KR20010112698A - Method and apparatus for directly attaching engineering balls to a chip or printed circuit board with high efficiency - Google Patents

Abstract

The invention concerns a preformed roof cover element consisting essentially of a quadrilateral panel (1) with the shape of an isosceles trapezium whereof the two non-parallel sides (2 and 3) have rims (4 and 5), extending substantially over the whole length of said sides, said rims (4 and 5) raised on the same panel (1) side, the length of one of the trapezium bases (6) being substantially equal to that of the other base (7) increased by twice the thickness of said rim (4 and 5) wall so as to enable the rim (4 and 5) ends (8) to be engaged on the shortest base (7) side with the panel part bordered by said ends with a predetermined element between the ends (9) located at the longest base (6) side of another element extending in a projection of said predetermined element and parallel to said rims (4 and 5).

Description

TECHNICAL AND APPARATUS FOR DIRECTLY ATTACHING ENGINEERING BALLS TO A CHIP OR PRINTED CIRCUIT BOARD WITH HIGH EFFICIENCY}

The present invention relates to a method and a device for directly attaching engineering balls onto a highly efficient chip or substrate, and more particularly, by pulverizing the droplets flowing out of the spray tank through the orifice by vibrating the vibration device. By dropping onto the land of a chip or board, engineering balls for connecting contacts such as metal balls or ceramic balls, such as solder balls for a BG / Ship Scaled Package, A method and apparatus for forming precisely and efficiently on land of an array structure of the present invention.

Conventionally, the chip or substrate 1 according to the present invention has a ball fusion land 3 for electrical contact in a predetermined arrangement, as shown in plan view in FIG. Balls 5 are respectively attached to the ball fusion lands 3 so as to form electrical contact therewith. In a ball grid array / chip scaled package having a solder ball having such a structure, the solder ball is fused by applying heat by hot air or the like after placing it on an external device or a substrate. Therefore, since the electrical contact with the external device or the substrate is completed, it is convenient to form an electrical contact, which has been widely adopted in recent years.

In manufacturing such solder balls, droplets are formed by passing through orifices in a molten state, and they are manufactured by solidifying them. In particular, by preventing contact with oxygen in the process of solidifying, contamination is prevented and sphericity is improved. To this end, metal balls, such as solder balls for aviS / SP package, have been manufactured by dropping and solidifying molten metal droplets in an oil or inert gas atmosphere.

These devices basically adopt a droplet forming method using a conventional vibrating device, and drop the droplets from the injection tank into oil or inert gas during the downward movement of the piston by the vibrating device, and the liquid during the upward movement. The drop of the enemy is stopped to form droplets of a predetermined size and spherical shape, and then cooled to form a ball.

Also, recently, a method of spraying molten solder metal in the form of a ball without solder paste on lands of an array structure that is electrical contacts of a ball grid array package has been proposed. As an example, the invention disclosed in US Pat. No. 5,855,323 uses a piezoelectric vibrating element and a piston to drop a plurality of droplets from an injection tank onto lands of an arrangement on a chip or substrate to form fusion splicing contacts. Also in the present invention, as described above, by vibrating displacement of the piston, molten metal in the injection tank is sprayed by a predetermined amount through a plurality of orifices to form droplets, and the droplets are dropped onto lands of an array of chips or substrates. It attaches on a land, and the size and arrangement of a ball are achieved by replacing a grid plate.

The above-mentioned invention of U.S. Patent No. 5,855,323 can simplify the process of forming a conventional ball and then fusion of the balls to the land of the chip or substrate, but does not satisfy the requirements of fine pitch, precise size and sphericity. There is a problem that it is not practical.

Accordingly, the present invention is to solve this problem, the liquid droplets flowing out of the injection tank through the orifice by the vibration of the vibrating device is broken by dropping onto the land of the chip or the substrate by viseu / SIP package ( For the precise and highly efficient formation of engineering balls for metal or ceramic balls, such as solder balls for ball grid array / chip scaled packages, on lands of the chip or substrate array structure Its purpose is to provide a method and an apparatus thereof.

1 is a plan view showing an arrangement of lands of a chip or a board with a ball according to the present invention;

2 is a schematic cross-sectional view showing the configuration of a direct attachment device of engineering balls onto a highly efficient chip or substrate according to an embodiment of the present invention;

3 is a plan view of the rotary table of FIG. 2 for explaining a method of directly attaching engineering balls onto a highly efficient chip or substrate according to an embodiment of the present invention;

4 is a schematic cross-sectional view showing one example of a configuration for loading and unloading a chip or substrate onto a device according to the present invention;

5 is a schematic cross-sectional view for explaining a feature configuration of a direct attachment device of engineering balls onto a highly efficient chip or substrate according to another embodiment of the present invention;

Figure 6 is a schematic cross-sectional view for explaining a feature configuration of the direct attachment device of engineering balls on a highly efficient chip or substrate according to another embodiment of the present invention.

<Description of the symbols for the main parts of the drawings>

1: chip or substrate 2: location hole

3: ball fusion land 3a: first set ball fusion land

3b: Second Set Ball Fusion Land 5: Ball

50,80,90: Direct attachment of rotary engineering balls

51: injection tank 52: orifice grid

53: diaphragm 54: vibrator

60: rotary table 61: heater

62: support and contact roller 63: casing

64: inert gas supply device 65: rotating means

66: groove 67: loading and unloading device

70: image acquisition means 71: A / D converter

72: computer (main control unit) 73: vibration device control unit

81: injection tank vibrator 91: orifice pin

In order to achieve this purpose, a method of directly attaching engineering balls onto a highly efficient chip or substrate according to an embodiment of the present invention includes a vibrating device and a diaphragm for dissolving droplets of molten metal through a plurality of array orifices from a spray tank. It is broken by vibration and flows into the ball fusion land of chips or boards, so that it can be connected to metal balls or ceramic balls such as solder balls for the BG / Ship Scaled Package. A method of directly attaching engineering balls onto a chip or substrate for forming the engineering balls for the contacts on lands of the chip or substrate arrangement, respectively: the ball fusion land is divided into a plurality of sets of ball fusion lands, When fusion is performed by dropping a plurality of droplets respectively corresponding to one set of ball fusion lands among a plurality of sets of ball fusion lands from one of the plurality of injection tanks. Said at least solidify the surface to form a ball and the next, characterized in that the transfer to the position for dropping the liquid drops of the ball sealing land next set.

At this time, when the chip or substrate is loaded, a heating means such as a heater mounted on a rotating table is applied to heat the droplets to increase the adhesion of the droplets to the chip or substrate, and the droplets are dropped and adhered. It is preferable to cool and solidify by supplying an inert gas from the inert gas supply device.

In addition, the present invention, after dropping a plurality of droplets corresponding to each ball from the spray tank to the ball fusion land, the image of the ball and the ball fusion land dropped and attached by the image acquisition means, the obtained ball and land Data of the ball position, size, spherical shape, surface roughness, etc. are acquired by the computer (main control unit) from the image of the diaphragm through the vibration device control unit so that the position, size, spherical shape, surface roughness, etc., fall within the reference value range. It provides a method of directly attaching the engineering ball on the chip or substrate, characterized in that the control of the frequency, amplitude, waveform mode and the like. In this case, when the ball fusion land is divided into at least two sets of ball fusion lands to drop and attach the droplets, data such as the position, size, sphericalness, and surface roughness of the attached set is attached to the next set of balls. After converting to the next set of feed positions for controlling the relative position between the ball and the ball fusion land to apply to the control, the feed displacement is controlled, and the next set of It is preferable to control the frequency, amplitude, waveform mode and the like of the diaphragm via the vibrator control unit.

Further, the present invention relates to spray tank oscillation of the spray tank itself in correlation with the frequency, amplitude, waveform mode, etc. of the diaphragm oscillating in the molten metal in the spray tank so as to make the size and drop direction of the droplet falling from the orifice constant. Provided is a method for directly attaching engineering balls onto a highly efficient chip or substrate, characterized by vibrating by the device.

In addition, the present invention is characterized in that a high potential is applied to the spray tank and orifice and the ball fusion land of the rotating table or the chip or substrate so that the droplets can be easily dropped from the orifice in a predetermined position and direction. Provides a direct method of attaching engineering balls onto an efficient chip or substrate.

In addition, the present invention is to break down the molten metal from the spray tank through the orifice of a plurality of arrangement structure by vibrating the vibrating device and the diaphragm to flow out and drop onto the ball fusion land of the chip or substrate, the BG / SSP Apparatus for direct attachment of engineering balls onto chips or substrates for forming engineering balls for connecting contacts such as metal balls or ceramic balls, such as package solder balls, onto ball fusion lands of the chip or substrate arrangement A rotary table in which a plurality of chips or substrates are loaded such that the ball fusion lands of the arrangement of each chip or substrate are rotated to the drop-dropping position below the orifice corresponding to each of the orifices of the arrangement, respectively; It comprises a rotation means such as a pulse motor for rotating by precisely controlling the angular position To provide a direct attachment of engineering balls onto a highly efficient chip or substrate.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

2 shows a schematic cross-sectional and block diagram of a direct attachment device 20 of an engineering ball onto a highly efficient chip or substrate according to one embodiment of the invention, and FIG. 3 shows a plan view of a rotating table 60. Is shown.

First, in Fig. 1, the ball fusion land 3 is divided into a plurality of sets of ball fusion lands 3a, 3b. The position, size, sphericity, surface roughness, and the like of the preferred ball 5 are divided into such forms that can be obtained.

As shown in Fig. 2, in the present invention, the molten metal in the injection tank 51, as in the prior art, includes a molten metal supply pipe 13, a temperature sensor 14, a level sensor or a pressure sensor 15, and a flow control means. The constant temperature, pressure, fluidity, etc., by the 13 ', the heater 51', and the like are required to form the same and uniform droplets. The vibrator 54 is basically a conventional vibrator such as a piezoelectric vibrating element, and the injection tank 51 and the orifice 52 ′ are provided with the vibrating plate 53 by the vibrator 54. It is configured to flow out of the orifice 52 'of the injection tank 51 during the downward movement, and the molten metal that flows out during the upward movement escapes from the orifice 52' to form droplets.

Orifice 52 'of the injection tank 51 of the direct attachment device 50 of the rotary type engineering ball according to an embodiment of the present invention is formed in a plurality of arrangements, the arrangement of the chip or substrate 1 It is formed to correspond to the ball fusion land (3). In addition, the orifices 52 ′ may be formed in the orifice grid 52 so that the orifices 52 ′ may be separated and assembled with the injection tank 51 for the chip or substrate 1 having another arrangement. In order to form the ball 5 by dividing the ball fusion land 3 into a plurality of sets of ball fusion lands 3a, 3b ..., a plurality of injection tanks 51 are included, each of which has a plurality of sets of balls. Orifices 52 'corresponding to one set of ball fusion lands 3a, 3b ... of the fusion lands 3a, 3b ... are formed, respectively.

Moreover, the direct attachment device 50 of the rotary type engineering ball, as shown in Figs. 2 and 3, includes a rotary table 60 and a rotary means 65 of the rotary table 60, and rotates. The table 60 is provided with means for setting the position of the chip or substrate 1 according to the conventional art. For example, when the location hole 2 is formed in the chip or the substrate 1, a location pin may be installed to be precisely inserted into the location hole 2, and a location block may be installed in addition to the location hole 2 and the location pin. have.

The rotary table 60 has an orifice 52 corresponding to each of the orifices 52 'of the arrangement of the ball fusion lands 3 of the chip or substrate 1 disposed on the rotary table 60, respectively. And rotating means 65 such as a pulse motor for precisely controlling and rotating each position of the rotary table 60 so as to rotate to the drop drop position below. The rotary table 60 is divided into angular positions at equal intervals on the circumference as shown in FIG. The plurality of stations include a loading station, a first set dropping station, a first set image acquisition station, a second set dropping station,... Unloading station or the like.

In addition, each droplet dropping station is provided with a spray tank 51, and the image acquisition station has a ball (5) and to control the position, size, sphericity, surface roughness, etc. of the ball (5) formed by dropping the droplets And image acquisition means (70) for acquiring the image of the ball fusion land (3). Further, the position, size, sphericalness, surface roughness, etc. of the ball are acquired from the image of the ball and land acquired from the image acquisition means 70, and the position, size, sphericalness, surface roughness, etc., fall within the reference value range. Vibration control unit 73 and computer (main control unit) 72 for controlling the frequency, amplitude, waveform mode, etc. of the diaphragm 53 may be installed.

In addition, a loading and unloading device 67 is provided in the loading station and the unloading station for holding the chip or substrate 1 to load and unload the chip or substrate 1 at a precise position on the rotary table 60 as shown in FIG. It is installed together. The loading and unloading device 67, which can be configured in various ways according to the prior art, is shown in FIG. 4 in the form of a grip, and when inserted using the location hole 2 and the location hole, its insertion When the location pin is fixed, the loading and unloading device 67 moves up and down by a distance such that the gripping portion can move the location pin from the location hole 2, and also moves away from the rotary table 60. It is configured to reciprocate to a position. In addition, the groove 66 is formed in the rotary table 60 for the loading and unloading device 67 of such a structure.

Further, in the direct attaching device 50 of the rotary type engineering ball according to an embodiment of the present invention, the ball fusion land 3 of the droplets falling on the chip or substrate 1 when the chip or substrate 1 is loaded Heating means, such as heater 61, may be installed on the rotary table 60 to apply heat to increase the adhesion to the rotary table 60, and when the heating means is embedded in the rotary table 60, support for electrical connection and The contact roller 62 may be installed.

In addition, when the droplet falls from the orifice 52 'and adheres to the ball fusion land 3, the rotary attaching device 50 of the rotary type engineering ball cools and solidifies the dropped droplets. An inert gas supply device 64 for supplying an inert gas may be installed to prevent contact, and for this atmosphere, the inert gas supply device 64 may be sealed by a casing 63 at a portion except for the loading and unloading station of the chip or substrate 1. Can be configured.

5 is a schematic cross-sectional view of a characteristic configuration of the injection tank 51 of the direct attachment device 80 of the engineering ball according to another embodiment of the present invention. The injection tank 51 is provided with an injection tank vibrator 81 for vibrating the injection tank 51 itself. The injection tank vibrator 81 includes the frequency, amplitude, and amplitude of the vibrating plate 53 vibrating in the molten metal in the injection tank 51 so that the size and drop direction of the droplet falling from the orifice 52 'are constant. The waveform mode and the like are controlled in a constant relationship, and this relationship is largely determined by the size of the droplets.

In addition, the apparatus 90 for directly attaching an engineering ball according to another embodiment of the present invention illustrated in FIG. 6 includes a plurality of orifice pins 91 vibrating corresponding to each orifice 52 'together with the diaphragm 53. It is configured to include).

In addition, the ball fusion land of the injection tank 51 and the orifice 52 'and the rotary table 60 to the chip or substrate 1 so that the droplet can be easily dropped from the orifice 52' in a predetermined position and direction. And a potential applying means 68 for applying potentials opposite to each other to (3).

The operation and action of the manufacturing apparatus of the high precision and high yield engineering ball of this invention comprised in this way are demonstrated with the manufacturing method of this invention as follows.

As shown in FIG. 2, in the present invention, the molten metal in the injection tank 51 is stable in a certain temperature, pressure, fluidity, etc. by a temperature sensor, a level sensor or a pressure sensor, a flow control means, a heater, and the like. It is required to form the same and uniform droplets to remain in the state of. In addition, the vibrator 54 is basically a conventional vibrator such as a piezoelectric vibrating element, and the orifice 52 of the injection tank 51 when the vibrating plate 53 moves downward by the vibrator 54. ') And the molten metal flowing out during the ascending movement is separated from the orifice (52') to form a drop and drop.

The chip or substrate 1 is loaded in the precise position by the loading and unloading device 67 in the loading station SL of the rotary table 60 of FIGS. 2 and 3, and the rotary table 60 is rotated ( 65 to rotate the loaded chip or substrate 1 to the first set dropping station. At this time, the chip or substrate 1 is preheated by the heating means such as the heater 61 to increase the adhesion of the droplets. It is also possible by hot air of inert gas, not the heater 1.

In the first set dropping station S11, the vibrating device 54 of the injection tank 51 installed at the upper side vibrates downward, and drops are formed and dropped from the orifice 52 'by the diaphragm 53, As a result, the droplets drop and adhere to one set of the ball fusion lands 3a, 3b ... among the plurality of divided ball fusion lands 3a, 3b. At this time, the inert gas is supplied from the inert gas supply device 64 to cool and solidify the droplet and the ball 5.

Thereafter, the rotary table 60 is rotated by one station to transfer the chip or substrate 1 to which the set of balls 5 is attached to the first set image acquisition station S12. The station acquires images of the ball 5 and the ball fusion land 3 by the image acquisition means 70. The video signals and data of the balls and lands thus obtained are directly or input to the computer 72 through the A / D converter 71 to extract data such as the ball position, size, sphericalness, and surface roughness. . This process may use software such as known data acquisition systems. The data such as the position, the size, the sphericity, the surface roughness and the like obtained are compared with each other in the reference value range, and the frequency and amplitude of the diaphragm 53 via the vibrator control unit 73 as a function related to the degree of deviation from the reference value range. Control waveform mode.

The data of the first set ball fusion land 3a in which the balls 5 are already formed in this manner is the first set for dropping the droplets on the first set ball fusion land 3a of the next chip or substrate 1. It may be used for the control of the vibrator 54 of the droplet dropping station S11, and may also be applied to the ball attachment on the second set ball fusion land 3b. To this end, it is necessary to convert to the next set of feed positions for controlling the relative position between the ball 5 and the ball fusion land 3, and control the feed displacement of the rotary table 60 based on the converted values. It is also possible to control the frequency, amplitude, waveform mode, etc. of the diaphragm 53 via the vibrator control unit 73 for the second set drop drop station S21 without controlling the feed displacement.

After the image is acquired and processed in this manner, the rotary table 60 is rotated by one station and transferred to the second set dropping station S21 for attaching the next set of balls 5. After the drop station S21, the above process is repeated.

In this way, when the balls 5 are formed in all the ball fusion lands 3a, 3b ..., the chip or substrate 1 is unloaded by the loading and unloading device 67 at the unloading station SU. .

In the above-described embodiment of the present invention, the rotary table 60 is employed, but the present invention can be applied to a conveying means such as a linear conveyor rather than the rotary table 60.

In addition, when the injection tank vibrator 81 is employed, the injection tank 51 itself is fixed in a constant relationship with the frequency, amplitude, waveform mode, etc. of the vibration plate 53 vibrating in the molten metal in the injection tank 51. It can be vibrated so that the effects of the temperature, pressure, etc. of the molten metal in the injection tank 51 and the influence of the adhesion between the molten metal and the material of the orifice 52 'can be minimized so as to fall from the orifice 52'. Drop size and drop position can be made more precise and consistent.

In addition, even when a plurality of orifice pins 91 are vibrated together with the diaphragm 53 corresponding to each orifice 52 ', the orifice 52' is closer to the orifice 52 '. It can act on the drop and formation of the droplets, thereby minimizing the influence of the temperature, pressure, etc. of the molten metal in the injection tank 51 and the influence of the adhesion between the molten metal and the material of the orifice 52 ', The size and drop position can be made more precise and consistent.

In addition, as shown in FIG. 2, the dispensing means 68 is opposite to the injection tank 51 to the orifice 52 ′ and the ball fusion land 3 of the rotary table 60 to the chip or substrate 1. The potential is applied, the dropping droplets are applied to the spray tank 51 to the orifice 52 'and the molten metal and repulsive force therein, and the electric attraction force is applied to the lower chip or substrate 1 to The size and drop position can be made more precise and consistent.

According to the method of directly attaching an engineering ball onto a high-efficiency chip or substrate and the configuration and operation of the apparatus according to the embodiment of the present invention described above, a split ball forming method, an image control method, and a spray tank vibration device ( 81), orifice pin 91, potential application, etc., can precisely control the drop position, size, spherical shape and surface roughness of the engineering ball and form it directly on the ball fusion land (3). Engineering balls such as metal balls or ceramic balls, such as package solder balls, can be directly formed on the land of the chip or substrate array structure precisely and efficiently.

Claims (10)

The molten metal is crushed by the vibration of the vibrator 54 and the diaphragm 53 by pulverizing the molten metal from the spray tank 51 through the orifices 52 'of the plurality of arrangement structures. 3) By spilling and dropping onto the phase, the engineering ball for the connection contact point of the metal ball or ceramic ball, such as the solder ball for the BG / Ship Scaled Package, In the method of directly attaching engineering balls onto a chip or substrate for forming on the ball fusion lands 3 of the arrangement structure: The ball fusion land 3 is divided into a plurality of sets of ball fusion lands 3a, 3b... And one set of balls of a plurality of sets of ball fusion lands 3a, 3b... From one of the plurality of injection tanks 51. A plurality of droplets corresponding to the fusion lands 3a, 3b, respectively, are dropped and fused, and at least the surface is solidified to form a ball, and then the droplets are dropped onto the next set of ball fusion lands 3a, 3b. Direct attachment of engineering balls onto a highly efficient chip or substrate, characterized in that it is transferred to a position. 2. The method of claim 1 wherein heat is applied to increase the adhesion of the droplets to the chip or substrate 1 by heating means such as a heater 61 mounted to the rotary table 60 when the chip or substrate 1 is loaded. A method of directly attaching engineering balls onto a chip or substrate having high efficiency, wherein the droplets are dropped and the inert gas is supplied from the inert gas supply device 64 to cool and solidify when the droplets are dropped or attached. The molten metal is crushed by the vibration of the vibrator 54 and the diaphragm 53 by pulverizing the molten metal from the spray tank 51 through the orifices 52 'of the plurality of arrangement structures. 3) By spilling and dropping onto the phase, the engineering ball for the connection contact point of the metal ball or ceramic ball, such as the solder ball for the BG / Ship Scaled Package, In the method of directly attaching engineering balls onto a chip or substrate for forming on the ball fusion lands 3 of the arrangement structure: After dropping a plurality of droplets corresponding to the ball fusion land 3 from the spray tank 51, respectively, the image of the ball 5 and the ball fusion land 3 attached and dropped by the image acquisition means 70 The data of the ball, the position, the size, the spherical shape, the surface roughness, and the like are acquired by the computer (main control unit) 72 from the acquired ball and land images. A method of directly attaching an engineering ball onto a highly efficient chip or substrate, characterized by controlling the frequency, amplitude, waveform mode, etc. of the diaphragm 53 via the vibrator control unit 73 so as to fall within the reference value range. 4. The position, size, and spherical view of the attached set of balls according to claim 3, wherein when the ball fusion lands 3 are divided into at least two or more sets of ball fusion lands 3a, 3b, etc., the droplets are dropped or attached. , After converting the data such as surface roughness to the next set of feed positions for controlling the relative position between the ball 5 and the ball fusion land (3) to apply the next set of ball attachment, and controls the feed displacement, High-efficiency chip, characterized in that for controlling the frequency, amplitude, waveform mode, etc. of the diaphragm 53 via the next set of vibrator control unit 73 according to the data, such as the ball size, sphericity, surface roughness, etc. Direct attachment of engineering balls onto a substrate. The molten metal is crushed by the vibration of the vibrator 54 and the diaphragm 53 in the injection tank 51 through the orifices 52 'of a plurality of arrangements from the injection tank 51 to arrange the chip or the substrate. Engineering balls for connecting contacts of metal balls or ceramic balls, such as solder balls for Ball Grid Array / Chip Scaled Package, by spilling and falling onto the ball fusion lands 3 of the structure. In the method of directly attaching an engineering ball onto a chip or substrate for forming each on the ball fusion lands 3 of the arrangement of the chip or substrate: The spray tank 51 correlates with the frequency, amplitude, waveform mode, and the like of the diaphragm 53 oscillating in the molten metal in the spray tank 51 so as to maintain the size and drop direction of the droplet falling from the orifice 52 '. ) Direct attachment of engineering balls onto a highly efficient chip or substrate, characterized by vibrating itself by the spray tank vibrator (81). The molten metal is crushed by the vibration of the vibrator 54 and the diaphragm 53 in the injection tank 51 through the orifices 52 'of a plurality of arrangements from the injection tank 51 to arrange the chip or the substrate. Engineering balls for connecting contacts of metal balls or ceramic balls, such as solder balls for Ball Grid Array / Chip Scaled Package, by spilling and falling onto the ball fusion lands 3 of the structure. In the method of directly attaching an engineering ball onto a chip or substrate for forming each on the ball fusion lands 3 of the arrangement of the chip or substrate: Ball fusion lands 3 of the spray tank 51 and orifice 52 'and the rotary table 60 to the chip or substrate 1 so that the droplets can be easily dropped from the orifice 52' in a predetermined position and direction. Direct attachment of engineering balls onto a highly efficient chip or substrate, characterized by applying opposite potentials to each other). The molten metal is crushed by the vibration of the vibrator 54 and the diaphragm 53 by pulverizing the molten metal from the spray tank 51 through the orifices 52 'of the plurality of arrangement structures. 3) By spilling and dropping onto the phase, the engineering ball for the connection contact point of the metal ball or ceramic ball, such as the solder ball for the BG / Ship Scaled Package, In the direct attachment apparatus of engineering balls onto a chip or substrate for forming on the ball fusion lands 3 of the arrangement structure: A plurality of chips such that the ball fusion lands 3 of the arrangement of each chip or substrate 1 each rotate to the droplet drop position below the orifice 52 'corresponding to each of the orifices 52' of the arrangement. Or a rotating table 60 on which the substrate 1 is loaded, and a rotating means 65 such as a pulse motor for precisely controlling and rotating the respective positions of the rotating table 60. Direct attachment of engineering balls onto chip or board with high efficiency. 8. A rotating table (60) according to claim 7, comprising a loading and unloading device (67) for holding and unloading the chip or substrate (1) for loading and unloading at a precise position on the rotating table (60). A plurality of stations are formed by dividing into circumferentially equal intervals, and dropping a plurality of corresponding droplets from the spray tank 51 to the ball fusion land 3 at the droplet dropping station, and then dropping and attaching them. Image acquisition means 70 for acquiring the image of the ball 5 and the ball fusion land 3 at an image acquisition station, and the position, size, spherical shape, and surface of the ball from the acquired image of the ball and land. The vibration device control unit 73 and the computer (main control unit) to control the frequency, amplitude, waveform mode, etc. of the diaphragm 53 so that the position, size, spherical shape, surface roughness, etc. are included in the reference value range by acquiring data such as illuminance. High characterized in that it comprises 72 Rate of chips or direct attached device of the engineering view of the substrate. 8. The rotary table (60) according to claim 7, in which heat is applied to the rotary table (60) to increase the adhesion of the droplets falling on the chip or substrate (1) to the ball fusion land (3) when the chip or the substrate (1) is loaded. A heating means such as a built-in heater 61, and an inert gas supply device 64 for supplying an inert gas when the droplet is dropped or attached to cool and solidify the droplet attached and dropped. Direct attachment of engineering balls onto chip or board with high efficiency. 8. The method according to claim 7, wherein the size, drop direction of the droplets falling from the orifice (52 ') correlate with the frequency, amplitude, waveform mode, etc. of the vibrating plate (53) vibrating in the molten metal in the injection tank (51). And at least one injection tank vibrator 81 for vibrating the injection tank 51 itself and an orifice pin 91 vibrating corresponding to each orifice 52 'together with the diaphragm 53. Direct attachment of engineering balls onto a highly efficient chip or substrate, characterized in that the configuration.