KR200184789Y1 - Photoresistor for semiconductor fabrication - Google Patents

Photoresistor for semiconductor fabrication Download PDF

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Publication number
KR200184789Y1
KR200184789Y1 KR2019970029854U KR19970029854U KR200184789Y1 KR 200184789 Y1 KR200184789 Y1 KR 200184789Y1 KR 2019970029854 U KR2019970029854 U KR 2019970029854U KR 19970029854 U KR19970029854 U KR 19970029854U KR 200184789 Y1 KR200184789 Y1 KR 200184789Y1
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South Korea
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opening
wafer
process chamber
humidity
transfer arm
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KR2019970029854U
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Korean (ko)
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KR19990016433U (en
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유승석
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김영환
현대반도체주식회사
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

본 고안은 웨이퍼를 적재한 이송암이 공정 챔버내에 투입시 개방되었다가 인출시 닫히는 개폐문을 형성하여 공정 챔버내의 온도 및 습도조절이 균일하게 이루어지도록 하는 반도체 제조용 포토레지스트 도포장치에 관한 것으로 종래의 포토레지스트 도포장치는 웨이퍼가 입출되는 개방구가 항상 열려있는 상태이므로 이를 통하여 외기가 유입되므로써 온·습도기가 작동되더라도 공정 챔버내의 온도 및 습도유지가 곤란한 문제점이 있었던바 본 고안은 웨이퍼를 공정 챔버내에 안착하고자 이송암이 공정 챔버내에 출입시에만 개방되고 공정 진행중에는 닫히는 개폐문을 형성하여 공정 챔버내의 온도 및 습도를 항상 일정하게 유지하는 효과가 있는 반도체 제조용 포토레지스트 도포장치이다.The present invention relates to a photoresist coating apparatus for semiconductor manufacturing, in which a transfer arm on which a wafer is loaded is formed when the transfer arm is loaded into a process chamber and is closed when the transfer arm is loaded, thereby controlling temperature and humidity in the process chamber uniformly. The resist coating device has a problem that it is difficult to maintain the temperature and humidity in the process chamber even if the temperature and humidity are operated by the inflow of outside air through the opening of the wafer into and out of the opening. The transfer arm is a photoresist coating device for semiconductor manufacturing, which has an effect of maintaining a constant temperature and humidity in the process chamber at all times by forming an opening / closing door which is opened only when entering and exiting the process chamber and closed during the process.

Description

반도체 제조용 포토레지스트 도포장치Photoresist coating device for semiconductor manufacturing

본 고안은 반도체 제조용 포토레지스트(Photoresist) 도포장치에 관한 것으로 더욱 상세하게는 웨이퍼를 적재한 이송암이 공정 챔버내에 투입시 개방되었다가 인출시 닫히는 개폐문을 형성하여 공정 챔버내의 온도 및 습도조절이 균일하게 이루어지도록 하는 반도체 제조용 포토레지스트 도포장치에 관한 것이다.The present invention relates to a photoresist coating device for semiconductor manufacturing. More specifically, the transfer arm carrying a wafer is opened and closed when the wafer is inserted into the process chamber to form an opening and closing door to uniformly control temperature and humidity in the process chamber. The present invention relates to a photoresist coating device for semiconductor manufacturing.

일반적으로 포토레지스트 도포장치에서 웨이퍼의 표면에 도포막을 형성하는 공정이 진행되는 동안에는 일정한 온도와 습도가 항상 유지되어야하며 따라서 공정 챔버내에는 온·습도기가 설치된다.In general, during the process of forming a coating film on the surface of the wafer in the photoresist coating apparatus, a constant temperature and humidity must be maintained at all times, and thus a temperature and humidity device is installed in the process chamber.

종래의 포토레지스트 도포장치는 도 1과 도 2에서 도시된 바와같이 공정 챔버(1)의 내부에 형성되어 일정한 온도와 습도를 유지하는 온·습도기(3)와, 이송암(7)에 적재된 웨이퍼(9)가 입출되는 개방구(5)와, 투입된 웨이퍼(9)가 안착되는 웨이퍼 척(11)과, 상기 웨이퍼 척(11)을 회전시키는 회전축(13)으로 구성된다.Conventional photoresist coating apparatus is formed in the process chamber 1, as shown in Figures 1 and 2 and loaded on the temperature and humidity humidifier (3) and the transfer arm (7) to maintain a constant temperature and humidity It consists of an opening 5 for entering and exiting the wafer 9, a wafer chuck 11 on which the inserted wafer 9 is seated, and a rotating shaft 13 for rotating the wafer chuck 11.

이러한 포토레지스트 도포장치의 공정 챔버(1)내에 이송암(7)에 적재된 웨이퍼(9)가 개방구(5)를 통하여 투입된다. 이렇게 투입된 웨이퍼(9)는 회전축(13)을 중심으로 회전하는 웨이퍼 척(11)의 상부면에 안착되어 공정이 진행된다. 이때 상기 공정 챔버(1)내에 설치된 온·습도기(3)가 작동되어 일정한 온도 및 습도를 유지한다.The wafer 9 loaded on the transfer arm 7 in the process chamber 1 of the photoresist coating apparatus is introduced through the opening 5. The wafer 9 thus introduced is seated on the upper surface of the wafer chuck 11 that rotates about the rotation shaft 13, and the process proceeds. At this time, the temperature and humidity humidifier 3 installed in the process chamber 1 is operated to maintain a constant temperature and humidity.

그러나 종래의 포토레지스트 도포장치는 웨이퍼가 입출되는 개방구가 항상 열려있는 상태이므로 이를 통하여 외기가 유입되므로써 온·습도기가 작동되더라도 공정 챔버내의 온도 및 습도유지가 곤란한 문제점이 있다.However, the conventional photoresist coating apparatus has a problem that it is difficult to maintain the temperature and humidity in the process chamber even when the temperature and humidity are operated because the open air through which the wafer is introduced and exited is always open.

본 고안의 목적은 웨이퍼의 출입시 개방되고 공정 진행중에는 닫히는 개폐문을 형성하여 공정 챔버내의 온도 및 습도를 항상 일정하게 유지하여 웨이퍼에 균일한 도포막을 형성하는 반도체 제조용 포토레지스트 도포장치를 제공하는 데 있다.It is an object of the present invention to provide a photoresist coating apparatus for semiconductor manufacturing, which forms a uniform coating film on a wafer by forming an opening / closing door that is opened upon entering and exiting a wafer and is closed during the process to maintain a constant temperature and humidity in the process chamber at all times. .

따라서, 본 고안은 상기의 목적을 달성하고자, 공정 챔버의 내부에 형성되어 일정한 온도와 습도를 유지하는 온·습도기와, 이송암에 적재된 웨이퍼가 입출되는 개방구와, 투입된 웨이퍼가 안착되는 웨이퍼 척과, 상기 웨이퍼 척을 회전시키는 회전축으로 구성되는 포토레지스트 도포장치에 있어서, 상기 개방구를 개폐하는 개폐문과, 출입시 상기 개폐문을 개방하는 이송암으로 구성된다.Therefore, the present invention, in order to achieve the above object, the temperature and humidity to be formed inside the process chamber to maintain a constant temperature and humidity, the opening to which the wafer loaded on the transfer arm is ejected, and the wafer chuck on which the inserted wafer is seated; And a photoresist coating apparatus composed of a rotating shaft for rotating the wafer chuck, the photoresist coating apparatus comprising an opening and closing door for opening and closing the opening and a transfer arm for opening and closing the opening and closing door.

도 1은 종래의 반도체 제조용 포토레지스트 도포장치를 도시한 정면도이고,1 is a front view showing a conventional photoresist coating device for manufacturing a semiconductor,

도 2는 종래의 반도체 제조용 포토레지스트 도포장치를 도시한 단면도이고,2 is a cross-sectional view showing a conventional photoresist coating device for semiconductor manufacturing;

도 3은 본 고안의 반도체 제조용 포토레지스트 도포장치를 도시한 평면도이고,3 is a plan view showing a photoresist coating device for manufacturing a semiconductor of the present invention,

도 4는 본 고안의 반도체 제조용 포토레지스트 도포장치를 도시한 요부측단면도이고,4 is a main sectional side view showing a photoresist coating device for manufacturing a semiconductor of the present invention,

도 5는 본 고안의 요부확대도이다.5 is an enlarged view illustrating main parts of the present invention.

* 도면의 주요 부분에 대한 부호의 설명 *Explanation of symbols on the main parts of the drawings

1 : 공정 챔버, 3 : 온·습도기,1: process chamber, 3: temperature / humidity device,

5 : 개방구, 7 , 105 : 이송암,5: opening, 7, 105: transfer arm,

9 : 웨이퍼, 11 : 웨이퍼 척,9: wafer, 11: wafer chuck,

13 : 회전축, 100 : 개폐문,13: rotating shaft, 100: opening and closing door,

101 : 경첩, 103 : 롤러,101: hinge, 103: roller,

107 : 안착암, 109 : 개방암,107: seating cancer, 109: open cancer,

111 : 복원 스프링.111: Restoration spring.

이하, 첨부된 도면을 참조하여 본 고안을 설명하면 다음과 같다.Hereinafter, the present invention with reference to the accompanying drawings as follows.

도 3과 도 4는 본 고안의 반도체 제조용 포토레지스트 도포장치를 도시한 평면도와 단면도이고, 도 5는 본 고안의 요부확대도이다.3 and 4 are a plan view and a cross-sectional view showing a photoresist coating device for manufacturing a semiconductor of the present invention, Figure 5 is an enlarged view of the main part of the present invention.

웨이퍼(9)가 상부면에 적재되어 일측에 형성된 회전축(13)에 의하여 회전되며 상,하로 이동하는 웨이퍼 척(11)이 공정 챔버(1)의 내측에 형성된다.The wafer 9 is loaded on the upper surface, rotated by the rotation shaft 13 formed on one side, and the wafer chuck 11 moving up and down is formed inside the process chamber 1.

이러한 공정 챔버(1)의 내측 상부에는 균일한 온도 및 습도를 유지하는 온·습도기(3)가 형성된다. 또한 상기 공정 챔버(1)의 일측에는 웨이퍼(9)가 투입되는 개방구(5)가 형성된다. 이때 상기 개방구(5)는 웨이퍼 척(11)과 동일선상에 천공됨은 물론이다.The temperature / humidifier 3 which maintains uniform temperature and humidity is formed in the upper part inside this process chamber 1. In addition, an opening 5 into which the wafer 9 is inserted is formed at one side of the process chamber 1. At this time, the opening 5 is of course drilled on the same line as the wafer chuck (11).

한편, 상기 개방구(5)에는 경첩(101)에 의하여 일방향으로 회동되는 개폐문(100)이 형성된다. 이때 상기 경첩(101)의 중심축에는 복원스프링(113)이 권취되어 개방된 개폐문(100)을 원위치시킨다.On the other hand, the opening 5 is formed with an opening and closing door 100 which is rotated in one direction by the hinge 101. At this time, the restoring spring 113 is wound around the central axis of the hinge 101 to open and close the opening and closing door 100.

또한, 상기 경첩(101)이 형성된 대각선 방향의 개폐문(100) 모서리부에 양측단이 지지되어 구름운동하는 롤러(103)가 형성된다.In addition, both sides of the end of the hinge 101 is formed in the corner of the opening and closing door 100 in the diagonal direction is supported roller 103 is formed in the rolling motion.

상기 개폐문(100)은 웨이퍼(9)를 공정 챔버(1)내의 웨이퍼 척(11)에 안착하는 이송암(105)에 의하여 개폐된다.The opening and closing door 100 is opened and closed by a transfer arm 105 that seats the wafer 9 on the wafer chuck 11 in the process chamber 1.

즉, 상기 이송암(105)이 상·하로 나누어져 하부에는 웨이퍼(9)가 적재되는 안착암(107)을 형성하고 상부에는 상기 안착암(107)보다 길이가 긴 개방암(109)을 형성하여 이송암(105)이 수평이동되며 상기 개방암(109)의 끝단이 개폐문(100)과 상호 맞닿으며 내측으로 개폐문(100)을 밀어 개방하므로써 웨이퍼 척(13)까지 웨이퍼(9)가 운반된다. 이때 상기 개방되는 개폐문(100)의 일측단에 형성된 롤러(103)가 개방암(109)의 상부면을 따라 이송되며 개폐문(100)의 개방을 보다 원활히한다.That is, the transfer arm 105 is divided into up and down to form a seating arm 107 in which a wafer 9 is loaded in the lower part, and an open arm 109 longer in length than the seating arm 107 in the upper part. The transfer arm 105 is horizontally moved so that the ends of the open arms 109 abut the door 100 and the wafer 9 is transported to the wafer chuck 13 by pushing the door 100 inward. . At this time, the roller 103 formed at one end of the opening and closing door 100 is transported along the upper surface of the opening arm 109 to smoothly open the opening and closing door 100.

본 고안의 포토레지스트 장치에서 공정 챔버내에 웨이퍼를 적재하는 과정을 알아보면 다음과 같다.In the photoresist device of the present invention, a process of loading a wafer into a process chamber is as follows.

도면을 참조하면 공정 챔버(1)내의 웨이퍼 척(11)에 웨이퍼(9)를 적재하기 위해서 웨이퍼(9)가 적재된 이송암(105)이 개폐문(100) 방향으로 수평이동된다.Referring to the drawings, in order to load the wafer 9 on the wafer chuck 11 in the process chamber 1, the transfer arm 105 on which the wafer 9 is loaded is horizontally moved toward the opening / closing door 100.

이러한 상태에서 이송암(105)의 상부에 형성된 개방암(109)의 끝단이 개폐문(100)의 일측면과 상호 맞닿아 이송력이 작용한다.In this state, the end of the open arm 109 formed on the upper portion of the transfer arm 105 abuts on one side of the opening and closing door 100, the transfer force acts.

따라서 상기 개폐문(100)의 일측에 형성된 경첩(101)이 이송암(105)에서 전달된 이송력에 의하여 일방향으로 회전하여 개폐문(100)이 개방되고 이송암(105)은 공정 챔버(1)의 웨이퍼 척(11)에 위치한다. 이때 상기 개폐문(100)의 일측에 형성된 롤러(103)는 유입되는 개방암(109)의 상부면을 따라 구름운동하며 개폐문(100)의 개방을 원활히한다.Therefore, the hinge 101 formed at one side of the opening and closing door 100 rotates in one direction by the transfer force transmitted from the transfer arm 105, so that the opening and closing door 100 is opened and the transfer arm 105 of the process chamber 1 is closed. It is located in the wafer chuck 11. At this time, the roller 103 formed on one side of the opening and closing door 100 smoothly opens and closes the opening and closing door 100 while rolling along the upper surface of the opening arm 109.

이러한 상태에서 상측으로 수직이동된 웨이퍼 척(11)에 의하여 안착암(107)에 적재된 웨이퍼(9)가 상측으로 이동하면서 웨이퍼 척(13)에 안착되고 웨이퍼(9)가 탈거된 이송암(105)은 공정 챔버(1)의 밖으로 원위치된다.In this state, the wafer 9 loaded on the seating arm 107 is moved upward by the wafer chuck 11 vertically moved upward, and is transferred to the wafer chuck 13 and the transfer arm from which the wafer 9 is removed ( 105 is retracted out of the process chamber 1.

이렇게 이송암(105)이 이동하면 개폐문(100)에 작용하던 개방암(109)의 이송력이 작용하지 않고 경첩(101)의 중심축에 권취된 복원 스프링(111)의 복원력에 의하여 개폐문(100)이 원위치된다. 이때 상기 개폐문(100)의 끝단에 형성된 롤러(103)는 개방구(5)의 내주면 일측과 상호 맞닿으면서 개방구(5)를 밀폐한다.When the transfer arm 105 moves in this way, the transfer force of the opening arm 109 acting on the opening / closing door 100 does not work, and the opening / closing door 100 is restored by the restoring force of the restoring spring 111 wound around the central axis of the hinge 101. ) Is in place. At this time, the roller 103 formed at the end of the opening and closing door 100 seals the opening 5 while being in contact with one side of the inner circumferential surface of the opening 5.

따라서 웨이퍼(9)를 공정 챔버(1)내에 장착하고자 이송암(105)이 입출될 때를 제외하고는 항상 개방구(5)가 닫힌 상태를 유지하여 공정챔버(1)의 내부를 일정하게 하므로써 공정시의 온도 및 습도를 균일하게 유지한다.Therefore, the opening 9 is always kept closed except for when the transfer arm 105 enters and exits in order to mount the wafer 9 in the process chamber 1, thereby making the inside of the process chamber 1 constant. The temperature and humidity during the process are kept uniform.

상기에서 상술된 바와 같이, 본 고안은 웨이퍼를 공정 챔버내에 안착하고자 이송암이 출입시에만 개방되고 공정 진행중에는 닫히는 개폐문을 형성하여 공정 챔버내의 온도 및 습도를 항상 일정하게 유지하는 잇점이 있다.As described above, the present invention has the advantage of maintaining a constant temperature and humidity in the process chamber at all times by forming an opening and closing door that is open only when the transfer arm is opened and closed to enter the wafer in the process chamber and closed during the process.

Claims (3)

공정 챔버(1)의 내부에 형성되어 일정한 온도와 습도를 유지하는 온·습도기(3)와, 이송암(7)에 적재된 웨이퍼(9)가 입출되는 개방구(5)와, 투입된 웨이퍼(9)가 안착되는 웨이퍼 척(11)과, 상기 웨이퍼 척(11)을 회전시키는 회전축(13)으로 구성되는 포토레지스트 도포장치에 있어서,A temperature / humidity device 3 formed inside the process chamber 1 to maintain a constant temperature and humidity, an opening 5 through which the wafer 9 loaded on the transfer arm 7 enters and exits the wafer In the photoresist application apparatus which consists of the wafer chuck 11 in which 9 is seated, and the rotating shaft 13 which rotates the said wafer chuck 11, 상기 개방구(5)를 여닫는 개폐문(100)과;An opening and closing door 100 that opens and closes the opening 5; 출입시 상기 개폐문(100)을 개방하는 이송암(105)으로 구성되는 것을 특징으로 하는 반도체 제조용 포토레지스트 도포장치.Photoresist coating device for manufacturing a semiconductor, characterized in that consisting of a transfer arm 105 for opening and closing the door 100 when entering and leaving. 청구항 1에 있어서, 상기 개폐문(100)은,The method according to claim 1, The opening door 100, 공정챔버(1)의 내측 일단과 개폐문(100)의 일측단을 상호 연결하여 일방향으로 회동되고 내측에 복원스프링(111)이 형성되는 경첩(101)과;A hinge 101 connected to one inner end of the process chamber 1 and one end of the opening and closing door 100 to be rotated in one direction and having a restoring spring 111 formed therein; 상기 경첩(101)의 반대측 끝단 모서리에 형성되어 구름운동하는 롤러(103)로 구성되는 것을 특징으로 하는 반도체 제조용 포토레지스트 도포장치.The photoresist coating device for manufacturing a semiconductor, characterized in that consisting of a roller 103 formed on the opposite end edge of the hinge 101 to roll movement. 청구항 1 에 있어서, 상기 이송암(105)은,The method according to claim 1, The transfer arm 105, 웨이퍼(9)가 내측 상부면에 적재되는 안착암(107)과;A seating arm 107 on which the wafer 9 is mounted on an inner upper surface; 상기 안착암(107)보다 길게 형성되어 웨이퍼(9)가 노출되지 않도록 하며 상기 개폐문(100)을 여는 개방암(109)으로 구성되는 것을 특징으로 하는 반도체 제조용 포토레지스트 도포장치.It is formed longer than the seating arm (107) to prevent the wafer (9) is exposed, the photoresist coating device for semiconductor manufacturing, characterized in that consisting of an open arm (109) for opening the opening and closing door (100).
KR2019970029854U 1997-10-28 1997-10-28 Photoresistor for semiconductor fabrication KR200184789Y1 (en)

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