KR200200227Y1 - Entry board for manufacturing pcb - Google Patents
Entry board for manufacturing pcb Download PDFInfo
- Publication number
- KR200200227Y1 KR200200227Y1 KR2020000014687U KR20000014687U KR200200227Y1 KR 200200227 Y1 KR200200227 Y1 KR 200200227Y1 KR 2020000014687 U KR2020000014687 U KR 2020000014687U KR 20000014687 U KR20000014687 U KR 20000014687U KR 200200227 Y1 KR200200227 Y1 KR 200200227Y1
- Authority
- KR
- South Korea
- Prior art keywords
- board
- entry
- entry board
- manufacturing
- pcb
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0214—Back-up or entry material, e.g. for mechanical drilling
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Drilling And Boring (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
본 고안은 인쇄회로기판 제조용 엔트리보드에 관한 것으로서, 생산성을 높이고 불량률을 줄일 수 있는 엔트리보드에 관한 것이다.The present invention relates to an entry board for manufacturing a printed circuit board, and to an entry board that can increase productivity and reduce a defective rate.
본 고안에 따르면, 백업보드(1) 위에 다수의 회로판 적층체(2,2,2)를 올려 놓고 그 위에 엔트리보드(3)를 덮은 다음에 소정 부위에 드릴(5)로써 구멍(6)을 천공하는 드릴링 공정에 사용하는 PCB제조용 엔트리보드(3)에 있어서, 상기 엔트리보드(3)는 열전도성 금속판(8)과, 이 금속판(8)의 일면에 코팅된 윤활제층(9)으로 이루어진 것을 특징으로 하는 PCB제조용 엔트리보드가 제공된다.According to the present invention, a plurality of circuit board stacks (2, 2, 2) are placed on the back up board (1), the entry board (3) is covered thereon, and the holes (6) are drilled in a predetermined area. In the entry board (3) for manufacturing a PCB used in a drilling process for drilling, the entry board (3) comprises a thermally conductive metal plate (8) and a lubricant layer (9) coated on one surface of the metal plate (8). An entry board for manufacturing a PCB is provided.
Description
본 고안은 인쇄회로기판 제조용 엔트리보드에 관한 것으로서, 좀 더 상세히는 드릴링 작업공정을 개선하여 생산성을 높이고 불량률을 줄일 수 있는 새로운 구조의 인쇄회로기판 제조용 엔트리보드에 관한 것이다.The present invention relates to an entry board for manufacturing a printed circuit board, and more particularly, to an entry board for manufacturing a printed circuit board of a new structure that can improve productivity and reduce defect rate by improving a drilling work process.
인쇄회로기판(이하 PCB라 칭함)을 제조하는 공정 중에서, 다층으로 적층된 회로판의 각 층간에 배치된 회로를 전기적으로 서로 연결하기 위해 회로판 적층체의 소정 부위에 구멍을 뚫고, 이 구멍부위를 전도성 재료로 코팅하게 된다. 이와 같이 각 층간의 회로사이의 전기적 연결을 위해 회로판 적층체에 구멍을 뚫는 공정을 드릴링 공정이라고 하는데, 이를 위해서는 도 1에 도시된 바와 같이, 백업보드(1) 위에 다수의 회로판 적층체(2,2,2)를 올려 놓고 그 위에 엔트리보드(3)를 덮은 다음에 소정부위에 드릴(5)로서 구멍(6)을 천공한다. 상기 엔트리보드(3)는 드릴링공정에서 회로판 적층체를 적절하게 눌러줌으로써의, 회로판 적층체의 불필요한 위치변동을 방지하고, 구멍을 정밀하고 매끄럽게 가공할 수 있도록 하며, 드릴링 작업시에 발생하는 마찰열을 신속하게 방출하기 위해 통상적으로 알루미늄과 같은 열전도율이 우수한 금속판을 사용한다.In the process of manufacturing a printed circuit board (hereinafter, referred to as a PCB), holes are formed in predetermined portions of the circuit board stack to electrically connect circuits disposed between the layers of the circuit board stacked in multiple layers, and the holes are conductive. Coating with material. As such, a process of drilling holes in a circuit board stack for electrical connection between circuits between layers is called a drilling process. For this purpose, as illustrated in FIG. 1, a plurality of circuit board stacks 2, 2 and 2 are placed, the entry board 3 is covered thereon, and the hole 6 is drilled as a drill 5 at a predetermined position. The entry board 3 prevents unnecessary displacement of the circuit board stack by properly pressing the circuit board stack in the drilling process, enables precise and smooth processing of holes, and removes frictional heat generated during drilling. In order to release quickly, a metal plate having excellent thermal conductivity such as aluminum is usually used.
그런데, 실제의 드릴링 공정에서, 드릴이 고속으로 회전하기 때문에, 다량의 마찰열이 발생함으로써, 엔트리보드(3) 만으로는 충분한 정도로 방열작용을 하지 못하여, 구멍 부위에 발생한 열이 PCB 재료인 에폭시수지를 녹게 함으로써, 구멍이 매끄럽고 정밀하게 가공되지 못하여 제품의 불량을 초래하였다. 아울러, 다량의 마찰열이 발생하지 못하도록, 백업보드(1)와 엔트리보드(3) 사이에 적층하여 한번에 드릴링할 수 있는 회로판 적층체(2)의 갯수도 제한되게 되어, 생산성도 만족스럽지 못하였다.By the way, in the actual drilling process, since the drill rotates at a high speed, a large amount of The frictional heat is generated, the entry board 3 alone does not radiate to a sufficient degree, and the heat generated in the hole portion melts the epoxy resin, which is a PCB material, and the hole is not processed smoothly and precisely, resulting in product defects. In addition, the number of circuit board laminates 2 that can be drilled at a time by stacking between the backup board 1 and the entry board 3 so as not to generate a large amount of frictional heat is also limited, and the productivity is not satisfactory.
본 고안은 전술한 바와 같은 종래의 PCB 제조의 드릴링 공정상의 문제점에 착안하여 제안된 것으로서, 본 고안은 드릴링 공정시의 마찰열을 줄일 수 있어서, 다량의 발열로 인한 제품불량이나 생산성의 저하를 방지할 수 있는 새로운 구조의 PCB 제조용 엔트리보드를 제공하고자 하는 것이다.The present invention has been proposed in view of the problems in the conventional drilling process of PCB manufacturing as described above, the present invention can reduce the frictional heat during the drilling process, it is possible to prevent product defects or deterioration of productivity due to a large amount of heat generated It is to provide an entry board for manufacturing a new structure PCB.
도 1은 PCB 제조 과정의 드릴링공정의 개념도1 is a conceptual diagram of a drilling process of the PCB manufacturing process
도 2는 본 고안에 따른 엔트리보드의 구성도2 is a block diagram of an entry board according to the present invention
<도면의 주요부분에 대한 부호의 설명><Explanation of symbols for main parts of the drawings>
1. 백업보드 2. 회로판적층체1. Backup board 2. Circuit board laminate
3. 엔트리보드 5. 드릴3. Entry board 5. Drill
6. 구멍 8.금속판6. Hole 8. Metal plate
9. 윤활제층9. Grease layer
본 고안에 따르면, 백업보드(1) 위에 다수의 회로판 적층체(2,2,2)를 올려 놓고 그 위에 엔트리보드(3)를 덮은 다음에 소정 부위에 드릴(5)로써 구멍(6)을 천공하는 드릴링 공정에 사용하는 PCB제조용 엔트리보드(3)에 있어서, 상기 엔트리보드(3)는 열전도성 금속판(8)과, 이 금속판(8)의 일면에 코팅된 윤활제층(9)으로 이루어진 것을 특징으로 하는 PCB제조용 엔트리보드가 제공된다.According to the present invention, a plurality of circuit board stacks (2, 2, 2) are placed on the back up board (1), the entry board (3) is covered thereon, and the holes (6) are drilled in a predetermined area. In the entry board (3) for manufacturing a PCB used in a drilling process for drilling, the entry board (3) comprises a thermally conductive metal plate (8) and a lubricant layer (9) coated on one surface of the metal plate (8). An entry board for manufacturing a PCB is provided.
이하에서 도면을 참조하여 본 고안의 바람직한 실시예를 설명한다. 도 2는 본 고안에 따른 엔트리보드(3)의 구성도로서, 도시된 바와 같이, 본고안의 엔트리보드(3)는 열전도성이 우수한 금속판(8)과, 그 상면에 코팅된 윤활제층(9)으로 이루어진다. 금속판(8)으로는, 방열특성이나 기타의 물리적 특성 대비 가격이 저렴한 알루미늄시트가 주로 사용된다. 그리고, 윤활제층(9)을 이루는 윤활제로는, 상온에서 응고되어 엔트리보드에 잘 부착되고 가열되면 잘 녹아서 유동성이 우수한 유동파라핀이나 기타의 윤활제를 사용하는 것이 바람직하다.Hereinafter, with reference to the drawings will be described a preferred embodiment of the present invention. FIG. 2 is a configuration diagram of the entry board 3 according to the present invention. As shown in the drawing, the entry board 3 of the present invention is a metal plate 8 having excellent thermal conductivity, and a lubricant layer 9 coated on the upper surface thereof. Is done. As the metal plate 8, an aluminum sheet which is inexpensive compared with other heat dissipation characteristics or other physical characteristics is mainly used. As the lubricant forming the lubricant layer 9, it is preferable to use a liquid paraffin or other lubricant that solidifies at room temperature, adheres well to the entry board, and melts well when heated.
이러한 본 고안에 따르면, 드릴링 작업시, 윤활제층(9)이 녹아서 윤활작용을 함으로써, 드릴(5)과 구멍(6) 사이에 마찰을 줄일 수 있어서, 마찰열을 줄일 수 있고, 이에 따라 마찰열에 위한 에폭시수지의 용융 및 이로 인한 제품불량을 억제할 수 있다. 또한, 마찰열이 상대적으로 작으므로, 백업보드(1)와 엔트리보드(3) 사이에 투입하여 한번에 드릴가공할 수 있는 회로판 적층체의 수량도 늘릴 수 있어서, 드릴링 공정의 생산성을 증대시킬 수 있다.According to the present invention, during the drilling operation, the lubricant layer 9 melts and lubricates, thereby reducing friction between the drill 5 and the hole 6, thereby reducing the frictional heat, and thus It is possible to suppress the melting of the epoxy resin and the resulting product defects. In addition, since the frictional heat is relatively small, the number of circuit board stacks that can be drilled at a time between the backup board 1 and the entry board 3 can be increased, thereby increasing the productivity of the drilling process.
이상에서 설명한 본 고안에 따르면, PCB 제조의 드릴링공정에서 사용하는 엔트리보드의 일면에 윤활제를 코팅함으로써, 드릴작업시의 윤활작용을 높이고 발열량을 줄임으로써, 생산성의 향상과 아울러, 품질의 불량을 억제할 수 있는 탁월한 성능의 엔트리보드를 달성할 수 있다.According to the present invention described above, by coating a lubricant on one surface of the entry board used in the drilling process of PCB manufacturing, by increasing the lubrication action during the drilling operation and reducing the calorific value, to improve the productivity and suppress the quality defects Achieve entry board performance with excellent performance.
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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KR2020000014687U KR200200227Y1 (en) | 2000-05-24 | 2000-05-24 | Entry board for manufacturing pcb |
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KR2020000014687U KR200200227Y1 (en) | 2000-05-24 | 2000-05-24 | Entry board for manufacturing pcb |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20020074908A (en) * | 2001-03-22 | 2002-10-04 | 디에스테크널러지(주) | The hole making method and its device on the MLB substrade in the process of hole making |
KR101463174B1 (en) * | 2013-05-27 | 2014-12-05 | 주식회사 디엔피코퍼레이션 | Device for Auto-Processing of PCB's Raw Materials |
-
2000
- 2000-05-24 KR KR2020000014687U patent/KR200200227Y1/en not_active IP Right Cessation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20020074908A (en) * | 2001-03-22 | 2002-10-04 | 디에스테크널러지(주) | The hole making method and its device on the MLB substrade in the process of hole making |
KR101463174B1 (en) * | 2013-05-27 | 2014-12-05 | 주식회사 디엔피코퍼레이션 | Device for Auto-Processing of PCB's Raw Materials |
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