KR200169673Y1 - Semiconductor inspection device - Google Patents
Semiconductor inspection deviceInfo
- Publication number
- KR200169673Y1 KR200169673Y1 KR2019940002346U KR19940002346U KR200169673Y1 KR 200169673 Y1 KR200169673 Y1 KR 200169673Y1 KR 2019940002346 U KR2019940002346 U KR 2019940002346U KR 19940002346 U KR19940002346 U KR 19940002346U KR 200169673 Y1 KR200169673 Y1 KR 200169673Y1
- Authority
- KR
- South Korea
- Prior art keywords
- wafer
- loading
- present
- cassette
- inspection
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/94—Investigating contamination, e.g. dust
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/6773—Conveying cassettes, containers or carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Analytical Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Health & Medical Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Power Engineering (AREA)
- Health & Medical Sciences (AREA)
- Computer Hardware Design (AREA)
- Biochemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
본 고안은 반도체 제품 검사장치에 관한 것으로, 웨이퍼가 담긴 카세트를 장착하여 승강시키기 위한 웨이퍼 로딩 엘리베이터와, 상기 카세트의 슬롯내의 웨이퍼를 로딩하기 위한 로딩요소와, 상기 로딩요소에 의해 이송되는 웨이퍼를 검사 위치로 수평 이동시키는 이동요소와, 상기 검사 위치에 유지되는 웨이퍼에 유 브이광을 발상하는 유 브이광 발사요소와, 상기 웨이퍼에서 반사되는 광을 이용하여 웨이퍼의 뒷면을 화상으로 관찰하기 위한 씨씨디 카메라 및 모니터를 포함하여 구성되어 있으며, 이러한 본 고안은 웨이퍼의 뒷면에 사용 장비에 의해 발생되는 파티클 오염, 스크래치 등 원인 파악이 용이하고, 기존에는 작업자가 진공 트위저를 사용하여 검사할 때 웨이퍼 뒷면의 파티클 및 전면 스크래치가 발생되는 것이었으나, 본 고안은 로딩요소와 이동요소가 웨이퍼의 가장자리 일부분만을 접촉하기 때문에 검사시 발생되는 파티클을 최소화할 수 있으며, 진공 트위저를 사용함에 따라 발생되는 파티클로 인한 디포커스를 최소화할 수 있다.The present invention relates to a semiconductor product inspection apparatus, comprising: a wafer loading elevator for mounting and lifting a cassette containing a wafer, a loading element for loading a wafer in a slot of the cassette, and a wafer transferred by the loading element CD for visually observing the back side of the wafer using a moving element that horizontally moves to a position, a u-light emitting element that generates u-light on the wafer held at the inspection position, and light reflected from the wafer It is composed of a camera and a monitor, the present invention is easy to determine the cause of the particle contamination, scratches, etc. caused by the equipment used on the back of the wafer, and in the past when the operator inspects using a vacuum tweezer Particles and front scratches were generated, but the present invention is a loading element Particles generated during inspection can be minimized because the and moving elements contact only a portion of the edge of the wafer, and defocus due to particles generated by using a vacuum tweezer can be minimized.
Description
제1도는 종래 검사장치의 사시도.1 is a perspective view of a conventional inspection device.
제2도는 본 고안에 의한 검사장치의 사시도.2 is a perspective view of the inspection device according to the present invention.
* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings
1 : 웨이퍼 2 : 카세트1: wafer 2: cassette
3 : 웨이퍼 로딩 엘리베이터 4 : 로딩요소3: wafer loading elevator 4: loading element
5 : 이동요소 6 : 유 브이광 발사요소5: moving element 6: U-light emitting element
7 : 씨씨디 카메라 8 : 모니터7: CD camera 8: monitor
9 : 콘트롤러 10 : 장치 본체9: controller 10: device body
본 고안은 반도체 웨이퍼 뒷면 검사장치에 관한 것으로, 특히 웨이퍼 뒷면의 파티클(particle) 오염과 웨이퍼 전면의 스크래치(scratch)를 방지하도록 한 반도체 제품 검사장치에 관한 것이다.The present invention relates to a semiconductor wafer backside inspection apparatus, and more particularly, to a semiconductor product inspection apparatus to prevent particle contamination on the back side of the wafer and scratches on the front side of the wafer.
종래에는 웨이퍼 뒷면 파티클 및 스크래치를 검사할 때에 제1도에 도시한 바와 같이, 함체(11)의 내부에서 진공 트위저(12)로 웨이퍼(13)를 잡고, 유 브이(UV) 광원(14)로부터 발사되는 유 브이광을 이용하여 검사함으로써 웨이퍼(13) 뒷면에 진공 트위저(12)의 자국이 남아 디포커스(defocus)가 발생할 수 있으며, 또한 카세트(cassette)에서 웨이퍼(13)를 홀딩(holding)할 때 웨이퍼(13) 전면에 스크래치가 발생하는 결함이 있는 것이었다.Conventionally, when inspecting the wafer back side particles and scratches, as shown in FIG. 1, the wafer 13 is held by the vacuum tweezer 12 inside the enclosure 11, and the UV light source 14 is removed. By inspecting using the emitted light, the traces of the vacuum tweezers 12 may remain on the back side of the wafer 13 to cause defocus, and also to hold the wafer 13 in a cassette. In this case, there was a defect in which a scratch occurred on the entire surface of the wafer 13.
본 고안은 상기한 바와 같은 종래의 결함을 해소하기 위하여 안출한 것으로 이를 첨부한 도면에 의하여 상세히 설명하면 다음과 같다.The present invention has been devised to solve the conventional defects as described above in detail by the accompanying drawings as follows.
제2도는 본 고안에 의한 반도체 제품 검사장치의 구성을 보인 사시도로서, 이에 도시한 바와 같이, 웨이퍼(1)가 담긴 카세트(2)를 장착하여 승강시키기 위한 웨이퍼 로딩 엘리베이터(3)와, 상기 카세트(2)의 슬롯(slot)내에 웨이퍼(1)를 로딩하기 위한 로딩요소(4)와, 상기 로딩요소(4)에 의해 이송되는 웨이퍼(1)를 검사위치로 수평 이동시키는 이동요소(5)와, 상기 검사 위치에 유지되는 웨이퍼(1)에 유 브이광을 발사하는 유 브이광 발사요소(6)와, 상기 웨이퍼(1)에서 반사되는 광을 이용하여 웨이퍼(1)의 뒷면을 화상으로 관찰하기 위한 씨씨디 카메라(7) 및 모니터(8)를 포함하여 구성되어 있다.2 is a perspective view showing the configuration of a semiconductor product inspection apparatus according to the present invention, as shown in the drawing, a wafer loading elevator 3 for mounting and lifting a cassette 2 containing a wafer 1, and the cassette; A loading element 4 for loading the wafer 1 in the slot of 2 and a moving element 5 for horizontally moving the wafer 1 carried by the loading element 4 to an inspection position. And an u-beam emitting element 6 which emits a u-light onto the wafer 1 held at the inspection position, and the light reflected from the wafer 1 to image the back surface of the wafer 1. The CD camera 7 and the monitor 8 for observation are comprised.
그리고, 상기 각 부품들은 장치 본체(10)에 적합하게 배치되어 있으며, 상기 본체(10)의 일측부에는 장치를 구동 제어하기 위한 콘트롤러(controller)(9)가 구비되어 있다.Each of the parts is suitably arranged in the apparatus main body 10, and one side of the main body 10 is provided with a controller 9 for driving control of the apparatus.
또한 상기 로딩요소(4)에는 웨이퍼(1)의 주변부가 접촉되어 안착되는 안착부(4a)가 형성되고, 상기 이동요소(5)에는 웨이퍼(1)의 주변부가 접촉되어 안착되는 접촉링(5a)가 형성되어 있다.In addition, a seating portion 4a is formed in the loading element 4 to be seated in contact with the periphery of the wafer 1, and a contact ring 5a in which the periphery of the wafer 1 is in contact with the movable element 5 is seated. ) Is formed.
상기한 바와 같은 본 고안은 웨이퍼 로딩 엘리베이터(3)에 카세트(2)를 로딩하고, 웨이퍼(1)의 번호를 지정한 후 장치의 스타트 버튼을 누르면, 로딩요소(4)가 카세트(2)내의 지정된 슬롯에서 웨이퍼(1)를 인출하여 이동요소(5)가 인수할 수 있도록 90도 회전하며, 로딩요소(4)가 이동요소(5)에 웨이퍼(1)를 넘겨 주면 이동요소(5)가 작업자가 조이스틱(joystic) 등을 이용하여 조작함에 따라 x, y축 이동을 하여 웨이퍼(1)를 검사 위치로 이송시킨다. 상기 웨이퍼(1)가 검사 위치에 유지되면 유 브이광 발사요소(6)에서 유 브이광이 웨이퍼(1)의 뒷면에 발사되고, 웨이퍼(1)이 뒷면에서 반사되며, 반사된 광이 씨씨디 카메라(7)를 통과한 후 모니터(8)에 도달하여 웨이퍼(1) 뒷면의 화상이 모니터(8)에 표시되고, 작업자는 상기 모니터(8)에 표시된 웨이퍼(1)의 화상에 의해 웨이퍼(1)의 상태를 검사하게 된다.As described above, the present invention loads the cassette 2 into the wafer loading elevator 3, specifies the number of the wafer 1, and presses the start button of the device, so that the loading element 4 is designated in the cassette 2. The wafer 1 is withdrawn from the slot and rotated 90 degrees for the mobile element 5 to take over. When the loading element 4 passes the wafer 1 to the mobile element 5, the mobile element 5 is a worker. By operating using a joystick or the like, the wafer 1 is moved to the inspection position by moving the x and y axes. When the wafer 1 is held at the inspection position, the u-light is emitted from the u-light emitting element 6 on the back side of the wafer 1, the wafer 1 is reflected from the back side, and the reflected light is reflected on the CD. After passing through the camera 7, the monitor 8 is reached so that the image of the backside of the wafer 1 is displayed on the monitor 8, and the operator uses the image of the wafer 1 displayed on the monitor 8 to display the wafer ( The condition of 1) is checked.
이상에서 설명한 바와 같은 본 고안은 웨이퍼 뒷면에 사용 장비에 의해 발생되는 파티클 오염, 스크래치 등 원인 파악이 용이하고, 기존에는 작업자가 진공 트위저를 사용하여 검사할 때 웨이퍼 뒷면의 파티클 및 전면의 스크래치가 발생되는 것이었으나, 본 고안은 로딩요소와 이동요소가 웨이퍼의 가장자리 일부분만을 접촉하기 때문에 검사시 발생되는 파티클을 최소화할 수 있으며, 진공 트위저를 사용함에 따라 발생되는 파티클로 인한 디포커스를 최소화할 수 있다.As described above, the present invention makes it easy to determine the cause of particle contamination, scratches, etc. caused by the equipment used on the back side of the wafer, and in the past, when the operator inspects using a vacuum tweezer, scratches on the back side of the wafer and particles occur However, the present invention minimizes particles generated during inspection because the loading element and the moving element contact only a portion of the edge of the wafer, and minimize defocus due to particles generated by using a vacuum tweezer. .
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019940002346U KR200169673Y1 (en) | 1994-02-07 | 1994-02-07 | Semiconductor inspection device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019940002346U KR200169673Y1 (en) | 1994-02-07 | 1994-02-07 | Semiconductor inspection device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR950025901U KR950025901U (en) | 1995-09-18 |
| KR200169673Y1 true KR200169673Y1 (en) | 2000-02-01 |
Family
ID=19377005
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2019940002346U KR200169673Y1 (en) | 1994-02-07 | 1994-02-07 | Semiconductor inspection device |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR200169673Y1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100617273B1 (en) * | 2004-05-28 | 2006-08-31 | (주) 쎄믹스 | Apparatus for transferring foup in semiconductor wafer prober |
-
1994
- 1994-02-07 KR KR2019940002346U patent/KR200169673Y1/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR950025901U (en) | 1995-09-18 |
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