KR20010048741A - A Zn-Ni ALLOY ELECTRODEPOSITION SOLUTION AND A METHOD FOR MANUFACTURING Zn-Ni ALLOY ELECTRODEPOSITION STEEL SHEET BY USING IT - Google Patents

A Zn-Ni ALLOY ELECTRODEPOSITION SOLUTION AND A METHOD FOR MANUFACTURING Zn-Ni ALLOY ELECTRODEPOSITION STEEL SHEET BY USING IT Download PDF

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KR20010048741A
KR20010048741A KR1019990053541A KR19990053541A KR20010048741A KR 20010048741 A KR20010048741 A KR 20010048741A KR 1019990053541 A KR1019990053541 A KR 1019990053541A KR 19990053541 A KR19990053541 A KR 19990053541A KR 20010048741 A KR20010048741 A KR 20010048741A
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solution
zinc
plating
chloride
alloy electroplating
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KR100419655B1 (en
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김현태
한갑수
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이구택
포항종합제철 주식회사
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    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/56Electroplating: Baths therefor from solutions of alloys
    • C25D3/565Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of zinc
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00Processes for servicing or operating cells for electrolytic coating
    • C25D21/02Heating or cooling
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00Processes for servicing or operating cells for electrolytic coating
    • C25D21/12Process control or regulation
    • C25D21/14Controlled addition of electrolyte components

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

PURPOSE: A Zn-Ni alloy electroplating solution and a method for manufacturing Zn-Ni alloy electroplating steel sheet using the same are provided which can manufacture a Zn-Ni alloy electroplating steel sheet having superior appearance of the surface and cohesion by using a basic solution in which zinc chloride and nickel chloride are used as a basic materials and chloride ions are adjusted by potassium chloride, and adding ammonium chloride and an appropriate amount of a mixed additive of sodium salt condensed naphthalene sulfonic acid and sodium sulfate as an additive. CONSTITUTION: The Zn-Ni alloy electroplating solution is prepared by adding 0.1 to 1.0 mols of ammonium chloride, 1:0.001-0.008 mol ratio of sodium sulfonate for the ammonium chloride, and 1:0.1 - 0.5 mol ratio of sodium sulphate for the sodium sulfonate to a chloride based Zn-Ni alloy electroplating solution comprising 0.5 to 2.0 mols of zinc ions, 0.1 to 0.5 mols of nickel ions and 6.0 to 9.0 mols of chloride ions. In a method for electroplating Zn-Ni on a substrate metal, the method for manufacturing Zn-Ni alloy electroplating steel sheet comprises the process of electroplating the substrate metal using the Zn-Ni alloy electroplating solution under the plating conditions of pH of the plating solution of 2.5 to 4.5, a temperature of the plating solution of 55 to 70 deg.C, a current density of 40 to 180 A/dm2, and a relative flow rate of the plating solution and an anode of 0.5 to 2.5 m/sec.

Description

아연-니켈 합금전기도금용액 및 이 용액을 이용한 아연-니켈 합금전기도금강판의 제조방법{A Zn-Ni ALLOY ELECTRODEPOSITION SOLUTION AND A METHOD FOR MANUFACTURING Zn-Ni ALLOY ELECTRODEPOSITION STEEL SHEET BY USING IT}Zn-Ni ALLOY ELECTRODEPOSITION SOLUTION AND A METHOD FOR MANUFACTURING Zn-Ni ALLOY ELECTRODEPOSITION STEEL SHEET BY USING IT}

본 발명은 가용성 양극을 사용하는 아연-니켈 합금 전기도금용액에 관한 것으로, 보다 상세하게는 도금용액의 성분 및 도금조성을 조정함으로써, 양호한 표면외관 및 밀착성을 얻을 수 있는 아연-니켈 합금 전기도금용액 및 이를 이용한 아연-니켈 합금 전기도금강판의 제조방법에 관한 것이다.The present invention relates to a zinc-nickel alloy electroplating solution using a soluble anode, and more particularly, to a zinc-nickel alloy electroplating solution capable of obtaining good surface appearance and adhesion by adjusting the composition and plating composition of the plating solution. It relates to a method of manufacturing a zinc-nickel alloy electroplated steel sheet using the same.

옛부터 철 위에 금속도금은 방청, 장식 등을 위해서 많이 사용되어 왔다. 특히, 아연 전기도금은 강판의 내식성 확보를 위해 개발되어 가전, 자동차, 건설 등의 분야에서 널리 이용되어 왔다. 그러나, 가혹한 분위기하에서 내식성을 확보하기 위해서는 아연 도금층의 두께를 증가시켜야 하기 때문에, 비용증가와 더불어, 밀착성 및 가공성 등에도 좋지 않은 영향을 주었다. 따라서, 이러한 결점을 해결하기 위해서 아연-니켈 합금전기도금이 개발되어 왔다.Since ancient times, metal plating on iron has been widely used for rust prevention and decoration. In particular, zinc electroplating has been developed to secure the corrosion resistance of the steel sheet has been widely used in the fields of home appliances, automobiles, construction and the like. However, in order to secure corrosion resistance under severe atmosphere, the thickness of the galvanized layer must be increased, which has an adverse effect on adhesion and workability as well as an increase in cost. Therefore, zinc-nickel alloy electroplating has been developed to solve this drawback.

아연-니켈 합금전기도금은 욕의 성분에 따라서 여러가지가 있는데, 그 중 산성욕을 기본으로 한 도금재 생산방식이 일반적으로 널리 사용되고 있다. 산성욕에는 황화물욕이 기본이 되는 것과 염화물욕이 기본이 되는 것 등이 있다. 염화물욕은 황화물욕에 비하여 전기전도도가 우수하여 고전류밀도 도금이 가능하고 주로 가용성 양극을 사용하므로, 불용성 양극을 사용하는 황화물욕에 비해 용액의 제어가 편리하고, 비용이 적게 든다. 상기 가용성 양극을 사용하는 것으로는 주로 아연과 니켈이 있는데 일반적으로, 아연이 약 85이상이다. 따라서, 아연 양극에 슬러지 (sludge)나 이물질이 남아있지 않아야 균일한 용해성을 갖어, 양호한 도금제품을 생산할 수 있다. 그러나, 아연과 니켈은 염화물 도금욕에서 전위차가 크므로 아연양극에 니켈의 무전해 치환으로 인한 아연 양극에 아연 수산화물계통의 슬러지가 발생하게 된다. 이 슬러지는 양극 표면에 붙어서 연속적 작업시 아연 용해가 불균일 하도록 하여 도금액의 심한 농도변화를 유발하고, 통전을 방해하여 도금전압을 상승시키며 도금층의 표면외관이 불균일하게 한다. 특히, 양극 표면에 붙은 슬러지는 다시 슬러지 형태로 박리되어 도금층에 줄무늬 및 강판의 양 에지(edge)에 버닝(burning)성 얼룩을 발생시킨다. 나아가, 슬러지 혼합으로 인해 도금층의 밀착성도 떨어지게 된다.There are various zinc-nickel alloy electroplating methods depending on the components of the bath. Among them, an acidic bath-based plating material production method is widely used. Acid baths include sulfide baths as the basis and chloride baths as the base. Chloride baths have better electrical conductivity than sulfide baths, which enables high current density plating and mainly use soluble anodes, making solution control easier and less expensive than sulfide baths using insoluble anodes. The use of the soluble anode mainly includes zinc and nickel, and zinc is generally about 85 or more. Therefore, sludge or foreign matter should not remain on the zinc anode, so that it can have a uniform solubility and can produce a good plating product. However, since zinc and nickel have a large potential difference in the chloride plating bath, sludge in the zinc hydroxide system is generated in the zinc anode due to the electroless substitution of nickel in the zinc anode. This sludge adheres to the surface of the anode, so that zinc dissolution becomes uneven during continuous operation, causing severe concentration change of the plating solution, preventing the conduction, increasing the plating voltage, and making the surface appearance of the plating layer uneven. In particular, the sludge adhering to the surface of the anode is peeled again in the form of sludge, causing streaks and burning stains on both edges of the steel sheet in the plating layer. Furthermore, the adhesion of the plating layer is also degraded due to the sludge mixing.

이러한 문제점을 해결하기 위한 종래기술로서 일본특허공재 (소)58-55585호, 일본특허공개(소)59-211589호 및 한국특허출원 93-29962호가 있다.Conventional techniques for solving such problems include Japanese Patent Application Laid-Open No. 58-55585, Japanese Patent Application Laid-Open No. 59-211589, and Korean Patent Application No. 93-29962.

일본특허공개(소)58-55585호는, 염화아연과 염화니켈을 주성분으로 한 도금용액에 각종 염화물을 1종 혹은 2종 이상 첨가함에 의해 도금층의 표면외관을 향상시키는 것에 관한 것이나, 도금층의 밀착성이 떨어지는 문제가 있다.Japanese Patent Application Laid-Open No. 58-55585 relates to improving the surface appearance of a plating layer by adding one or two or more kinds of chlorides to a plating solution containing zinc chloride and nickel chloride as a main component, or the adhesion of the plating layer. There is a problem with this falling.

일본특허공개(소)59-211589는 염화아연 및 염화니켈을 주성분으로 하는 염화물욕 및 유산염을 혼합한 도금액에 염화 암모늄염을 일부 첨가하고 도금조건을 변경함으로써, 석출물에 부수적으로 수반되는 황갈색이나 청자색 산화물의 혼입석출을 유효하게 억제하는 기술이다. 그러나, 상기 방법에 의하면, 초기 약 100시간 정도까지는 산화물의 석출이 억제되지만, 그 이상 조업시 다시 석출물이 나타나는 결점이 있다.Japanese Patent Application Laid-Open No. 59-211589 discloses a yellowish brown or blue-violet oxide incidentally to the precipitate by adding some ammonium chloride salt to a plating solution containing zinc chloride and nickel chloride as a main component, and a plating solution containing lactate and changing plating conditions. This technique effectively suppresses the mixed precipitation of However, according to the above method, the precipitation of oxide is suppressed up to about 100 hours at the beginning, but there is a drawback that the precipitate appears again during further operation.

한국특허출원 93-29962호는, 첨가제로 알콜을 첨가하여 양극의 용해성을 개선하는 방법이나, 장시간 사용할 경우 알콜이 휘발되어 소모가 심해지는 단점이 있다.Korean Patent Application No. 93-29962 is a method of improving the solubility of the positive electrode by adding alcohol as an additive, but has a disadvantage in that the alcohol is volatilized and consumed severely when used for a long time.

그 외, 도금액에 염화암모늄염을 첨가하여 양극의 반응성을 개선한 것도 있으나, 이것도 양극에 슬러지의 이탈을 가속시켜 용액중 슬러지의 양을 증가시키는 문제점이 있다.In addition, although ammonium chloride salt is added to the plating solution to improve the reactivity of the positive electrode, this also has a problem of increasing the amount of sludge in the solution by accelerating the release of sludge to the positive electrode.

상기한 바와 같이 지금까지 제안된 종래기술는 아연-니켈 합금도금에서 양극의 용해성을 개선함으로써 도금층의 표면외관 및 도금층의 밀착성을 개선하려고 하였으나, 장시간 사용시 용액에 슬러지가 다시 증가하거나, 용액의 도금성변화로 인해 오히려 도금층의 표면외관이 불량해지는 결점이 있었다.As described above, the conventional techniques proposed up to now try to improve the surface appearance of the coating layer and the adhesion of the coating layer by improving the solubility of the anode in zinc-nickel alloy plating, but the sludge increases again or changes the plating property of the solution after prolonged use. Rather, there was a defect that the surface appearance of the plating layer is poor.

본 발명자들은 상기한 종래기술의 제반 문제점을 해결하기 위하여 연구 및 실험을 행하고, 그 결과에 근거하여 본 발명을 제안하게 된 것으로서, 본 발명 염화아연 및 염화니켈을 기본으로 하고 염화이온을 염화칼륨으로 조정한 기본 용액을 이용하고, 염화암모늄염과 첨가제로서 술폰산나트륨(sodium salt condensed naphthalene sulfonic acid) 및 황산염나트륨(sodium sulfate)의 혼합첨가제를 적정량 첨가함으로써, 표면외관 및 밀착성이 우수한 아연-니켈 합금전기도금강판의 제조가 가능한 아연-니켈 전기도금용액 및 이를 이용하여 표면외관 및 밀착성이 우수한 아연-니켈합금 전기도금강판을 제조하는 방법을 제공하고자 하는데, 그 목적이 있다.MEANS TO SOLVE THE PROBLEM The present inventors carried out research and experiment in order to solve the above-mentioned problems of the prior art, and proposed the present invention based on the results. Zinc-nickel alloy electroplating sheet with excellent surface appearance and adhesion by using a basic solution and adding an appropriate amount of a mixed additive of ammonium chloride salt and sodium salt condensed naphthalene sulfonic acid and sodium sulfate as an additive. To provide a zinc-nickel electroplating solution that can be prepared and a zinc-nickel alloy electroplating steel sheet having excellent surface appearance and adhesion using the same, and its purpose is to provide.

본 발명은, 아연이온: 0.5~2.0몰, 니켈이온: 0.1~0.5몰, 염화이온: 6.0~9.0몰로 조성되는 염화물계 아연-니켈 합금 전기도금용액에,The present invention is a chloride-based zinc-nickel alloy electroplating solution composed of zinc ion: 0.5 to 2.0 mol, nickel ion: 0.1 to 0.5 mol, chloride ion: 6.0 to 9.0 mol,

(a) 0.1~1.0몰의 염화 암모늄염;(a) 0.1-1.0 molar ammonium chloride salt;

(b) 상기 염화 암모늄염에 대해 1:0.001~0.008몰비의 술폰산 나트륨; 및(b) from 1: 0.001 to 0.008 molar ratio of sodium sulfonate relative to the ammonium chloride salt; And

(c) 상기 술폰산 나트륨에 대해 1:0.1~0.5몰비의 황산염 나트륨을 첨가하여 이루어지는 아연-니켈 합금전기도금용액에 관한 것이다.(c) A zinc-nickel alloy electroplating solution formed by adding 1: 0.1 to 0.5 molar ratio of sodium sulfate to sodium sulfonate.

또한 본 발명은, 소지금속에 아연-니켈을 전기도금하는 방법에 있어서,In addition, the present invention is a method of electroplating zinc-nickel on a base metal,

상기 도금용액을 이용하여, 도금용액의 pH를 2.5~4.5로, 그 온도를 55~70℃로, 전류밀도를 40~180A/d㎡로, 그리고 도금용액과 음극의 상대 유속을 0.5~2.5m/sec로 하는 도금조건으로 전기도금하여 아연-니켈합금 전기도금강판을 제조하는 방법에 관한 것이다.Using the plating solution, the pH of the plating solution was 2.5 to 4.5, the temperature was 55 to 70 ° C, the current density was 40 to 180 A / dm 2, and the relative flow rates of the plating solution and the cathode were 0.5 to 2.5 m. The present invention relates to a method of manufacturing a zinc-nickel alloy electroplated steel sheet by electroplating under a plating condition of / sec.

이하, 본 발명을 상세히 설명한다.Hereinafter, the present invention will be described in detail.

[아연-니켈 함금전기도금용액][Zinc-Nickel Electroplating Solution]

본 발명은 염화아연, 염화니켈 및 염화암모늄염을 주성분으로 하는 도금용액에 술폰산나트륨과 황산염나트륨을 적정량 첨가하여 아연-니켈합금 전기도금용액을 조성함으로써, 아연-니켈합금 전기도금강판의 표면외관 및 밀착성을 향상시키고자 하는데 그 특징이 있다.The present invention provides a zinc-nickel alloy electroplating solution by adding an appropriate amount of sodium sulfonate and sodium sulfate to a plating solution mainly composed of zinc chloride, nickel chloride and ammonium chloride salts, thereby forming the surface appearance and adhesion of the zinc-nickel alloy electroplating steel sheet. There is a feature to improve this.

본 발명의 도금용액에 있어서, 아연이온 몰농도가 0.5몰 미만인 경우에는 금속이온이 부족하여 도금강판에 검게 그을린 자국(burning)이 발생할 수 있고, 2.0몰을 초과하는 경우에는 도금층이 분말 형태의 도금이 되어서 밀착성이 떨어진다. 따라서, 상기 아연이온은 0.5~2.0몰로 제한하는 것이 바람직하다.In the plating solution of the present invention, when the zinc ion molar concentration is less than 0.5 moles, metal ions may be insufficient to burn tanned steel sheets, and when the molar concentration exceeds 2.0 moles, the plating layer may be powder-plated. This becomes inferior to adhesiveness. Therefore, the zinc ion is preferably limited to 0.5 to 2.0 moles.

상기 도금용액의 니켈이온 몰농도가 0.1몰 미만인 경우에는 도금층의 합금에서 니켈함량이 10이상 확보되지 않아 내식성이 떨어지며, 몰농도가 0.5몰을 초과하는 경우에는 도금층의 니켈 함량이 16이상이 되어서 가공성 및 내식성이 떨어진다. 따라서, 상기 니켈이온은 0.1~0.5몰로 제한하는 것이 바람직하다.If the nickel ion molar concentration of the plating solution is less than 0.1 mole, the nickel content in the alloy of the plating layer is not secured because the nickel content is not more than 10, the corrosion resistance is lowered. And poor corrosion resistance. Therefore, the nickel ion is preferably limited to 0.1 ~ 0.5 mol.

상기 도금용액의 염화이온 몰농도가 6.0몰 미만인 경우에는 전기전도도의 감소로 인한 버닝이 다량 발생하고, 9.0몰을 초과하는 경우에는 용해도 문제로 염화이온이 석출하게 된다. 따라서, 상기 염화이온은 6.0~9.0몰로 제한하는 것이 바람직하다.When the molar concentration of chloride ion of the plating solution is less than 6.0 moles, a large amount of burning occurs due to a decrease in electrical conductivity, and when it exceeds 9.0 moles, chloride ions are precipitated due to solubility problems. Therefore, the chloride ion is preferably limited to 6.0 ~ 9.0 mol.

한편, 상기 도금용액의 염화암모늄염의 몰농도가 0.1몰 미만인 경우에는 연속 도금작업을 어렵게하는 슬러지(sludge)가 다량 발생되고, 1.0몰을 초과하는 경우에는 양극에서 검은색의 피막이 발생되어 도금용액이 오염된다. 따라서, 상기 염화암모늄은 0.1~1.0몰로 제한하는 것이 바람직하다.On the other hand, when the molar concentration of the ammonium chloride salt of the plating solution is less than 0.1 mol, a large amount of sludge is generated, which makes it difficult to perform continuous plating operation, and when it exceeds 1.0 mol, a black film is generated at the anode and the plating solution is formed. Is contaminated. Therefore, the ammonium chloride is preferably limited to 0.1 ~ 1.0 mole.

상기 술폰산나트륨의 농도는 상기 염화 암모늄염에 대해 1:0.001~0.008몰비가 바람직한데, 그 이유는 염화 암모늄 몰 대비가 0.001 미만인 경우에는 조업시 양극 피막의 슬러지를 억제하지 못해 도금층의 표면외관 및 밀착성이 개선되지 못하고, 0.008을 초과하는 경우에는 도금층의 전류효율을 떨어뜨려 에지에 버닝성 표면불량이 발생되기 때문이다. 따라서, 상기 술폰산나트륨은 상기 염화암모늄에 대해 1:0.001~0.008몰비로 제한하는 것이 바람직하다.The concentration of sodium sulfonate is preferably 1: 0.001 to 0.008 molar ratio with respect to the ammonium chloride salt, because when the molar ratio of ammonium chloride is less than 0.001, the surface appearance and adhesion of the plating layer may not be suppressed due to the sludge of the anode coating during operation. This is because, when it is not improved and exceeds 0.008, the current efficiency of the plating layer is lowered, and burnable surface defects are generated at the edges. Therefore, the sodium sulfonate is preferably limited to 1: 0.001 to 0.008 molar ratio with respect to the ammonium chloride.

또한, 상기 황산염나트륨은 술폰산 나트륨에 대해 1:0.1~0.5몰비인 것이 바람직한데, 그 이유는 술폰산 나트륨 대비 황산염 나트륨의 비가 0.1 미만인 경우에는 표면외관이 노랗게 되며, 0.5를 초과하는 경우에는 밀착성이 감소되기 때문이다. 따라서, 상기 황산나트륨은 상기 술폰산나트륨에 대해 1:0.1~0.5몰비로 제한하는 것이 바람직하다.In addition, the sodium sulfate is preferably 1: 0.1 to 0.5 molar ratio with respect to sodium sulfonate, the reason is that when the ratio of sodium sulfate to sodium sulfonate is less than 0.1, the surface appearance is yellow, and if it exceeds 0.5, the adhesion decreases Because it becomes. Therefore, the sodium sulfate is preferably limited to 1: 0.1 to 0.5 molar ratio with respect to the sodium sulfonate.

[아연-니켈 합금전기도금강판의 제조방법][Manufacturing method of zinc-nickel alloy electroplating steel sheet]

본 발명은, 상기한 본 발명의 아연-니켈 합금전기도금용액을 소지강판에 전기도금하여 아연-니켈합금 전기도금강판을 제조하는 방법에 관한 것이다. 본 발명에 따라 전기도금하는 경우 도금조건은 도금용액의 pH:2.5~4.5, 온도:55~70℃, 전류밀도:40~180A/d㎡ 로 하고 상기 도금용액과 음극의 상대 유속을 0.5~2.5m/sec로 하는 것이 바람직하다.The present invention relates to a method for producing a zinc-nickel alloy electroplated steel sheet by electroplating the zinc-nickel alloy electroplating solution of the present invention on a steel sheet. In the case of electroplating according to the present invention, the plating conditions are pH: 2.5 to 4.5 of the plating solution, temperature: 55 to 70 ° C, current density: 40 to 180 A / dm 2, and the relative flow rates of the plating solution and the cathode are 0.5 to 2.5. It is preferable to set it as m / sec.

상기 도금용액의 pH가 2.5 미만이면 도금표면이 어둡고 반광택상태가 되며, 4.5를 초과하면 용액에 녹은 불순이온의 슬러지화에 의해 도금액이 오염되므로, pH는 2.5~4.5로 제한하는 것이 바람직하다.If the pH of the plating solution is less than 2.5, the plating surface becomes dark and semi-gloss, and if it exceeds 4.5, the plating solution is contaminated by sludge of impurity ions dissolved in the solution, so the pH is preferably limited to 2.5 to 4.5.

상기 도금용액의 온도가 55℃ 미만이면 도금층의 색상이 어둡고 도금층의 밀착성이 떨어져서 박리현상이 나타난다. 반면, 도금층의 온도가 70℃를 초과하는 경우에는 도금 줄무늬 현상이 심하며 도금층의 광택이 없어진다. 따라서, 도금용액의 온도는 55~70℃로 제한하는 것이 바람직하다.When the temperature of the plating solution is less than 55 ° C., the color of the plating layer is dark and the adhesion of the plating layer is inferior, resulting in peeling. On the other hand, when the temperature of the plating layer exceeds 70 ℃ plating phenomena are severe and the gloss of the plating layer is lost. Therefore, the temperature of the plating solution is preferably limited to 55 ~ 70 ℃.

상기 전류밀도는 40~180A/d㎡로 제한하는 것이 바람직한데, 이는 전류밀도가 40A/d㎡미만의 경우에는 도금결정이 조대해지고 밀착성이 떨어지며, 180A/d㎡를 초과하면 에지버닝이 다량 발생되기 때문이다.It is preferable to limit the current density to 40 ~ 180A / dm 2, which is when the current density is less than 40A / dm 2, the plating crystals are coarse and the adhesion is poor, if the current density exceeds 180A / dm 2 a large amount of edge burning occurs Because it becomes.

상기 도금액과 음극(피도금체의 강판)의 상대유속은 0.5~2.5m/sec로 제한하는 것이 바람직한데, 이는 상대유속이 0.5m/sec 미만인 경우에는 에지버닝이 다량발생하고, 2.5m/sec를 초과하는 경우에는 도금조업이 곤란해지기 때문이다.The relative flow rate of the plating liquid and the negative electrode (steel plate of the plated body) is preferably limited to 0.5 to 2.5 m / sec. When the relative flow rate is less than 0.5 m / sec, a large amount of edge burning occurs and 2.5 m / sec. It is because plating operation becomes difficult when it exceeds.

이하, 실시예를 통하여 본 발명을 보다 상세히 설명한다.Hereinafter, the present invention will be described in more detail with reference to Examples.

(실시예)(Example)

냉연강판을 소지금속으로 하여 하기 표1에 나타난 도금액 조성을 가진 용액을 연속조업으로 5일(120시간)을 도금한 후, 탁도량, 표면외관 및 도금 밀착성을 측정하고, 그 평가결과를 하기 표1에 나타내었다. 하기 표1의 탁도량은 용액에 전기도금을 양극반응성 시험장치로서 연속으로 4시간 행한 다음 도금액에 발생되어 있는 탁도량으로 측정한 것이다. 상기 도금 밀착성은 120˚ 구부린 뒤 테이프에 묻어나는 도금층의 박리량으로 측정한 것인데, 테이프에 박리된 도금층이 보이면 불량으로 나타내었다. 또한, 상기 표면외관은 30g/㎡의 도금량으로 도금한 제품의 광택도와 백색도로 평가하였는데, 광택도기로 측정된 광택도는 70 이상은 양호, 그 이하는 불량으로 나타내었으며, 색차계로 측정된 백색도는 60 이상은 양호, 그 이하는 불량으로 나타내었다.After the plating of the solution having the plating liquid composition shown in Table 1 as a base metal for 5 days (120 hours) using a cold rolled steel sheet as a base metal, the turbidity, surface appearance and plating adhesion were measured, and the evaluation results are shown in Table 1 below. Shown in The turbidity of Table 1 is measured by the amount of turbidity generated in the plating solution after 4 hours of continuous electroplating of the solution as a positive electrode reactivity test apparatus. The plating adhesion is measured by the peeling amount of the plating layer buried in the tape after bending 120 °, it was shown as defective when the peeled plating layer is visible on the tape. In addition, the surface appearance was evaluated by the degree of gloss and whiteness of the product plated with a plating amount of 30g / ㎡, the glossiness measured by the glossiness is more than 70 is good, the less is shown as poor, the whiteness measured by the color difference meter 60 or more was good and the following was shown to be bad.

구분division 도금액 조성Plating solution 첨가제 조건Additive condition Zn2+ Zn 2+ Ni2+ Ni 2+ Cl- Cl - NH4+ NH 4+ NH4+:술폰산나트륨(몰비)NH 4+ : Sodium sulfonate (molar ratio) 술폰산나트륨:황산염나트륨(몰비)Sodium sulfonate: Sodium sulfate (molar ratio) 도금액 탁도량(NTU)Plating solution turbidity (NTU) 광택도Glossiness 백색도Whiteness 도금박리성Peeling 비교예1Comparative Example 1 1.11.1 0.180.18 7.07.0 0.80.8 1:0.001: 0.00 0:00: 0 0.90.9 불량Bad 불량Bad 불량Bad 비교예2Comparative Example 2 1:0.00051: 0.0005 1:0.31: 0.3 0.70.7 불량Bad 불량Bad 불량Bad 발명예3Inventive Example 3 1:0.0011: 0.001 0.20.2 양호Good 양호Good 양호Good 발명예4Inventive Example 4 1:0.0051: 0.005 0.10.1 양호Good 양호Good 양호Good 발명예5Inventive Example 5 1:0.0081: 0.008 0.20.2 양호Good 양호Good 양호Good 비교예6Comparative Example 6 1:0.011: 0.01 0.20.2 불량Bad 불량Bad 양호Good 비교예7Comparative Example 7 1:0.0051: 0.005 1:0.001: 0.00 0.30.3 불량Bad 불량Bad 양호Good 비교예8Comparative Example 8 1:0.051: 0.05 0.30.3 불량Bad 불량Bad 양호Good 발명예9Inventive Example 9 1:0.11: 0.1 0.20.2 양호Good 양호Good 양호Good 발명예10Inventive Example 10 1:0.31: 0.3 0.10.1 양호Good 양호Good 양호Good 발명예11Inventive Example 11 1:0.51: 0.5 0.20.2 양호Good 양호Good 양호Good 비교예12Comparative Example 12 1:0.61: 0.6 0.30.3 양호Good 불량Bad 불량Bad

상기 표1에 나타난 바와 같이, 본 발명에 부합되는 발명예는 모두 0.2 이하의 낮은 탁도량을 나타내고, 광택도 및 백색도에 있어서도 양호함을 나타내어 표면외관이 양호함을 알 수 있다. 또한, 도금 박리성도 양호하여 밀착성도 우수함을 알 수 있다. 반면, 술폰산나트륨이 첨가되지 않거나 미량 첨가된 비교예(1),(2)는 모든 평가에서 불량함을 나타내었고, 과량 첨가된 비교예(6)과 황산염나트륨이 첨가되지 않거나 미량첨가된 비교예(7),(8)은 도금박리성은 양호하였으나, 광택도 및 백색도가 불량하여 표면외관이 나쁜 것으로 유추된다. 또한, 황산염나트륨이 본 발명보다 과량첨가된 비교예(12)의 경우 백색도 및 도금박리성이 불량한 것으로 나타났다.As shown in Table 1, all of the invention examples in accordance with the present invention exhibits a low turbidity amount of 0.2 or less, and also shows good glossiness and whiteness, indicating that the surface appearance is good. Moreover, it turns out that plating peelability is also favorable and it is excellent also in adhesiveness. On the other hand, Comparative Examples (1) and (2), in which no sodium sulfonate was added or traced, were poor in all evaluations, and Comparative Example (6) in which an excess amount was added and Comparative Example in which no sodium sulfate was added or traced was added. Although (7) and (8) had good plating peeling property, it is inferred that the surface appearance was bad because of poor gloss and whiteness. In addition, in the case of Comparative Example (12) in which sodium sulfate was excessively added than the present invention, the whiteness and the peeling property were poor.

상술한 바와 같이, 본 발명은 염화물계의 도금용액의 조성 및 도금조건을 적절히 조정함으로써, 표면외관 및 밀착성이 양호한 우수한 품질의 도금강판을 얻을 수 있는 효과가 있는 것이다.As described above, the present invention has an effect of obtaining a plated steel sheet having excellent quality with good surface appearance and adhesion by appropriately adjusting the composition and plating conditions of the chloride plating solution.

Claims (2)

아연이온: 0.5~2.0몰, 니켈이온: 0.1~0.5몰, 염화이온: 6.0~9.0몰로 조성되는 염화물계 아연-니켈 합금 전기도금용액에,In a chloride-based zinc-nickel alloy electroplating solution composed of zinc ion: 0.5 to 2.0 mol, nickel ion: 0.1 to 0.5 mol, chloride ion: 6.0 to 9.0 mol, (a) 0.1~1.0몰의 염화 암모늄염;(a) 0.1-1.0 molar ammonium chloride salt; (b) 상기 염화 암모늄염에 대해 1:0.001~0.008몰비의 술폰산 나트륨; 및(b) from 1: 0.001 to 0.008 molar ratio of sodium sulfonate relative to the ammonium chloride salt; And (c) 상기 술폰산 나트륨에 대해 1:0.1~0.5몰비의 황산염 나트륨을 첨가하여 이루어지는 아연-니켈합금 전기도금용액.(c) A zinc-nickel alloy electroplating solution formed by adding 1: 0.1 to 0.5 molar ratio of sodium sulfate to sodium sulfonate. 소지금속에 아연-니켈을 전기도금하는 방법에 있어서,In the method of electroplating zinc-nickel on a base metal, 제1항의 아연-니켈합금 전기도금용액을 이용하여, 도금용액의 pH를 2.5~4.5로, 그 온도를 55~70℃로, 전류밀도를 40~180A/d㎡로, 그리고 도금용액과 음극의 상대 유속을 0.5~2.5m/sec로 하는 도금조건으로 전기도금하는 것을 특징으로 하는 아연-니켈합금 전기도금강판을 제조하는 방법Using the zinc-nickel alloy electroplating solution of claim 1, the pH of the plating solution is 2.5 to 4.5, the temperature is 55 to 70 ° C, the current density is 40 to 180 A / dm 2, and the plating solution and the cathode A method of manufacturing a zinc-nickel alloy electroplated steel sheet characterized by electroplating under plating conditions with a relative flow rate of 0.5 to 2.5 m / sec.
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KR100436905B1 (en) * 1999-12-28 2004-06-23 주식회사 포스코 Plating solution for the electroplating
CN114075684A (en) * 2021-12-31 2022-02-22 成都高鑫机械制造有限公司 Zinc-nickel alloy electroplating process for metal surface

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KR20200081946A (en) 2018-12-28 2020-07-08 케이지동부제철 주식회사 Electroplating solution
KR20200081947A (en) 2018-12-28 2020-07-08 케이지동부제철 주식회사 Electroplating solution

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100436905B1 (en) * 1999-12-28 2004-06-23 주식회사 포스코 Plating solution for the electroplating
CN114075684A (en) * 2021-12-31 2022-02-22 成都高鑫机械制造有限公司 Zinc-nickel alloy electroplating process for metal surface
CN114075684B (en) * 2021-12-31 2024-02-09 成都高鑫机械制造有限公司 Zinc-nickel alloy electroplating process for metal surface

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