KR20020006275A - exhausting appararus for use in manufacturing of semiconductor device - Google Patents

Abstract

PURPOSE: An exhausting apparatus for manufacturing a semiconductor device is provided to prevent a disconnection of a robot signal and a corrosion problem, by installing a ventilation part in a predetermined region inside a process chamber so that gas remaining inside the chamber is easily exhausted to an exhaust duct. CONSTITUTION: The exhaust duct(102) through which unnecessary gas generated in manufacturing the semiconductor device is exhausted to the exterior of the process chamber(100) is installed in the exhausting apparatus. The ventilation part which transfers the necessary gas exhausted form a gas exhaust port to the exhaust duct is installed in the predetermined region inside the process chamber.

Description

Exhausting appararus for use in manufacturing of semiconductor device

The present invention relates to a semiconductor device manufacturing apparatus, and more particularly to an exhaust device for manufacturing a semiconductor device.

The process for manufacturing a semiconductor device can be classified into a single crystal manufacturing process, a mask manufacturing process, a wafer process process, a substrate process, a wiring process, an assembly process, a reliability inspection process, and the like. Here, the wafer process process is called a preprocess in semiconductor device manufacturing, and is a very basic and important process for determining the characteristics and yield of the semiconductor device. The wafer process process includes a normal cleaning process, a heat treatment process, an impurity implantation process, a thin film formation process, a lithography process, a planarization process, and the like, and to perform each of these processes, equipment suitable for each process is used.

On the other hand, the chemical vapor deposition (CVD) process for forming a thin film during the wafer process process, the planarization of the material film, or the wet etching process for patterning the material film during the lithography process is performed by using various chemical liquids. It is a process. When the chemical liquid used in the wet process is heated, chemical gases harmful to the human body are generated. Therefore, the process of discharging the chemical gas in the wet process may be essential.

1 shows a configuration diagram of an exhaust device according to a conventional method.

Referring to the drawings, the exhaust device comprises a process chamber 1 through which a wet process proceeds, an exhaust duct 2 for discharging chemical gas generated during the wet process, and the process chamber 1 and an exhaust duct 2. It consists of an exhaust pipe 3 for connecting. In the process chamber 1, a first gas outlet 4 and a second gas outlet 5 through which chemical gases generated during a wet process are ejected are formed.

The chemical gas ejected through the first gas outlet 4 and the second gas outlet 5 is discharged to the outside through an exhaust duct 2 connected to the exhaust pipe 3. At this time, when the gas discharged through the exhaust duct 2 is liquefied in contact with the cold air in the exhaust duct 2 is discharged to the outside through the drain line.

However, according to the conventional exhaust apparatus, the gas ejected through the first gas outlet 4 is easily discharged to the exhaust duct 2, but the gas ejected through the second gas outlet 5 is exhausted. It can be seen that the discharge into the duct 2 is not easy. That is, the gas ejection direction (reference numeral “A”) at the first gas ejection opening 4 is directed toward the exhaust pipe 3, and thus it is easy to be discharged to the exhaust duct 2. However, the gas ejection direction (reference numeral “B”) at the second gas ejection opening 4 does not face the exhaust pipe 3, and the exhaust duct 2 is not discharged smoothly.

As such, when the gas ejected from the second gas outlet 4 is not immediately discharged to the exhaust duct 2 and remains inside the process chamber 1, the robot gas is disconnected due to the defendant gas or corrosion of the equipment is caused. There is a problem.

It is therefore an object of the present invention to provide an exhaust device for manufacturing a semiconductor device which can solve the above-mentioned conventional problems.

Another object of the present invention is to provide an exhaust device for manufacturing a semiconductor device which can discharge the chemical gas generated during the wet process to the outside in a more effective manner.

Another object of the present invention is to provide an exhaust device for manufacturing a semiconductor device which can solve the problem that chemical gas generated during the wet process remains in the process chamber.

It is still another object of the present invention to provide an exhaust device for manufacturing a semiconductor device which can prevent disconnection of a robot signal or corrosion of equipment due to a chemical gas generated during a wet process.

In order to achieve the above objects, the present invention provides an exhaust apparatus comprising: an exhaust duct for exhausting an undesired gas generated during fabrication of a semiconductor device out of a process chamber; An exhaust device for manufacturing a semiconductor device is provided in a predetermined region inside the process chamber, and has a blower for using an unnecessary gas ejected from the gas ejection port toward the exhaust duct.

Preferably, the blower is formed in a region around the gas ejection opening through which no gas is ejected toward the exhaust duct.

1 shows a configuration diagram of an exhaust device according to a conventional method.

2 is a block diagram of an exhaust apparatus having a blower according to a preferred embodiment of the present invention.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

2 is a block diagram of an exhaust apparatus according to a preferred embodiment of the present invention.

Referring to the drawings, the exhaust device comprises a process chamber 100 in which a wet process using various chemical liquids is performed, an exhaust duct 102 for discharging a chemical gas generated during a wet process, and the process chamber 100 and It is comprised by the exhaust pipe 104 which connects the exhaust duct 102 with each other. In addition, a first gas outlet 106 and a second gas outlet 108 are formed in the process chamber 100 through which the chemical gas generated during the wet process is ejected.

The process chamber 100, the exhaust duct 102, the exhaust pipe 104, the first gas outlet 106 and the second gas outlet 108 are similar to the conventional exhaust apparatus structure shown in FIG. However, the present invention is characterized in that the blower (fan) device 110 for generating wind in a predetermined region near the second gas outlet 108 is formed. The blower 110 is formed so that the gas ejected from the second outlet 108 can be easily moved to the exhaust pipe 104, and is formed in the peripheral region of the second gas outlet 108. For example, the second gas outlet 108 may be formed on the front surface, the side surface, the bottom surface, or the top surface.

In the related art, various problems are caused by the chemical gas ejected from the second gas outlet (see FIG. 1) not being completely discharged to the outside and remaining in the process chamber. However, in the present invention, the blower 110 forms such a blower. The conventional problem can be solved. That is, the gas ejected from the first gas outlet 106 (reference numeral “C”) is easily discharged through the exhaust duct 102 and thus does not remain in the process chamber 100. In addition, the gas (reference numeral "D") ejected to the opposite side of the exhaust duct 102 through the second gas outlet 108 is also moved to the exhaust duct 102 by the blower 110 so that the process chamber ( 100) Does not remain inside. As such, all of the chemical gases generated inside the process chamber 100 by the blower 110 are discharged to the outside through the exhaust duct 102, thereby eliminating problems such as disconnection of the robot signal or corrosion of equipment due to residual gas. It becomes possible.

As described above, although described with reference to a preferred embodiment of the present invention, those skilled in the art will be variously modified without departing from the spirit and scope of the invention described in the claims below. And can be changed.

As described above, in the present invention, in the exhaust device for discharging unnecessary gas generated during the manufacture of the semiconductor device, a blower is formed in a predetermined region inside the process chamber. Due to the blower, gas remaining in the process chamber, which is not discharged through the exhaust duct, is more smoothly discharged toward the exhaust duct, thereby eliminating the problem that the robot signal is disconnected or the equipment is corroded.

Claims (3)

In an exhaust device in which an exhaust duct for exhausting unnecessary gas generated during semiconductor device manufacture to a process chamber is provided: And a blower for using an unnecessary gas ejected from the gas ejection opening toward the exhaust duct in a predetermined region inside the process chamber. The exhaust device for manufacturing a semiconductor device according to claim 1, wherein the blower is formed in a region around a gas ejection opening through which gas is not ejected toward the exhaust duct. The exhaust device for manufacturing a semiconductor device according to claim 2, wherein the air vent is formed on a front surface, a side surface, a bottom surface, or an upper surface of the gas ejection opening through which no gas is ejected toward the exhaust duct.