink. The fan further includes a window mask cross-connected to one side of the heat conductive heat sink, wherein the first heat dissipating element is disposed on an opposite side of the heat conductive heat sink, The integrated heat dissipation device of claim 4, wherein a fan can face toward the first heat dissipation element and the second heat dissipation element. A fastening member, wherein the second heat dissipation element has an accommodation space, and the window mask has an opening in the vicinity of the first heat dissipation element and the second heat dissipation element; The integrated heat dissipation device according to claim 5, wherein a portion is aligned with the storage space, and the fastening member can be inserted into the opening and the storage space. The integrated thermal device according to claim 6, further comprising a support member, wherein one end of the support member is locked by an inner wall of the window mask, and the fastening member is pressed by the support member. Dissipation device.

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