KR200191238Y1 - A insert clamp device of lead frame for semiconductor package - Google Patents
A insert clamp device of lead frame for semiconductor package Download PDFInfo
- Publication number
- KR200191238Y1 KR200191238Y1 KR2020000007125U KR20000007125U KR200191238Y1 KR 200191238 Y1 KR200191238 Y1 KR 200191238Y1 KR 2020000007125 U KR2020000007125 U KR 2020000007125U KR 20000007125 U KR20000007125 U KR 20000007125U KR 200191238 Y1 KR200191238 Y1 KR 200191238Y1
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- South Korea
- Prior art keywords
- lead frame
- insert clamp
- semiconductor package
- lead
- present
- Prior art date
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Wire Bonding (AREA)
Abstract
본 고안은 패드상에 탑재된 칩과 리드 프레임의 인너리드를 와이어 본딩으로 연결한 후 몰딩공정을 통해 완성된 반도체 팩키지를 제공함에 있어, 상기 리드 프레임상의 리드가 성형공정을 통해 균일하면서도 평탄도와 직진도가 우수하게 가압되어 정밀하고도 고품질의 팩키지 생산이 가능한 반도체 팩키지 리드 프레임용 인서트 클램프에 관한 것으로, 이를 위해 본 고안은 가압공간을 갖는 인서트 클램프에 있어서, 상기 가압공간의 하단주면에 형성된 요홈부와; 상기 요홈부에 게재된 탄성수지; 및 상기 탄성수지가 게재된 요홈부로 가압턱이 돌출 형성된 가압부재가 일체로 부착됨을 특징으로 한다.The present invention connects the chip mounted on the pad and the inner lead of the lead frame by wire bonding, and then provides a completed semiconductor package through a molding process. The lead on the lead frame is uniform, flat and straight through the forming process. The present invention relates to an insert clamp for a semiconductor package lead frame capable of producing a precise and high-quality package with excellent pressure. To this end, the present invention provides an insert clamp having a pressing space in a lower peripheral surface of the pressing space. Wow; An elastic resin placed on the recess; And it is characterized in that the pressing member protruding the pressure jaw is integrally attached to the groove portion in which the elastic resin is placed.
Description
본 고안은 반도체 팩키지의 리드 프레임을 위한 개선된 기능의 인서트 클램프에 관한 것으로, 특히 패드상에 탑재된 칩과 리드 프레임의 인너리드를 와이어 본딩으로 연결한 후 몰딩공정을 통해 완성된 반도체 팩키지를 제공함에 있어, 상기 리드 프레임상의 리드가 성형공정을 통해 균일하면서도 평탄도와 직진도가 우수하게 가압되어 정밀하고도 고품질의 팩키지 생산이 가능한 반도체 팩키지 리드 프레임용 인서트 클램프에 관한 것이다.The present invention relates to an improved insert clamp for a lead frame of a semiconductor package, and in particular, provides a semiconductor package completed through a molding process after connecting the chip mounted on the pad and the inner lead of the lead frame by wire bonding. The present invention relates to an insert clamp for a semiconductor package lead frame in which the lead on the lead frame is uniformly pressurized evenly through a molding process and excellent in flatness and straightness, thereby producing a precise and high quality package.
일반적으로, 반도체 팩키지의 제조공정에 따르면 첨부된 도 4에서와 같이 소정의 칩 사이즈 및 패드의 레이아웃에 의해 프레스 금형을 통해 타발된 리드 프레임(1)에는 칩(4)이 탑재될 수 있도록 타이바로 연결된 패들(2)이 1개 또는 복수개로 형성되어 있으며, 이후 별도의 칩 본딩기를 통해 패들(2)상에 탑재된 칩(4)의 패드(4a)와 패들(2) 주위에 배치된 인너리드(3)가 상호 와이어 루프를 형성하도록 금속재의 와이어(5)로서 연결 배선하여 전기적인 전송체계를 이룩하게 된다.In general, according to the manufacturing process of the semiconductor package as shown in Figure 4 attached to the lead frame (1) punched through the press mold by a predetermined chip size and the layout of the pad as a tie bar so that the chip 4 can be mounted Inner leads arranged around one or more paddles 2 and then pads 4a and paddles 2 of chips 4 mounted on paddles 2 via separate chip bonding machines. (3) is connected and wired as a metal wire 5 so as to form a mutual wire loop to achieve an electrical transmission system.
이때, 인너리드(3)는 절연체상에 부착될 수 있으며, 와이어 본딩 이후 상기 칩(4)과 리드 프레임(1)의 인너리드(3)가 외부로부터 충분하게 보호될 수 있도록 에폭시 수지를 이용하여 긴밀하게 인캡슐레이션(봉지)하는 몰딩과 동시에 타이바의 트리밍과 포밍으로 노출된 아웃리드를 절곡 형성함으로 비로소 완성된 반도체 팩키지가 제조된다는 것이다.In this case, the inner lead 3 may be attached on an insulator, and an epoxy resin may be used to sufficiently protect the inner lead 3 of the chip 4 and the lead frame 1 after wire bonding. The finished semiconductor package is produced by bending the outlead exposed by the trimming and foaming of the tie bar at the same time as the closely encapsulated molding.
따라서, 이와 같이 완성된 반도체 팩키지는 PCB기판의 회로구성에 따라 적정 위치에 실장됨으로서 비로소 소정의 기능을 수행할 수 있는데, 그러나 이와 같은 팩키지 제조 공정중 인서트 클램프를 이용하여 리드를 가압하여 주는 연속적이고도 반복적인 성형공정에서 상기 클램프 하단의 가압부가 마모되어 높이 편차를 발생시킴으로 리드의 평탄도와 균일성이 낮아져 직진도가 떨어졌고, 따라서 불량성 플래쉬가 발생될 우려가 높아 정밀도가 우수한 반도체 생산에 차질을 야기하였다.Thus, the semiconductor package thus completed is able to perform a predetermined function by being mounted at a proper position according to the circuit configuration of the PCB, but it is continuous and pressurized the lead by using an insert clamp during the package manufacturing process. In the repetitive molding process, the pressing part of the lower end of the clamp wears out, resulting in a height deviation, leading to lower flatness and uniformity of the lead, resulting in poor straightness. It was.
또한, 인서트 클램프의 마모는 성형장치의 수리나 혹은 교체를 요구하게 되어 경제적인 부담으로도 작용한다는 문제점을 포함하고 있다.In addition, wear of the insert clamp requires a repair or replacement of the molding apparatus, and also includes a problem that it acts as an economic burden.
따라서, 본 고안은 반도체 팩키지 리드의 가압 성형공정에서 리드의 눌림작업이 연속적인 공정에도 불구하고 항상적인 균일성과 평탄성 및 직진도를 유지할 수 있도록 함과 동시에 인서트 클램프의 마모율을 낮추어 장기적이고도 안정적인 사용을 보장토록 함에 그 목적이 있다.Therefore, the present invention can maintain the uniformity, flatness and straightness of the lead in the press molding process of the semiconductor package lead, while maintaining the uniformity and flatness and straightness of the insert. Its purpose is to ensure.
도 1은 본 고안 인서트 클램프의 일 실시예를 도시해 보인 사시도.1 is a perspective view showing an embodiment of the insert clamp of the present invention.
도 2는 본 고안 인서트 클램프의 탄성 가압부를 도시한 단면도.Figure 2 is a cross-sectional view showing the elastic pressing portion of the insert clamp of the present invention.
도 3은 본 고안 인서트 클램프의 작용상태를 도시한 평면도.Figure 3 is a plan view showing an operating state of the insert clamp of the present invention.
도 4는 본 고안에 적용되는 리드 프레임의 예시도.4 is an exemplary view of a lead frame applied to the present invention.
※도면의 주요부분에 대한 부호의 설명※※ Explanation of symbols about main part of drawing ※
1 : 리드 프레임 2 : 패들1: lead frame 2: paddle
3 : 리드(인너, 아웃) 4 : 칩3: lead (inner, out) 4: chip
4a : 패드 5 : 와이어4a: pad 5: wire
6 : 클램프 6a : 가압공간6: clamp 6a: pressurized space
7 : 요홈부 8 : 탄성수지7: recessed portion 8: elastic resin
9 : 가압부재 9a : 가압턱9 pressure member 9a pressure jaw
α : 두께 폭α: thickness width
상기의 목적 달성을 위해 본 고안은 칩이 탑재된 리드 프레임의 상단에서 탑재된 칩의 개수별로 이에 대응하도록 가압공간이 형성된 팩키지 리드의 인서트 클램프에 있어서, 상기 가압공간의 하단주면에 형성된 요홈부와; 상기 요홈부에 게재된 탄성수지; 및 상기 탄성수지가 게재된 요홈부로 가압턱이 돌출형성된 가압부재를 일체로 부착하여 탄성 가압부가 제공됨을 특징으로 한다.In order to achieve the above object, the present invention provides an insert clamp of a package lead in which a pressing space is formed so as to correspond to the number of chips mounted on the top of the lead frame on which the chip is mounted, and a recess formed in the lower peripheral surface of the pressing space. ; An elastic resin placed on the recess; And it is characterized in that the elastic pressing portion is provided by integrally attaching the pressing member protruding the pressing jaw to the groove portion in which the elastic resin is placed.
이하, 첨부된 도면을 참조하여 본 고안의 바람직한 실시예를 보다 상세하게 설명한다.Hereinafter, with reference to the accompanying drawings will be described in detail a preferred embodiment of the present invention.
첨부된 도 1은 본 고안의 일 실시예를 도시한 사시도이며, 도 2는 탄성 가압부를 확대 도시해 보인 단면도인바, 리드 프레임(1)의 패들(2)상에 칩(4)을 탑재한 후 리드(3)와 와이어 본딩됨에 있어서, 상기 리드 프레임(1)의 상단으로부터 탑재된 칩(4)의 개수별로 이와 동일하게 대응하도록 가압공간(6a)이 형성된 인서트 클램프(6)가 상기 리드(3)를 적정의 압력으로 가압하여 눌러줌으로서 몰딩공정 및 추후 PCB기판과의 실장에 유용함을 부여할 수 있는데, 이를 위해 가압공간(6a)의 하단주면 둘레를 일정 깊이로 삭설 및 형성함으로 요홈부(7)가 형성되어 결국 그 두께 폭(α)은 다른 주변에 비해 상대적으로 얇아진다.1 is a perspective view showing an embodiment of the present invention, Figure 2 is an enlarged cross-sectional view showing the elastic pressing portion, after mounting the chip 4 on the paddle (2) of the lead frame (1) In the wire bonding with the lead 3, an insert clamp 6 having a pressing space 6a is formed so as to correspond to the number of chips 4 mounted from the upper end of the lead frame 1 in the same way. ) By pressing to the appropriate pressure, it can be useful to the molding process and the mounting with the PCB substrate later, for this purpose, by cutting and forming the circumference of the lower peripheral surface of the pressing space (6a to a certain depth) 7) is formed so that its thickness width α becomes relatively thin compared to other peripheries.
이후, 상기의 요홈부(7)로 충분한 신축성을 포함하고 있는 탄성수지(8)를 긴밀하게 도포하여 게재시킨 후 가압턱(9a)이 ㄱ형상으로 돌출형성된 가압부재(9)를 상기 요홈부(7)에 맞추어 긴밀하게 일체로 부착시킨 구성을 이루게 된다.Subsequently, the grooves 7 are formed by closely applying the elastic resin 8 having sufficient elasticity to the grooves 7, and then the pressure member 9 having the pressure jaw 9a protruding into a-shape is formed in the grooves ( According to 7), it is possible to form a structure that is closely and integrally attached.
이와 같은 구성의 본 고안 인서트 클램프(6)에 있어 그 작용상태는 첨부된 도 3의 평면도에서와 같은 것인데, 상술한 바와 같이 리드 프레임(1)의 패들(2)위로 탑재된 칩(4)의 패드(4a)와 패들(2) 주위에 배치된 리드(3)의 상단으로부터 이와 대응하는 형상의 인서트 클램프(6)가 위치됨으로 리드(3)를 가압 눌러주게 되는데, 탄성 가압부로 인해 높이 편차에도 불구하고 리드의 균일성을 향상시킬 수 있으며, 가압부재(9)가 게재된 탄성수지(8)로 인하여 완충성을 유지함으로서 연속 반복적인 사용에도 마모율의 최소화를 도모할 수 있다.In the insert clamp 6 of the present invention having such a configuration, the working state thereof is the same as that of the top view of FIG. 3 attached to the chip 4 mounted on the paddle 2 of the lead frame 1 as described above. An insert clamp 6 having a corresponding shape is positioned from an upper end of the lid 3 arranged around the pad 4a and the paddle 2, thereby pressing the lid 3, even though the elastic biasing portion causes a height deviation. Nevertheless, it is possible to improve the uniformity of the lead, and to maintain the buffering property due to the elastic resin 8 in which the pressing member 9 is placed, it is possible to minimize the wear rate even in continuous repeated use.
따라서, 본 고안의 인서트 클램프를 이용한 리드의 가압 성형공정은 리드의 균일성과 평탄성 및 직진도를 향상시킬 수 있음과 동시에 클램프 자체의 내구성을 향상시킴으로 결국 고품질의 반도체 팩키지를 제공할 수 있다는 것이다.Therefore, the press molding process of the lead using the insert clamp of the present invention can improve the uniformity, flatness and straightness of the lead and at the same time improve the durability of the clamp itself, thereby providing a high quality semiconductor package.
한편, 본 고안은 그에 관한 최선의 실시예를 예거하였으나, 이에 한정되는 것은 아니며, 첨부된 청구범위에 국한되어 본 고안의 범위를 벗어나지 않고 실시될 수 있다면 지금까지 설명된 실시예의 변경을 고려하여 볼 수 있다.On the other hand, the present invention is not limited to the best embodiment thereof, but is not limited thereto, and can be carried out without departing from the scope of the present invention limited to the appended claims in view of changes in the embodiments described so far Can be.
Claims (1)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020000012636A KR20010091197A (en) | 2000-03-14 | 2000-03-14 | A insert clamp device of lead frame for semiconductor package |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020000012636A Division KR20010091197A (en) | 2000-03-14 | 2000-03-14 | A insert clamp device of lead frame for semiconductor package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR200191238Y1 true KR200191238Y1 (en) | 2000-08-16 |
Family
ID=19654825
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2020000007125U KR200191238Y1 (en) | 2000-03-14 | 2000-03-14 | A insert clamp device of lead frame for semiconductor package |
| KR1020000012636A KR20010091197A (en) | 2000-03-14 | 2000-03-14 | A insert clamp device of lead frame for semiconductor package |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020000012636A KR20010091197A (en) | 2000-03-14 | 2000-03-14 | A insert clamp device of lead frame for semiconductor package |
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| Country | Link |
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| KR (2) | KR200191238Y1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100673942B1 (en) * | 2000-12-20 | 2007-01-24 | 삼성테크윈 주식회사 | Window clamp of wire bonding apparatus |
-
2000
- 2000-03-14 KR KR2020000007125U patent/KR200191238Y1/en not_active IP Right Cessation
- 2000-03-14 KR KR1020000012636A patent/KR20010091197A/en not_active Application Discontinuation
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| Publication number | Publication date |
|---|---|
| KR20010091197A (en) | 2001-10-23 |
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