KR100239699B1 - Semiconductor wafer inspection apparatus - Google Patents

Semiconductor wafer inspection apparatus Download PDF

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Publication number
KR100239699B1
KR100239699B1 KR1019960041409A KR19960041409A KR100239699B1 KR 100239699 B1 KR100239699 B1 KR 100239699B1 KR 1019960041409 A KR1019960041409 A KR 1019960041409A KR 19960041409 A KR19960041409 A KR 19960041409A KR 100239699 B1 KR100239699 B1 KR 100239699B1
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wafer
semiconductor wafer
inspection apparatus
magnifying glass
inspection
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KR1019960041409A
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Korean (ko)
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KR19980022303A (en
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유승석
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김영환
현대반도체주식회사
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10Measuring as part of the manufacturing process
    • H01L22/12Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

본 발명은 반도체 웨이퍼 검사장치에 관한 것으로, 종래에는 육안검사와 현미경검사를 통하여 검사시 시간이 많이 소요되고, 검사불량이 발생하는 문제점이 있었다. 본 발명 반도체 웨이퍼 검사장치는 웨이퍼에 발생된 이물질, 스크랫치 등을 검사하기 위한 확대경과, 그 확대경을 고정하기 위한 고정수단을 포함하여 구성되어, 확대경을 이용하여 웨이퍼의 전면을 일시에 검사함으로서, 검사시간의 절감에 따른 생산성이 향상되는 효과가 있고, 또한 검사불량을 방지할 수 있는 효과가 있다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor wafer inspection apparatus. In the related art, it takes a lot of time to inspect through visual inspection and microscopic examination, and there is a problem that inspection defects occur. The semiconductor wafer inspection apparatus of the present invention comprises a magnifying glass for inspecting foreign substances, scratches, etc. generated in the wafer, and a fixing means for fixing the magnifying glass, thereby temporarily inspecting the entire surface of the wafer using the magnifying glass. Productivity is improved by reducing the inspection time, and also has the effect of preventing inspection failure.

Description

반도체 웨이퍼 검사장치Semiconductor Wafer Inspection Equipment

제1도는 종래 반도체 웨이퍼 검사장치를 보인 사시도로서,1 is a perspective view showing a conventional semiconductor wafer inspection apparatus,

(a)는 육안검사.(a) visual inspection.

(b)는 현미경검사.(b) microscopy.

제2도는 본 발명 반도체 웨이퍼 검사장치의 구성을 보인 정면도.2 is a front view showing the configuration of the semiconductor wafer inspection apparatus of the present invention.

* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings

12 : 확대경 12a : 고정홈12: magnifying glass 12a: fixing groove

13 : 고정수단 16 : 발광기13 fixing means 16: light emitter

17 : 고정대 18 : 지지대17: holder 18: support

W : 웨이퍼W: Wafer

본 발명은 반도체 웨이퍼 검사(INSPECTION)장치에 관한 것으로, 특히 웨이퍼(WAFER)에 발생된 이물질, 스크랫치(SCRATCH) 등을 단시간에 검사할 수 있도록 하는데 적합한 반도체 웨이퍼 검사장치에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor wafer inspection apparatus, and more particularly, to a semiconductor wafer inspection apparatus suitable for enabling inspection of foreign matter, scratches, etc. generated in a wafer in a short time.

제1도는 종래 반도체 웨이퍼 검사장치를 보인 것으로, (a)는 육안검사이고, (b)는 현미경검사이다.1 shows a conventional semiconductor wafer inspection apparatus, in which (a) is visual inspection and (b) is microscopic examination.

종래 반도체 웨이퍼 검사장치는 (a)에 도시된 바와같이, 하측이 개구된 챔버(CHAMBER)(1)의 일측면에 챔버(1)의 내측으로 빛을 비추기 위한 투광기(2)가 설치되어 있어서, 작업자가 손(3)으로 트위저(4)를 이용하여 웨이퍼(W)를 챔버(1)의 내측에 위치하도록 이동한 다음, 이물질, 스크랫치 등의 육안검사를 실시한다.In the conventional semiconductor wafer inspection apparatus, as shown in (a), a light emitter 2 for illuminating the inside of the chamber 1 is provided on one side of the chamber CHAMBER 1 having a lower side, The worker moves the wafer W to the inside of the chamber 1 using the tweezer 4 with the hand 3, and then performs a visual inspection of foreign matter, scratches and the like.

그런 다음, (b)에 도시된 바와 같이, 스테이지(5)의 상면에 육안검사가 완료된 웨이퍼(W)를 얹어 놓고, 현미경(6)을 이용하여 웨이퍼(W)의 현미경검사를 실시한다.Then, as shown in (b), the wafer W on which the visual inspection is completed is placed on the top surface of the stage 5, and the microscope W is subjected to microscopic examination.

그러나, 상기와 같은 종래 반도체 웨이퍼 검사장치는 육안검사시 미세한 크기의 이물질 또는 스크랫치 등이 발견되지 못하여 검사의 정확성이 떨어지는 문제점이 있었으며, 이러한 미세한 이물질 또는 스크랫치 등이 현미경검사시 발견되나 웨이퍼 한장의 전면을 현미경검사하기에는 시간이 많이 소요되어 생산성 향상의 저해요인 되므로 지정된 부분만 검사하게 되고, 따라서 치명적인 결함을 발견치 못하는 요인이 되어 검사불량이 발생하는 문제점이 있었다.However, the conventional semiconductor wafer inspection apparatus as described above has a problem in that the accuracy of inspection is inferior because no foreign substances or scratches of fine size are found during visual inspection, and such fine foreign substances or scratches are found during microscopic examination, but one wafer is used. It takes a long time to microscopically inspect the entire surface of the surface of the microscope, so that only the designated part is inspected, and thus, a defect is not detected because of a fatal defect.

본 발명의 주목적은 상기와 같은 여러 문제점이 발생하지 않는 반도체 웨이퍼 검사장치를 제공함에 있다.SUMMARY OF THE INVENTION An object of the present invention is to provide a semiconductor wafer inspection apparatus in which the various problems as described above do not occur.

본 발명의 다른 목적은 검사시간을 절감할 수 있도록 하는데 적합한 반도체 웨이퍼 검사장치를 제공함에 있다.Another object of the present invention is to provide a semiconductor wafer inspection apparatus suitable for reducing inspection time.

본 발명의 또 다른 목적은 검사불량이 발생하는 것을 방지하도록 하는데 적합한 반도체 웨이퍼 검사장치를 제공함에 있다.It is another object of the present invention to provide a semiconductor wafer inspection apparatus suitable for preventing inspection defects from occurring.

상기와 같은 본 발명의 목적을 달성하기 위하여 검사하고자 하는 웨이퍼를 고정시키기 위한 고정대와, 그 고정된 웨이퍼의 전면에 빛을 비추기 위한 발광기와, 상기 웨이퍼의 전면을 확대하여 검사자가 웨이퍼의 전면에 존재하는 외관불량을 일시에 확인하도록 하는 확대경을 구비하여서 구성되는 것을 특징으로 하는 반도체 웨이퍼 검사장치가 제공된다.In order to achieve the above object of the present invention, a holder for fixing a wafer to be inspected, a light emitter for shining light on the front surface of the fixed wafer, and an inspector is present on the front surface of the wafer by enlarging the front surface of the wafer. There is provided a semiconductor wafer inspection apparatus, characterized in that it is provided with a magnifying glass for confirming an appearance defect at a time.

이하, 상기와 같이 구성되는 본 발명 반도체 웨이퍼 검사장치를 첨부된 도면의 실시예를 참고하여 보다 상세히 설명하면 다음과 같다.Hereinafter, the semiconductor wafer inspection apparatus of the present invention configured as described above will be described in detail with reference to embodiments of the accompanying drawings.

제2도는 본 발명 반도체 웨이퍼 검사장치의 구성을 보인 정면도로서, 도시된 바와 같이, 본 발명 반도체 웨이퍼 검사장치는 본체(11)와, 그 본체(11)의 일측 상부에 설치되며 웨이퍼(W)에 발생된 이물질, 스크랫치 등을 검사하기 위한 확대경(12)과, 그 확대경(12)을 고정하기 위한 고정수단(13)과, 상기 본체(11)의 타측 상면에 설치되며 다수개의 웨이퍼(W)가 수납되는 카세트(14)와, 그 카세트(14)에 수납되어 있는 웨이퍼(W)를 인출하여 상기 확대경(12)의 하부로 이동하기 위한 무빙아암(15)과, 그 무빙아암(15)에 의해 이동된 웨이퍼(W)에 빛을 비추기 위한 발광기(16)로 구성된다.2 is a front view showing the configuration of the semiconductor wafer inspection apparatus of the present invention. As shown in the drawing, the semiconductor wafer inspection apparatus of the present invention is installed on the main body 11 and one side of the main body 11, and is placed on the wafer W. As shown in FIG. Magnifying glass 12 for inspecting the generated foreign matter, scratches, fixing means 13 for fixing the magnifying glass 12, and is installed on the other upper surface of the main body 11, a plurality of wafers (W) To the moving arm (15) and the moving arm (15) for pulling out and moving the wafer (W) stored in the cassette (14) to the lower part of the magnifying glass (12). It consists of a light emitter 16 for shining light on the wafer W moved by.

그리고, 상기 고정수단(13)은 확대경(12)을 고정하기 위한 고정대(17)와, 그 고정대(17)를 지지하기 위한 지지대(18)로 구성된 것을 특징으로 한다.In addition, the fixing means 13 is characterized in that consisting of a support (17) for fixing the magnifying glass 12, and a support (18) for supporting the support (17).

또한, 상기 고정대(17)은 상기 확대경(12)의 양면에 형성된 고정홈(12a)에 탄력고정되어 배율에 따른 교체가 용이하도록 탄성체로 하는 것이 바람직하며, 상기 지지대(18)는 확대경(12)을 일정각도로 조정이 가능하도록 절곡스프링을 사용하는 것이 바람직하다.In addition, the holder 17 is elastically fixed to the fixing groove (12a) formed on both sides of the magnifying glass 12 is preferably made of an elastic body to facilitate replacement according to the magnification, the support 18 is a magnifying glass 12 It is preferable to use a bending spring so that it can be adjusted at an angle.

상기와 같이 구성되는 본 발명 반도체 웨이퍼 검사장치를 이용하여 웨이퍼를 검사하는 동작을 설명하면 다음과 같다.An operation of inspecting a wafer using the semiconductor wafer inspection apparatus of the present invention configured as described above is as follows.

먼저, 검사하고자 하는 웨이퍼(W)들이 적재된 카세트(14)를 본체(11)의 상면에 설치한다. 그런 다음, 프로그램 입력부에 원하는 기능을 입력하면 무빙아암(15)이 이동하여 카세트(14)에 수납되어 있는 웨이퍼(W)들 중에 검사하고자 하는 1개의 웨이퍼(W)를 진공흡착하여 확대경(12)이 위치한 검사위치까지 이동한다.First, the cassette 14 loaded with the wafers W to be inspected is installed on the upper surface of the main body 11. Then, when a desired function is inputted to the program input unit, the moving arm 15 moves, and vacuum-adsorbs one wafer W to be inspected among the wafers W stored in the cassette 14 by vacuum suction. Move to the test position where is located.

상기와 같은 상태에서 무빙아암(15)의 각도가 일정각도로 조정되고, 발광기(16)를 이용하여 웨이퍼(W)의 상면에 빛을 비추도록 한 다음, 지지대(18)를 일정각도로 조정하여 확대경(12)이 웨이퍼(W)의 상면에 위치하도록 한다.In the above state, the angle of the moving arm 15 is adjusted to a predetermined angle, the light is emitted to the upper surface of the wafer W using the light emitter 16, and then the support 18 is adjusted to a predetermined angle. The magnifying glass 12 is positioned on the upper surface of the wafer W.

그런 다음, 작업자가 확대경(12)을 통하여 웨이퍼(W)의 전면을 보며 이물질, 스크랫치 등을 검사하게 된다.Then, the operator looks at the front of the wafer (W) through the magnifying glass 12 to inspect the foreign matter, scratches and the like.

상기와 같은 검사가 이루어지는 중에 배율이 다른 확대경(12)으로 교체하고자 할 경우에는 탄성체로 된 고정대(17)를 양측으로 벌려서 확대경(12)의 양면에 형성된 고정홈(12a)에서 고정대(17)를 빼낸 다음, 다른 배율의 확대경(12)으로 교체하면 된다.If the magnification is to be replaced with a magnifying glass 12 having a different magnification while the inspection is performed as described above, the holder 17 is opened in the fixing grooves 12a formed on both sides of the magnifying glass 12 by spreading the holder 17 made of elastic body to both sides. It can be removed and replaced with a magnifying glass 12 of a different magnification.

이상에서 상세히 설명한 바와 같이 본 발명 반도체 웨이퍼 검사장치는 웨이퍼에 발생된 이물질, 스크랫치 등을 검사하기 위한 확대경과, 그 확대경을 고정하기 위한 고정수단을 포함하여 구성되어, 확대경을 이용하여 웨이퍼의 전면을 일시에 검사함으로서, 검사시간의 절감에 따른 생산성이 향상되는 효과가 있고, 또한 검사불량을 방지할 수 있는 효과가 있다.As described in detail above, the semiconductor wafer inspection apparatus of the present invention comprises a magnifying glass for inspecting foreign substances, scratches, etc. generated in the wafer, and a fixing means for fixing the magnifying glass, and the front surface of the wafer using the magnifying glass. By inspecting at a time, there is an effect of improving the productivity by reducing the inspection time, and also has the effect of preventing the inspection failure.

Claims (1)

검사하고자 하는 웨이퍼를 고정시키기 위한 고정대와, 그 고정된 웨이퍼의 전면에 빛을 비추기 위한 발광기와, 상기 웨이퍼의 전면을 확대하여 검사자가 웨이퍼의 전면에 존재하는 외관결함을 일시에 확인하기 위한 확대경을 구비하여서 구성되는 것을 특징으로 하는 반도체 웨이퍼 검사장치.A holder for fixing the wafer to be inspected, a light emitter for illuminating the front surface of the fixed wafer, and a magnifying glass for enlarging the front surface of the wafer to check the appearance defects on the front surface of the wafer at one time. A semiconductor wafer inspection apparatus, comprising: provided.
KR1019960041409A 1996-09-21 1996-09-21 Semiconductor wafer inspection apparatus KR100239699B1 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100481074B1 (en) * 1997-09-10 2005-06-28 삼성전자주식회사 Semiconductor Wafer Inspection System

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03191537A (en) * 1989-12-20 1991-08-21 Nec Corp Semiconductor pellet mounting device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03191537A (en) * 1989-12-20 1991-08-21 Nec Corp Semiconductor pellet mounting device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100481074B1 (en) * 1997-09-10 2005-06-28 삼성전자주식회사 Semiconductor Wafer Inspection System

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