KR20020027099A - Interconnection structure between rambus dram inline memory modules using bridge pcb with improved thermal emission property - Google Patents

Abstract

PURPOSE: An interconnection structure between rambus dram modules using bridge printed circuit board is provided to prevent deterioration of an operating characteristic owing to heating by forming a hole at a bridge printed circuit board. CONSTITUTION: A bridge printed circuit board(30) is provided to have shorter length than that of a RAMBUS inline memory module(20). The bridge printed circuit board(30) is disposed at the center of the RAMBUS inline memory module(20). Segmented bridge printed circuit boards are provided on the center of the RAMBUS inline memory module(20) so as to be spaced apart from each other.

Description

Interconnection structure between Rambus DRAM memory modules using bridge printed circuit board with improved heat dissipation characteristics {INTERCONNECTION STRUCTURE BETWEEN RAMBUS DRAM INLINE MEMORY MODULES USING BRIDGE PCB WITH IMPROVED THERMAL EMISSION PROPERTY}

The present invention relates to a Rambus DRAM memory module, and more particularly, to a connection structure between Rambus DRAM memory modules using a bridge printed circuit board capable of improving heat dissipation characteristics.

As miniaturization and high integration of semiconductor devices have progressed, the demand for high-speed operation has increased. As a result of this study, a Rambus DRAM having a data transfer rate of about 800 MHz has recently been developed.

However, when the Rambus DRAM is modularized unlike the conventional DRAM, each DRAM device is operated in a serial manner based on a design reason, so when the conventional signal transmission method is applied, the signal transmission is performed. Problems and noise problems become severe.

That is, in the Rambus DRAM Inline Memory Module (RIMM), as shown in FIG. 1, signal transmission is sequentially transmitted to the DRAM devices 1 mounted on the RIMM 10a of the previous stage. After that, it is made in such a manner that is sequentially transmitted to the DRAM elements (2) mounted on the next stage RIMM (10b). In contrast, the conventional dual inline memory module (DIMM) is a DRAM device of the front and rear DIMMs 11a and 11b in which signal transmission is arranged on the same line as shown in FIG. 2. To each of these fields (not shown).

Therefore, in order to solve the problem of weakening of the signal transmission and noise of the RIMM, a connection structure between RIMMs using a bridge printed circuit board (hereinafter referred to as a bridge PCB) has been proposed by Micron. In this structure, as shown in FIG. 3, after the bridge PCB is placed on the front RIMM 12a and the rear RIMM 12b, a signal applied to the DRAM element (not shown) of the front RIMM 12a is bridged. The PCB 13 is transferred to the DRAM device of the rear stage RIMM 12b to reduce the signal transmission length.

However, although the connection structure between the conventional RIMMs using the bridge PCB can solve the signal transmission and noise problems to some extent, the bridge PCB suppresses convection and thermal problems are generated, rather, the operation characteristics of the RIMMs are deteriorated. There is a problem.

Accordingly, the present invention has been made in order to solve the above problems, by reducing the size of the bridge PCB, or by providing a hole in the bridge PCB, a bridge PCB that can prevent the operating characteristics of the RIMM due to heat The purpose of the present invention is to provide a connection structure between RIMMs used.

1 is a schematic diagram illustrating a signal transmission method of a Rambus DRAM memory module.

2 and 3 are diagrams for explaining signal transmission paths of a dual inline memory module and a Rambus DRAM memory module.

4 and 5 are perspective views illustrating a connection structure between Rambus DRAM memory modules using a bridge printed circuit board according to an exemplary embodiment of the present invention.

6A to 6C are diagrams illustrating an electrode structure of a Rambus DRAM memory module according to an embodiment of the present invention.

7A and 7B are views for explaining a bridge printed circuit board according to another embodiment of the present invention.

8 is a diagram illustrating a connection structure between Rambus DRAM memory modules using a bridge printed circuit board according to another exemplary embodiment of the present invention.

Explanation of symbols on the main parts of the drawings

14,15: electrode terminal 20: Rambus DRAM memory module

21,22: hole 23: heat sink

30: bridge printed circuit board 31: socket

40: motherboard

The connection structure between RIMMs using the bridge PCB of the present invention for achieving the above object is electrically connected to each other by a bridge PCB in which a pair of spaced and arranged RIMMs are disposed on their upper surfaces to provide a signal transmission path. In the connection structure between the RIMMs using the bridge PCB connected, the bridge PCB is characterized in that provided with a length less than the total length of the RIMM.

In addition, the connection structure between the RIMMs using the bridge PCB of the present invention uses a bridge PCB in which a pair of spaced and arranged RIMMs are electrically interconnected by a bridge PCB disposed on their upper surface to provide a signal transmission path. In the connection structure between RIMMs, the bridge PCB is characterized in that provided with a plurality of stripe-shaped holes therein.

In addition, the connection structure between the RIMMs using the bridge PCB of the present invention uses a bridge PCB in which a pair of spaced and arranged RIMMs are arranged on their upper surface and electrically interconnected by a bridge PCB providing a signal transmission path. In the connection structure between RIMMs, the bridge PCB is characterized in that the heat sink is attached to the lower surface.

According to the present invention, the heat dissipation characteristics of the RIMM can be improved by reducing the size of the bridge PCB, providing a hole therein, or attaching a heat sink to the lower surface thereof, so that the operating characteristics are lowered. Can be prevented.

(Example)

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

4 and 5 are diagrams illustrating a connection structure between RIMMs using a bridge PCB according to an embodiment of the present invention. In this embodiment, the bridge PCB 30 is provided with a length smaller than the full length of the RIMM 20, as shown, disposed in the middle of the upper surface of the RIMM 20, or separated form Spaced apart. In the figure, arrows indicate heat release.

The connection structure between the RIMMs 20 is easier to heat dissipation compared with the conventional structure, so that, compared with the conventional one, the degradation of operating characteristics of the RIMM 20 due to heat is suppressed.

On the other hand, in order to apply the Brit PCB 30 as described above to the electrical interconnection between the RIMMs 20, it is disposed on the upper surface of the RIMM 20 to be in contact with the pads (not shown) of the bridge PCB 30. It is preferable to change the arrangement of the electrode terminals as shown in Figs. 6B and 6C. Here, reference numeral 15 denotes an electrode terminal. 6A is a diagram showing the arrangement of the electrode terminals 14 of the conventional RIMM.

7A and 7B are plan views illustrating a bridge PCB according to another exemplary embodiment of the present invention for improving heat dissipation characteristics. In this embodiment, the bridge PCB 30 is provided with several striped holes 21 and 22 therein, and these holes 21 and 22 are integrally provided, or the dot-shaped holes 22 are provided. It is provided in a form arranged in a line.

In this embodiment as in the previous embodiment, since the bridge PCB 30 does not completely encapsulate the upper surface of the RIMM, heat dissipation is facilitated as compared with the conventional one, so that the operation characteristic of the RIMM due to heat is suppressed. do.

FIG. 8 is a cross-sectional view showing a connection structure between RIMMs according to another embodiment of the present invention for improving heat dissipation characteristics. In this embodiment, a heat sink 23 is provided on a lower surface of the bridge PCB 30. Is attached, and the heat generated during the operation of the RIMM 20 by the heat sink 23 can be quickly released to the outside. Therefore, also in this embodiment, the degradation of the operating characteristics of the RIMM due to heat is suppressed. Here, reference numeral 31, which has not been described, denotes a socket into which the RIMM 20 is inserted and fixed, and 40 denotes a mother board.

On the other hand, although not shown, the heat sink 23 can be attached to the upper surface as well as the lower surface of the bridge PCB (30).

As described above, the present invention provides an operating characteristic of the RIMM by heat by reducing the length of the bridge PCB, providing holes therein, or attaching heat sinks to the upper and lower surfaces, thereby increasing the heat release path. The fall can be suppressed.

In addition, this invention can be implemented in various changes within the range which does not deviate from the summary.

Claims (6)

A pair of spaced and placed Rambus DRAM memory modules are placed on their top surface to provide a connection structure between Rambus DRAM memory modules using a bridge printed circuit board electrically interconnected by a bridge printed circuit board providing a signal transmission path. In The bridge printed circuit board is a connection structure between Rambus DRAM memory modules using a bridge printed circuit board, characterized in that provided with a length less than the total length of the Rambus DRAM in-line memory module. 2. The connection structure of Rambus DRAM memory modules using a bridge printed circuit board according to claim 1, wherein the bridge printed circuit board is provided in a separated form. A pair of spaced and placed Rambus DRAM memory modules are placed on their top surface to provide a connection structure between Rambus DRAM memory modules using a bridge printed circuit board electrically interconnected by a bridge printed circuit board providing a signal transmission path. In The bridge printed circuit board is a connection structure between Rambus DRAM memory modules using a bridge printed circuit board, characterized in that provided with a plurality of stripe-shaped holes therein. 4. The structure of claim 3, wherein the stripe-shaped holes are integral or dot-shaped holes are arranged in a row. A pair of spaced and placed Rambus DRAM memory modules are placed on their top surface to provide a connection structure between Rambus DRAM memory modules using a bridge printed circuit board electrically interconnected by a bridge printed circuit board providing a signal transmission path. In The bridge printed circuit board is a connection structure between Rambus DRAM memory modules using a bridge printed circuit board, characterized in that the heat sink is attached to the lower surface. 6. The structure of claim 5, wherein the heat dissipation plate is attached to an upper surface of the bridge printed circuit board.