KR20010004390A - Method for forming of pattern of plasma display panel - Google Patents

Abstract

PURPOSE: A method of forming pattern in plasma display panel is provided to make it possible to form fine pattern using a photo-each method and remove needs of a vacuum evaporation device. CONSTITUTION: A materials of various kinds that is intented to pattern on a glass substrate(10) became a paste state and then the pastes(20) is applied on the glass substrate(10) and dried. A negative photoresist(30) is applied to the pastes(20) and the photoresist(30) is exposed by light using a photo mask(40). Then photoresist(30) is developed so that a photoresist pattern is formed to produce a protection mask layer. The pastes of area that is not covered with the photoresist(30) is etched by a solvent. Ultimately, the patterned photoresist(30) is calcined to form pattern.

Description

Method for forming of pattern of plasma display panel

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to flat panel display technology, and more particularly, to a method of forming an electrode, a black stripe, or the like pattern of a plasma display panel (hereinafter referred to as PDP).

PDP is a device that displays characters or images by using light emitted from plasma generated during gas discharge, and is also called a gas discharge display device. PDP is largely exposed to direct plasma because the electrode used to apply external voltage to form plasma is directly exposed because the direct current (DC) type and conduction current flowing through the electrode are covered with dielectric. Therefore, it is classified into AC type through which displacement current flows. In addition, depending on the electrode structure of the discharge cell, it is classified into a counter discharge type, a surface discharge type, a barrier rib discharge type, and the like. In the case of directly using the visible light emitted from the discharge gas, it is used in a monochromatic display PDP device. There is an orange PDP from Ne gas, and when full color display is required, ultraviolet light emitted from discharge gas such as Kr or Xe is red (R), green (G) and blue (B) phosphor. Using the visible light to excite the. However, there are still problems such as low brightness and contrast ratio, high driving voltage, low power consumption efficiency, and low manufacturing yield due to the difficulty in manufacturing process technology due to large size. I have a problem to do.

In general, a process mainly used as a method of forming a pattern such as an address electrode of the back plate, a bus electrode of the front plate, and a black stripe constituting the AC type PDP includes screen printing and photosensitive paste. Method, photo-etch method and the like are used.

In the screen printing method, a patterned screen is formed on a substrate at a constant interval, and a viscous partition paste between the screen patterns is repeatedly printed and dried about 7-8 times, and then fired. As a method of making bulkheads, it is widely used because of the simple process and low unit cost. However, the screen and substrate must be adjusted every time and the printing and drying must be repeated several times. In contrast, precision is a problem for manufacturing PDP with high definition such as HDTV.

In addition, the photosensitive paste method is a process developed by Dupont of the United States, also known as FODELTM method, the photosensitive paste is applied and dried, and then exposed and developed using a photo process, and then fired. As a method of forming a thick film, there is an advantage in that a high-definition pattern can be formed, while the loss of material is large, and the silver (Ag) component in the paste component is diffused into a glass substrate or a transparent dielectric (in the case of a bus electrode). The transparency is inferior, and in case of the electrode, there is a problem in that the stability of the process itself of the edge-curling phenomenon occurs.

In the photo-etch method, which can form the pattern most stably, Ag electrode paste is printed 1-2 times on a substrate, baked, and then coated with a photoresist, exposed, and developed. After this, the method is finally patterned through an etch process. However, even in the case of the photo-etch method, there are disadvantages in that the initial investment cost and the cost of waste disposal after the etch process are high.

The present invention has been made to solve the problems of the prior art as described above, by utilizing the advantages of the photo-etch method as described above to enable the formation of fine patterns, vacuum deposition equipment is It is an object of the present invention to provide a method of forming a pattern such as an electrode and a black stripe of a plasma display panel, which can reduce the initial investment cost considerably.

1A to 1D are pattern forming process diagrams of a plasma display panel according to the present invention.

* Explanation of symbols for main parts of the drawings

10: glass substrate 20: paste layer for pattern formation

30: photoresist 40: photo mask

The present invention for achieving the above object, the first step of coating the entire surface by pasting the material to be patterned on the substrate; A second step of forming a photoresist pattern by coating, exposing and developing a photoresist on the applied paste; Etching the paste in a region not covered with the photoresist pattern by using a solvent; And a fourth step of baking to form a pattern.

DETAILED DESCRIPTION Hereinafter, exemplary embodiments of the present invention will be described with reference to the accompanying drawings so that those skilled in the art may easily implement the technical idea of the present invention. do.

1A to 1D are process progress diagrams illustrating a process progress of pattern formation according to an embodiment of the present invention.

In the process according to the present embodiment, first, as shown in Figure 1a to paste the material of the various layers to be patterned on the glass substrate 10, and then apply the paste 20 on the glass substrate in full To dry.

Next, a negative photoresist 30 is applied to the process paste 20, and the photoresist 30 is exposed using the photo mask 40.

Subsequently, as shown in FIG. 1B, the negative photoresist subjected to the above exposure process is developed to form the photoresist pattern 31, thereby forming a protective mask layer.

Subsequently, etching is performed using a solvent of a paste as shown in FIG. 1C. In this case, as the paste solvent used in the etching process, a solvent usually included in the paste, for example, B.C.A (butyl carbitol acetate), terpeneol (Terpeneol) or IPA (Isopropyl Alchol) is used.

The reason for using IPA (Isopropyl Alchol) as the paste solvent is that the break point of IPA (Isopropyl Alchol) is low at about 82 ° C. and evaporates well at room temperature, so it is easy to separate from the paste and cause chemical changes in the main component of the paste. Compared to the strong acid or strong base materials used in the photo-etch process, it is much safer and easier to handle, and also by selecting a solvent which is easily separated from the paste such as IPA (Isopropyl Alchol). The reason is that the solvent and paste used in the etching process can be recovered and separated again.

In addition, since a diluent of a paste such as BCA (butyl carbitol acetate) or terpeneol is used as the paste solvent, the diluent used in the etching process and the melted paste are used as pastes having low viscosity. The reason for this is that the viscosity can be properly adjusted and used again as a paste.

Subsequently, if the solvent remains on the substrate after the etching process, the pattern itself, which is protected by the mask, is also dissolved and the pattern is not formed properly. Air) to remove the etching residue or solvent remaining on the substrate.

Finally, as shown in FIG. 1D, the patterned photoresist is peeled off and put into a firing furnace to fire to complete the pattern. In this case, the photoresist may be baked without peeling off to burn off the photoresist and simultaneously form a pattern.

Although the technical idea of the present invention has been described in detail according to the above preferred embodiment, it should be noted that the above-described embodiment is for the purpose of description and not of limitation. In addition, those skilled in the art will understand that various embodiments are possible within the scope of the technical idea of the present invention.

As described above, the present invention enables the formation of a high-definition pattern by utilizing the advantages of the photo-etch process while using the conventional paste as it is, and does not require a vacuum deposition equipment, thereby significantly reducing the initial investment cost. have. In addition, since the etchant used during the etching process is a relatively easy-to-handle paste solvent, maintenance and management can be easily performed, thereby maximizing cost reduction effects. Furthermore, since the waste agent after the etching process is finished or can be used as it is, it is a revolutionary method for environmental conservation effect and material cost reduction.

Claims (6)

In the pattern formation method of the plasma display, A first step of paste-coating the material to be patterned on the substrate; A second step of forming a photoresist pattern by coating, exposing and developing a photoresist on the applied paste; Etching the paste in a region not covered with the photoresist pattern by using a solvent; And Fourth step of firing to form a pattern Pattern forming method of the plasma display comprising a. The method of claim 1, The solvent, Method for forming a pattern of a plasma display, characterized in that using IPA (Isopropyl Alchol). The method of claim 1, The solvent, B.C.A (butyl carbitol acetate) or terphenol, which is a diluent of a paste, is used. The method of claim 1, And a fifth step of removing the remaining etch residues or solvent by blowing the gas at a high pressure while simultaneously inclining the substrate after performing the third step. The method of claim 1, And a seventh step of peeling off the photoresist before firing of the fifth step. The method of claim 1, When the firing process of the fifth step, the photoresist is fired as it is, the pattern forming method of the plasma display, characterized in that to remove the photoresist at the same time.