KR20020017368A - Led mounted on surface and method for manufacturing the same - Google Patents

Abstract

PURPOSE: A surface-mounting light emitting diode(LED) is provided to remarkably reduce fabricating cost, by simultaneously forming a plurality of surface-mounting LED's on a glass epoxy substrate so that a light collecting lens unit is formed as one body with encapsulation resin and is automatically mounted on a mother board. CONSTITUTION: An LED(15) is disposed on the glass epoxy substrate(12). After an electrode of the LED is connected to a pair of electrodes formed on the glass epoxy substrate, the upper portion of the glass epoxy substrate is encapsulated by a resin material. A reflection frame(21) is disposed near the LED. The first resin material(25) mixed with a material for modifying a wavelength is filled in the reflection frame. Simultaneously, the second resin material(27) and the third resin material(28) as an outermost layer are stacked on the glass epoxy substrate including the reflection frame, wherein an ultraviolet absorbing material is mixed in at least the third resin material.

Description

Surface Mount Light-Emitting Diode and Manufacturing Method Thereof {LED MOUNTED ON SURFACE AND METHOD FOR MANUFACTURING THE SAME}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface mount type light emitting diode that can be surface mounted on a motherboard and a method for manufacturing the same, and more particularly, to a type of surface mount type light emitting diode that changes its emission color by converting a wavelength of a light emitting diode element.

(Conventional technology)

Conventionally, as shown in Fig. 1, for example, this kind of wavelength conversion type light emitting diode is known (Japanese Patent Laid-Open No. 7-99345). This is a lead frame type light emitting diode (1), in which a recess (3) is provided in a metal post (2) on one side of the lead frame, and a light emitting diode element (4) is mounted on the recess (3). At the same time, the light emitting diode element 4 and the metal stem 5 on the other side of the lead frame are connected by bonding wires, and a fluorescent material for converting wavelengths and the like are mixed in the concave portion 3. The resin material 76 was filled, and the whole was further sealed by the shell type transparent epoxy resin 8. In the light emitting diode 1 having such a structure, since the light emission wavelength in the light emitting diode element 4 is wavelength-converted by the resin material 7 filled in the recess 3, the light emitting diode element 4 It is possible to irradiate luminescence different from the original luminescence color of.

However, since the fluorescent material for wavelength conversion and the like mixed in the resin material 7 have a property of being easily aged by ultraviolet rays from the outside, the entirety as described above is transferred to the transparent epoxy resin 8. As the light emitting diode 1 which is only sealed by this, there is a problem that the above-mentioned fluorescent substance is deflected under the influence of ultraviolet rays from the outside.

(Summary of invention)

The first object of the present invention is to make the structure of the light emitting diode surface mount, and at the same time to make the wavelength conversion material such as the fluorescent material hardly influenced by ultraviolet rays from the outside. It is to suppress aging.

Moreover, the 2nd object of this invention is to prevent the fall of the brightness | luminance of a light emitting diode for the reason which made it the structure which became hard to be influenced by an ultraviolet-ray.

In order to solve the above problems, the surface mount light emitting diode according to the present invention includes a light emitting diode element disposed on an upper surface of a glass epoxy substrate, and a pair of electrodes formed on the electrode of the light emitting diode element and a glass epoxy substrate. A surface-mounted light emitting diode comprising a resin epoxy encapsulated in an upper portion of a glass epoxy substrate after contact with each other, wherein a reflecting frame is disposed around the light emitting diode element, and a wavelength conversion material is incorporated in the reflecting frame. While filling the resin body of 1 and encapsulating the light emitting diode element, a second resin body and a third resin body as a surface layer are stacked on the glass epoxy substrate including the reflecting frame in a layer to encapsulate the whole, and at least In the resin body of 3, the ultraviolet absorber is mixed. It is characterized by the above-mentioned.

Moreover, the surface mount type light emitting diode which concerns on another aspect of this invention is characterized in that the upper surface of the said filled 1st resin body is in the position lower than the considerable edge of a reflection frame.

The surface mount light emitting diode according to another aspect of the present invention is characterized in that the wavelength conversion material incorporated into the first resin body is a fluorescent substance made of a fluorescent dye or a fluorescent pigment.

Moreover, the surface mount type light emitting diode which concerns on another aspect of this invention is characterized in that the said 2nd resin body contains the diffusing agent which diffuses the wavelength converted light.

Moreover, the surface mount type light emitting diode which concerns on another aspect of this invention is a cap shape in which the said 3rd resin body coat | covers the whole said 2nd resin body, and the outer peripheral part is adhesively fixed to the upper surface of a glass epoxy board | substrate. It is characterized by.

Moreover, the surface mount light emitting diode which concerns on another aspect of this invention is characterized by the condensing lens part formed in the upper surface of the said 3rd resin body.

Moreover, the surface mount light emitting diode which concerns on another aspect of this invention is characterized in that the said light emitting diode element is a blue light emitting element which consists of a gallium nitride compound semiconductor or a silicon carbide compound semiconductor.

Moreover, the manufacturing method of the surface mount type light emitting diode which concerns on this invention is a process of bonding and fixing a reflector frame assembly on the upper surface of the glass epoxy assembly board | substrate in which a pair of electrode is formed, and a light emitting diode element inside each reflecting frame. Arranging and connecting the electrodes of the light emitting diode element and the pair of electrodes formed on the glass epoxy substrate, respectively, and filling the first resin body into which the wavelength conversion material is mixed in the reflecting frame. Sealing the device, sealing the upper portion of the glass epoxy assembly substrate including the reflecting frame with a second resin body in which the diffusion material is mixed, and a third surface containing the ultraviolet absorber in the upper surface of the second resin body. According to the process of encapsulating with the resin body and the cutting line assumed on the glass epoxy assembly substrate, the substrate is cut for each size of the substrate constituting each LED. One is characterized in that it includes the step and for dividing the light emitting diode.

According to such a structure, since the ultraviolet absorber is mixed in the surface layer part of the resin encapsulation material, the wavelength conversion material near the light emitting diode element is less likely to be affected by ultraviolet rays from the outside, thereby suppressing the aging of the wavelength conversion material. There is a number.

In addition, since the ultraviolet absorber is mixed only in the surface layer portion of the resin encapsulation member, the whiteness of the light emitting diode is not significantly reduced because of this.

In addition, since the upper surface of the first resin body filled in the reflecting frame is located at a lower position than the upper edge of the reflecting frame, even when a plurality of surface mount light emitting diodes are arranged in close proximity, the light emitted from one light emitting diode may It can block at the upper edge of the reflecting frame of a light emitting diode, and the light emission color of both light emitting diodes is not mixed.

Moreover, by incorporating a diffusing agent into the second resin body, the wavelength-converted light is diffused to obtain a uniform color of emitted light.

In addition, since the entire second resin body is covered with a cap-shaped third resin body, the wavelength conversion material located therein becomes less susceptible to the influence of ultraviolet rays from the outside.

In addition, since the condensing lens portion is formed on the upper surface of the third resin body, light from the light emitting diode element is condensed by the condensing lens portion to obtain high luminance light emission.

In addition, according to the manufacturing method of the present invention, since a large number of surface mount light emitting diodes can be simultaneously formed on a glass epoxy assembly substrate, a significant cost reduction is possible and the economic effect is large. In addition, the condenser lens unit is integrally molded with the encapsulation resin, and the mounting on the motherboard can be performed automatically, thereby reducing the number of processes, improving the profit margin, and further improving the reliability.

The features and advantages of the present invention as described above are described in detail below with reference to the accompanying drawings.

1 is a cross-sectional view showing an example of a conventional wavelength conversion light emitting diode;

2 is a perspective view showing a first embodiment of a surface mount light emitting diode according to the present invention;

3 is a cross-sectional view taken along line A-A in FIG. 2 when the surface mounted light emitting diode is mounted on a motherboard;

4 is a perspective view showing an electrode pattern forming process when manufacturing the surface mount light-emitting diode as an integrated substrate;

5 is a perspective view showing a process of placing a reflection frame assembly on the assembly board;

6 is a cross-sectional view showing a step of mounting a light emitting diode element on the assembly substrate and wire bonding the same;

7 is a cross-sectional view showing a step of encapsulating the light emitting diode element on the assembly substrate with a first resin member;

8 is a cross-sectional view showing a step of encapsulating an upper portion of the assembly substrate with a second resin body;

9 is a cross-sectional view showing a step of sealing an upper portion of the second resin body with a third resin body;

10 is a cross-sectional explanatory view in the case of dividing the assembly board along cutting lines in the X and Y directions;

11 is a perspective view showing a second embodiment of a surface mount light emitting diode according to the present invention;

12 is a cross-sectional view taken along line B-B in FIG. 11 when the surface mounted light emitting diode is mounted on a mother board;

FIG. 13 is a perspective view showing an electrode pattern forming step and a step of placing a reflecting frame assembly when the surface mounted light emitting diode is manufactured by using an assembly substrate; FIG.

14 is a cross-sectional view showing a step of encapsulating an upper portion of the assembly substrate with a second resin body;

15 is a cross-sectional view showing a step of sealing an upper portion of the second resin body with a third resin body;

16 is a cross-sectional explanatory diagram in the case of dividing the assembly substrate according to the second embodiment along a cutting line in the X direction;

17 is a perspective view showing a third embodiment of the surface mount type light emitting diode according to the present invention;

18 is a cross-sectional view taken along the line C-C in FIG. 17 when the surface mounted light emitting diode is mounted on a motherboard;

19 is a cross-sectional view taken along the line D-D in FIG. 17,

20 is a cross-sectional view when the third resin encapsulation body produced in a separate step is covered on the second resin encapsulation body;

FIG. 21 is a perspective view showing a step of encapsulating an upper portion of the second resin encapsulation member with a third resin encapsulation body in the case of manufacturing the assembly substrate;

FIG. 22 is a cross-sectional view taken along the line E-E in FIG. 21;

Fig. 23 is a cross-sectional explanatory diagram in the case of dividing the assembly substrate according to the third embodiment along the cutting lines in the X and Y directions.

(Description of Example)

EMBODIMENT OF THE INVENTION Hereinafter, based on an accompanying drawing, embodiment of the surface mount type light emitting diode and manufacturing method which concern on this invention is described in detail. 2 and 3 show a first embodiment of the surface mounted light emitting diode 11 according to the present invention. In the surface mount type light emitting diode 11 according to this embodiment, a pair of electrodes (for example, the cathode electrode 13 and the anode electrode 14) is patterned on the upper surface of the rectangular glass epoxy substrate 12, and one side is formed. After mounting the light emitting diode element 15 on the cathode electrode 13, the upper part was sealed with the resin body. These electrodes 13 and 14 turn to the back side through the through-hole electrodes 16a and 16b provided at both ends of the glass epoxy substrate 12, and as shown in Fig. 3, the back electrodes 17a and 17b It is connected to the printed wirings 19a and 19b provided on the motherboard 18. Furthermore, a masking tape 34 is attached to the upper surfaces of the through hole electrodes 16a and 16b.

As shown in Figs. 2 and 3, the cathode electrode 13 extends to the center of the upper surface of the glass epoxy substrate 12, and the light emitting diode element 15 is fixed to the center electrode portion 20 by adhesion. Moreover, the cylindrical reflecting frame 21 is arrange | positioned at the center electrode part 20 so that this light emitting diode element 15 may be enclosed. The inner circumferential surface of the reflecting frame 21 is inclined in the shape of a mortar, and has a function of reflecting light emission of the light emitting diode element 15 to the inner circumferential surface and condensing upward. The inner circumferential surface has a mirror surface finish in order to increase the reflectance of the light from the light emitting diode element 15.

The light emitting diode element 15 disposed in the reflecting frame 21 is a microchip having a substantially cuboid shape, and has electrodes on the lower surface and the upper surface, respectively. The lower surface electrode is adhesively fixed to the cathode electrode 13 in the reflecting frame 21 with the conductive adhesive 22, while the upper surface electrode is connected to the anode electrode 14 by the bonding wire 23. In this embodiment, the light emitting diode element 15 is a blue light emitting element made of a silicon carbide compound semiconductor, but a blue light emitting element of a gallium nitride compound semiconductor may be used. In this case, since there is no electrode on the lower surface of the light emitting element, it is necessary to connect both the P electrode and the N electrode to each of the cathode electrode 13 and the anode electrode 14 by the bonding wires 23.

In this embodiment, the first resin body 25 for encapsulating the light emitting diode element 15 is filled in the reflecting frame 21. In the first resin body 25, a wavelength conversion material that is excited by blue light emission and emits long wavelength visible light is mixed. For example, blue light emission can be converted to white to emit light. Fluorescent materials made of fluorescent dyes, fluorescent pigments, and the like are used for the wavelength conversion material, and organic fluorescent materials such as fluorescein and rhodamine are used as fluorescent dyes, and inorganic fluorescent materials such as calcium tungstate are used as fluorescent pigments. Can be used. Furthermore, since the mixing amount of these fluorescent substances is changed, the wavelength range for conversion can be adjusted. In this embodiment, as shown in Figs. 2 and 3, the filling amount of the first resin body 25 is preferably such that its upper surface is lower than the upper edge 26 of the reflecting frame 21. Do. In this way, even when a plurality of surface mount light emitting diodes 11 are arranged in close proximity, the light emitted from one light emitting diode can be blocked by the upper edge 26 of the reflecting frame 21 of the other light emitting diode. It is possible to prevent the light emitting colors of the LEDs from mixing with each other. Moreover, epoxy resins are generally used for resin materials incorporating these fluorescent substances.

The upper portion of the glass epoxy substrate 12 including the reflection frame 21 is sealed by the second resin body 27. This second resin body 27 also has an epoxy transparent resin as a main component, and has a certain thickness and is formed in the same planar shape as the glass epoxy substrate 12. The second resin body 27 transmits the emission color changed by the first resin body 25 as it is, and epoxy transparent resin may be used alone, but aluminum oxide or silicon dioxide is used in this manner. By incorporating diffusing agents such as these, a more uniform luminous color is obtained.

Furthermore, in this Example, the 3rd resin body 28 is laminated | stacked several layers in the upper part of the said 2nd resin body 27. As shown in FIG. Ultraviolet light absorbers, such as salicylic acid derivatives and 2-hydroxybenzophenone derivatives, are mixed in the third resin body 28, and the ultraviolet rays from external light are blocked here, and the ultraviolet rays to the first resin body 25 are mixed. The effect of suppressing the aging of the mixed fluorescent material is reduced. The third resin 28 has the same planar shape as the second resin 27, but the thickness thereof is thinner than that of the second resin 27. This is because the purpose of the third resin body 28 is to prevent the aging of the fluorescent material caused by the ultraviolet rays. Therefore, if the ultraviolet rays can be effectively blocked, the light emission luminance is lowered if the thickness is too thin and sufficient. In this embodiment, a hemispherical condensing lens portion 29 is integrally formed on the central portion of the upper surface of the third resin body 28. This condensing lens portion 29 is located above the reflecting frame 21 and serves as a convex lens for condensing light from the light emitting diode element 15 reflected upward from the inner circumferential surface of the reflecting frame 21. Has action. That is, the light emitted from the light emitting diode element 15 is divided into one which proceeds upward as it is, and which is reflected from the inner circumferential surface of the reflecting frame 21 and then directed upward, but any light is directed to the first resin body 25. As a result of wavelength conversion, the second resin body 27 makes the light emission color uniform and is condensed by the condensing lens unit 29. Thus, high luminance white light emission is obtained. The curvature radius, shape, and refractive index of the condensing lens unit 29 are not particularly limited in the range in which condensing is obtained. Furthermore, the condensing lens portion 29 may not be provided in the third resin body 28.

As shown in FIG. 3, the surface mounted light emitting diode 11 having the above configuration can be directly mounted on the upper surface of the motherboard 18. That is, the surface mounted light emitting diode 11 is placed on the printed wirings 19a and 19b formed on the upper surface of the motherboard 18 upwards, and the back electrodes 17a and the left and right sides of the glass epoxy substrate 12 are placed. The soldering of 17b) completes the mounting of the light emitting diode with the reduced height dimension. In this way, the surface-mounted light emitting diode 11 mounted on the motherboard 28 emits light having directivity in the upward direction without discoloring the light changed from blue light emission to white light emission.

4 to 10 show a method of manufacturing the surface mounted light emitting diode 11 having the above configuration. This manufacturing method is a method of manufacturing a plurality of light emitting diodes at the same time by using an assembly substrate. 4 shows an electrode pattern 32 constituting a cathode electrode and an anode electrode and a light hole through hole 33 constituting a through hole electrode for each glass epoxy substrate 12 described above on the glass epoxy assembly substrate 31. And the steps up to closing the round hole through-hole portion 33 with the masking tape 34 are shown.

FIG. 5 illustrates a process of positioning the reflectance assembly 35 on the upper surface of the glass epoxy assembly substrate 31, placing the reflection frame 21 at a predetermined position of the electrode pattern 32, and fixing the adhesive.

In the next step, as shown in Fig. 6, a light emitting diode element 15 is placed in each reflecting frame 21 of the glass epoxy assembly substrate 31, and the bottom surface thereof is conductive to the central electrode portion 20. The adhesive 22 adheres. After fixing the light emitting diode element 15 in a curing furnace, the top electrode of the light emitting diode element 15 and the anode electrode 14 of the glass epoxy substrate 12 are connected by a bonding wire 23.

7 shows a sealing step of the first resin body 25. In this encapsulation step, the first resin 25 containing the fluorescent material is poured into each of the reflecting frames 21 and filled to a position where the upper surface of the light emitting diode element 15 is hidden. Furthermore, in the case of filling, care is taken so that the upper surface of the first resin 25 does not reach the upper edge 26 of the reflecting frame 21. After filling, it is placed in a curing furnace to thermoset the first resin body 25.

8 shows a sealing step of the second resin body 27. In this encapsulation step, the mold 36 is provided around the upper surface of the glass epoxy gathering substrate 31, and the second resin 27 is poured into the mold 36 to form the entire upper surface of the glass epoxy gathering substrate 31. To seal at the same time.

Since the upper surface of the round hole through-hole part 33 is blocked by the masking tape 34, the 2nd resin material 27 does not flow in it. In this state, the glass epoxy assembly substrate 31 is placed in a curing furnace to thermally cure the second resin body 27.

9 shows a sealing step of the third resin body 28. In this sealing process, the other metal mold | die 37 in which the hemispherical recessed part 38 for integrally molding the condensing lens part 29 was formed is prepared, and the 3rd resin body 28 is filled in this time. Then, the glass epoxy assembly substrate 31 is inverted and laced down therefrom, and the glass epoxy assembly substrate 31 is cured in a state in which the third resin body 28 and the second resin body 27 are in contact with each other. Into the third resin body 28 to be thermally cured.

Fig. 10 shows the process after taking out from the curing furnace, and cutting the glass epoxy assembly substrate 31 sealed with the second resin body 27 and the third resin body 28 in the X and Y directions. Dicing or slicing checkerboard according to (39,40). As shown in FIGS. 4 and 10, the cutting line 39 in the X direction is a line along the length direction of the electrode pattern 32, and the cutting line 40 in the Y direction is on the round hole through hole 33. 돤 formed on the line. The surface-mounted light emitting diodes 11 divided in this way are transferred onto the vacuum-adsorbed motherboard 18 by an automatic mounter (not shown).

11 and 12 show a second embodiment of the surface mount light emitting diode 11 according to the present invention. Unlike the previous embodiment, the surface mounted light emitting diode 11 according to this embodiment has a side electrode 41a constituting the cathode electrode 13 and the anode electrode 14 on the side of the glass epoxy substrate 12. And 41b are provided over the entire side width and extend to the back electrodes 42a and 42b in this state. In addition, the 2nd resin body 27 and the 3rd resin body 28 are provided in the state which exposed both sides of the upper surface of the glass epoxy substrate 12 partially. Further, since other points are made of the same configuration as the surface mount light emitting diodes according to the previous embodiment and have the same working effects, detailed descriptions will be omitted with the same reference numerals.

13 to 16 show a method of manufacturing the surface mounted light emitting diode 11 in the second embodiment. The manufacturing method in this case is also basically the same as in the previous embodiment, and the same electrode pattern 32 is formed on the glass epoxy assembly substrate 31 as shown in FIG. The through hole 43 is formed. In this case, the masking tape becomes unnecessary. In addition, after positioning the reflective frame assembly 35 on the upper surface of the glass epoxy assembly substrate 31, each reflective frame 21 is adhesively fixed on the electrode pattern 32.

Since the process of mounting and wire-bonding the light emitting diode element 15 in the reflecting frame 21 and the sealing of the first resin body 25 are the same as those of the first embodiment shown in Figs. Omit the description.

FIG. 14 shows a step of installing a mold 44 on the upper surface of the glass epoxy assembly substrate 31 and filling the second resin body 27 therein, but the shape of the mold 44 It is different from that of the previous embodiment. In other words, the mold 44 not only surrounds the outer periphery of the glass epoxy assembly substrate 31 but also has a mold mask portion 45 in a tooth formed corresponding to each of the long hole through-hole portions 43. An upper surface of the long hole through hole portion 43 is blocked by the mask portion 45. The width of the mold mask portion 45 is larger than that of the long hole through hole portion 43. Therefore, when the second resin body 27 is filled, the mold mask portion 45 is filled in the long hole through hole portion 43. While the second resin body 27 does not flow, the second resin body 27 is formed at a position slightly away from the edge of the long hole through hole portion 43.

FIG. 15 shows the sealing process of the third resin body 28. Similarly to the previous embodiment, the mold 46 in which the concave portion 38 for integrally molding the condensing lens portion 29 is formed. Although used, the mold mask part 47 for blocking the long hole through-hole part 43 is also formed in this mold 46 similarly to the former metal mold 44, and is provided to the long hole through-hole part 43. The point which prevents the flow of the 3rd resin body 28 is different.

FIG. 16 illustrates a cutting process of the glass epoxy assembly substrate 31, but unlike the previous embodiment, only one surface-mounted light is emitted by dicing or slicing according to the cutting line 39 in the X direction. The diode 11 can be divided. That is, since the Y-direction is the long-hole through-hole part 43 and is divided from the beginning, it is not necessary to cut | disconnect.

17 to 19 show a third embodiment of the surface mount light emitting diode 11 according to the present invention. The surface mounted light emitting diode 11 according to this embodiment has a structure in which the entire second resin body 27 is covered with the third resin body 28 in the second embodiment. That is, the 2nd resin body 27 is formed in the state which exposed the upper outer peripheral part 12a of the glass epoxy substrate 12. As shown in FIG. In addition, the 3rd resin sealing body 28 is shape | molded by a separate process as shown in FIG. 20, and is recessed to cover the upper surface 27a and the main side surface 27b of the said 2nd resin body 27. As shown in FIG. It has the cap shape in which the place 30 was formed. This recessed part 30 forms the space corresponding to the shape of the 2nd resin body 27 by the upper wall surface 30a and the side wall surface 30b, and when it covers the 2nd resin body 27, It adheres to the outer peripheral surface. Moreover, the adhesive agent 24 is apply | coated to the lower wall surface 30c of the 3rd resin body 28 over the whole circumference, and when it is covered on the 2nd resin sealing body 27, the upper surface of the glass epoxy substrate 12 is carried out. It is adhesively fixed to the outer peripheral part 12a. In addition, since the other points consist of the same structure and the same effect as the surface mount type light emitting diode which concerns on the previous embodiment, detailed description is abbreviate | omitted by attaching | subjecting the same code | symbol.

21 to 23 show a method of manufacturing the surface mounted light emitting diode 11 in the third embodiment. Moreover, in this manufacturing method, since the sealing process of the 2nd resin body 27 is the same as that of the said 2nd Example, detailed description is abbreviate | omitted and it demonstrates from the sealing process of the 3rd resin body 28. FIG.

21 and 22 show a state after removing the mold 44 (see FIG. 14) for forming the second resin body 27, and the glass epoxy assembly substrate 31 is adjacent to each other. The voids 39 are formed between the resin bodies 27. For this reason, the upper peripheral part 12a of each glass epoxy substrate 12 is exposed. On the other hand, the third resin body 28 is formed as the aggregate 40 in a separate step and is covered from above the glass epoxy aggregate substrate 31. Each recess 30 of the assembly 40 is inserted into the second resin encapsulation 27 and the upper surface outer periphery 12a is applied to the lower wall surface 30c of the assembly 40 in advance. To adhere to. Then, this is put into a hardening furnace and the adhesive agent 24 is solidified.

FIG. 23 shows that the light emitting diode element 15 mounted on the glass epoxy assembly substrate 31 is formed of the first resin encapsulation member 25, the second resin encapsulation member 27, and the third resin encapsulation member 28. It shows the state encapsulated in a three-layer structure.

As shown in Figs. 21 and 23, the glass epoxy assembly substrate 31 is diced or sliced in a checkerboard shape according to the cutting lines 41 and 42 in the X and Y directions previously assumed on the substrate. 17 is divided into one surface-mounting side light emitting diode 11 as shown in FIG. Each of the divided surface mount light emitting diodes 11 is vacuum-absorbed by an automatic mounter (not shown) and transferred onto the motherboard 18.

Moreover, although all the above embodiments have described the connection method using the bonding wire 23, the present invention is not limited to this, and includes, for example, a bonding method such as flip chip mounting using solder bumps.

In addition, according to the manufacturing method of the present invention, since a large number of surface mount light emitting diodes can be simultaneously formed on a glass epoxy assembly substrate, a significant cost reduction is possible and the economic effect is large. In addition, the condenser lens unit is integrally molded with the encapsulation resin, and the mounting on the motherboard can be performed automatically, thereby reducing the number of processes, improving the profit margin, and further improving the reliability.

Claims (8)

A surface mount type in which a light emitting diode element is disposed on an upper surface of a glass epoxy substrate, the electrodes of the light emitting diode element and a pair of electrodes formed on the glass epoxy substrate are connected to each other, and the top of the glass epoxy substrate is encapsulated with a resin body. In the light emitting diode, A reflecting frame is arranged around the light emitting diode element, the first resin body containing the wavelength conversion material is filled in the reflecting frame to encapsulate the light emitting diode element, and at the same time, the glass epoxy substrate including the reflecting frame. A surface-mounted light emitting diode comprising a second resin body and a third resin body as a surface layer stacked on top of each other to encapsulate the whole, and an ultraviolet absorber mixed in at least the third resin body. The surface mounted light emitting diode of claim 1, wherein an upper surface of the filled first resin body is lower than an upper edge of the reflecting frame. The surface-mount light emitting diode according to claim 1, wherein the wavelength conversion material incorporated into the first resin body is a fluorescent material made of a fluorescent dye or a fluorescent pigment. The surface mounted light emitting diode according to claim 1, wherein a diffusion agent for diffusing the wavelength-converted light is mixed in the second resin body. 2. The surface mounted light emitting diode according to claim 1, wherein the third resin body covers the whole of the second resin body, and at the same time the outer circumferential portion is cap-shaped fixed to the upper surface of the glass epoxy substrate. The surface mounted light emitting diode according to claim 1 or 5, wherein a condensing lens portion is formed on an upper surface of said third resin body. 2. The surface mounted light emitting diode according to claim 1, wherein the light emitting diode element is a blue light emitting element comprising a gallium nitride compound semiconductor or a silicon carbide compound semiconductor. Bonding and fixing the reflective frame assembly on the upper surface of the glass epoxy assembly substrate on which the pair of electrodes are formed; and arranging the light emitting diode elements inside the respective reflective frames, and forming the electrodes and the glass epoxy substrate of the light emitting diode element. A step of connecting each pair of electrodes, a step of sealing a light emitting diode element by filling a first resin body in which a wavelength conversion material is mixed in the reflecting frame, and an upper portion of a glass epoxy assembly substrate including a reflecting frame; Is encapsulated in a second resin body in which a diffusion material is incorporated, a process of encapsulating the upper surface of the second resin body in a third resin body in which an ultraviolet absorber is incorporated, and a cutting line assumed on a glass epoxy assembly substrate. Therefore, each step of cutting the size of the substrate constituting the light emitting diode, characterized in that the step of dividing into one by one light emitting diode Method of manufacturing a surface mounted light emitting diode.