KR20020035978A - vacuum pressure system and using method there of - Google Patents

Abstract

PURPOSE: A vacuum pressure system is provided to improve driving efficiency of a vacuum pump and shorten an interval of time for forming a vacuum pressure, by making a vacuum pressure state inside a chamber have more than a predetermined value and by supplying gas corresponding to an excessive vacuum pressure. CONSTITUTION: Sealing is selectively maintained in a chamber(12a,12b). The vacuum pump(33) selectively supplies a vacuum pressure, connected to the chamber through an exhaust pipe having a throttle valve(32). A sensor(34) measures the vacuum pressure state inside the chamber. A gas supply unit(36) supplies predetermined gas to the inside of the chamber, connected to the chamber by a connection pipe(41). An intercepting unit(42) controls the flow rate of the predetermined gas to the chamber, installed on the connection pipe. A controller controls driving of the throttle valve, the vacuum pump and the intercepting unit through a measured signal of the sensor.

Description

Vacuum pressure system and using method there of}

The present invention relates to a vacuum pressure system and a method of operating the same, and more particularly, to a vacuum pressure system and a method of operating the same to facilitate the rapid and easy formation of the required vacuum pressure state in a closed predetermined process chamber.

In general, a semiconductor device manufacturing process or the like is required to form the inside of a partitioned space including a chamber in a predetermined vacuum state as a process condition for performing a process including a high cleanness condition.

With respect to the conventional vacuum pressure system installation configuration for forming the vacuum pressure as described above, the application embodiment will be described with reference to the schematic installation configuration for the semiconductor device manufacturing equipment shown in FIG.

The semiconductor device manufacturing apparatus 10 shown in FIG. 1 performs a process with respect to the wafer W at a predetermined vacuum pressure, and processes the process chambers 12a and 12b and the plurality of wafers W on which the process is performed. The wafer (between the process positions of the cassette 14 and the process chambers 12a and 12b between the load lock chamber 16 and the process chambers 12a and 12b and the load lock chamber 16 where the cassette 14 accommodated is located) And a transfer chamber 18 equipped with a robot 17 to position W).

The above-described process chambers 12a and 12b have a high cleanness condition so that the supplied process gases are uniformly distributed therein or, when high frequency power is used, the process gases are easily formed into a plasma state. It is required to maintain a predetermined vacuum state and its state.

In addition, the transfer chamber 18 including the load lock chamber 16 loads and unloads the cassette 14 from the production line and the vacuum state corresponding to maintaining the vacuum state of the process chambers 12a and 12b. As it is positioned, the pressure constantly changes.

In this relationship, each of the chambers 12a, 12b, 16, and 18 described above has vacuum pressure forming means for forming the interior thereof in a predetermined vacuum state, and door parts 20a, 20b for separating and partitioning each interior. 20c, 20d) is required.

The installation configuration of the vacuum pressure forming means as the frequent change between the vacuum pressure and the normal pressure of the process chambers 12a and 12b among the above-described requirements will be described in more detail.

As described above, the vacuum pressure forming means, that is, the vacuum pressure forming of the vacuum pressure system 30, is different from the other chambers 16 and 18 in response to the vacuum pressure required in the process chambers 12a and 12b. Accurate control is required so that their vacuum state is within the same or predetermined range.

First, referring to the configuration of the vacuum pressure system 30, as shown in Figure 1, selectively communicating through a pipe 31 provided with a throttle valve 32 on one side of the predetermined chamber (16, 18), A vacuum pump 33 is provided in the chambers 16 and 18 in communication with the opening of the pipe 31 to provide a predetermined vacuum pressure.

In addition, on the other side in the chambers 16 and 18, a sensor 34 for measuring and detecting the vacuum pressure state by the vacuum pump 33 is provided, and the sensor 34 is provided with a signal of the measured vacuum pressure state. It is configured to apply to the controller 35 to cause the controller 35 to control the driving of the vacuum pump 33 and the throttle valve 32.

And, one side of the chamber (16, 18) through the connecting pipe 38 is provided with a shut-off valve 37 to form the inside of the chamber (16, 18) at atmospheric pressure in response to the unloading process of the cassette (14) The gas supply part 36 which supplies a predetermined gas is installed so that it may communicate selectively.

As in the configuration of the vacuum pressure system 30 described above, the controller 35 opens and closes the throttle valve 32 in response to a vacuum pressure signal measured by a sensor 34 installed inside the chambers 16 and 18. You will adjust the degree.

However, at this time, the opening and closing degree of the throttle valve 32 is gradually blocked the opening degree of the pipe 31 as the interior of the chamber (16, 18) is closer to the value of the set vacuum pressure state, gradually progress in this process As the pneumatic pressure is gradually transmitted, there is a problem that the driving efficiency of the vacuum pump 33 is lowered, the vacuum pressure forming time is delayed, and the productivity is lowered due to the lowering of the driving efficiency of the manufacturing equipment.

In addition, when the driving of the vacuum pump 33 is continuously maintained for a predetermined time, power consumption is generated, and when the vacuum pressure inside the chambers 12a, 12b, 16, 18 is formed to be about or more, the above-described gas supply unit ( Through 36), there is a problem that it is difficult to control and difficult to form the vacuum pressure again after forming it to normal pressure.

SUMMARY OF THE INVENTION An object of the present invention is to solve the problems according to the prior art described above, and by forming a vacuum pressure state inside a chamber above a setting, it is possible to compensate the driving efficiency of a vacuum pump by setting the vacuum pressure state through a gas supply. It is to provide a vacuum pressure system and its operation method to improve, to shorten the vacuum pressure forming time, thereby improving the driving efficiency and productivity of the manufacturing equipment.

In addition, by compensating to the set vacuum pressure state from the excessive vacuum pressure inside the chamber to prevent the cumbersome against the conventional excessive vacuum pressure to reduce the operating time of the operation and the operation of the vacuum pump to reduce the power consumption accordingly To provide a vacuum pressure system and its operation method.

1 is a view schematically showing a conventional vacuum pressure system.

2 is a view schematically showing a vacuum pressure system according to an embodiment of the present invention.

Explanation of symbols on the main parts of the drawings

10: semiconductor device manufacturing equipment 12a, 12b: process chamber

14: cassette 16: load lock chamber

18: transfer chamber 20a, 20b, 20c, 20d: door part

30, 40: vacuum pressure system 31: piping

32: throttle valve 33: vacuum pump

34: sensor 35, 45: controller

36: gas supply unit 37: shut-off valve

38, 41: connector 42: shield

43: solenoid valve 44: flow meter

A configuration of a semiconductor device manufacturing system according to the present invention for achieving the above object comprises a chamber in which airtightness is optionally maintained; A vacuum pump communicating with the chamber via a pipe provided with a throttle valve to selectively provide a vacuum pressure; A sensor for measuring a vacuum state in the chamber; A gas supply unit configured to supply a predetermined gas into the chamber through a connection pipe connected to the chamber; A shield installed on the connection pipe to control a flow rate of a predetermined gas into the chamber; And a controller for controlling driving of the throttle valve, the vacuum pump, and the shielding unit through the measurement signal of the sensor.

In addition, the shielding unit, preferably configured by a solenoid valve for selectively shielding the connection pipe by the controller, and detects the flow amount of the fluid through the connection pipe to the solenoid valve to apply the signal to the controller It is effective to form the structure further equipped with the flowmeter to make.

On the other hand, the operating method of the vacuum pressure system according to an embodiment of the present invention for achieving the above object comprises the steps of providing a vacuum pressure inside the chamber through the pipe; Measuring a vacuum state inside the chamber by a sensor; And compensating for supplying a predetermined gas to correspond to a set vacuum pressure in response to an over-vacuum state inside the chamber.

In addition, the compensating supply of the predetermined gas may include calculating an amount of gas to be compensated for in correspondence with a vacuum pressure equal to or greater than a set value in the chamber by the sensor and a volume inside the chamber; And controlling the supply of the predetermined gas to correspond to the calculated amount of gas on the connection pipe connected to supply the predetermined gas to the chamber.

The controlling of the gas supply may include shielding means controlled to selectively block the flow of the gas through the connecting pipe, and the shielding means causes the gas amount to be compensated for and the gas flow due to over-vacuum pressure. Calculating a control time of a predetermined gas supply by combining the induction pressure of the fuel cell, a correlation including a diameter of the gas flow passage of the connector and a gas supply pressure on the connector; And causing the shielding means to block supply of a predetermined gas in response to the estimated time.

In addition, the controlling of the gas supply may include: shielding means for selectively blocking a flow of a predetermined gas through the connecting pipe; A flow meter for sensing a flow amount of the gas through the heat pipe, and confirming, by the flow meter, a time point at which the flow amount of the gas through the connection pipe corresponds to the gas amount to be compensated for; And causing the shielding means to block supply of a predetermined gas at the identified time point.

In addition, the shielding means is preferably to use a solenoid valve, the predetermined gas is preferably to use a nitrogen gas of weak reactivity.

Hereinafter, a vacuum pressure system and an operating method thereof according to an embodiment of the present invention will be described with reference to the accompanying drawings.

FIG. 2 is a view schematically showing an installation configuration of a vacuum pressure system according to an embodiment of the present invention as an installation configuration for a semiconductor device manufacturing facility. The same reference numerals are given to the same parts as in the related art, and a detailed description thereof will be described. It will be omitted.

The semiconductor device manufacturing facility 10 in which the vacuum pressure system 40 according to the present invention is installed includes a process chamber 12a and 12b and a plurality of wafers W in which a process is performed, as shown in FIG. 2. The wafer W between the load lock chamber 16 and the process chambers 12a and 12b and the load lock chamber 16 where the cassette 14 is located between the process positions of the cassette 14 and the process chambers 12a and 12b. It comprises a transfer chamber 18 is provided with a robot 17 to position the transfer.

The above-described process chambers 12a and 12b have high cleanliness conditions so that the supplied process gases are uniformly distributed therein, or when the high frequency power is used, the process gases are easily formed into a plasma state. A predetermined vacuum state is required.

In addition, such a vacuum state is required to be continuously maintained in order to prevent a process delay due to its formation or to increase the operating efficiency of the equipment.

Thus, in order to maintain the vacuum pressure of the process chambers 12a and 12b, the door portions 20a and 20b which selectively open to communicate with each other with respect to the transfer of the wafer W between the process chambers 12a and 12b and the transfer chamber 18. ) Is provided.

In addition, a door means 20c is provided between the load lock chamber 16 including the transfer chamber 18 and the production line to keep the airtight corresponding to the loading and unloading position of the cassette 14.

In addition, a door means 20d may be provided between the load lock chamber 16 and the transfer chamber 18 to selectively open in response to the transfer of the wafer W.

Here, the above-described vacuum pressure system 40, as shown in Fig. 2, each chamber 12a, 12b, 16, 18 where airtightness is selectively maintained by each door portion 20a, 20b, 20c, 20d. The pipe means 31 is selectively provided in communication with the valve means provided on one side of the throttle valve 32, and the other end of the pipe 31 is connected to each chamber 12a, 12b, 16, and 18 are provided with a vacuum pump 33 for providing a predetermined vacuum pressure.

Moreover, inside each chamber 12a, 12b, 16, 18, the sensor 34 which measures the vacuum pressure state in the chamber 12a, 12b, 16, 18 by the vacuum pump 33 is provided, In other predetermined positions of the chambers 12a, 12b, 16, 18, a gas supply unit 36 for supplying a predetermined gas into the chambers 12a, 12b, 16, 18 is installed in communication with the connecting pipe 38. do.

On the connection pipe 38 described above, in addition to the shut-off valve 37 which is generally installed, the flow amount of a predetermined gas flowing from the gas supply unit 36 to the chambers 12a, 12b, 16, 18 through the connection pipe 38. Shield 42 is installed to control the.

The above-described configuration of the throttle valve 32, the vacuum pump 33, and the shielding part 42 is a measurement signal from the sensor 34 measuring the vacuum pressure state inside the chambers 12a, 12b, 16, 18. The driving is controlled by the controller 45 to which is applied.

Meanwhile, the above-described shielding part 42 may be constituted by a solenoid valve 43 for selectively shielding and controlling the flow of a predetermined gas through the connection pipe 38 by the controller 45, and the solenoid valve ( In addition to 43, it may be formed with a configuration further comprising a flow meter 44 to measure and detect the flow amount of the predetermined gas through the connection pipe 38.

Looking at the vacuum pressure forming process of the predetermined chambers 12a, 12b, 16, and 18 by the vacuum pressure system 40 having such a configuration, the predetermined chambers 12a and 12b are defined by the respective door parts 20a, 20b, 20c, and 20d. ), While the airtight airtightness is maintained, the controller 45 opens the throttle valve 32 on the pipe 31 and simultaneously drives the vacuum pump 33 to move inside the predetermined chambers 12a, 12b, 16, 18. To provide pneumatic pressure.

At this time, the sensor 34 provided in the predetermined chambers 12a, 12b, 16 and 18 measures and senses the vacuum pressure state inside the chambers 12a, 12b, 16 and 18, and continuously detects the measured and detected signals. It is applied to the controller 45.

In this process, when it is confirmed from the above-described sensor 34 that the vacuum pressure inside the chambers 12a, 12b, 16, and 18 is a set vacuum pressure state, the controller 45 passes through the throttle valve 32 to the pipe 31. The transmission of the vacuum pressure through the cut off, and then the driving of the vacuum pump 33 is stopped.

According to the above, the insides of the predetermined chambers 12a, 12b, 16, and 18 are in an over-vacuum state with a relatively set vacuum pressure or more.

At this time, the controller 45 controls to input a predetermined amount of the predetermined gas through the connecting pipe 38 in response to the excess vacuum pressure inside the chambers 12a, 12b, 16, 18 by the sensor 34. To compensate for the over-vacuum condition.

The compensation supply of the predetermined gas to the over-vacuum pressure is thus applied to the degree of vacuum pressure in the chambers 12a, 12b, 16 and 18 measured by the sensor 34 and the volume of the chambers 12a, 12b, 16 and 18. Correspondingly, the amount of gas for which compensation is required is calculated, and the connecting pipe 38 is selectively opened to control the amount of supply so as to correspond to the amount of gas required by the calculation.

On the other hand, as described above, as a method for controlling the supply of the predetermined gas, in addition to the shutoff valve 37 provided on the connecting pipe 38, the connecting pipe close to the chambers 12a, 12b, 16, and 18. A shielding means is provided on the 38, and the controller 45 causes the controller 45 to induce the pressure of the gas flow due to the amount of gas to be compensated and the overvacuum pressure, the diameter of the connecting pipe 38 and the gas supply on the connecting pipe 38. The supply control time of the predetermined gas is calculated by synthesizing the mutual relations including the pressure.

Thereafter, in response to the time calculated as described above, the shielding means may be made to block the supply of the predetermined gas.

In addition, the other means for controlling the supply of the predetermined gas is a flow meter for sensing the flow of gas through the connecting pipe 38 and shielding means for selectively blocking the flow of the predetermined gas through the connecting pipe 38 described above. 44 is provided.

In such a state, the flow rate of the gas through the connecting pipe 38 through the flow meter 44 is identified at the point corresponding to the amount of gas required to be compensated, and then, at the identified time point, the shielding means causes the supply of the predetermined gas to be blocked. It can be done.

Therefore, the vacuum pressure by the vacuum pump 33 is directly transmitted without being blocked or controlled above the predetermined vacuum pressure set in the chambers 12a, 12b, 16, 18, and the over-vacuum pressure by the sensor 34 As the predetermined gas is compensated and supplied to reach the set vacuum pressure corresponding to the state, the vacuum pressure is formed more quickly and easily.

In addition, the above-described shielding means may be a solenoid valve 43 that can instantly shield the connection pipe 38 by the controller 45, the predetermined gas is said to be efficient to use a nitrogen gas that is weakly reactive will be.

On the other hand, in the description of the installation configuration and operation method of the above-described vacuum pressure system 40, Figure 2 is shown only limited to the installation configuration for the transfer chamber 18 for the sake of simplicity of the drawing, but such a vacuum pressure system ( 40 is applicable to the load lock chamber 16 and the process chambers 12a and 12b and other partitioned spaces requiring a predetermined vacuum pressure.

Therefore, according to the present invention, as the vacuum pressure inside the chamber is set above the set value, and the gas is compensated and supplied in response to the overvacuum pressure, the driving efficiency of the vacuum pump is first improved, and the vacuum pressure forming time is shortened. Therefore, there is an effect that the driving efficiency and productivity of the manufacturing facility is improved accordingly.

In addition, the control of the gas supply and the control of the vacuum pressure supply facilitates the reduction of the vacuum pressure inside the chamber, thereby preventing the hassle and efficient operation, and shortening the driving time of the vacuum pump, thereby reducing power consumption. There is an advantage.

Although the present invention has been described in detail only with respect to specific embodiments, it will be apparent to those skilled in the art that modifications and variations can be made within the scope of the technical idea of the present invention, and such modifications or changes belong to the claims of the present invention. something to do.

Claims (9)

A chamber in which airtightness is optionally maintained; A vacuum pump communicating with the chamber via a pipe provided with a throttle valve to selectively provide a vacuum pressure; A sensor for measuring a vacuum state in the chamber; A gas supply unit configured to supply a predetermined gas into the chamber through a connection pipe connected to the chamber; A shield installed on the connection pipe to control a flow rate of a predetermined gas into the chamber; And And a controller for controlling the driving of the throttle valve, the vacuum pump, and the shielding unit through the measurement signal of the sensor. The method of claim 1, The shielding unit, the vacuum pressure system, characterized in that consisting of a solenoid valve for selectively shielding the connection pipe by the controller. The method of claim 1, The shielding unit includes: a flow meter for sensing the flow rate of the fluid through the connecting pipe and applying the signal to the controller; And the solenoid valve for selectively shielding and controlling the connection pipe by the controller according to the signal of the flow meter. Providing a vacuum pressure inside the chamber through the piping; Measuring a vacuum state inside the chamber by a sensor; And Compensating for supplying a predetermined gas to correspond to the set vacuum pressure in response to the over-vacuum pressure state inside the chamber; operating method of a vacuum pressure system comprising a. The method of claim 4, wherein Compensating and supplying the predetermined gas may include calculating an amount of gas to be compensated for in correspondence with a vacuum pressure equal to or greater than a set value in the chamber by the sensor and a volume inside the chamber; And controlling a supply of a predetermined gas to correspond to the calculated amount of gas on a connection pipe connected to supply a predetermined gas to the chamber. The method of claim 5, The controlling of the predetermined gas supply may include shielding means controlled to selectively block the flow of gas through the connecting pipe, The shielding means allows a control time for a predetermined gas supply by combining the amount of gas to be compensated for, the induction pressure of the gas flow due to the over-vacuum pressure, and the correlation including the diameter of the connection pipe and the gas supply pressure on the connection pipe. Calculating; And causing the shielding means to shut off the supply of a predetermined gas in response to the calculated time. The method of claim 5, The controlling of the predetermined gas supply may include: shielding means for selectively blocking the flow of the predetermined gas through the connecting pipe; It is provided with a flow meter for sensing the flow of gas through the connecting pipe, Confirming, by the flow meter, a time point at which the flow rate of gas through the connecting tube corresponds to the amount of gas to be compensated for; And causing the shielding means to block the supply of a predetermined gas at the identified time point. The method of claim 6, And the shielding means is a solenoid valve. The method according to any one of claims 4 to 8, And said predetermined gas is nitrogen gas.