KR20020056097A - Ashing apparatus - Google Patents
Ashing apparatus Download PDFInfo
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- KR20020056097A KR20020056097A KR1020000085395A KR20000085395A KR20020056097A KR 20020056097 A KR20020056097 A KR 20020056097A KR 1020000085395 A KR1020000085395 A KR 1020000085395A KR 20000085395 A KR20000085395 A KR 20000085395A KR 20020056097 A KR20020056097 A KR 20020056097A
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- hot plate
- glass
- color filter
- holes
- cap
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/133509—Filters, e.g. light shielding masks
- G02F1/133514—Colour filters
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
- Drying Of Semiconductors (AREA)
- Optical Filters (AREA)
Abstract
Description
본 발명은 애싱장치에 관한 것으로, 특히, 컬러필터에 발생하는 얼룩을 제거할 수 있도록 한 애싱장치에 관한 것이다.TECHNICAL FIELD The present invention relates to an ashing apparatus, and more particularly, to an ashing apparatus capable of removing stains generated in a color filter.
최근 사무기기나 휴대용 소형텔레비젼등의 보급에 따라 이제까지의 전자디스플레이 장치로 브라운관(CRT) 대신에 액정 디스플레이(LCD), 렉트로루미너센스(EL)소자, 플라즈마 디스플레이(PDP), 형광표시관(VFD) 등이 실용화 되고 있다.Recently, with the spread of office equipment and portable small TVs, LCD displays, electroluminescence (EL) devices, plasma displays (PDP), and fluorescent display tubes (CRT) have been used as electronic display devices. VFD) and the like have been put to practical use.
그 중에서도 액정 디스플레이는 극도의 경량으로 박형, 저가 저소비전력구동으로 집적회로와의 정합성이 좋은 등의 특징을 가져 랩 톱 컴퓨터(Lap Top ComputeAmong them, liquid crystal displays are extremely lightweight, thin, low-cost, low-power drive, and have a good match with integrated circuits.
r)나 포켓 컴퓨터(Pocket Computer)의 표시 외에 차량적재용, 컬러텔레비젼화상용으로서 그 용도를 급속하게 확대하고 있다. 또한 액정표시장치에 사용되고 있는 칼라필터는 3-5인치가 실용화되어 있고 10-14인치가 개발중이며 대형화를 향해 급속히 진행되고 있다.In addition to the display of r) and Pocket Computer, its use is rapidly expanding for vehicle loading and color television imaging. In addition, the color filter used in the liquid crystal display is 3-5 inches in practical use, 10-14 inches are under development, and is rapidly progressing toward larger size.
이러한 액정 표시판은 크게 개별 스위칭 소자인 박막 트랜지스터(Thin film transistor)가 형성된 하부기판과, 컬러필터가 반복 배열되어 컬러화를 시키는 상부기판으로 구성된다. 이러한, 컬러필터는 특정 파장대역의 광을 투과시킴으로 적색, 녹색 및 청색을 표시하게 된다.The liquid crystal panel is largely composed of a lower substrate on which thin film transistors, which are individual switching elements, and an upper substrate on which color filters are repeatedly arranged to colorize. Such a color filter transmits light of a specific wavelength band and displays red, green, and blue colors.
도 1a 내지 도 1d는 종래의 컬러필터기판을 제조하는 방법을 단계적으로 도시하고 있다.1A to 1D show step by step methods for manufacturing a conventional color filter substrate.
도 1a 내지 도 1d를 참조하면, 컬러필터기판의 제조방법은 상부기판(10)상에 블랙매트릭스(8)를 형성하는 단계와, 적색, 녹색 및 청색 컬러필터(2, 4, 6)를 형성하는 단계와, 공통전극(12)을 형성하는 단계와, 배향막(14)을 인쇄하는 단계를 포함한다. 블랙매트릭스(8)는 도 1a에 도시된 바와 같이 상부기판(10)상에 형성되어 인접한 적색, 녹색 및 청색 컬라필터(2, 4, 6)간에 광학적 혼신을 방지한다. 컬러필터(2, 4, 6)들의 경계부에는 도 1b에 도시된 바와 같이 블랙매트릭스(8)가 위치한다. 이와 같은 컬러필터(2, 4, 6)들은 특정 파장대역의 광을 투과시킴으로 적색, 녹색 및 청색을 표시하게 된다. 공통전극(12)은 도 1c에 도시된 바와 같이 컬러필터(2, 4, 6)들 상에 전면 증착된다. 배향막(14)은 도 1d에 도시된 바와 같이 공통전극(12)상에 전면 인쇄된다. 배향막(14)은 통상적으로 폴리이미드가 사용되고 있다.1A to 1D, a method of manufacturing a color filter substrate includes forming a black matrix 8 on an upper substrate 10 and forming red, green, and blue color filters 2, 4, and 6. And forming the common electrode 12 and printing the alignment layer 14. The black matrix 8 is formed on the upper substrate 10 as shown in FIG. 1A to prevent optical interference between adjacent red, green and blue color filters 2, 4, 6. The black matrix 8 is located at the boundary of the color filters 2, 4, 6 as shown in FIG. 1B. The color filters 2, 4, and 6 transmit red light of a specific wavelength band and display red, green, and blue colors. The common electrode 12 is entirely deposited on the color filters 2, 4, 6 as shown in FIG. 1C. The alignment film 14 is printed on the entire surface of the common electrode 12 as shown in FIG. 1D. As the alignment layer 14, polyimide is usually used.
위에서 상술한 것과 같이 컬러필터기판을 제조하는 과정에 있어서, 상부기판 및 블랙매트릭스 상에 컬러필터를 도포하는 과정에서 포토레지스터의 찌거기가 발생하게 된다. 이러한 찌꺼기를 제거하기 위해서 도 2a에 도시된 애싱장치가 이용된다.In the process of manufacturing the color filter substrate as described above, the residue of the photoresist occurs in the process of applying the color filter on the upper substrate and the black matrix. The ashing device shown in Fig. 2a is used to remove this debris.
애싱장치는 핫플레이트에 안착된 글라스를 고온으로 가열되어 글라스상에 잔존하는 포토레지스트의 찌꺼기를 제거한다.The ashing apparatus heats the glass seated on the hot plate to a high temperature to remove the residue of the photoresist remaining on the glass.
도 2a는 종래의 컬러필터 제작에 사용되는 애싱장치를 도시한다.Figure 2a shows an ashing apparatus used for manufacturing a conventional color filter.
도 2a를 참조하면, 종래의 애싱장치는 핫플레이트(21)와, 핫플레이트(21)에 형성되어 외부로부터 삽입되는 글라스(22)가 안착되는 지지핀(29)과, 핫플레이트(Referring to FIG. 2A, the conventional ashing apparatus includes a hot plate 21, a support pin 29 formed on the hot plate 21, and a glass 22 inserted from the outside, and a hot plate 21.
21)에 형성되어 지지핀(29)이 설치되는 홀(23 내지 27)을 구비한다.It is provided with a hole (23 to 27) formed in the 21, the support pin 29 is installed.
핫플레이트(21)는 글라스(22)상에 잔존하는 포토레지스터의 찌꺼기를 제거하기 위해 높은 온도로 가열되고, 지지핀(29)은 홀(Hole:23 내지27)에 설치되는 외부로부터 로딩되는 글라스(22)가 안착된다. 이러한 지지핀(29)은 외부로부터 글라스The hot plate 21 is heated to a high temperature to remove the residue of the photoresist remaining on the glass 22, the support pin 29 is loaded from the outside installed in the holes (Hole: 23 to 27) (22) is seated. This support pin 29 is glass from the outside
(22)가 로딩시에는 상승하고, 외부로부터 글라스(22)가 언로딩시에는 하강된다.The 22 is raised at the time of loading and the glass 22 is lowered at the time of unloading from the outside.
홀(23 내지 27)은 도 2c와 같이 지지핀(29)의 상승, 하강 할 수 있도록 홀(23 내지 27)에 소정간격으로 형성되어 있다.The holes 23 to 27 are formed at predetermined intervals in the holes 23 to 27 so that the support pin 29 can be raised and lowered as shown in FIG. 2C.
도 2c를 참조하면, 핫플레이트(21)의 지지핀(29)과 홀(23 내지 27)이 소정간격으로 떨어져 형성되기 때문에 핫플레이트(21)와 홀(23 내지 27)간의 온도차가발생하게 된다. 이러한, 온도차이로 인하여 사람의 육안으로 식별할 수 있는 얼룩이 컬러필터상에 나타나는 문제점이 발생한다.Referring to FIG. 2C, since the support pins 29 and the holes 23 to 27 of the hot plate 21 are formed at predetermined intervals, a temperature difference occurs between the hot plate 21 and the holes 23 to 27. . Due to such a temperature difference, a problem occurs in which a spot which can be identified by the human eye appears on the color filter.
따라서, 본 발명의 목적은 컬러필터에 발생하는 얼룩을 제거할 수 있도록 한 애싱장치를 제공하는데 있다.Accordingly, an object of the present invention is to provide an ashing apparatus capable of removing stains generated in a color filter.
도 1a 내지 도 1d는 컬러필터의 제조단계를 도시한 액정표시장치의 단면도.1A to 1D are cross-sectional views of a liquid crystal display device showing a manufacturing step of a color filter.
도 2a는 애싱장치의 핫플레이트를 도시한 평면도.Figure 2a is a plan view showing a hot plate of the ashing device.
도 2b는 도 2a에 도시된 핫플레이트에 형성된 홀에 글라스가 안착된 측면도.Figure 2b is a side view of the glass seated in the hole formed in the hot plate shown in Figure 2a.
도 2c는 도 2a에 도시된 A부분을 상세하게 도시한 도면.FIG. 2C is a detailed view of portion A shown in FIG. 2A;
도 3a는 본 발명에 실시예의 애싱장치의 핫플레이트를 도시한 평면도.Figure 3a is a plan view showing a hot plate of the ashing device of the embodiment of the present invention.
도 3b는 도 3a에 도시된 핫플레이트에 형성된 홀에 글라스가 안착된 측면도.Figure 3b is a side view of the glass seated in the hole formed in the hot plate shown in Figure 3a.
도 3c는 도 3a에 도시된 B부분을 상세하게 도시한 도면.FIG. 3C is a detailed view of portion B shown in FIG. 3A; FIG.
<도면의 주요부분에 대한 부호의 설명><Description of the symbols for the main parts of the drawings>
2, 4, 6 : 컬러필터8 : 블랙매트릭스2, 4, 6: Color filter 8: Black matrix
10 : 상부기판12 : 공통전극10: upper substrate 12: common electrode
14 : 배향막 21, 38 : 핫플레이트14: alignment film 21, 38: hot plate
29, 35 : 핀 22, 39 : 글라스29, 35: pin 22, 39: glass
23, 24, 25, 26, 27, 30, 31, 32, 33, 34 : 핀 구멍23, 24, 25, 26, 27, 30, 31, 32, 33, 34: pin hole
36 : 캡36: cap
상기 목적을 달성하기 위하여 본 발명에 따른 애싱장치는 컬러필터가 형성된 글라스와, 컬러필터에 잔존하는 포토레지스터의 찌꺼기를 제거하기 위해 글라스를 고온으로 가열하기 위한 핫플레이트와, 핫플레이트에 설치되어 글라스가 안착되는지지핀과, 핫플레이트에 형성되어 지지핀이 설치되는 홀들 및 홀들을 밀폐할 수 있도록 홀들에 형성되는 캡을 구비한다.In order to achieve the above object, the ashing apparatus according to the present invention includes a glass on which a color filter is formed, a hot plate for heating the glass to a high temperature to remove the residue of the photoresist remaining on the color filter, and a glass installed on the hot plate. It is provided with a support pin to be seated, and a cap formed in the holes to seal the holes and the holes are formed in the hot plate is installed support pin.
상기 목적 외에 본 발명의 다른 목적 및 특징은 첨부도면을 참조한 실시 예에 대한 설명으로 나타나게 될 것이다.Other objects and features of the present invention in addition to the above object will appear in the description of the embodiments with reference to the accompanying drawings.
이하, 도 3a내지 도 3c를 참조하여 본 발명의 실시 예에 대하여 설명하기로 한다.Hereinafter, embodiments of the present invention will be described with reference to FIGS. 3A to 3C.
본 발명의 실시예에 의한 도 3a를 참조하면, 본 발명의 애싱장치는 핫플레이트(38)와, 핫플레이트(38)에 형성되어 외부로부터 삽입되는 글라스(39)가 안착되는 지지핀(35)과, 핫플레이트(38)에 형성되어 지지핀(35)이 설치되는 홀(30 내지 34)을 구비한다.Referring to Figure 3a according to an embodiment of the present invention, the ashing device of the present invention is a hot plate 38, the support pin 35 is formed on the hot plate 38, the glass 39 is inserted from the outside is seated And holes 30 to 34 formed in the hot plate 38 and on which the support pins 35 are installed.
핫플레이트(38)는 글라스(39)상에 잔존하는 포토레지스터의 찌꺼기를 제거하기 위해 높은 온도로 가열되고, 지지핀(39)은 홀(Hole:30 내지 34)에 설치되는 외부로부터 로딩되는 글라스(39)가 안착된다. 이러한 지지핀(35)은 외부로부터 글라스(39)가 로딩시에는 상승하고, 외부로부터 글라스(39)가 언로딩시에는 하강된다.The hot plate 38 is heated to a high temperature to remove the residue of the photoresist remaining on the glass 39, the support pin 39 is loaded from the outside installed in the holes (Hole: 30 to 34) (39) is seated. The support pin 35 rises when the glass 39 is loaded from the outside and descends when the glass 39 is unloaded from the outside.
지지핀(35)은 도 3c와 같이 윗변이 넓은 사다리꼴모양의 캡(36)이 형성되어 있다. 캡(36)은 핫플레이트(38)의 열을 쉽게 전도 받을 수 있도록 열 전도도가 높은 재질로 형성된다. 나아가, 캡(36)은 열팽창율을 고려하여 핫플레이트(38)의 표면 높이 보다 L만큼 낮게 설치된다.The support pin 35 has a trapezoidal cap 36 having a wide upper side as shown in FIG. 3C. Cap 36 is formed of a high thermal conductivity material so that the heat of the hot plate 38 can be easily conducted. Further, the cap 36 is installed by L lower than the surface height of the hot plate 38 in consideration of the coefficient of thermal expansion.
이와 같이, 핫플레이트(38)의 글라스(39)의 지지핀(35) 자체에 윗면이 넓은 사다리꼴 모양의 캡(36)을 씌워 핫플레이트(38)와 홀(30 내지 34)을 밀폐함으로써 핫플레이트(30)와 홀(30 내지 34)과의 온도를 동일하게 유지할 수 있다.In this way, the cover plate 35 of the glass plate 39 of the hot plate 38 itself is covered with a trapezoidal cap 36 having a wide top surface to seal the hot plate 38 and the holes 30 to 34. The temperature between 30 and the holes 30 to 34 can be maintained the same.
상술한 바와 같이, 본 발명에 따른 애싱장치는 글라스 지지핀의 구조를 개조함으로써 핫플레이트와 홀과의 온도 차이를 균일하게 하여 컬러필터상에 발생하는 얼룩을 방지할 수 있다.As described above, the ashing apparatus according to the present invention can prevent the unevenness generated on the color filter by uniformizing the temperature difference between the hot plate and the hole by modifying the structure of the glass support pin.
또한, 핫플레이트와 홀과의 온도차이를 균일하게 하여 컬러필터에 발생하는 얼룩을 방지함으로써 컬러필터의 수율이 향상된다.In addition, the yield of the color filter is improved by making the temperature difference between the hot plate and the hole uniform so as to prevent unevenness occurring in the color filter.
이상 설명한 내용을 통해 당업자라면 본 발명의 기술사상을 일탈하지 아니하는 범위에서 다양한 변경 및 수정이 가능함을 알 수 있을 것이다. 따라서, 본 발명의 기술적 범위는 명세서의 상세한 설명에 기재된 내용으로 한정되는 것이 아니라 특허 청구의 범위에 의해 정하여 져야만 할 것이다.Those skilled in the art will appreciate that various changes and modifications can be made without departing from the technical spirit of the present invention. Therefore, the technical scope of the present invention should not be limited to the contents described in the detailed description of the specification but should be defined by the claims.
Claims (5)
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| KR1020000085395A KR100790490B1 (en) | 2000-12-29 | 2000-12-29 | Ashing Apparatus |
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| CN103454810A (en) * | 2013-09-09 | 2013-12-18 | 深圳市华星光电技术有限公司 | Baking device for liquid crystal alignment film |
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| KR900007571B1 (en) * | 1987-12-11 | 1990-10-15 | 삼성전자 주식회사 | Interface controll circuit for lcd display |
| JPH07106239A (en) * | 1993-09-29 | 1995-04-21 | Dainippon Screen Mfg Co Ltd | Substrate heating device |
| JPH08279548A (en) * | 1993-12-28 | 1996-10-22 | Sharp Corp | Pin used for hot plate type proximity bake furnace and furnace using it |
| JP3179661B2 (en) * | 1994-08-30 | 2001-06-25 | シャープ株式会社 | Hot plate type proximity bake furnace and its substrate support pins |
| JPH11297789A (en) * | 1998-04-09 | 1999-10-29 | Tokyo Electron Ltd | Treating device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103454810A (en) * | 2013-09-09 | 2013-12-18 | 深圳市华星光电技术有限公司 | Baking device for liquid crystal alignment film |
| WO2015032183A1 (en) * | 2013-09-09 | 2015-03-12 | 深圳市华星光电技术有限公司 | Roasting device for liquid crystal alignment film |
| US20150153105A1 (en) * | 2013-09-09 | 2015-06-04 | Shenzhen China Star Optoelectronics Technology Co. Ltd. | Baking device for liquid crystal alignment films |
| CN103454810B (en) * | 2013-09-09 | 2016-06-08 | 深圳市华星光电技术有限公司 | Apparatus for baking for liquid crystal orienting film |
| US10041735B2 (en) | 2013-09-09 | 2018-08-07 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Baking device for liquid crystal alignment films |
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